CN220830508U - Camera module and endoscope - Google Patents

Abstract

The utility model relates to the technical field of multi-depth-of-field imaging, in particular to a camera module and an endoscope. The camera module comprises a mounting seat, a photosensitive chip and at least two lens assemblies, wherein each lens assembly is arranged in the mounting seat; the photosensitive chip is arranged at the light-emitting end of the lens component; wherein the depth of field and/or the viewing angle of any two lens assemblies are different. Specifically, each lens assembly can image in a corresponding area of a single photosensitive chip, so that a multi-lens multi-view super-depth-of-field image is realized. In addition, the occupation space of the whole module can be reduced by adopting a single photosensitive chip, the module can be conveniently operated in a narrow space, and the applicability is better.

Description

Camera module and endoscope

Technical Field

The utility model relates to the technical field of multi-depth-of-field imaging, in particular to a camera module and an endoscope.

Background

Multi-depth imaging is an imaging technique aimed at capturing multiple images at different focal lengths and synthesizing them into an image with an extended depth of field.

In the existing mode, the imaging with multiple depth of field is generally realized by replacing a lens, and the space for manually operating and switching the lens is needed, so that the volume is enlarged, the manual operation is needed, and the image effect is influenced by dust sticking of a photosensitive chip in operation.

Disclosure of utility model

The embodiment of the utility model aims to solve the technical problem of large occupied space caused by the fact that a camera module and an endoscope are provided for solving the problem that multiple depth of field imaging is realized by replacing lenses in the prior art.

In a first aspect, a camera module provided in an embodiment of the present utility model includes:

A mounting base;

At least two lens components, each lens component is arranged in the mounting seat;

the photosensitive chip is arranged at the light emitting end of the lens component;

The depth of field and the visual angle of any two lens assemblies are different.

Optionally, the photosensitive chip includes at least two imaging areas, and a plurality of imaging areas are in one-to-one correspondence with a plurality of lens assemblies.

Optionally, the mount pad is run through and is equipped with two at least mounting grooves, every the camera lens subassembly is all installed in corresponding mounting groove, a plurality of the mounting groove interval sets up, and two adjacent are limited with the division wall between the mounting groove, a plurality of the mounting groove with a plurality of imaging area one-to-one.

Optionally, a narrowing portion is disposed on a side of the partition wall adjacent to the photosensitive chip, the narrowing portion includes two opposite side surfaces, and a distance between the two side surfaces is gradually reduced in a direction in which the narrowing portion faces the photosensitive chip.

Optionally, the narrowing is V-shaped.

Optionally, the light-transmitting cover plate is further included, and the light-transmitting cover plate is covered on one side, away from the photosensitive chip, of the mounting seat.

Optionally, the camera module still includes the PCB board, the PCB board paster connect in sensitization chip is kept away from one side of mount pad, the mount pad orientation one side of sensitization chip is equipped with the chimb, the chimb encircles sensitization chip's global, and with the PCB board is connected.

Optionally, in a direction that the lens assembly is away from the photosensitive chip, an outer contour of the mount has a tendency to shrink.

Optionally, the groove wall of the mounting groove is provided with an internal thread, the outer peripheral surface of the lens assembly is provided with an external thread, and the internal thread is in threaded connection with the external thread.

In a second aspect, an embodiment of the present utility model further provides an endoscope, including the camera module in the foregoing embodiments.

Compared with the prior art, the camera module provided by the embodiment of the utility model has the beneficial effects that: the camera module comprises a mounting seat, a photosensitive chip and at least two lens assemblies, wherein each lens assembly is arranged in the mounting seat; the photosensitive chip is arranged at the light-emitting end of the lens component; wherein the depth of field and/or the viewing angle of any two lens assemblies are different. Specifically, each lens assembly can image in a corresponding area of a single photosensitive chip, so that images with multiple visual angles and multiple depths of field are realized. In addition, the occupation space of the whole module can be reduced by adopting a single photosensitive chip, the module can be conveniently operated in a narrow space, and the applicability is better.

Drawings

The utility model will now be described in further detail with reference to the accompanying drawings and examples, in which:

fig. 1 is an assembly schematic diagram of a camera module according to an embodiment of the utility model;

FIG. 2 is a top view of a photo-sensing chip and lens assembly according to an embodiment of the present utility model;

FIG. 3 is a cut-away view of a camera module provided by an embodiment of the present utility model;

FIG. 4 is an enlarged schematic view of a portion of the A position of FIG. 3;

fig. 5 is a schematic perspective view of a mounting seat according to an embodiment of the present utility model.

The reference numerals in the drawings are as follows:

1000. A camera module; 100. a photosensitive chip; 110. an imaging region; 200. a lens assembly; 210. an external thread; 300. a mounting base; 310. a mounting groove; 320. a partition wall; 321. a narrowing portion; 3211. a side surface; 330. a convex edge; 340. an internal thread; 400. a light-transmitting cover plate; 500. and a PCB board.

Detailed Description

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. Preferred embodiments of the present utility model will now be described in detail with reference to the accompanying drawings.

As shown in fig. 1 to 5, the camera module 1000 includes a mounting base 300, a photosensitive chip 100, and at least two lens assemblies 200, wherein each lens assembly 200 is mounted in the mounting base 300; the photosensitive chip 100 is arranged at the light-emitting end of the lens assembly 200; wherein the depth of field and the viewing angle of any two lens assemblies 200 are different.

Specifically, a single photo chip 100 performs image capturing on each lens assembly 200, thereby forming a multi-view multi-depth image. In addition, the occupation space of the whole module can be reduced by adopting the single photosensitive chip 100, so that the module can be conveniently operated in a narrow space, and the applicability is better. Therefore, the utility model can realize image acquisition with multiple view angles and multiple depth of field in a smaller space so as to be applied to image detection under special conditions. Furthermore, using a single light sensing chip 100 to sense different types of lenses may increase the flexibility of the detection apparatus.

It should be noted that, compared with the embodiment in which the DSP and the signals provided with the two photosensitive chips 100 are two paths, the output of the single photosensitive chip 100 is a single signal path, and the circuit and the signal transmission at the rear end are also equivalent to one path, so that the rear end only needs a smaller space to perform the signal transmission, but achieves the effect of multiple viewing angles and multiple depths of field. Meanwhile, the single photosensitive chip 100 does not need to be provided with an increased space at intervals like the two photosensitive chips 100, and the single photosensitive chip 100 can further compress the gap so as to reduce the whole space, so that the camera module 1000 can perform image acquisition of double-lens multi-depth in extremely narrow occasions.

In the above-described scheme, the depth of field refers to a distance range in which a clear focus can be maintained during photographing, and the angle of view refers to a scene range in which the lens assembly 200 can capture. For example, the lens assembly 200 may be a telephoto lens, a wide-angle lens or a super-wide-angle lens, and a specific lens type may be selected by those skilled in the art, and may be changed according to actual detection requirements.

In order to better understand the effect achieved by the present solution, the number of lenses and the lens types in the present solution are combined and paired to be many, and for example, referring to fig. 1 and 3, the number of lens assemblies 200 may be set to be two, where one lens is a tele lens and the other lens is a wide lens, so that a single photosensitive chip 100 can collect images of different types of lenses, and implement the function of image multi-view super-depth. Similarly, the number of lens assemblies 200 may be set to three or four to meet different detection requirements for image acquisition.

Referring to fig. 2, in an aspect of the present utility model, the photosensitive chip 100 includes at least two imaging areas 110, and the plurality of imaging areas 110 are in one-to-one correspondence with the plurality of lens assemblies 200. The imaging area 110 of the photosensitive chip 100 refers to an effective area on the image sensor for receiving light. Different imaging regions 110 correspond to different types of lens assemblies 200, which is more beneficial to improving the accuracy of image acquisition. In particular, sensing different types of lenses in a single photo-sensing chip 100 facilitates images captured by all lenses having the same pixel resolution and photo-sensing elements, which helps to maintain consistency of the image, thereby reducing complexity of post-processing. In addition, a single photosensitive chip 100 accommodates a plurality of lens types, and can reduce production costs and equipment maintenance costs. Manufacturing multiple specialized photo-sensing chips 100 to accommodate different types of lenses requires more resources and costs, which can be reduced by providing multiple imaging areas 110 on a single photo-sensing chip 100.

Referring to fig. 3, in the embodiment of the present utility model, at least two mounting grooves 310 are formed through the mounting base 300, each lens assembly 200 is mounted in a corresponding mounting groove 310, a plurality of mounting grooves 310 are spaced apart, a partition wall is defined between two adjacent mounting grooves 310, and the plurality of mounting grooves 310 are in one-to-one correspondence with the plurality of imaging areas 110. Specifically, the plurality of mounting grooves 310 are arranged at intervals, so that a partition wall is defined between every two mounting grooves 310, and the partition wall partitions the plurality of imaging areas 110, so that when each imaging area 110 acquires image information through the corresponding lens assembly 200, the imaging area is not interfered by other components in the interior, and the accuracy of image acquisition is more beneficial to improvement.

Referring to fig. 4, in the embodiment of the present utility model, a narrowing portion 321 is provided at a side of the partition wall adjacent to the photosensitive chip 100, the narrowing portion 321 includes two opposite side surfaces 3211, and a distance between the two side surfaces 3211 gradually decreases in a direction in which the narrowing portion 321 faces the photosensitive chip 100. The partition wall 320 is more beneficial to precisely divide different imaging areas 110, specifically, the distance between two sides 3211 of the narrowed portion 321 near the photosensitive chip 100 is the smallest, that is, the thickness of the partition wall near the photosensitive chip 100 is the smallest, so when dividing and separating different imaging areas 110, the narrowed portion 321 narrows one side onto the photosensitive chip 100, the required occupied space is smaller, and the two-to-two imaging areas 110 are more precisely separated. Meanwhile, the narrowing portion 321 occupies a smaller area on the photosensitive chip 100 when the photosensitive chip 100 is partitioned, so that the area of the photosensitive chip 100 that can be used for image formation is larger.

Specifically, in one embodiment, the narrowed portion 321 is V-shaped. In another embodiment, the narrowing 321 is trapezoidal.

Referring to fig. 2, in the solution of the present utility model, the projection of the lens assembly 200 in the light emitting direction thereof falls completely on the photosensitive chip 100. Specifically, the projection of the lens assembly 200 always falls on the photosensitive chip 100 completely, so that the stability and reliability of the image collected by the sensing chip through different lenses are improved, and the situation that no image is collected is avoided.

Referring to fig. 1, in the solution of the present utility model, a light-transmitting cover plate 400 is further included, and the light-transmitting cover plate 400 covers a side of the mounting base 300 away from the photosensitive chip 100. The light-transmitting cover plate 400 may be made of glass. Specifically, the installation of the light-transmitting cover plate 400 can protect the lens assembly 200. The lens assembly 200 is protected from scratches, dust and other damage. In addition, the transparent cover plate 400 can help the camera capture clear and sharp images by refracting and focusing light rays by providing the shape of the transparent cover plate 400.

The number of the light-transmitting cover plates 400 may be set according to the need. Illustratively, the light-transmitting cover plate 400 may be provided in plurality, and the plurality of light-transmitting cover plates 400 are installed in one-to-one correspondence with the plurality of installation grooves 310. As yet another example, the light-transmitting cover plate 400 may be provided as one, and the light-transmitting cover plate 400 covers all the mounting grooves 310.

Referring to fig. 1 and 3, in the solution of the present utility model, the camera module 1000 further includes a PCB 500, the PCB 500 is attached to a side of the photosensitive chip 100 away from the mounting base 300, a convex edge 330 is disposed on a side of the mounting base 300 facing the photosensitive chip 100, and the convex edge 330 surrounds the peripheral surface of the photosensitive chip 100 and is connected to the PCB 500. Specifically, the PCB 500 and the flange 330 can completely enclose the photosensitive chip 100 inside the mounting base 300. In one aspect, the enclosure may provide additional protection to the photosensitive chip 100, isolating the photosensitive chip 100 from the external environment, and reducing the effects of dust, moisture, contaminants, and other factors that may cause damage to the photosensitive chip 100. On the other hand, the closed space can effectively prevent light from entering the area of the photosensitive chip 100 from the non-photosensitive portion, thereby avoiding the influence of light leakage on image quality.

Referring to fig. 5, in the aspect of the present utility model, the outer profile of the mount 300 has a tendency to shrink in a direction in which the lens assembly 200 is away from the photo-sensing chip 100. Specifically, when the mounting base 300 can mount a plurality of lens assemblies 200, the overall occupied space of the mounting base 300 is reduced, and then the volume of the whole camera module 1000 is reduced, so that the camera module 1000 can be further applied to a narrower space for image acquisition, and the flexibility of module use is improved. Furthermore, the reduced profile of the outer contours may also provide a guiding effect when implemented on some products that need to be moved. For example, when the camera module 1000 of the endoscope needs to move and penetrate into certain areas, the mount 300 of the present embodiment can provide guiding function for the camera module 1000 when the camera module 1000 moves.

Referring to fig. 3, in the embodiment of the present utility model, the groove wall of the mounting groove 310 is provided with an internal thread 340, the outer circumferential surface of the lens assembly 200 is provided with an external thread 210, and the internal thread 340 is screwed to the external thread 210. Specifically, the lens assembly 200 can be firmly fixed in the mounting groove 310, and the distance between the lens assembly 200 and the photosensitive chip 100 can be adjusted by screwing the lens assembly 200, so that different lens assemblies 200 and the photosensitive chip 100 can be within a preset required distance range, and the lens assembly 200 can correctly focus light on the photosensitive chip 100 within the distance range, thereby generating a clear and accurate image. At the same time, maintaining the correct distance also ensures the accuracy of the focal length and angle of view. The above-mentioned predetermined required distance is the optimal working distance range between the lens assembly 200 and the photosensitive chip 100.

The present utility model also provides an endoscope (not shown) including the camera module 1000 of the above embodiments. The smaller size of the camera module 1000 is mounted on the endoscope, which means that the endoscope can be inserted into the body more easily, and the discomfort of the patient can be reduced, facilitating examination of the organs in the body.

It should be understood that the foregoing embodiments are merely illustrative of the technical solutions of the present utility model, and not limiting thereof, and that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art; all such modifications and substitutions are intended to be included within the scope of this disclosure as defined in the following claims.

Claims (10)

1. A camera module, comprising:

A mounting base;

At least two lens components, each lens component is arranged in the mounting seat;

The photosensitive chip is arranged at the light emitting ends of the plurality of lens assemblies;

the depth of field of any two lens assemblies is different from the visual angle.

2. The camera module of claim 1, wherein the light sensing chip comprises at least two imaging areas, and a plurality of the imaging areas are in one-to-one correspondence with a plurality of the lens assemblies.

3. The camera module of claim 2, wherein the mounting base is provided with at least two mounting grooves, each lens assembly is mounted in a corresponding mounting groove, a plurality of mounting grooves are arranged at intervals, a partition wall is defined between two adjacent mounting grooves, and the plurality of mounting grooves are in one-to-one correspondence with the plurality of imaging areas.

4. A camera module according to claim 3, wherein a narrowing portion is provided on a side of the partition wall adjacent to the photosensitive chip, the narrowing portion including two oppositely disposed side surfaces, and a distance between the side surfaces is gradually reduced in a direction in which the narrowing portion faces the photosensitive chip.

5. The camera module of claim 4, wherein the narrowing is V-shaped.

6. The camera module of any one of claims 1 to 5, further comprising a light-transmissive cover plate, the light-transmissive cover plate being disposed on a side of the mount remote from the light-sensitive chip.

7. The camera module of claim 6, further comprising a PCB board, wherein the PCB board patch is connected to a side of the photosensitive chip away from the mounting base, a convex edge is disposed on a side of the mounting base facing the photosensitive chip, and the convex edge surrounds a peripheral surface of the photosensitive chip and is connected to the PCB board.

8. The camera module of claim 7, wherein an outer contour of the mount has a tendency to shrink in a direction of the lens assembly away from the light sensing chip.

9. A camera module according to claim 3, wherein the wall of the mounting groove is provided with an internal thread, the outer circumferential surface of the lens assembly is provided with an external thread, and the internal thread is screwed to the external thread.

10. An endoscope comprising the camera module of any one of claims 1 to 9.