CN220821564U

CN220821564U - Novel multi-color temperature LED light source

Info

Publication number: CN220821564U
Application number: CN202322494616.6U
Authority: CN
Inventors: 林成通; 朱颖颀
Original assignee: Zhejiang Inteled Optoeletronic Technology Co ltd
Current assignee: Zhejiang Inteled Optoeletronic Technology Co ltd
Priority date: 2023-09-14
Filing date: 2023-09-14
Publication date: 2024-04-19
Anticipated expiration: 2033-09-14

Abstract

The utility model discloses a novel multi-color temperature LED light source, which comprises a filament support substrate, wherein a plurality of rows of chip strings are arranged on the filament support substrate, a silver layer circuit on the surface of a support is printed on one side of the filament support substrate, a public positive electrode is arranged at any end part of the filament support substrate, and a plurality of negative electrodes are arranged at the end part of the filament support substrate; the width of the filament substrate is narrower, and the appearance is attractive; the different color temperatures are closely spaced, and the mutual light mixing effect is better.

Description

Novel multi-color temperature LED light source

Technical Field

The utility model relates to the technical field of illumination, in particular to a novel multi-color temperature LED light source.

Background

Along with the development of filament market, the main stream illumination of filament still mainly uses single color light source or white light colour temperature to be adjustable, but the colour temperature is comparatively single, can't satisfy current people's demand to colour change. And the filaments of different colors have a bit of interval, and when dimming, the colors can not be completely mixed, so that the effect is poor after mixing light, and the requirements of people can not be met.

Disclosure of utility model

The utility model aims to solve the technical problem of providing a novel multi-color temperature LED light source, and solves the problems of single color and single color temperature of the existing filament.

The utility model is realized by the following technical scheme.

The utility model discloses a novel multi-color temperature LED light source, which comprises a filament support substrate, wherein a plurality of rows of chip strings are arranged on the filament support substrate, a silver layer circuit on the surface of a support is printed on one side of the filament support substrate, a public positive electrode is arranged at any end of the filament support substrate, and a plurality of negative electrodes are arranged at the end of the filament support substrate.

Further, the chip string is covered with front fluorescent glue, and the back of the filament support substrate is provided with back fluorescent glue.

Further, the chips are arranged in series and are positively arranged, and the independent chips are connected through metal wires.

Further, the chip strings are chip strings for emitting light of different colors.

Further, the width of the filament support base plate is 1mm-4mm.

Further, the front fluorescent glue and the back fluorescent glue are a mixture of glue and fluorescent powder.

Further, the front fluorescent glue and the back fluorescent glue are a mixture of glue mixed powder.

The utility model has the beneficial effects that: the single filament has multiple color temperatures, can realize the independent adjustable function of each color temperature, namely the purpose of adjusting the light and the color of the single filament, can be installed efficiently and conveniently, meets the market demand, can realize multi-color temperature luminescence, and can respectively control the current of each color temperature; the width of the filament substrate is narrower, and the appearance is attractive; the different color temperatures are closely spaced, and the mutual light mixing effect is better.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a first embodiment of the present utility model;

FIG. 2 is a schematic illustration of front dispensing according to an embodiment of the present utility model;

FIG. 3 is a schematic illustration of back side dispensing according to an embodiment of the present utility model;

FIG. 4 is a circuit diagram of a first embodiment of the present utility model;

FIG. 5 is a schematic diagram of a second embodiment of the present utility model;

fig. 6 is a circuit diagram of a second embodiment of the present utility model.

Detailed Description

The utility model will now be described in detail with reference to fig. 1-6, wherein for convenience of description, the orientations described below are now defined as follows: the vertical, horizontal, front-rear directions described below are identical to the vertical, horizontal, front-rear directions of the projection relationship of fig. 1 itself.

Embodiment one:

The novel multi-color temperature LED light source is described with reference to figures 1-4, and comprises a filament support substrate 10, wherein the width of the filament support substrate 10 is 1-4 mm, the filament support substrate 10 is provided with a plurality of rows of chip strings 20, the chip strings 20 are light-emitting units, the chip strings 20 are positively arranged on the chip, the chip strings are formed by connecting individual chips in pairs, the individual chips are connected by metal wires 03, in the embodiment, the chip strings 20 are in three groups and are arranged on the filament support substrate 10 in parallel, the first chip string 21, the second chip string 22 and the third chip string 23 are respectively arranged on the filament support substrate 10, and the first chip string 21, the second chip string 22 and the third chip string 23 are arranged as chip strings for emitting light with different colors.

The filament support base plate 10 is printed with a support surface silver layer line 04 at one side, the support surface silver layer line 04 is connected with the third chip string 23 through a metal wire 03, wherein the surface of the filament base plate is provided with four unconnected silver layers, and the silver layers are firmly adhered to the surface of the base plate by printing high-temperature sintering silver conductive paste at a specific position of the base plate and then sintering.

The filament support substrate 10 is provided with a common positive electrode 50 at any end, the filament support substrate 10 is provided with a plurality of negative electrodes 60 at the end, the common positive electrode 50 and the negative electrodes 60 of the pins at the two ends of the filament support substrate 10 are connected through solder paste, as three groups of parallel chip strings 20 are arranged, namely, a first chip string 21, a second chip string 22 and a third chip string 23, the positive electrodes of the three groups of parallel chip strings 20 share the same positive electrode, namely, the first chip string 21, the second chip string 22 and the positive electrode of the third chip string 23 are all common positive electrodes 50, the three groups of parallel chip strings 20 are respectively provided with independent negative electrodes 60, namely, a first negative electrode 61, a second negative electrode 62 and a third negative electrode 63, the first negative electrode 61 is the negative electrode of the first chip string 21, the second negative electrode 62 is the negative electrode of the second chip string 22, and the third negative electrode 63 is the negative electrode of the third chip string 23.

In summary, the filament support substrate 10 has 4 unconnected pins serving as the positive and negative electrodes of the filaments with different color temperatures, the common positive electrode 50, the first negative electrode 61, the second negative electrode 62, and the third negative electrode 63.

The high temperature solder paste silver paste and the high temperature solder paste are preferable as the adhesive in this embodiment.

The first chip string 21, the second chip string 22 and the third chip string 23 are respectively fixed on different positions on the surface of the filament support substrate 10 through a die bonder, the chip strings are mutually parallel and equal in interval, the first chip string 21, the second chip string 22 and the third chip string 23 are connected with the common positive electrode 50, the first negative electrode 61, the second negative electrode 62 and the third negative electrode 63 of the pins at the two ends of the filament support substrate 10 through metal wires 3 and a wire bonder.

The chip string 20 is covered with a front fluorescent glue 70, and a back fluorescent glue 80 is arranged on the back of the filament support substrate 10.

When dispensing, the front fluorescent glue 70 needs to completely cover the first chip string 21, the second chip string 22 and the third chip string 23, after the front fluorescent glue 70 is dispensed, the dispensing operation of the back fluorescent glue 80 can be performed, the first chip string 21, the second chip string 22 can be simultaneously dispensed, the third chip string 23 needs to be separately dispensed, and finally the back of the filament support substrate 10 is simultaneously dispensed.

The front fluorescent glue 70 is correspondingly modulated according to different chip strings, and the back fluorescent glue 80 is in one-to-one correspondence with the front fluorescent glue 70, and glue with different proportions or glue with uniform proportions is dispensed. In this embodiment, glue with uniform proportion is preferable.

The front fluorescent glue 70 and the back fluorescent glue 80 may be a mixture of glue and fluorescent powder (fluorescent glue), wherein the glue may be silica gel or epoxy glue.

The front fluorescent glue 70 and the back fluorescent glue 80 may be glue mixed with other powders, such as silicon dioxide, titanium dioxide, aluminum oxide, C powder or other material powders.

After the front fluorescent glue 70 and the back fluorescent glue 80 are dispensed, the materials are put into an oven or a tunnel oven for baking, so that the fluorescent glue is completely cured. And then the common positive electrode 50 and the plurality of negative electrodes 60 are respectively connected to a power supply, so that the filament can realize the functions of multiple color temperatures and adjustable color temperatures.

The output currents of the first negative electrode 61, the second negative electrode 62 and the third negative electrode 63 are respectively controlled, so that the filament can realize the functions of multiple color temperatures and adjustable color temperatures.

Embodiment two:

As shown in fig. 5-6, the difference between the embodiment 2 and the embodiment one is that the third chip string 23 is two rows, the chip strings 20 of the two rows are connected by the metal wire 03 at the tail, and the head of the chip string 20 of the last row is connected with the third negative electrode 63 by the metal wire 03 to form a loop, and the chip string of the last row replaces the original silver layer line 04 when the control loop is set due to the two rows of the third chip string 23.

In other embodiments, the two rows of chip strings arranged in the third chip string 23 may enlarge the space between adjacent chips in the individual normal chips forming the chip string, so as to complete the two rows of arrangement of the third chip string 23 without increasing the number of chips.

The above embodiments are only for illustrating the technical concept and features of the present utility model, and are intended to enable those skilled in the art to understand the present utility model and implement it without limiting the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.

Claims

1. The utility model provides a novel multi-color temperature LED light source, includes filament support base plate (10), its characterized in that: the lamp filament support base plate (10) is provided with a plurality of rows of chip strings (20), a support surface silver layer circuit (04) is printed on one side of the lamp filament support base plate (10), a public positive electrode (50) is arranged at any end of the lamp filament support base plate (10), and a plurality of negative electrodes (60) are arranged at the end of the lamp filament support base plate (10).

2. The novel multi-color temperature LED light source of claim 1, wherein: the chip string (20) is covered with a front fluorescent glue (70), and the back of the filament support substrate (10) is provided with a back fluorescent glue (80).

3. The novel multi-color temperature LED light source of claim 1, wherein: the chip string (20) is a normal chip, and the individual chips are connected by metal wires (03).

4. A novel multi-color temperature LED light source as claimed in claim 3, wherein: the chip strings (20) are chip strings for emitting light of different colors.

5. The novel multi-color temperature LED light source of claim 1, wherein: the width of the filament support base plate (10) is 1mm-4mm.

6. The novel multi-color temperature LED light source of claim 2, wherein: the front fluorescent glue (70) and the back fluorescent glue (80) are mixtures of glue and fluorescent powder.

7. The novel multi-color temperature LED light source of claim 2, wherein: the front fluorescent glue (70) and the back fluorescent glue (80) are a mixture of glue mixed powder.