CN220823158U

CN220823158U - High-performance television main board with built-in multi-core processor

Info

Publication number: CN220823158U
Application number: CN202322500879.3U
Authority: CN
Inventors: 安选良
Original assignee: Guangdong Shanmu Electronic Technology Co ltd
Current assignee: Guangdong Shanmu Electronic Technology Co ltd
Priority date: 2023-09-14
Filing date: 2023-09-14
Publication date: 2024-04-19
Anticipated expiration: 2033-09-14

Abstract

The utility model discloses a high-performance television main board with a built-in multi-core processor, which comprises: the power socket, the button infrared receiving socket, the loudspeaker socket, the first LED driver interface, the second LED driver interface, the 12V input test interface, the WIFI antenna interface, the screen wire socket, external WIFI module socket are distributed on the base plate, the base plate is provided with a first side, a second side and a third side which are parallel to each other, a fourth side, a fifth side and a sixth side which are parallel to each other, the first side and the fifth side are connected and are perpendicular to each other, the power socket is located on the first side, the first LED driver interface and the second LED driver interface are adjacent and are located on the sixth side, the WIFI antenna interface is close to the first side, the external WIFI module socket is close to the fourth side, and the button infrared receiving socket, the loudspeaker socket, the 12V input test interface and the screen wire socket are all located in the area where the central line of the first side and the second side is close to the first side.

Description

High-performance television main board with built-in multi-core processor

Technical Field

The utility model relates to the field of computer voice signal processing, in particular to a high-performance television main board with a built-in multi-core processor.

Background

With the development of the social science and technology level and the improvement of the living standard of people, the development of intelligent electrical appliances is more and more rapid, the intelligent television has become the normalization of the living of people, the light and thin of the television is also used as an important means for product market competition, and the performance requirement of the device (board card) which is the most important for connecting various internal and external electronic components of the intelligent television is higher and higher. At present, the television board card on the market cannot meet the high-main-frequency CPU and the high performance of multi-interface input and output on the basis of miniaturization.

It is therefore necessary to develop a new high performance television motherboard with a built-in multi-core processor.

Disclosure of utility model

In order to overcome the defects of the prior art, the utility model aims to provide a high-performance television main board with a built-in multi-core processor, and the purposes of reasonable and compact arrangement of various components and parts and the built-in multi-core processor of a television board card and miniaturization are realized through reasonable wiring.

The utility model is realized by the following technical scheme: a high performance television motherboard with a built-in multi-core processor, comprising: the circuit comprises a pentagon-shaped substrate, at least one power socket, a key infrared receiving socket, a loudspeaker socket, a first LED driver interface, a second LED driver interface, a 12V input test interface, a WIFI antenna interface, a screen wire socket, and an external WIFI module socket, wherein the pentagon-shaped substrate is provided with a first side, a second side and a third side which are parallel to each other, a fourth side, a fifth side and a sixth side which are parallel to each other, the first side and the fifth side are connected and perpendicular to each other, the power socket is located on the first side, the first LED driver interface and the second LED driver interface are adjacent and are located on the sixth side, the WIFI antenna interface is close to the first side, the external WIFI module socket is close to the fourth side, and the key infrared receiving socket, the loudspeaker socket, the 12V input test interface and the screen wire socket are all located in the areas of the first side and the second side, and the central line of the second side is close to the first side.

Further, the key infrared receiving socket, the speaker socket, the 12V input test interface and the screen wire socket are all located between the fourth side and the fifth side.

Further, the power socket is adjacent to the WIFI antenna interface, and the speaker socket is adjacent to the external WIFI module socket:

further, a line connecting the speaker socket and the screen wire socket is parallel to the fourth side.

Further, the second LED driver interface is located at the junction of the second side and the six sides.

Further, the power socket, the key infrared receiving socket, the loudspeaker socket, the 12V input test interface, the WIFI antenna interface and the screen wire socket, the external WIFI module socket is located in the area surrounded by the extension lines of the first side, the second side, the fourth side and the fifth side.

Compared with the prior art, the utility model has the following beneficial effects:

According to the utility model, the power socket is positioned on the first side, the first LED driver interface and the second LED driver interface are adjacent and are both positioned on the sixth side, the WIFI antenna interface is close to the first side, the external WIFI module socket is close to the fourth side, the key infrared receiving socket, the loudspeaker socket, the 12V input test interface and the screen wire socket are all positioned in the areas, close to the first side, of the central lines of the first side and the second side, so that the substrate is provided with enough space to embed a multi-frequency processor, and the multifunctional purpose of the television board card is realized and the purpose of miniaturization is achieved.

Drawings

FIG. 1 is a schematic diagram of a high performance TV motherboard with a built-in multi-core processor according to the present utility model;

100. A substrate 101, a first side; 102. a second side; 103. a third side; 104. fourth side; 105. a fifth side; 106. a sixth side; 1. a power socket; 2. the key infrared receiving socket; 3. a speaker socket; 4. a first LED driver interface; 5. a second LED driver interface; 6. a 12V input test interface; 7. a WIFI antenna interface; 8. a screen wire socket; 9. and (5) externally connecting a WIFI module socket.

Detailed Description

The utility model will be further described with reference to the drawings and detailed description. It should be noted that, on the premise of no conflict, new embodiments may be formed by any combination of the embodiments or technical features described below.

As shown in fig. 1, an embodiment of the present utility model discloses a high performance television motherboard with a built-in multi-core processor, including: the circuit comprises a pentagonal substrate 100, at least one power socket 1, a key infrared receiving socket 2, a loudspeaker socket 3, a first LED driver interface 4, a second LED driver interface 5, a 12V input test interface 6, a WIFI antenna interface 7, a screen wire socket 8 and an external WIFI module socket 9 which are distributed on the substrate 100.

In detail, the substrate 100 has a first side 101, a second side 102 and a third side 103 that are parallel to each other, and a fourth side 104, a fifth side 105 and a sixth side 106 that are parallel to each other, where the first side 101 and the fifth side 105 are connected and perpendicular to each other, the power socket 1 is located on the first side 101, the first LED driver interface 4 and the second LED driver interface 5 are adjacent to each other and are located on the sixth side 106, the WIFI antenna interface 7 is adjacent to the first side 101, the external WIFI module socket 9 is adjacent to the fourth side 104, and the key infrared receiving socket 2, the speaker sockets 3, 12V input test interface 6, and the screen socket 8 are all located on a region where lines in the first side 101 and the second side 102 are adjacent to the first side 101. Further, the key infrared receiving socket 2, the speaker socket 3, the 12V input test interface 6, the screen wire socket 8 are all located between the fourth side 104 and the fifth side 105, the power socket 1 is adjacent to the WIFI antenna interface 7, the speaker socket 3 is adjacent to the external WIFI module socket 9, the connection line between the speaker socket 3 and the screen wire socket 8 is parallel to the fourth side 104, the second LED driver interface 5 is located at the junction of the second side 102 and the sixth side, the power socket 1, the key infrared receiving socket 2, the speaker socket 3, the 12V input test interface 6, the WIFI antenna interface 7, the screen wire socket 8, and the external WIFI module socket 9 are all located in the area surrounded by the extension lines of the first side 101, the second side 102, the fourth side 104 and the fifth side 105.

In addition, in terms of functions, the high-performance television main board with the built-in multi-core processor is a main Hi3751V560 global system 4K intelligent television main processing chip, a built-in high-performance multi-core ARMA55 CPU, a multi-core ARM G52 GPU, a AOSP operating system is adopted, NTSC/PAL/SECAM system demodulation is supported, DTMB/DVB-C digital Demod is supported, ATSC/ISDB-T/DVB-T/T2/S/S2 Demod can be expanded, USB playing is supported, video formats supporting the main stream comprise AVS2, MPGE2, H.264, H.265, VP9, RMVB and the like, main stream audio decoding and audio processing are supported, and sea self-grinding SWS audio processing is supported, far-field voice schemes are supported, CVBS/YPbPr/VGA/2.0/USB interfaces are supported, HDMI is supported by V560, 3GB memory is supported maximally, LVDS, VBO and main stream P2P interfaces are supported, and Tconless screens of the main stream are supported. 1GB DDR is built in.

In this way, the power socket 1 is located on the first side 101, the first LED driver interface 4 and the second LED driver interface 5 are adjacent and are both located on the sixth side 106, the WIFI antenna interface 7 is close to the first side 101, the external WIFI module socket 9 is close to the fourth side 104, the key infrared receiving socket 2, the speaker sockets 3 and 12V input test interface 6, and the screen wire socket 8 are all located on the areas of the lines of the first side 101 and the second side 102 close to the first side 101, so that the substrate 100 has enough space to embed a multi-frequency processor, thereby realizing the multi-functional use of the television board card and the purpose of miniaturization.

The above embodiments are only preferred embodiments of the present utility model, and the scope of the present utility model is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present utility model are intended to be within the scope of the present utility model as claimed.

Claims

1. A high performance television motherboard with a built-in multi-core processor, comprising: the circuit comprises a pentagon-shaped substrate, at least one power socket, a key infrared receiving socket, a loudspeaker socket, a first LED driver interface, a second LED driver interface, a 12V input test interface, a WIFI antenna interface, a screen wire socket and an external WIFI module socket, wherein the power socket, the key infrared receiving socket, the loudspeaker socket, the first LED driver interface, the second LED driver interface, the 12V input test interface, the WIFI antenna interface and the screen wire socket are distributed on the substrate, and the circuit is characterized in that: the substrate is provided with a first side, a second side and a third side which are parallel to each other, and a fourth side, a fifth side and a sixth side which are parallel to each other, wherein the first side is connected with the fifth side and vertical to the fifth side, the power socket is positioned on the first side, the first LED driver interface and the second LED driver interface are adjacent and are both positioned on the sixth side, the WIFI antenna interface is close to the first side, the external WIFI module socket is close to the fourth side, and the key infrared receiving socket, the loudspeaker socket, the 12V input test interface and the screen wire socket are all positioned in the areas of the first side and the second side, which are close to the first side, of the central line.

2. The high performance television motherboard with a built-in multi-core processor of claim 1, wherein the key infrared receiving jack, the speaker jack, the 12V input test interface, and the screen wire jack are all located between the fourth side and the fifth side.

3. The high performance television motherboard with a built-in multi-core processor of claim 2, wherein the power socket is adjacent to the WIFI antenna interface and the speaker socket is adjacent to the external WIFI module socket.

4. The high performance television motherboard with a built-in multi-core processor of claim 1, wherein a line between said speaker socket and said screen line socket is parallel to said fourth side.

5. The high performance television motherboard with a built-in multi-core processor of claim 1, wherein said second LED driver interface is located at the junction of said second side and said six sides.

6. The high performance television motherboard with a built-in multi-core processor of claim 1, wherein the power socket, the key infrared receiving socket, the speaker socket, the 12V input test interface, the WIFI antenna interface, the screen wire socket, the external WIFI module socket are all located in an area surrounded by extension lines of the first side, the second side, the fourth side, and the fifth side.