CN220856239U - High-power sampling chip resistor - Google Patents
High-power sampling chip resistor Download PDFInfo
- Publication number
- CN220856239U CN220856239U CN202321981660.3U CN202321981660U CN220856239U CN 220856239 U CN220856239 U CN 220856239U CN 202321981660 U CN202321981660 U CN 202321981660U CN 220856239 U CN220856239 U CN 220856239U
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- China
- Prior art keywords
- resistor
- welding
- plastic package
- utility
- model
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Links
- 238000005070 sampling Methods 0.000 title claims abstract description 12
- 238000003466 welding Methods 0.000 claims abstract description 47
- 239000004033 plastic Substances 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000004593 Epoxy Substances 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- HPDFFVBPXCTEDN-UHFFFAOYSA-N copper manganese Chemical group [Mn].[Cu] HPDFFVBPXCTEDN-UHFFFAOYSA-N 0.000 claims description 4
- 238000010894 electron beam technology Methods 0.000 claims description 3
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 3
- 238000005253 cladding Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 229920001169 thermoplastic Polymers 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 description 9
- 238000005476 soldering Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000006004 Quartz sand Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Abstract
The utility model discloses a high-power sampling chip resistor, and belongs to the field of electronic elements. The utility model is an improved product of 4527 type resistor, which is greatly changed in structure, has wider width compared with the product in the prior art, is favorable for heat dissipation of the resistor functional part, adopts epoxy plastic package material for the peripheral plastic package shell, has higher strength than common thermoplastic plastic package, and has stronger current resistance. The thickness and width of the outer welding part plated with the plating layer and the resistor functional body part are more uniform, and the current passing is more stable when the resistor functional body is electrified. Compared with the common similar products in the prior art, the utility model has stronger current resistance, higher upper limit of overload operation and less possibility of deformation of the external plastic package shell during overload.
Description
Technical Field
The utility model belongs to the field of electronic elements, and particularly relates to a high-power sampling chip resistor.
Background
At present, with the continuous updating of electronic products, the performance requirements on electronic components are also higher and higher. In electronic components, the resistor is an important passive device, and the performance of the resistor has a critical influence on the overall performance of the electronic product. In the field of high-power electronic products, such as electric automobiles, industrial automation equipment and the like, a high-power sampling chip resistor is required to be used for realizing accurate control of a circuit.
At present, some high-power sampling chip resistor products exist in the market, but the problems of large power loss, low precision, large temperature drift and the like exist in the market, and the requirements of high-power electronic products cannot be met.
For example, 4527 type resistor, which solves the problems of miniaturization and temperature drift of the resistor to a certain extent through metal film technology, temperature compensation technology and metal oxide thermistor technology, and effectively improves the safety and stability of the resistor under high-power working condition. However, the resistor still has the defects that, for example, under the condition of short-time overload, the current resistance is poor, short-time electrification is usually carried out under the condition of 3 times of rated power, the tissue change rate of the resistor can reach about 2 percent, and the surface of a product can be seriously foamed in the process of loading due to the influence of a plastic packaging process.
Therefore, a new design with a higher current-carrying capacity and a lower rate of change of resistance is needed.
Disclosure of utility model
In view of the foregoing problems of the prior art, an object of the present utility model is to provide a high-power sampling chip resistor.
In order to solve the problems, the technical scheme adopted by the utility model is as follows:
The utility model provides a high power sampling sheet resistor, includes resistance function portion, encapsulation shell and welding portion, resistance function portion pass through electron beam welding and link to each other with the welding portion, encapsulation shell set up in resistance function portion and partial welding portion, the welding portion expose the part outside the plastic envelope shell and be provided with the cladding material and buckle to encapsulation shell bottom.
The resistance functional part is a manganese copper alloy sheet.
The width of the resistance functional part is 8mm.
The width of the welding part is 8mm.
The packaging shell is made of epoxy plastic packaging material.
The packaging shell is made of an epoxy plastic packaging material doped with quartz sand.
The plating layer is nickel tin plating layer.
The thickness of the resistance functional part is the same as that of the welding part.
Compared with the prior art, the utility model has the beneficial effects that:
Compared with 4527 resistor in the prior art, the utility model has the advantages that the structure is further improved, the width of the resistor functional part is increased compared with the traditional 6mm chip resistor, the material of the package is replaced, the structure and the process of the welded part are improved, the current resistance of the resistor is enhanced, and meanwhile, the problem of package bulge caused by heating of the resistor is solved.
Drawings
FIG. 1 is a schematic vertical cross-section of a resistor;
FIG. 2 is a schematic cross-sectional view of a resistor;
In the figure: 1. a resistor function unit; 2. a welding part; 3. a plastic package shell; 4. welding a coating; 5. and (3) welding seams.
Detailed Description
The utility model is further described below in connection with specific embodiments.
As shown in fig. 2, the present utility model includes an energized body portion of a resistor and a plastic package housing 3.
The energized body part of the resistor comprises a resistor functional part 1, a welding part 2 and a welding line 5, the resistor functional part 1 is made of a manganese-copper alloy material, the width of the manganese-copper alloy material is 8mm, the welding part 2 is welded on the left side and the right side of the resistor functional part 1, the welding part 2 is a part for welding the resistor and the circuit board, but not a part for directly welding the resistor functional part 1 and the circuit board, the resistor functional part 1 is welded with the welding part 2 through an electron beam welding process, and the welding line 5 is reserved at the welding point of the resistor functional part 1 and the welding line 2.
The width and thickness of the welding part 2 and the welding line 5 are consistent with those of the resistance function part 1, and the thickness of the welding part 2 and the outer coating layer at the two ends of the chip resistor in the prior art is generally far greater than that of the resistance function part 1.
In this embodiment, the welding part 2 is made of red copper, and as shown in fig. 1, a plastic package casing 3 is molded on the periphery of the energized body part of the resistor, and the plastic package part includes the whole resistor functional part 1, the welding seam 5 and a small part of the welding part 2. The part of the soldering part 2 extending out of the plastic package housing 3 is added with a soldering coating 4 by electroplating, and the soldering coating 4 adopted in the embodiment is a nickel tin coating for better soldering with a circuit board when soldering.
The part of the welding part 2 extending out of the plastic package housing 3 is integrally bent downwards until the part is bent to the bottoms of the left end and the right end of the plastic package housing 3, so that the welding part is convenient to be matched with welding spots on a circuit board for welding.
The plastic package housing 3 is made of an epoxy plastic package material doped with quartz sand, and has the characteristics of high strength and strong current resistance, so that the plastic package housing 3 cannot deform under the condition of overload power-on of the resistor.
In the prior art, the manufacturing process of the 4527 resistor of the same type is generally to weld the resistor functional part 1 with the welding part 2 plated with the welding coating, and then to perform the subsequent steps of plastic packaging and classification, wherein the plastic packaging component is generally made of thermoplastic materials, so that the welding coating 4 is damaged due to high temperature during plastic packaging, resulting in poor welding. And the surface of the resistor may foam due to overheating when overloaded.
The adopted manufacturing flow is to weld the resistance function part 1 and the welding part 2, then carry out the steps of plastic packaging, grading and the like, and then electroplate the welding coating 4 on the welding part 2 outside the plastic packaging after the grading, thereby avoiding the situation that the coating is possibly damaged due to overhigh plastic packaging temperature when the electroplating is carried out before the plastic packaging. And then bending the welding part 2, and bending the welding part to the lower part of the plastic package housing 3 to finally form the structure of fig. 1.
Through a short-time load test in a laboratory, like products in the market are electrified for 5 seconds under the condition that the load condition is 3 times, the change rate of the resistance value is less than or equal to 2 percent, and a plastic package body used by the product is a thermoplastic material, so that the surface area is small and the heating value is large in the load process, and the surface of the product is seriously foamed.
The product made of the materials and the structure selected in the embodiment is electrified for 5 seconds under the condition of 5 times of load, the resistance change rate is less than or equal to 0.5 percent, and the surface of the epoxy molding compound doped with quartz sand is almost unchanged under the load.
Claims (4)
1. The utility model provides a high power sampling chip resistor, its characterized in that includes resistance function portion, encapsulation shell and welding portion, resistance function portion pass through electron beam welding and link to each other with the welding portion, encapsulation shell set up in resistance function portion and partial welding portion, the welding portion expose the part outside the plastic envelope shell and be provided with the cladding material and buckle to encapsulation shell bottom, resistance function portion and welding portion's width be 8mm, encapsulation shell's material be the epoxy plastic envelope material.
2. The high-power sampling chip resistor of claim 1, wherein the resistor functional part is a manganese-copper alloy sheet.
3. The high power sampling chip resistor of claim 1, wherein the coating is a nickel tin coating.
4. The high power sampling chip resistor of claim 1, wherein the resistor function is the same thickness as the solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321981660.3U CN220856239U (en) | 2023-07-26 | 2023-07-26 | High-power sampling chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321981660.3U CN220856239U (en) | 2023-07-26 | 2023-07-26 | High-power sampling chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220856239U true CN220856239U (en) | 2024-04-26 |
Family
ID=90775620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321981660.3U Active CN220856239U (en) | 2023-07-26 | 2023-07-26 | High-power sampling chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220856239U (en) |
-
2023
- 2023-07-26 CN CN202321981660.3U patent/CN220856239U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |