CN220820070U

CN220820070U - Semiconductor testing device

Info

Publication number: CN220820070U
Application number: CN202322200855.6U
Authority: CN
Inventors: 沈平
Original assignee: Suzhou Yunkuo Automation Technology Co ltd
Current assignee: Suzhou Yunkuo Automation Technology Co ltd
Priority date: 2023-08-16
Filing date: 2023-08-16
Publication date: 2024-04-19
Anticipated expiration: 2033-08-16

Abstract

The utility model relates to the technical field of semiconductor testing, and provides a semiconductor testing device which comprises a testing table and a support, wherein the support is L-shaped overall, a testing machine box is arranged on the inner side wall of the support, the bottom of the testing machine box is positioned at the top of the testing table, the testing table is disc-shaped overall, a plurality of chip positioning mechanisms are uniformly arranged at the top of the testing table, and a transposition driving mechanism is arranged between the lower structure of the support and the testing table. The chip positioning mechanism can realize positioning operation on different semiconductor chips, and meanwhile, a multi-station test bench and a transposition driving mechanism are matched, so that people for feeding and discharging can be added to match with quick test operation of a test case, and the overall test efficiency is effectively improved.

Description

Semiconductor testing device

Technical Field

The utility model relates to the technical field of semiconductor testing, in particular to a semiconductor testing device.

Background

A semiconductor (semiconductor) refers to a material having conductivity between that of a conductor and an insulator at normal temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high power conversion, etc., and diodes are devices fabricated using semiconductors.

The semiconductor chip needs to be subjected to performance test in the processing process, the traditional testing device mostly adopts a single station to carry out testing operation, the specific operation is to place the semiconductor chip on a positioning component in the station, then a testing machine case is started to carry out testing operation on the semiconductor chip, at the moment, a tester and a person who goes up and down the chip stand on one side of the testing device, the space is insufficient, the whole working efficiency is further influenced, the testing operation can be carried out after the loading and unloading operation of the chip is completed by waiting for the loading and unloading personnel, and the efficiency is low.

Therefore, the present disclosure provides a semiconductor testing device to solve the above-mentioned problems.

Disclosure of utility model

In order to overcome the defects in the prior art, the utility model aims to provide a semiconductor testing device.

In order to achieve the purpose, the technical scheme of the utility model is realized as follows: the utility model provides a semiconductor testing arrangement, includes testboard and support, the support is whole to be L type, install the test box on the support inside wall, the bottom of test box is located the top of testboard, the testboard is whole to be discoid, just testboard top evenly is provided with a plurality of chip positioning mechanism, the substructure of support with install transposition actuating mechanism between the testboard.

Preferably, the chip positioning mechanism comprises a chip positioning frame, a positioning assembly and a driving button, wherein the positioning assembly is installed at the inner attaching frame of the chip positioning frame, and the driving button is installed at the top of the front side frame of the chip positioning frame.

Preferably, the positioning assembly comprises a clamping assembly, a guiding assembly and a positioning clamping plate, wherein the clamping assembly and the guiding assembly are respectively installed inside the inner walls of the front frame and the rear frame inside the chip positioning frame, and the positioning clamping plate is provided with two parallel distribution driving ends and is in butt joint with the guiding ends of the clamping assembly.

Preferably, the clamping assembly comprises a double-shaft speed reducing motor, a driving screw rod and a threaded sleeve, wherein the double-shaft speed reducing motor is located at the center, the driving screw rod is respectively abutted to output ends on two sides of the double-shaft speed reducing motor, the threaded sleeve is respectively sleeved on two sides of the driving screw rod in a threaded manner, and the outer side faces of the threaded sleeve are respectively fixedly connected with one end of the same side of the locating clamping plate on two sides.

Preferably, the guide assembly comprises a guide column and a guide sleeve, the guide column is arranged in the frame at the front side of the chip positioning frame, the guide sleeve is provided with two guide sleeves which are respectively sleeved at two ends of the guide column in a sliding manner, and the outer side faces of the guide sleeve are respectively fixedly connected with one ends of the same sides of the positioning clamping plates at two sides.

Preferably, the transposition driving mechanism comprises a bottom bracket, a stepping motor and a supporting table, wherein the bottom bracket is arranged above the lower structure of the bracket, the supporting table is arranged at the top of the bottom bracket, the test table is integrally rotatably arranged at the top of the bracket, the stepping motor is arranged at the center of the bottom bracket, and an output shaft of the stepping motor penetrates through the supporting table and is fixedly connected with the center of the bottom of the test table.

Preferably, a test channel is arranged at the bottom of the test case.

The beneficial effects of the utility model are as follows:

According to the utility model, the chip positioning mechanism is arranged to realize positioning operation on different semiconductor chips, and meanwhile, a multi-station test bench and a transposition driving mechanism are matched, so that feeding and discharging personnel can be added to match with quick test operation of the test case, and the overall test efficiency is effectively improved.

Drawings

In the drawings:

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of a chip positioning mechanism according to the present utility model;

FIG. 3 is a schematic view of a positioning assembly according to the present utility model;

FIG. 4 is a schematic view of a clamping assembly according to the present utility model;

FIG. 5 is a schematic view of a guide assembly of the present utility model;

FIG. 6 is a right side view of the present utility model;

FIG. 7 is a schematic diagram of a test case according to the present utility model;

Reference numerals illustrate:

1. A test bench; 2. a chip positioning mechanism; 3. a transposition driving mechanism; 4. a bracket; 5. a test case; 21. a chip positioning frame; 22. a positioning assembly; 23. a drive button; 221. a clamping assembly; 222. a guide assembly; 223. positioning clamping plates; 2211. a double-shaft speed reducing motor; 2212. driving a screw rod; 2213. a threaded sleeve; 2221. a guide post; 2222. a guide sleeve; 31. a bottom bracket; 32. a stepping motor; 33. a support table; 51. and testing the channel.

Detailed Description

The present utility model will now be described in further detail with reference to the drawings and examples, wherein it is apparent that the examples described are only some, but not all, of the examples of the utility model. Embodiments of the utility model and features of the embodiments may be combined with each other without conflict. All other embodiments, based on the embodiments of the utility model, which would be apparent to one of ordinary skill in the art without inventive effort are within the scope of the utility model.

It should be noted that, in the embodiment of the present utility model, directional indications (such as up, down, left, right, front, and rear … …) are referred to, and the directional indications are merely used to explain the relative positional relationship, movement conditions, and the like between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, "a plurality of" means two or more. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed by the utility model.

Referring to fig. 1-7 of the specification, the utility model provides a semiconductor testing device, which comprises a testing table 1 and a bracket 4, and is characterized in that the bracket 4 is integrally L-shaped, a testing machine box 5 is installed on the inner side wall of the bracket 4, the bottom of the testing machine box 5 is positioned at the top of the testing table 1, the testing table 1 is integrally disc-shaped, a plurality of chip positioning mechanisms 2 are uniformly arranged at the top of the testing table 1, and a transposition driving mechanism 3 is installed between the lower structure of the bracket 4 and the testing table 1.

The chip positioning mechanism 2 includes a chip positioning frame 21, a positioning assembly 22, and a drive button 23. The chip positioning frame 21 is located on the inner side wall of the bracket 4, is rectangular in shape as a whole, and has an opening for placing and fixing the chip. The positioning component 22 is installed at the inner joint frame of the chip positioning frame 21, and the positioning component mainly clamps and guides the chip to realize accurate positioning. The driving button 23 is mounted on the top of the front side frame of the chip positioning frame 21, and the chip is released by pressing the button to perform replacement and positioning operations.

The positioning assembly 22 includes a chip positioning frame 21, a positioning clamping plate 223, and a positioning guide member. The positioning clamp 223 is located inside the chip positioning frame 21, and provides stable support while clamping the chip. The positioning guide component is composed of a guide column 2221 and a guide sleeve 2222, the guide column 2221 is installed in the front side frame of the chip positioning frame 21, the guide sleeve 2222 is sleeved at two ends of the guide column 2221 in a sliding manner, and the proper position of a chip in the positioning process is ensured.

The clamping assembly 221 is used for clamping a chip, and comprises a biaxial speed reducing motor 2211, a driving screw 2212 and a threaded sleeve 2213. The double-shaft gear motor 2211 is located at the center of the positioning clamping plate 223, and drives the threaded sleeve 2213 to move by driving the screw rod 2212 to rotate, so that the two side positioning clamping plates 223 are driven to gather and disperse, and the clamping and the releasing of chips are realized. The outer side surface of the threaded sleeve 2213 is fixedly connected with one end of the locating clamp plate 223, so that stability of the clamping assembly 221 and the locating clamp plate 223 is ensured.

The transposition driving mechanism 3 is mainly used for realizing transposition and positioning of the test bench 1. The bottom bracket 31 is mounted above the lower structure of the bracket 4, and the support stand 33 is mounted on top of the bottom bracket 31. The bottom bracket 31 is connected to the bracket 4 by fixing bolts, providing stable support. The stepping motor 32 is installed in the center of the bottom bracket 31, and the output shaft passes through the supporting table 33 and is fixedly connected with the center of the bottom of the test table 1. The rotation of the stepping motor 32 drives the rotation of the test bench 1, and the transposition driving mechanism can realize the transposition and positioning functions of the test bench.

When the chip positioning device is used, a user places the chip in the chip positioning frame when the chip needs to be positioned, and then presses the driving button to release the positioning component. The positioning assembly comprises a positioning clamping plate and a positioning guide part, and drives the screw rod to rotate through the driving of the double-shaft gear motor so as to push the threaded sleeve to move, thereby clamping the chip. When the chip needs to be replaced, the double-shaft gear motor reversely rotates to release the clamping, so that the chip is taken out or a new chip is clamped.

The chip in the forefront station is transferred to the inside of the test case for test operation, and the transposition driving mechanism consists of a bottom bracket, a stepping motor and a supporting table. The stepping motor drives the test board to rotate, so that the indexing and positioning functions are realized, the chip positioning mechanism is screwed into the test case at the test channel during the indexing, and the feeding and discharging speed is increased by adding the feeding and discharging personnel on a plurality of stations.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims

1. The utility model provides a semiconductor testing device, includes testboard (1) and support (4), its characterized in that, support (4) are the L type as a whole, install test box (5) on support (4) inside wall, the bottom of test box (5) is located the top of testboard (1), testboard (1) is whole discoid, just testboard (1) top evenly is provided with a plurality of chip positioning mechanism (2), the substructure of support (4) with install transposition actuating mechanism (3) between testboard (1).

2. The semiconductor testing device according to claim 1, wherein the chip positioning mechanism (2) comprises a chip positioning frame (21), a positioning assembly (22) and a driving button (23), the positioning assembly (22) is mounted at an inner attaching frame of the chip positioning frame (21), and the driving button (23) is mounted at the top of a front side frame of the chip positioning frame (21).

3. The semiconductor testing device according to claim 2, wherein the positioning assembly (22) comprises a clamping assembly (221), a guiding assembly (222) and a positioning clamping plate (223), the clamping assembly (221) and the guiding assembly (222) are respectively installed inside the inner walls of the front and rear frames inside the chip positioning frame (21), and the positioning clamping plate (223) is provided with two parallel driving ends of the clamping assembly (221) and the guiding ends of the guiding assembly (222) in butt joint.

4. A semiconductor testing device according to claim 3, wherein the clamping assembly (221) comprises a double-shaft speed reducing motor (2211), a driving screw rod (2212) and a threaded sleeve (2213), the double-shaft speed reducing motor (2211) is located at the center, the driving screw rod (2212) is respectively connected to two output ends on two sides of the double-shaft speed reducing motor (2211) in a butt joint mode, the threaded sleeve (2213) is respectively connected to the driving screw rod (2212) on two sides in a threaded sleeve mode, and outer side surfaces of the threaded sleeve (2213) on two sides are respectively fixedly connected with one end on the same side of the locating clamping plate (223) on two sides.

5. A semiconductor testing device according to claim 3, wherein the guide assembly (222) comprises a guide column (2221) and a guide sleeve (2222), the guide column (2221) is mounted in the front side frame of the chip positioning frame (21), the guide sleeve (2222) is provided with two ends respectively sleeved at the two ends of the guide column (2221) in a sliding manner, and the outer side surfaces of the guide sleeve (2222) at two sides are respectively fixedly connected with one ends of the same side of the positioning clamping plate (223) at two sides.

6. The semiconductor test device according to claim 1, wherein the transposition driving mechanism (3) comprises a bottom bracket (31), a stepping motor (32) and a supporting table (33), the bottom bracket (31) is installed above the lower structure of the bracket (4), the supporting table (33) is installed at the top of the bottom bracket (31), the test table (1) is integrally rotatably installed at the top of the bottom bracket (31), the stepping motor (32) is installed at the center of the bottom bracket (31), and an output shaft of the stepping motor (32) penetrates through the supporting table (33) to be fixedly connected with the center of the bottom of the test table (1).

7. A semiconductor testing device according to claim 1, characterized in that the bottom of the test case (5) is provided with a test channel (51).