CN220830566U - Local solder paste printing repeated positioning device - Google Patents
Local solder paste printing repeated positioning device Download PDFInfo
- Publication number
- CN220830566U CN220830566U CN202322473621.9U CN202322473621U CN220830566U CN 220830566 U CN220830566 U CN 220830566U CN 202322473621 U CN202322473621 U CN 202322473621U CN 220830566 U CN220830566 U CN 220830566U
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- China
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- steel mesh
- solder paste
- long
- groove
- cantilever
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 22
- 238000007639 printing Methods 0.000 title claims abstract description 20
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 40
- 239000010959 steel Substances 0.000 claims abstract description 40
- 238000005476 soldering Methods 0.000 abstract description 12
- 230000000712 assembly Effects 0.000 abstract description 6
- 238000000429 assembly Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a repeated positioning device for printing local soldering paste, which comprises a base, wherein symmetrical T-shaped grooves are formed in the base, adjustable positioning pins are connected to the T-shaped grooves, a pair of stand columns are arranged on one side edge of the base along the direction of the T-shaped grooves, rotating shafts are movably connected between the stand columns, cantilevers are arranged along the vertical direction of the rotating shafts, small steel mesh fixing pins are arranged in the vertical direction of the cantilevers, and small steel meshes are arranged below the small steel mesh fixing pins. The repeated positioning device for solder paste printing ensures that the printed circuit board can repeatedly print the solder paste on the same position of a plurality of printed board assemblies in the reworking process, ensures the printing quality of the solder paste and improves the production efficiency.
Description
Technical Field
The utility model belongs to the technical field of electronic components, and particularly relates to a local solder paste printing repeated positioning device.
Background
The printed circuit board (also called PCB: printedcircuitboards) is a provider of electrical connection of electronic components and is also a carrier of components, and in order to ensure the reliability of soldering, individual components (such as BGA and QFN package components) in the reworked printed board assembly need to be printed with solder paste at the reworked position first, and then soldered with the mounted components. The existing components on the printed board assembly with the components can not adopt integral printing soldering paste, reworking is difficult to ensure requirements, and the positioning can not be repeated on the components at the same position of a plurality of printed board assemblies when the local small-sized soldering paste is manufactured for printing a steel screen, and the positioning difficulty of fine-pitch components is high.
Chinese patent publication No. CN204168614U discloses a device for manually printing solder paste, said device comprising: the device comprises a circuit board, a steel mesh plate, a plurality of net structures and a bonding pad, wherein the steel mesh plate is used for being attached to one surface of the circuit board to be printed with soldering paste, the steel mesh plate is provided with the net structures used for printing the soldering paste, the positions of the net structures correspond to the positions of the bonding pad on the circuit board, and the area of the net structures is smaller than the area of the bonding pad on the circuit board corresponding to the area of the net structures. The device can finish the work of manually printing soldering paste only by using a steel screen plate and a scraper without using a manual printer. But the quality of solder paste printing when the device in the same position of the plurality of printed board assemblies is repeatedly reworked cannot be ensured.
Disclosure of utility model
In order to solve the above problems, the present utility model aims to provide a local solder paste print repositioning device,
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a local solder paste printing repeated positioning device, includes the base, has seted up symmetrical "T" shape groove on the base, is connected with adjustable locating pin on "T" shape groove, is provided with a pair of stand along "T" shape groove direction on base one side edge, swing joint has the rotation axis between the stand, installs the cantilever along rotation axis vertical direction, and the vertical direction of cantilever is installed little steel mesh fixed pin, is provided with little steel mesh in the below of little steel mesh fixed pin.
The adjustable locating pin is L-shaped, a through long groove is formed in the long end of the L-shaped locating pin, the long end face of the L-shaped locating pin is placed on the base along the vertical direction of the T-shaped groove, and the locating column is inserted into the T-shaped groove from the long groove to be fixed.
The rotary shaft comprises two long strips, cylinders are integrally fixed at two ends of the long strips, and a gap is reserved between the two long strips; the column is provided with a round hole, and the cylinder of the rotary shaft penetrates through the round hole of the column and can rotate in the round hole.
The cantilever is a long slat provided with a long slot, one end of the cantilever is provided with a clamping slot, and a through hole is further formed in the clamping slot.
The width of the clamping groove of the cantilever is consistent with the width formed by the two strips of the rotating shaft, the clamping groove is buckled on the two strips, and the positioning column penetrates through a through hole in the clamping groove and a gap between the two strips to be fixed.
The small steel mesh fixing pins are integrated into a disc, a cylinder and a round nail from top to bottom in sequence, the radiuses of the disc, the cylinder and the round nail are gradually reduced, and the small steel mesh fixing pins are inserted into the long grooves of the cantilever from top and move in the long grooves.
The steel mesh is a rectangular thin plate with a groove in the middle, a plurality of meshes are arranged in the groove in a rectangular manner, and the four corners of the steel mesh are fixed by small steel mesh fixing pins.
Compared with the prior art, the utility model has the following advantages:
1. The device realizes the repeated positioning of the printed board assemblies to be reworked through the base and the adjustable positioning pins, reduces the difficulty of printing soldering paste when the printed board assemblies rework devices at the same positions in batches, and improves the reworking efficiency;
2. The device realizes repeated positioning of the small steel mesh through the upright post, the rotatable shaft, the cantilever, the small steel mesh fixing pin and the customized small steel mesh, ensures that the offset of repeated solder paste printing is within the quality requirement error range, and solves the problem that the small steel mesh can not fix the printed board assembly and the small steel mesh when carrying out local solder paste screen printing on the printed board assembly;
3. The device is of a desk type design, is small in size, can be used for checking alignment errors in a desk type high-power magnifying glass, is simple to operate, and improves welding reliability of reworking.
Drawings
In order to more clearly illustrate the technical solutions of specific embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1 is a schematic diagram of a partial solder paste print repositioning device according to the present utility model;
In the figure, a 1-base; 2-an adjustable locating pin; 3-stand columns; 4-rotating shaft; 5-cantilever; 6-small steel mesh fixing pins; 7-small steel mesh.
Detailed Description
The present utility model will be further described with reference to the drawings and the specific embodiments, but it should not be construed that the scope of the subject matter of the present utility model is limited to the following embodiments, and various modifications, substitutions and alterations made according to the ordinary skill and familiar means of the art to which this utility model pertains are included within the scope of the present utility model without departing from the above technical idea of the utility model.
Referring to fig. 1, the device mainly comprises a base 1, an adjustable positioning pin 2, an upright post 3, a rotatable shaft 4, a cantilever 5, a small steel mesh fixing pin 6 and a customized small steel mesh 7. The to-be-repaired printed board is fixed through the base 1 and 4 adjustable locating pins 2, the base 1 is a rectangular plate provided with symmetrical T-shaped grooves, the locating column fixes the adjustable locating pins 2 in the T-shaped grooves of the base 1, the locating column drives the adjustable locating pins 2 to translate along the short sides of the base 1 in the T-shaped grooves, and the locating column realizes the translation of the adjustable locating pins 2 along the long sides of the base in the strip-shaped grooves of the adjustable locating pins 2. And fixing the printed board to be repaired by adjusting the front-back left-right distance of the adjustable positioning pins.
And then the cantilever 5 is matched with the small steel mesh fixing pin 6, the customized small steel mesh 7 is firstly placed on the printed board to be repaired, the mesh holes of the small steel mesh 7 are overlapped with the bonding pads of the printed board, the small steel mesh fixing pin 6 is fixed on four corners of the small steel mesh 7, soldering paste is manually printed after the fixing is finished, and the customized small steel mesh 7 and the small steel mesh fixing pin are lifted through the rotatable shaft 4 after the first completion. And (4) reworking the next printed board to realize repeated printing and positioning of the soldering paste. The device can guarantee the printing quality of soldering paste when repeatedly returning devices at the same position of a plurality of printed board assemblies, and the purpose of high-reliability welding is achieved after mounting and welding. The operation is simple, convenient, practical and effective, and the repeated positioning precision can be ensured when the device printing soldering paste is arranged at the positions of a plurality of printed boards.
The above description of the device for repeatedly positioning the printing of the partial solder paste provided by the utility model is provided in detail, and specific examples are applied to the description of the structure and the working principle of the utility model, and the description of the above embodiments is only used for helping to understand the method and the core idea of the utility model. It should be noted that it will be apparent to those skilled in the art that various improvements and modifications can be made to the present utility model without departing from the principles of the utility model, and such improvements and modifications fall within the scope of the appended claims.
Claims (7)
1. A local solder paste printing repeated positioning device is characterized in that: including base (1), set up symmetrical "T" shape groove on base (1), be connected with adjustable locating pin (2) on "T" shape groove, be provided with a pair of stand (3) along "T" shape groove direction in base (1) one side edge, swing joint has rotation axis (4) between stand (3), install cantilever (5) along rotation axis (4) vertical direction, install little steel mesh fixed pin (6) in the vertical direction of cantilever (5), be provided with little steel mesh (7) in the below of little steel mesh fixed pin (6).
2. The localized solder paste print repositioning device of claim 1, wherein: the adjustable locating pin (2) is L-shaped, a through long groove is formed in the long end of the L-shaped locating pin, the long end face of the L-shaped locating pin is placed on the base (1) along the vertical direction of the T-shaped groove, and a locating column is inserted into the T-shaped groove from the long groove to be fixed.
3. The localized solder paste print repositioning device of claim 1, wherein: the rotating shaft (4) comprises two long strips, two ends of each long strip are integrally fixed with cylinders, and a gap is reserved between the two long strips; round holes are formed in the upright posts (3), and the cylinder of the rotating shaft (4) penetrates through the round holes of the upright posts (3) and can rotate in the round holes.
4. The localized solder paste print repositioning device of claim 1, wherein: the cantilever (5) is a long slat provided with a long slot, one end of the cantilever (5) is provided with a clamping slot, and a through hole is further formed in the clamping slot.
5. The localized solder paste print repositioning device of claim 4, wherein: the width of the clamping groove of the cantilever (5) is consistent with the width formed by the two strips of the rotating shaft (4), the clamping groove is buckled on the two strips, and the positioning column penetrates through a through hole in the clamping groove and a gap between the two strips to be fixed.
6. The localized solder paste print repositioning device of claim 1, wherein: the small steel mesh fixing pins (6) are integrated into a disc, a cylinder and a round nail from top to bottom in sequence, the radiuses of the disc, the cylinder and the round nail are gradually reduced, and the small steel mesh fixing pins (6) are inserted into the long grooves of the cantilever (5) from top and move in the long grooves.
7. The localized solder paste print repositioning device of claim 1, wherein: the steel mesh (7) is a rectangular thin plate with a groove in the middle, a plurality of meshes are arranged in the groove in a rectangular manner, and the small steel mesh fixing pins (6) are used for fixing four corners of the steel mesh (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322473621.9U CN220830566U (en) | 2023-09-12 | 2023-09-12 | Local solder paste printing repeated positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322473621.9U CN220830566U (en) | 2023-09-12 | 2023-09-12 | Local solder paste printing repeated positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220830566U true CN220830566U (en) | 2024-04-23 |
Family
ID=90727583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322473621.9U Active CN220830566U (en) | 2023-09-12 | 2023-09-12 | Local solder paste printing repeated positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220830566U (en) |
-
2023
- 2023-09-12 CN CN202322473621.9U patent/CN220830566U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |