CN220825389U - Stamping liquid cooling device - Google Patents

Stamping liquid cooling device Download PDF

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Publication number
CN220825389U
CN220825389U CN202322576331.7U CN202322576331U CN220825389U CN 220825389 U CN220825389 U CN 220825389U CN 202322576331 U CN202322576331 U CN 202322576331U CN 220825389 U CN220825389 U CN 220825389U
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CN
China
Prior art keywords
stamping
stamping liquid
liquid recovery
liquid
cooling device
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Application number
CN202322576331.7U
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Chinese (zh)
Inventor
潘静声
李旺全
祝木君
袁海兵
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Jiangxi Jinku Intelligent Manufacturing Co ltd
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Jiangxi Jinku Intelligent Manufacturing Co ltd
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Priority to CN202322576331.7U priority Critical patent/CN220825389U/en
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Abstract

The utility model discloses a stamping liquid cooling device, which comprises a stamping liquid recovery box, wherein a liquid inlet pipe is connected to the middle of the left side of the top of the stamping liquid recovery box, a first control valve is arranged on the liquid inlet pipe, a liquid outlet pipe is connected to the middle of the bottom of the left side of the stamping liquid recovery box, a second control valve is arranged on the liquid outlet pipe, a square opening and a semiconductor refrigerating sheet are arranged on the left side of an inner cavity of the stamping liquid recovery box, the square opening is arranged on the stamping liquid recovery box, the first control valve is opened, stamping liquid is recovered into the stamping liquid recovery box, the semiconductor refrigerating sheet is opened, the stamping liquid is cooled by the cold end of the semiconductor refrigerating sheet, a hydraulic pump is opened, the stamping liquid is extracted through a first guide pipe, and is guided into the stamping liquid recovery box again through a second guide pipe, a round hole and a through hole, so that the stamping liquid is circulated, the cooling effect of the stamping liquid is more sufficient, the cooling effect of the cooling liquid is enhanced, the second control valve is opened, and the cooled stamping liquid is guided out.

Description

Stamping liquid cooling device
Technical Field
The utility model relates to the technical field of cooling devices, in particular to a stamping liquid cooling device.
Background
In the stamping production process, the stamping tool and the die are required to be cooled and lubricated through cooling liquid, and when the cooling effect of the cooling liquid is insufficient, the heat load of the tool and the die is too high, so that the service life of the tool and the die is greatly reduced.
In the prior art, when using the stamping liquid, lack cooling structure, can't cool down the stamping liquid, along with the continuous and long-time input use of stamping liquid, the heat in the stamping liquid can accumulate gradually to reduce the cooling effect of stamping liquid, can't provide effectual cooling protection effect for cutter and mould.
For the problems in the related art, no effective solution has been proposed at present.
Disclosure of utility model
The utility model provides a stamping liquid cooling device aiming at the problems in the related art, so as to overcome the technical problems in the prior related art.
For this purpose, the utility model adopts the following specific technical scheme:
the utility model provides a stamping liquid cooling device, includes stamping liquid recovery case, stamping liquid recovery case top left side intermediate junction has the feed liquor pipe, be provided with first control valve on the feed liquor pipe, stamping liquid recovery case left side bottom intermediate junction has the drain pipe, be provided with the second control valve on the drain pipe, stamping liquid recovery case inner chamber left side is provided with square mouth and semiconductor refrigeration piece, square mouth is seted up on the stamping liquid recovery case, the left hot junction of semiconductor refrigeration piece is connected with the stamping liquid recovery case, be provided with the pump box in the middle of the stamping liquid recovery case right side, be equipped with the hydraulic pump in the pump box, be connected with first pipe between hydraulic pump bottom and the stamping liquid recovery case right side bottom, be connected with the second pipe between stamping liquid recovery case top intermediate junction and the hydraulic pump.
Preferably, the square opening is embedded with a heat conducting plate, the right side of the heat conducting plate is connected with the hot end of the semiconductor refrigerating sheet, and the left side of the heat conducting plate is equidistantly connected with radiating fins.
Preferably, a fixed frame plate is arranged on the outer wall of the right side of the semiconductor refrigeration piece, and the fixed frame plate is connected with the stamping liquid recovery box.
Preferably, a cylinder is arranged in the middle of the inner cavity of the stamping liquid recovery box, round holes penetrating up and down are formed in the cylinder, through holes are formed in the annular array of the outer wall of the stamping liquid recovery box, and the through holes are communicated with the round holes.
Preferably, an installation opening is formed in the middle of the front side of the stamping liquid recovery box.
Preferably, a transparent plate is arranged in the mounting opening, and the transparent plate is connected with the stamping liquid recovery box.
The beneficial effects of the utility model are as follows:
1. Opening a first control valve, recovering stamping liquid into a stamping liquid recovery box, opening a semiconductor refrigeration sheet, refrigerating and cooling the stamping liquid through a cold end of the semiconductor refrigeration sheet, opening a hydraulic pump, extracting the stamping liquid through a first guide pipe, guiding the stamping liquid into the stamping liquid recovery box again through a second guide pipe, a round hole and a through hole, circulating the stamping liquid, enabling the stamping liquid to be cooled more fully, enhancing the cooling effect of the cooling liquid, opening a second control valve, and guiding out the cooled stamping liquid.
2. Through setting up fixed frame board, can restrict the semiconductor refrigeration piece to strengthen the leakproofness between semiconductor refrigeration piece and the punching press liquid collection box, through setting up heat-conducting plate and fin, the heat of heat-conducting plate with semiconductor refrigeration piece hot junction is derived, and diverges through the fin, guarantees the refrigeration effect of semiconductor refrigeration piece, through setting up cylinder, round hole and through-hole, makes punching press liquid more even distribution in the punching press liquid collection box, through setting up mounting port and transparent plate, be convenient for know the condition of punching press liquid in the punching press liquid collection box.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view showing the overall structure of a press liquid cooling apparatus according to an embodiment of the present utility model;
Fig. 2 is a schematic view showing an internal structure of a press liquid cooling apparatus according to an embodiment of the present utility model;
FIG. 3 is a schematic view of a stationary frame plate of a ram fluid cooling device according to an embodiment of the utility model;
fig. 4 is a schematic view of a cylinder of a press liquid cooling apparatus according to an embodiment of the present utility model.
In the figure:
1. A stamping liquid recovery box; 2. a liquid inlet pipe; 3. a first control valve; 4. a liquid outlet pipe; 5. a second control valve; 6. a square mouth; 7. a semiconductor refrigeration sheet; 8. a pump case; 9. a hydraulic pump; 10. a first conduit; 11. a second conduit; 12. a heat conductive plate; 13. a heat sink; 14. fixing the frame plate; 15. a cylinder; 16. a round hole; 17. a through hole; 18. a mounting port; 19. and a transparent plate.
Detailed Description
For the purpose of further illustrating the various embodiments, the present utility model provides the accompanying drawings, which are a part of the disclosure of the present utility model, and which are mainly used to illustrate the embodiments and, together with the description, serve to explain the principles of the embodiments, and with reference to these descriptions, one skilled in the art will recognize other possible implementations and advantages of the present utility model, wherein elements are not drawn to scale, and like reference numerals are generally used to designate like elements.
According to an embodiment of the present utility model, there is provided a ram liquid cooling device.
Example 1
As shown in fig. 1-4, a stamping liquid cooling device according to an embodiment of the utility model comprises a stamping liquid recovery tank 1, a liquid inlet pipe 2 is connected in the middle of the left side of the top of the stamping liquid recovery tank 1, a first control valve 3 is arranged on the liquid inlet pipe 2, a liquid outlet pipe 4 is connected in the middle of the bottom of the left side of the stamping liquid recovery tank 1, a second control valve 5 is arranged on the liquid outlet pipe 4, a square opening 6 and a semiconductor refrigerating sheet 7 are arranged on the left side of the inner cavity of the stamping liquid recovery tank 1, the square opening 6 is arranged on the stamping liquid recovery tank 1, the hot end of the left side of the semiconductor refrigerating sheet 7 is connected with the stamping liquid recovery tank 1, a pump box 8 is arranged in the middle of the right side of the stamping liquid recovery tank 1, a hydraulic pump 9 is arranged in the pump box 8, the bottom of the hydraulic pump 9 is connected with a first conduit 10 between the bottom of the right side of the stamping liquid recovery box 1, a second conduit 11 is connected between the middle of the top of the stamping liquid recovery box 1 and the hydraulic pump 9, a heat conducting plate 12 is embedded in the square opening 6, the right side of the heat conducting plate 12 is connected with the hot end of the semiconductor refrigerating sheet 7, the left side of the heat conducting plate 12 is equidistantly connected with a radiating sheet 13, the heat of the hot end of the semiconductor refrigerating sheet 7 is conducted out by the heat conducting plate 12 and is dispersed through the radiating sheet 13, the refrigerating effect of the semiconductor refrigerating sheet 7 is ensured, a fixed frame plate 14 is arranged on the outer wall of the right side of the semiconductor refrigerating sheet 7, the fixed frame plate 14 is connected with the stamping liquid recovery box 1, the semiconductor refrigerating sheet 7 is limited, and the tightness between the semiconductor refrigerating sheet 7 and the stamping liquid recovery box 1 is enhanced.
Example two
As shown in fig. 1-4, a stamping liquid cooling device according to an embodiment of the utility model includes a stamping liquid recovery tank 1, a liquid inlet pipe 2 is connected in the middle of the left side of the top of the stamping liquid recovery tank 1, a first control valve 3 is provided on the liquid inlet pipe 2, a liquid outlet pipe 4 is connected in the middle of the bottom of the left side of the stamping liquid recovery tank 1, a second control valve 5 is provided on the liquid outlet pipe 4, a square opening 6 and a semiconductor refrigeration sheet 7 are provided on the left side of the inner cavity of the stamping liquid recovery tank 1, the square opening 6 is provided on the stamping liquid recovery tank 1, the hot end of the left side of the semiconductor refrigeration sheet 7 is connected with the stamping liquid recovery tank 1, a pump tank 8 is provided in the middle of the right side of the stamping liquid recovery tank 1, a hydraulic pump 9 is provided in the pump tank 8, a second conduit 11 is connected between the bottom of the hydraulic pump 9 and the bottom of the stamping liquid recovery tank 1, a cylinder 15 is provided in the middle of the inner cavity of the stamping liquid recovery tank 1, round holes 16 penetrating up and down are provided in the cylinder 15, an annular array of through holes 17 are provided on the outer wall of the stamping liquid recovery tank 1, and the through holes 17 are distributed more uniformly in the stamping liquid recovery tank 1.
Example III
As shown in fig. 1-4, a stamping liquid cooling device according to an embodiment of the utility model includes a stamping liquid recovery tank 1, a liquid inlet pipe 2 is connected in the middle of the left side of the top of the stamping liquid recovery tank 1, a first control valve 3 is provided on the liquid inlet pipe 2, a liquid outlet pipe 4 is connected in the middle of the bottom of the left side of the stamping liquid recovery tank 1, a second control valve 5 is provided on the liquid outlet pipe 4, a square opening 6 and a semiconductor refrigeration sheet 7 are provided on the left side of an inner cavity of the stamping liquid recovery tank 1, the square opening 6 is provided on the stamping liquid recovery tank 1, the hot end of the left side of the semiconductor refrigeration sheet 7 is connected with the stamping liquid recovery tank 1, a pump tank 8 is provided in the middle of the right side of the stamping liquid recovery tank 1, a hydraulic pump 9 is provided in the pump tank 8, a second conduit 11 is connected between the bottom of the hydraulic pump 9 and the bottom of the right side of the stamping liquid recovery tank 1, a mounting opening 18 is provided in the middle of the front side of the stamping liquid recovery tank 1, a transparent plate 19 is provided in the mounting opening 18, and the transparent plate 19 is connected with the stamping liquid recovery tank 1, so that the stamping liquid recovery in the stamping liquid recovery tank 1 can be conveniently recovered.
In summary, by means of the above technical scheme of the utility model, when the device is used, the external power supply is used for supplying power to the hydraulic pump 9 and the semiconductor refrigerating plate 7, the first control valve 3 is opened, the stamping liquid is recovered into the stamping liquid recovery box 1, the semiconductor refrigerating plate 7 is opened, the stamping liquid is refrigerated and cooled through the cold end of the semiconductor refrigerating plate 7, the hydraulic pump 9 is opened, the stamping liquid is extracted through the first guide pipe 10 and is redirected into the stamping liquid recovery box 1 through the second guide pipe 11, the round hole 16 and the through hole 17, so that the stamping liquid circulates, the stamping liquid is cooled more fully, the cooling effect of the cooling liquid is enhanced, the second control valve 5 is opened, and the cooled stamping liquid is led out.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims (6)

1. The utility model provides a stamping liquid cooling device, includes stamping liquid recovery case (1), its characterized in that, stamping liquid recovery case (1) top left side intermediate junction has feed liquor pipe (2), be provided with first control valve (3) on feed liquor pipe (2), be connected with drain pipe (4) in the middle of stamping liquid recovery case (1) left side bottom, be provided with second control valve (5) on drain pipe (4), stamping liquid recovery case (1) inner chamber left side is provided with square mouth (6) and semiconductor refrigeration piece (7), square mouth (6) are seted up on stamping liquid recovery case (1), the hot junction in semiconductor refrigeration piece (7) left side is connected with stamping liquid recovery case (1), be provided with pump box (8) in the middle of stamping liquid recovery case (1) right side, be equipped with hydraulic pump (9) in pump box (8) bottom and stamping liquid recovery case (1) right side bottom between be connected with first pipe (10), be connected with between stamping liquid recovery case (1) top middle (9) and second hydraulic pump (11).
2. The stamping liquid cooling device according to claim 1, wherein the square opening (6) is embedded with a heat conducting plate (12), the right side of the heat conducting plate (12) is connected with the hot end of the semiconductor refrigerating sheet (7), and the left side of the heat conducting plate (12) is equidistantly connected with cooling fins (13).
3. The stamping liquid cooling device according to claim 1, characterized in that a fixed frame plate (14) is arranged on the outer wall of the right side of the semiconductor refrigerating sheet (7), and the fixed frame plate (14) is connected with the stamping liquid recovery tank (1).
4. The stamping liquid cooling device according to claim 1, wherein a cylinder (15) is arranged in the middle of an inner cavity of the stamping liquid recovery box (1), round holes (16) penetrating up and down are formed in the cylinder (15), through holes (17) are formed in an annular array on the outer wall of the stamping liquid recovery box (1), and the through holes (17) are communicated with the round holes (16).
5. The stamping liquid cooling device according to claim 1, characterized in that an installation opening (18) is provided in the middle of the front side of the stamping liquid recovery tank (1).
6. The stamping liquid cooling device according to claim 5, characterized in that a transparent plate (19) is arranged in the mounting opening (18), and the transparent plate (19) is connected with the stamping liquid recovery tank (1).
CN202322576331.7U 2023-09-21 2023-09-21 Stamping liquid cooling device Active CN220825389U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322576331.7U CN220825389U (en) 2023-09-21 2023-09-21 Stamping liquid cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322576331.7U CN220825389U (en) 2023-09-21 2023-09-21 Stamping liquid cooling device

Publications (1)

Publication Number Publication Date
CN220825389U true CN220825389U (en) 2024-04-23

Family

ID=90722672

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322576331.7U Active CN220825389U (en) 2023-09-21 2023-09-21 Stamping liquid cooling device

Country Status (1)

Country Link
CN (1) CN220825389U (en)

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