CN214293991U

CN214293991U - Water cooling device for plastic mold

Info

Publication number: CN214293991U
Application number: CN202023020848.0U
Authority: CN
Inventors: 张宇
Original assignee: Wuhan Xinfengyun Technology Co ltd
Current assignee: Wuhan Xinfengyun Technology Co ltd
Priority date: 2020-12-15
Filing date: 2020-12-15
Publication date: 2021-09-28
Anticipated expiration: 2030-12-15

Abstract

The utility model discloses a plastic mould water cooling device relates to plastic mould cooling technology field, and for solving the cooling water circulation and using, the absorptive heat of cooling water can not effectual carry on with, can rise the temperature of cooling water gradually, and this cooling water temperature difference effect of reuse descends down, has reduced the heat absorbing capacity of cooling water, leads to the not good problem of water-cooled effect. The utility model discloses a water injection mould, including die holder, water pump, water injection pipe, water pump, water injection pipe, and water injection pipe, water injection.

Description

Water cooling device for plastic mold

Technical Field

The utility model relates to a plastic mould cooling technology field specifically is plastic mould water cooling plant.

Background

The plastic mold is a short name for a combined mold used for compression molding, extrusion molding, injection, blow molding and low-foaming molding. The coordination change of the male die, the female die and the auxiliary forming system of the die can process a series of plastic parts with different shapes and sizes, the plastic die is the female die of the industry, and the release of new products relates to plastics. The water-cooled radiator is provided with a water inlet and a water outlet, and a plurality of water channels are arranged in the radiator, so that the advantage of water cooling can be fully exerted, more heat can be taken away, and the water cooling system is widely adopted in an engine and has the advantages of reliable cooling, compact arrangement, low noise, convenient use and the like.

At present, when using water cooling device to cool down plastic mould, the cooling water recycles, and the absorbed heat of cooling water can not effectual going on with, can rise the temperature of cooling water gradually, uses this cooling water temperature difference effect to descend down once more, has reduced the heat absorbing capacity of cooling water, leads to the water-cooled effect not good, can not satisfy the user demand. Therefore, there is a strong need in the market for a water cooling device for plastic molds to solve these problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a plastic mould water cooling plant to propose cooling water recycling in solving above-mentioned background art, the absorptive heat of cooling water can not effectual carry on with, can rise the temperature of cooling water gradually, and this cooling water temperature difference of reuse descends under the effect, has reduced the heat absorbing capacity of cooling water, leads to the not good problem of water-cooled effect.

In order to achieve the above object, the utility model provides a following technical scheme: the plastic mold water cooling device comprises a lower die base, wherein a base is arranged below the lower die base and is connected with the lower die base in a clamping manner, an upper die base is arranged above the lower die base and is attached to the lower die base, a guide mechanism is arranged between the lower die base and the upper die base and is connected with the lower die base and the upper die base through screws, a die cavity is arranged at the upper end of the lower die base and is punched with the lower die base into an integral structure, a radiator is arranged inside the lower die base and is arranged into the integral structure with the lower die base, a water cooling pipeline is arranged inside the radiator and is in joggle joint with the radiator, a water pump is arranged on one side of the lower die base and is connected with the base through screws, water injection pipes are respectively arranged at two ends of the water pump, and one end of each water injection pipe extends into the water cooling pipeline, the outside of water injection pipe is provided with the solenoid valve, and solenoid valve and water injection pipe set up as an organic whole structure.

Preferably, the opposite side of die holder is provided with the water tank, and the water tank passes through bolted connection with the base, be provided with the back flow between water tank and the water-cooling pipeline, and the both ends of back flow extend to the inside of water tank and water-cooling pipeline respectively, the other end of water injection pipe extends to the inside of water tank.

Preferably, the inside of water tank is provided with the semiconductor refrigerator, and the semiconductor refrigerator passes through the screw connection with the water tank, the upper end of water tank is provided with the exhaust hole, and the one end in exhaust hole extends to the inside of water tank, the exhaust hole sets up structure as an organic whole with the water tank.

Preferably, the side wall of the lower die base is provided with two heat dissipation grooves, the two heat dissipation grooves are formed in the two sides of the lower die base, two heat dissipation fans are arranged inside the two heat dissipation grooves, the two heat dissipation fans are arranged, and the two heat dissipation fans are connected with the lower die base through screws.

Preferably, a heat collecting plate is arranged inside the heat radiating groove, the heat collecting plate is attached to the lower die base, the heat collecting plate is arranged on one side of the heat radiating fan, and the heat collecting plate is attached to the heat radiating fan.

Preferably, the outside of die holder is provided with the fin, and the fin is provided with a plurality of, and the fin sets gradually in the outside of die holder, fin and die holder set up structure as an organic whole.

Preferably, one side of the cooling fan is provided with a dustproof filter screen, the dustproof filter screen is arranged inside the cooling groove, and the dustproof filter screen is connected with the lower die base through screws.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a device passes through the water pump, the water-cooling pipeline, the setting of semiconductor cooler and back flow, the water pump can be with the cooling water extraction in the water tank and pour into the water-cooling pipeline into, the cooling water flows in the water-cooling pipeline and can be with the heat absorption transfer on the radiator, thereby carry the inside heat of mould, the back flow can flow the cooling water back in the water tank, thereby realize the used circulation of cooling water, the semiconductor cooler can carry out cooling treatment to the inside cooling water of water tank, the temperature of cooling water has been reduced, indirect improvement the water cooling effect. The problem of be used for water-cooled water secondary use when the water temperature rises, the heat absorption capacity of water descends, leads to the effect of water cooling to descend is solved.

2. The utility model discloses a device passes through the setting of thermal-arrest board, radiator fan and fin, and the thermal-arrest board can form a high temperature region with the heat absorption on the die holder wall body in one side of radiator fan, can be quick distribute the absorptive heat of thermal-arrest board under radiator fan's effect and dredge, and the fin can form a vortex in the outside of die holder, and the air of accelerating flows under the effect of vortex to can assist the die holder heat dissipation. The problem of rely on the water-cooling to dispel the heat to the plastic mould, the cooling effect of plastic mould outer wall is not good is solved.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a front view of the present invention;

FIG. 3 is a cross-sectional view of the lower die holder of the present invention;

fig. 4 is a connection relationship diagram of the water cooling pipeline, the water tank and the water pump.

In the figure: 1. a lower die holder; 2. a base; 3. an upper die holder; 4. a mold cavity; 5. a guide mechanism; 6. a water-cooled pipeline; 7. a water tank; 8. a semiconductor refrigerator; 9. an exhaust hole; 10. a return pipe; 11. a water pump; 12. a water injection pipe; 13. an electromagnetic valve; 14. a dustproof filter screen; 15. a heat sink; 16. a heat radiation fan; 17. a heat collecting plate; 18. a heat sink; 19. and a heat sink.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-4, the present invention provides an embodiment: the plastic mold water cooling device comprises a lower die base 1, a base 2 is arranged below the lower die base 1, the base 2 is connected with the lower die base 1 in a clamping manner, an upper die base 3 is arranged above the lower die base 1, the upper die base 3 is attached to the lower die base 1, a guide mechanism 5 is arranged between the lower die base 1 and the upper die base 3, the guide mechanism 5 is connected with the lower die base 1 and the upper die base 3 through screws, a die cavity 4 is arranged at the upper end of the lower die base 1, the die cavity 4 and the lower die base 1 are punched into an integral structure, a radiator 18 is arranged inside the lower die base 1, the radiator 18 and the lower die base 1 are arranged into an integral structure, the radiator 18 can absorb heat inside the lower die base 1, a water cooling pipeline 6 is arranged inside the radiator 18, the water cooling pipeline 6 is in joggled connection with the radiator 18, the water cooling pipeline 6 can absorb and transfer the heat absorbed by the radiator 18, so as to realize a water cooling function, one side of die holder 1 is provided with water pump 11, and water pump 11 passes through screw connection with base 2, and the both ends of water pump 11 are provided with water injection pipe 12 respectively, and the one end of water injection pipe 12 extends to the inside of water-cooling pipeline 6, and the outside of water injection pipe 12 is provided with solenoid valve 13, and solenoid valve 13 sets up structure as an organic whole with water injection pipe 12, and water pump 11 carries out the water-cooling with the help of water injection pipe 12 with the cooling water injection in water-cooling pipeline 6.

Further, a water tank 7 is arranged on the other side of the lower die holder 1, the water tank 7 is connected with the base 2 through screws, a return pipe 10 is arranged between the water tank 7 and the water cooling pipeline 6, two ends of the return pipe 10 respectively extend into the water tank 7 and the water cooling pipeline 6, and the other end of the water injection pipe 12 extends into the water tank 7. The cooling water in the water cooling pipeline 6 can be returned to the water tank 7 through the return pipe 10, so that the cooling water can be recycled.

Further, the inside of water tank 7 is provided with semiconductor cooler 8, and semiconductor cooler 8 passes through screw connection with water tank 7, and the upper end of water tank 7 is provided with exhaust hole 9, and the one end of exhaust hole 9 extends to the inside of water tank 7, and exhaust hole 9 sets up structure as an organic whole with water tank 7. The cooling water in the water tank 7 can be refrigerated through the semiconductor refrigerator 8, so that the temperature of the cooling water is reduced, the water cooling effect of the cooling water is indirectly improved, and the exhaust hole 9 can release heat.

Further, the side wall of the lower die holder 1 is provided with two heat dissipation grooves 15, the two heat dissipation grooves 15 are arranged on two sides of the lower die holder 1, two heat dissipation fans 16 are arranged inside the two heat dissipation grooves 15, the two heat dissipation fans 16 are arranged, and the two heat dissipation fans 16 are connected with the lower die holder 1 through screws. The heat on the lower die holder 1 can be dissipated through the heat dissipating slot 15, and the heat dissipating fan 16 can improve the heat dissipating effect of the heat dissipating slot 15.

Further, a heat collecting plate 17 is disposed inside the heat dissipating slot 15, and the heat collecting plate 17 is attached to the lower die holder 1, the heat collecting plate 17 is disposed at one side of the heat dissipating fan 16, and the heat collecting plate 17 is attached to the heat dissipating fan 16. The heat collecting plate 17 can absorb the heat of the lower die holder 1 to form a high temperature region at one side of the cooling fan 16, thereby improving the working effect of the cooling fan 16.

Further, the outer portion of the lower die holder 1 is provided with a plurality of cooling fins 19, the cooling fins 19 are sequentially arranged on the outer portion of the lower die holder 1, and the cooling fins 19 and the lower die holder 1 are arranged into an integral structure. An eddy current can be formed around the lower die holder 1 through the radiating fins 19, and the plastic die can be assisted in radiating under the action of the eddy current.

Further, one side of the heat radiation fan 16 is provided with a dustproof filter screen 14, the dustproof filter screen 14 is arranged inside the heat radiation groove 15, and the dustproof filter screen 14 is connected with the lower die holder 1 through screws. The dust screen 14 prevents external dust from being adsorbed to the heat dissipation fan 16.

The working principle is as follows: when the cooling water circulation device is used, cooling water is injected into the water tank 7, the electromagnetic valve 13 is opened, the water pump 11 is started, the cooling water in the water tank 7 can be extracted and injected into the water cooling pipeline 6 through the water injection pipe 12 under the action of the water pump 11, heat on the die holder 1 under the action of the temperature difference between the inside and the outside of the water cooling pipeline 6 is transferred to the water cooling pipeline 6, and the cooling water in the water cooling pipeline 6 can absorb the heat on the water cooling pipeline 6 and flow back to the water tank 7 through the return pipe 10, so that the circulation use of the cooling water is realized; the semiconductor refrigerator 8 is turned on to perform a cooling process on the cooling water inside the water tank 7, and the temperature of the cooling water is lowered, thereby improving the effect of water cooling. The heat collecting plate 17 can absorb heat on the lower die holder 1, the heat absorbed by the heat collecting plate 17 can be dissipated under the action of the cooling fan 16, and the cooling fins 19 form a vortex outside the lower die holder 1, so that heat dissipation can be assisted under the action of the vortex, and the cooling effect of the plastic die is improved.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. Plastic mould water cooling plant, including die holder (1), its characterized in that: the die comprises a lower die holder (1), a base (2) is arranged below the lower die holder (1), the base (2) is connected with the lower die holder (1) in a clamping manner, an upper die holder (3) is arranged above the lower die holder (1), the upper die holder (3) is attached to the lower die holder (1), a guide mechanism (5) is arranged between the lower die holder (1) and the upper die holder (3), the guide mechanism (5) is connected with the lower die holder (1) and the upper die holder (3) through screws, a die cavity (4) is arranged at the upper end of the lower die holder (1), the die cavity (4) and the lower die holder (1) are punched into an integral structure, a radiator (18) is arranged inside the lower die holder (1), a water cooling pipeline (6) is arranged inside the radiator (18), and the water cooling pipeline (6) is in tenon joint with the radiator (18), one side of die holder (1) is provided with water pump (11), and water pump (11) pass through screw connection with base (2), the both ends of water pump (11) are provided with water injection pipe (12) respectively, and the one end of water injection pipe (12) extends to the inside of water-cooling pipeline (6), the outside of water injection pipe (12) is provided with solenoid valve (13), and solenoid valve (13) and water injection pipe (12) set up structure as an organic whole.

2. The water cooling device for plastic molds of claim 1, wherein: the opposite side of die holder (1) is provided with water tank (7), and water tank (7) pass through screw connection with base (2), be provided with back flow (10) between water tank (7) and water-cooling pipeline (6), and the both ends of back flow (10) extend to the inside of water tank (7) and water-cooling pipeline (6) respectively, the other end of water injection pipe (12) extends to the inside of water tank (7).

3. The water cooling device for plastic molds of claim 2, wherein: the inside of water tank (7) is provided with semiconductor cooler (8), and semiconductor cooler (8) pass through screw connection with water tank (7), the upper end of water tank (7) is provided with exhaust hole (9), and the one end in exhaust hole (9) extends to the inside of water tank (7), exhaust hole (9) set up structure as an organic whole with water tank (7).

4. The water cooling device for plastic molds of claim 1, wherein: be provided with radiating groove (15) on the lateral wall of die holder (1), radiating groove (15) are provided with two, and two radiating groove (15) set up in the both sides of die holder (1), two the inside of radiating groove (15) all is provided with radiator fan (16), and radiator fan (16) are provided with two, and radiator fan (16) pass through bolted connection with die holder (1).

5. The water cooling device for plastic molds of claim 4, wherein: the heat-radiating fin is characterized in that a heat-collecting plate (17) is arranged inside the heat-radiating groove (15), the heat-collecting plate (17) is attached to the lower die holder (1), the heat-collecting plate (17) is arranged on one side of the heat-radiating fan (16), and the heat-collecting plate (17) is attached to the heat-radiating fan (16).

6. The water cooling device for plastic molds of claim 1, wherein: the die comprises a lower die holder (1) and is characterized in that a plurality of radiating fins (19) are arranged outside the lower die holder (1), the radiating fins (19) are sequentially arranged outside the lower die holder (1), and the radiating fins (19) and the lower die holder (1) are of an integrated structure.

7. The water cooling device for plastic molds of claim 4, wherein: one side of the heat radiation fan (16) is provided with a dustproof filter screen (14), the dustproof filter screen (14) is arranged in the heat radiation groove (15), and the dustproof filter screen (14) is connected with the lower die holder (1) through screws.