CN220805805U - Intelligent switching device of soldering tin pump - Google Patents

Abstract

The utility model discloses an intelligent switching device of a soldering tin pump, which comprises a turntable bracket, a first soldering tin pump, a second soldering tin pump, a first lifting piece, a second lifting piece and a fixed ring, wherein the turntable bracket is provided with a first lifting piece; the first lifting piece and the second lifting piece are both movably arranged on the turntable bracket up and down; the first soldering tin pump is arranged at the top of the first lifting piece; the second soldering tin pump is arranged at the top of the second lifting piece; the upper end surface of the fixed ring is surrounded by a section of arched sloping platform; the bottom of the first lifting piece is provided with a first lower convex piece which can rotate along the upper end surface of the fixed ring; the bottom of the second lifting piece is provided with a second lower convex piece which can rotate along the upper end surface of the fixed ring; when the turntable bracket rotates to a first position, the first downward convex piece is propped against the upper top surface of the arched sloping platform to jack up the first soldering tin pump; when the turntable type bracket rotates to the second position, the second downward protruding piece is propped against the upper top surface of the arched slope table to jack up the second soldering tin pump, and the first soldering tin pump and the second soldering tin pump are switched at a high position through rotation, so that the occupied space of equipment can be reduced, and the uniform movement path is short, so that the working efficiency is high.

Description

Intelligent switching device of soldering tin pump

Technical Field

The utility model relates to the technical field of automation equipment, in particular to an intelligent switching device of a soldering tin pump.

Background

The soldering machine is intelligent automatic mechanical equipment, and generally, a large-size transparent window is basically arranged, so that the whole welding process is conveniently observed, and the soldering machine has very important effects on product research and development, process curve optimization and the like. The temperature control adopts a high-precision intuitive intelligent controller, the programmable perfect curve control is adopted, the temperature control is accurate, the parameter setting is simple and convenient, and the operation is easy. Can finish the welding of single and double-sided PCB boards in CHIP, SOP, PLCC, QFP, BGA packaging modes. The working efficiency is extremely high, one solder machine is added with one silk screen printing table and two workers, nearly 100 PCB boards with the largest size can be completed in one day, and the small size can reach thousands of PCB boards. The soldering machine changes the way that the soldering machine can only cool by means of natural cooling or pulling out the PCB outside the soldering machine, so that the reflow soldering process curve is more perfect, and the problems of damage and soldering displacement of surface mount devices are avoided.

For the existing soldering machine, because the soldering positions of the PCB are different, the large soldering points are needed to be soldered at some positions, and the small soldering points are needed to be soldered at some positions, so that the existing soldering machine generally needs to be provided with two soldering pumps with soldering nozzles with different inner diameters for pumping liquid soldering tin, the traditional corresponding two soldering pumps are basically arranged side by side, and the two corresponding soldering pumps are correspondingly driven to lift through two independent lifting devices arranged on a linear conveyor, for example, the lifting device A is arranged to control the lifting of the soldering pump A and the lifting device B is arranged to control the lifting of the soldering pump B; when the solder pump A is required to be used, the solder pump A is conveyed to a designated position through the linear conveyor, and the lifting device A controls the lifting preset stroke to enable the solder nozzle of the solder pump to be aligned with the solder point on the PCB at the corresponding designated position and work, and at the moment, the lifting device B also controls the lifting preset stroke to enable the solder pump B to be lowered to stop working; when the solder pump B is required to be used, the solder pump B is conveyed to a designated position through the linear conveyor, the lifting device B controls the lifting preset stroke to enable the solder nozzle of the solder pump to be aligned with the solder point on the PCB at the corresponding designated position and work, and at the moment, the lifting device A also controls the lifting preset stroke to enable the solder pump A to be lowered to stop working.

The soldering machine with the structure provided with two soldering pumps with different powers for pumping liquid soldering tin is widely used, but the inventor finds that the soldering machine still has certain defects and defects in practical work.

Specifically, on the one hand, when the linear conveyor is used to convey the solder pump a and the solder pump B to the same designated position in turn, the linear conveyor needs to be long enough, so that the occupied space of the whole equipment is greatly increased, the set hood is also necessarily required to be large enough, so that the volume of the whole equipment is greatly increased, and on the other hand, when the linear conveyor is used to convey the solder pump a and the solder pump B to the same designated position in turn or to different positions in turn, the operation is troublesome, the conveying path is long, the running speed is slow, and the working efficiency of the whole soldering machine cannot be effectively improved.

Therefore, the existing problems remain to be solved.

Disclosure of utility model

The present utility model aims to solve at least one of the technical problems in the related art to some extent. Therefore, the utility model aims to provide an intelligent switching device for a soldering tin pump.

In order to achieve one of the above objects, an intelligent switching device for a solder pump according to an embodiment of the present utility model includes a turntable bracket, a first solder pump, a second solder pump, a first lifting member, a second lifting member, and a fixing ring;

The first lifting piece and the second lifting piece are both arranged on the turntable bracket in an up-and-down movable way; the first soldering tin pump is fixedly arranged at the top of the first lifting piece; the second soldering tin pump is fixedly arranged at the top of the second lifting piece;

The fixed ring frame is arranged outside the bottom of the turntable type bracket, and the upper end surface of the fixed ring frame is provided with a section of arched slope table in a surrounding manner; the bottom of the first lifting piece is provided with a first lower protruding piece which is propped against the upper end face of the fixed ring and can rotate along the upper end face of the fixed ring; the bottom of the second lifting piece is provided with a second lower protruding piece which is propped against the upper end face of the fixed ring and can rotate along the upper end face of the fixed ring;

When the turntable bracket rotates to a first position, the first downward protruding piece is propped against the upper top surface of the arched sloping platform so as to drive the first lifting piece to lift and jack up the first soldering tin pump; when the turntable type bracket rotates to a second position, the second downward protruding piece is propped against the upper top surface of the arched sloping platform, so that the second lifting piece is driven to lift up to jack up the second soldering tin pump. In addition, the intelligent switching device for the solder pump according to the embodiment of the utility model can also have the following additional technical characteristics:

According to one embodiment of the utility model, the turntable bracket comprises a fixed base, a lower turntable rotatably sleeved on the upper part of the fixed base, an upper turntable erected above the lower turntable, a rotation driving motor downwards fixedly arranged on the upper end surface of the lower turntable and a gear coaxially fixedly arranged outside a rotating shaft at the lower end of the rotation driving motor;

The first lifting piece and the second lifting piece are both arranged on the upper turntable in an up-and-down movable way; the fixed ring frame is arranged outside the fixed base, a certain gap is formed between the inner surface of the fixed ring frame and the outer peripheral surface of the fixed base, and a circle of rotating teeth are arranged on the inner surface of the fixed ring frame; the gear is positioned in the gap and meshed with the rotating teeth.

According to one embodiment of the utility model, both lower ends of the arched ramp are smoothly transited to the upper end surface of the fixed ring.

According to one embodiment of the utility model, the first downward protruding member comprises a first fixed cylinder arranged at the bottom of the first lifting member and a first ball clamped in the first fixed cylinder; the second downward convex part comprises a second fixed cylinder arranged at the bottom of the second lifting part and a second ball clamped in the second fixed cylinder;

The lower part of the first fixed cylinder is provided with a first necking; the lower part of the first ball is exposed to the first necking; the lower part of the second fixed cylinder is provided with a second necking; the lower part of the second ball is exposed at the second necking.

According to one embodiment of the utility model, the first lifting member comprises a first top supporting plate, a first bottom supporting plate and a plurality of first guide columns uniformly connected between the periphery of the lower bottom surface of the first top supporting plate and the periphery of the upper end surface of the first bottom supporting plate;

The first soldering tin pump is upwards and fixedly arranged on the first top supporting plate; the upper turntable is provided with a plurality of first guide holes for correspondingly sleeving a plurality of first guide posts; the first fixing cylinder of the first lower protruding piece is vertically and fixedly arranged on the lower bottom surface of the first bottom supporting plate.

According to one embodiment of the utility model, the middle part of the first top support plate is provided with a first mounting opening penetrating through the upper end face and the lower end face of the first top support plate; the upper turntable is provided with a first through hole penetrating through the upper end face and the lower end face of the upper turntable and facing the first mounting hole; the upper part of the first soldering tin pump is clamped in the first mounting port, and the lower part of the first soldering tin pump downwards passes through the first passing port.

According to one embodiment of the utility model, the second lifting member comprises a second top supporting plate, a second bottom supporting plate and a plurality of second guide posts uniformly connected between the periphery of the lower bottom surface of the second top supporting plate and the periphery of the upper end surface of the second bottom supporting plate;

The second soldering tin pump is upwards and fixedly arranged on the second top supporting plate; the upper turntable is provided with a plurality of second guide holes for correspondingly sleeving and fixing a plurality of second guide posts; the second fixing cylinder of the second lower protruding piece is vertically and fixedly arranged on the lower bottom surface of the second bottom supporting plate.

According to one embodiment of the utility model, the middle part of the second top support plate is provided with a second mounting opening penetrating through the upper end face and the lower end face of the second top support plate; the upper turntable is also provided with a second through hole penetrating through the upper end face and the lower end face of the upper turntable and facing the second mounting hole; the upper part of the second soldering tin pump is clamped in the second mounting port, and the lower part of the second soldering tin pump downwards passes through the second passing port.

According to one embodiment of the utility model, the turntable bracket further comprises a jacking device;

The jacking device is connected between the lower turntable and the upper turntable; when the jacking device controls the upper rotary table to ascend by a preset stroke, the jacking device can jack the first top supporting plate and/or the second top supporting plate.

According to one embodiment of the utility model, the device further comprises a CCD camera for monitoring the welding state of the welding part of the incoming material of the PCB;

The CCD camera is arranged on the upper end face of the upper rotary disc and is positioned between the first soldering tin pump and the second soldering tin pump.

The beneficial effects of the utility model are as follows:

The first point, under the combination of carousel formula bracket, first lifting part, second lifting part and solid fixed ring, can make first soldering tin pump and second electromagnetic pump can be according to the actual need not divide the front and back by the jack-up certain height in order to weld the solder joint on the PCB board, in this process, mainly make first soldering tin pump and second electromagnetic pump carry out position switching and lift switch through carousel formula bracket rotation, especially when there is big or small to a welding position solder joint on the PCB board, only need with the top surface just to corresponding welding position on the arch sloping platform, so, under carousel formula bracket's rotation, can not divide the order first soldering tin pump to rotate just to corresponding welding position and jack-up preset stroke and weld through its little to corresponding welding position, and order the second soldering tin pump solder joint to just to corresponding welding position and jack-up preset stroke and weld through its big to corresponding welding position, for above-mentioned relative operation, the relative operation of adopting the mode of first soldering tin pump of rotation just corresponding welding position and jack-up preset stroke, the whole soldering tin machine of the application occupies the soldering tin, can reduce the whole size of the soldering tin equipment of the application, the whole size of the soldering tin equipment of the application is greatly reduced, even the application is greatly reduced.

The second point adopts the pivoted mode to come to the first soldering tin pump with the switching of second soldering tin pump carries out the switching of position and high-order switching, compares in the background art the mode of operation, easy and simple to handle, and relatively speaking, first soldering tin pump with the equal motion path of second soldering tin pump is short for it moves up fast, can effectively improve the work efficiency of whole soldering tin machine.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a front view of an intelligent switching device of a solder pump of the present utility model;

FIG. 2 is a schematic diagram 1 of the whole structure of an intelligent switching device of a soldering tin pump;

FIG. 3 is an exploded view of the intelligent switching device of the solder pump of the present utility model;

FIG. 4 is a schematic view 2 of the whole structure of the intelligent switching device of the soldering tin pump;

FIG. 5 is an exploded view of the intelligent switching device of the solder pump of the present utility model;

Reference numerals:

the intelligent switching device 1000 of the soldering tin pump;

a turntable type carriage 10;

A fixed base 101; a lower turntable 102; an upper turntable 103; a first guide hole 1031; a first via 1032; a second guide hole 1033; a second via 1034; a drive motor 104; a gear 105; a jacking device 106;

A first solder pump 20;

A second solder pump 30;

A first elevating member 40;

a first lower convex member 40a; a first fixed cylinder 40a1; a first ball 40a2; a first top pallet 401; a first bottom plate 402; a first guide post 403;

a second elevating member 50;

A second lower convex member 50a; a second fixed cylinder 50a1; a second ball 50a2; a second top pallet 501; a second bottom plate 502; a second guide post 503;

a fixing ring 60;

an arched ramp 601; rotating teeth 602;

A CCD camera 70;

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below are exemplary and intended to illustrate the present utility model and should not be construed as limiting the utility model, and all other embodiments, based on the embodiments of the present utility model, which may be obtained by persons of ordinary skill in the art without inventive effort, are within the scope of the present utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings of the specification are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following describes in detail the intelligent switching apparatus 1000 for a solder pump according to an embodiment of the present utility model with reference to the accompanying drawings.

Referring to fig. 1 to 5, an intelligent switching device 1000 for a solder pump according to an embodiment of the present utility model includes a turntable bracket 10, a first solder pump 20, a second solder pump 30, a first lifter 40, a second lifter 50, and a fixing ring 60;

Wherein, the first lifting member 40 and the second lifting member 50 are both movably mounted on the turntable bracket 10; the first solder pump 20 is fixedly arranged at the top of the first lifting member 40; the second solder pump 30 is fixedly arranged at the top of the second lifting member 50;

The fixing ring 60 is arranged outside the bottom of the turntable bracket 10 in a framing manner, and the upper end surface of the fixing ring is provided with a section of arched slope 601 in a surrounding manner; the bottom of the first lifting member 40 is provided with a first downward protruding member 40a that abuts against the upper end surface of the fixed ring 60 and can rotate along the upper end surface of the fixed ring 60; the bottom of the second lifting member 50 is provided with a second downward protruding member 50a which is abutted against the upper end surface of the fixed ring 60 and can rotate along the upper end surface of the fixed ring 60;

and in the specific implementation, the inner diameter of the welding nozzle of the first soldering tin pump 20 is smaller than that of the welding nozzle of the second soldering tin pump 30;

When the turntable bracket 10 rotates to the first position, the first downward protruding member 40a abuts against the upper top surface of the arched ramp 601, so as to drive the first lifting member 40 to lift up and jack up the first solder pump 20; when the turntable bracket 10 rotates to the second position, the second downward protruding member 50a abuts against the upper top surface of the arched ramp 601, so as to drive the second lifting member 50 to lift up and jack up the second solder pump 30.

Based on the above, it is clear that the present application is mainly used as the intelligent switching device 1000 for solder pump when it is implemented.

Specifically, when the present application is applied and assembled according to the above-mentioned structure, and when soldering points on a certain part of a PCB are required to be soldered using the soldering machine of the present application, the whole body formed by the present application is mounted on a two-dimensional moving table of the soldering machine which can move left and right and back and forth, and then the first soldering pump 20 and the second soldering pump 30 can be controlled to operate without moving back and forth to a designated position by manipulating the turntable type bracket 10.

Specifically:

As shown in fig. 1, 2 and 4, when the solder joint on the PCB needs to be soldered, the turntable bracket 10 is rotated to the first position, at this time, the first downward protruding member 40a will abut against the upper top surface of the arched sloping platform 601 to drive the first lifting member 40 to lift up the first solder pump 20, and at this time, the second downward protruding member 50a will be at a low position, so that the second solder pump 30 fixed on the top of the second lifting member 50 is also at a low position, so that the solder joint on the PCB is aligned to the small position of the solder joint on the PCB by the two-dimensional moving platform of the soldering machine, which can move left and right and moves back and forth, so that the solder joint on the PCB can be soldered by the solder joint on the PCB by the solder joint of the first solder pump 20, at this time, and at this time, the solder joint on the second solder joint is not blocked by the second solder pump 30, and the solder joint on the PCB is not blocked by the second solder pump 30, so that the solder joint on the PCB is not smoothly soldered.

When the soldering is required to be performed at the position with larger soldering points on the PCB, the turntable bracket 10 is rotated to the second position, at this time, the second downward protruding member 50a is abutted to the upper top surface of the arched sloping platform 601 to drive the second lifting member 50 to lift up and jack up the second solder pump 30, and at this time, the first downward protruding member 40a is positioned at a low position, so that the first solder pump 20 fixed at the top of the first lifting member 40 is also positioned at a low position, and thus, the solder nozzle of the second solder pump 30 is aligned to the position with larger soldering points on the PCB by the two-dimensional moving platform capable of moving left and right and moving back and forth of the soldering machine, so that the solder nozzle of the second solder pump 30 can be utilized to perform soldering at the position with larger soldering points on the PCB, and at this time, the solder nozzle of the first pump 20 is positioned at a low position, so that the solder nozzle of the first pump 20 is far away from the position on the PCB, thereby preventing the solder pump 30 from smoothly performing stable operation.

For the above, it can be summarized that:

on the one hand, in the combination of the turntable bracket 10, the first lifting member 40, the second lifting member 50 and the fixing ring 60, the first solder pump 20 and the second electromagnetic pump can be lifted up to a certain height according to actual needs to weld the solder joints on the PCB board, in this process, mainly, the turntable bracket 10 rotates to switch the positions of the first solder pump 20 and the second electromagnetic pump and lift up and down to switch the positions of the solder joints, especially when a solder joint on a welding position on the PCB board is large or small, only the top surface of the arched ramp 601 is just opposite to the corresponding welding position, so that under the rotation of the turntable bracket 10, the first solder pump 20 can be driven to rotate to the corresponding welding position and lift up to a preset stroke to weld the small solder joint on the corresponding welding position, and the second solder pump 30 can be driven to rotate to the corresponding welding position and lift up to the preset stroke to switch the solder joints on the corresponding position by the large welding position, thus the whole size of the solder machine can be greatly reduced, and the whole soldering machine can be greatly reduced, even if the welding device is greatly switched by adopting the relative mode of the application, and the soldering machine is greatly reduced.

On the other hand, the first solder pump 20 and the second solder pump 30 are switched in a rotating manner, so that compared with the operation manner in the background art, the operation is simple and convenient, and the motion paths of the first solder pump 20 and the second solder pump 30 are relatively short, so that the operation speed is high, and the working efficiency of the whole soldering machine can be effectively improved.

Furthermore, through the optimization design, the whole structure formed by the application has strong practicability and good use effect.

Further, in the embodiment, as shown in fig. 3 and 5, according to an embodiment of the present utility model, the turntable bracket 10 includes a fixed base 101, a lower turntable 102 rotatably sleeved on the upper portion of the fixed base 101, an upper turntable 103 mounted above the lower turntable 102, a rotation motor 104 fixed on the upper end surface of the lower turntable 102 downward, and a gear 105 coaxially fixed on the outer side of the rotation shaft at the lower end of the rotation motor 104;

Based on this, in the present solution, the first lifting member 40 and the second lifting member 50 are both movably mounted on the upper turntable 103 up and down; the fixed ring 60 is arranged outside the fixed base 101 in a frame manner, a certain gap is formed between the inner surface of the fixed ring and the outer peripheral surface of the fixed base 101, and a circle of rotating teeth 602 are arranged on the inner surface of the fixed ring; the gear 105 is positioned in the gap and is engaged with the rotary teeth 602.

Therefore, the fixing base 101 and the fixing ring 60 are both fixed on a two-dimensional moving table of the soldering machine, which can move left and right and move back and forth, and the gear 105 is driven to rotate by the driving motor 104, at this time, the gear 105 rotates around the fixing ring 60 in the fixing ring 60, so that the lower turntable 102 can be driven to rotate on the upper portion of the fixing base 101 and the upper turntable 103 fixed on the lower turntable is driven to rotate, and then the first lifting member 40 and the second lifting member 50 are driven to rotate by the upper turntable 103, so that the position switching and the synchronous lifting height switching of the first soldering tin pump 20 and the second soldering tin pump 30 are finally realized.

Therefore, the turntable bracket 10 and the fixing ring 60 are designed in an optimized manner, so that the whole structure is compact while the good driving function can be maintained, and the occupied space is small.

Still further, in the embodiment, as shown in fig. 3 and 5, both lower ends of the arched ramp 601 smoothly transition to the upper end surface of the fixing ring 60 according to an embodiment of the present utility model.

Therefore, when the first downward protruding member 40a rotates along the upper end surface of the fixing ring 60 and the upper surface of the arch ramp 601, it can smoothly rotate along one of the lower ends of the arch ramp 601 to the upper surface of the arch ramp 601, and smoothly rotate along the upper surface of the arch ramp 601 to the other lower end of the arch ramp 601 to the upper surface of the fixing ring 60, and similarly, when the second downward protruding member 50a rotates along the upper end surface of the fixing ring 60 and the upper surface of the arch ramp 601, it can smoothly rotate along one of the lower ends of the arch ramp 601 to the upper surface of the arch ramp 601, and smoothly rotate along the upper surface of the arch ramp 601 to the other lower end of the arch ramp 601 to the upper surface of the fixing ring 60.

In this way, even when the first lower protruding member 40a and the second lower protruding member 50a rotate circumferentially along the upper end surface of the fixing ring 60 and the upper top surface of the arched ramp 601, the smoothness of rotation is good, no frustration is caused, and the stability of movement is good when the first solder pump 20 and the second solder pump 30 switch positions and the lifting height are synchronously switched.

In addition, in the implementation, according to an embodiment of the present utility model, the first protruding member 40a includes a first fixing cylinder 40a1 provided at the bottom of the first lifting member 40 and a first ball 40a2 engaged in the first fixing cylinder 40a 1; the second downward protruding member 50a includes a second fixing cylinder 50a1 disposed at the bottom of the second lifting member 50, and a second ball 50a2 locked in the second fixing cylinder 50a 1;

Based on this, in the present solution, a first shrinkage opening is formed at the lower portion of the first fixing cylinder 40a 1; the lower part of the first ball 40a2 is exposed to the first shrinkage opening; a second necking is formed at the lower part of the second fixed cylinder 50a 1; the lower portion of the second ball 50a2 is exposed at the second constriction.

It will be appreciated that, in practical use, when the first lower protruding member 40a rotates along the upper end surface of the fixed ring 60 and the upper top surface of the arched ramp 601, the first balls 40a2 rotate along the upper end surface of the fixed ring 60 and the upper top surface of the arched ramp 601 in a rolling manner, so that friction between the bottom of the first lower protruding member 40a and the upper end surface of the fixed ring 60 and the upper top surface of the arched ramp 601 is greatly reduced, the first lower protruding member 40a is not easily worn, so that the service life is long, and when the second lower protruding member 50a rotates along the upper end surface of the fixed ring 60 and the upper top surface of the arched ramp 601, the second balls 50a2 rotate along the upper end surface of the fixed ring 60 and the upper top surface of the arched ramp 601 in a rolling manner, so that friction between the bottom of the second lower protruding member 50a and the upper end surface of the fixed ring 60 and the upper top surface of the arched ramp 601 is greatly reduced, so that the service life of the second lower protruding member 50a is not easily worn.

Furthermore, through the optimization design, the whole formed by the application can effectively improve the use effect.

Further, in the embodiment, referring to fig. 3 and 5, according to an embodiment of the present utility model, the first lifter 40 includes a first top plate 401, a first bottom plate 402, and a plurality of first guide posts 403 uniformly connected between the periphery of the bottom surface of the first top plate 401 and the periphery of the upper end surface of the first bottom plate 402;

Wherein the first solder pump 20 is fixed on the first top support plate 401 upwards; a plurality of first guiding holes 1031 for corresponding interference fit sleeved with a plurality of first guiding columns 403 are formed in the upper turntable 103; the first fixing cylinder 40a1 of the first protruding element 40a is vertically fixed on the lower bottom surface of the first bottom plate 402.

Therefore, it can be understood that when the first ball 40a2 of the first protruding member 40a rotates from the upper end surface of the fixed ring 60 to the upper top surface of the arched ramp 601 in a rolling manner, even if the plurality of first guide posts 403 can be automatically lifted up along the plurality of first guide holes 1031, the first solder pump 20 fixed on the first top support plate 401 is lifted up by a preset stroke, so as to solder a small solder joint at a certain soldering position on the PCB board through the solder nozzle after the lifting up.

For the above related operation, the plurality of first guide posts 403 are correspondingly lifted along the plurality of first guide holes 1031, so that the first solder pump 20 is good in vertical direction and not easy to shift circumferentially, and then is not easy to shift circumferentially when lifted along the vertical direction, so that the operation is stable.

In addition, in the implementation, as still referring to fig. 3 and 5, according to an embodiment of the present utility model, a first mounting hole penetrating through the upper and lower end surfaces of the first top support plate 401 is formed in the middle of the first top support plate; the upper turntable 103 is provided with a first through hole 1032 penetrating through the upper end surface and the lower end surface and facing the first mounting hole; the upper part of the first solder pump 20 is clamped in the first mounting port, and the lower part passes through the first through port 1032.

Therefore, through the structural optimization design, the lower part of the first solder pump 20 is limited between the first top support plate 401 and the first bottom support plate 402, and is surrounded by the plurality of first guide posts 403, so that the protection effect is good, the connection structure between the first solder pump 20, the turntable bracket 10 and the first lifting member 40 is more compact, and the connection structure is not easy to be collided by foreign objects.

Again, in the embodiment, as shown in fig. 3 and 5, according to one embodiment of the present utility model, the second lifter 50 includes a second top supporting plate 501, a second bottom supporting plate 502, and a plurality of second guiding columns 503 uniformly connected between the periphery of the lower bottom surface of the second top supporting plate 501 and the periphery of the upper end surface of the second bottom supporting plate 502;

Wherein the second solder pump 30 is fixed on the second top supporting plate 501 upwards; a plurality of second guiding holes 1033 for correspondingly sleeving and fixing a plurality of second guiding columns 503 are formed in the upper turntable 103; the second fixing cylinder 50a1 of the second downward protruding member 50a is vertically fixed on the lower bottom surface of the second bottom plate 502.

Therefore, it can be understood that when the second ball 50a2 of the second downward protruding member 50a rotates from the upper end surface of the fixed ring 60 to the upper top surface of the arched ramp 601 in a rolling manner, even if the plurality of second guiding columns 503 can be automatically lifted up along the plurality of second guiding holes 1033, the second solder pump 30 fixed on the second top supporting plate 501 is lifted up by a preset stroke, so as to solder a large solder joint of a certain soldering position on the PCB board through the solder nozzle after the lifting up.

For the above related operation, the second guiding posts 503 are correspondingly lifted along the second guiding holes 1033, so that the second guiding posts are not easy to shift circumferentially, and then the second solder pump 30 is not easy to shift circumferentially when lifted along the vertical direction, so that the operation is stable.

In a specific implementation, according to an embodiment of the present utility model, a second mounting hole penetrating through the upper and lower end surfaces of the second top supporting plate 501 is formed in the middle of the second top supporting plate; the upper turntable 103 is also provided with a second through hole 1034 penetrating through the upper end surface and the lower end surface and facing the second mounting hole; the upper part of the second solder pump 30 is clamped in the second mounting port, and the lower part passes through the second through port 1034.

Therefore, through the structural optimization design, the lower part of the second solder pump 30 is limited between the second top supporting plate 501 and the second bottom supporting plate 502, and is surrounded by the plurality of second guide posts 503, so that the second solder pump is protected, is not easy to collide with foreign objects, and has a more compact connection structure with the turntable bracket 10 and the second lifting member 50.

Therefore, through the above-mentioned optimization design, the connection structure between the first solder pump 20 and the turntable bracket 10 and the second lifting member 50 is very compact, and when the connection structure between the second solder pump 30 and the turntable bracket 10 and the second lifting member 50 is also very compact, the whole formed by the application is small in real occupation space, and the hood arranged on the soldering machine provided with the application is also very small in real occupation space, so that the volume of the whole soldering machine equipment can be very small, and the whole soldering machine equipment can be still installed and used in a narrow space environment.

It should be noted that, in the embodiment, as shown in fig. 1, 2 and 4, the turntable bracket 10 further includes a jacking device 106 according to one embodiment of the present utility model;

Wherein the jacking device 106 is connected between the lower turntable 102 and the upper turntable 103; when the jacking device 106 controls the upper turntable 103 to ascend by a preset stroke, it may jack up the first top tray 401 and/or the second top tray 501.

For example, when the first solder pump 20 is kept at a high position and the second solder pump 30 is kept at a low position, the jacking device 106 controls the upper turntable 103 to lift for a short stroke, so that the upper turntable 103 horizontally jacks up the second top supporting plate 501 and the second solder pump 30 fixed thereon, so that the second solder pump 30 can be stably supported, and the jacking force of the second lower protruding member 50a to the upper end surface of the fixed ring 60 can be greatly reduced, so that the service lives of the fixed ring 60 and the second lower protruding member 50a are long.

Similarly, when the second solder pump 30 is kept at a high position and the first solder pump 20 is kept at a low position, the jacking device 106 controls the upper turntable 103 to ascend for a short stroke, so that the upper turntable 103 horizontally jacks up the first top supporting plate 401 and the first solder pump 20 fixed on the first top supporting plate, the first solder pump 20 can be stably supported, the jacking force of the first lower protruding part 40a on the upper end face of the fixed ring 60 can be greatly reduced, and the service lives of the fixed ring 60 and the second lower protruding part 50a are long.

When the present application is not used, the jacking device 106 may control the upper turntable 103 to ascend for a longer stroke, so that the upper turntable 103 horizontally jacks the first top plate 401 and the first solder pump 20 fixed thereon, and horizontally jacks the second top plate 501 and the second solder pump 30 fixed thereon, so that both the first solder pump 20 and the second solder pump 30 can be stably supported, and the jacking forces of the first lower convex piece 40a and the second lower convex piece 50a on the upper end surface of the fixed ring 60 and the upper top surface of the arched sloping table 601 can be greatly reduced, so that the service lives of the fixed ring 60 and the arched sloping table 601 are longer.

On this basis, in a preferred technical solution, as shown in fig. 3 and 5, a section of the arched ramp 601 is circumferentially disposed on the periphery of the upper end surface of the fixed ring 60, and the area of the periphery of the fixed ring 60 other than the arched ramp 601 is circumferentially cut to form a hollowed area, so that, on one hand, the first solder pump 20 is kept at a high position and the second solder pump 30 is kept at a low position, and the lifting device 106 controls the upper turntable 103 to lift a relatively short stroke, so that the second top pallet 501 and the second solder pump 30 fixed on the upper turntable are horizontally lifted, the second solder pump 30 can be stably supported by lifting, the bottom of the second lower protruding member 50a is in a suspended state, so that the service life of the fixed ring 60 and the second lower protruding member 50a can be greatly prolonged, on the other hand, the second solder pump 30 is kept at a high position, and the first solder pump 103 is kept at a low position, and the lifting device is kept at a low position, so that the service life of the first solder pump 30 is prolonged, and the first solder pump 20 is kept at a short position, and the first lifting member 40 is kept at a high position, so that the service life of the second lifting member 50a is prolonged, and the second lifting member 20 is kept at a short position, and the second lifting member is kept at a lower position, and the second lifting member is stable, and the service life is greatly prolonged, and the service life is prolonged, and the service life of the second lifting member is prolonged.

In addition, when the first solder pump 20 and the second solder pump 30 are in the switching positions, the bottom of the second lower protruding member 50a is in a suspended state and does not abut against the upper end surface of the fixed ring 60 during rotation when the second solder pump 30 in the lower position is supported by the upper turntable 103, so that the first solder pump 20 in the lower position is less prone to wear, and similarly, the bottom of the first lower protruding member 40a is also in a suspended state and does not abut against the upper end surface of the fixed ring 60 during rotation when the first solder pump 20 in the lower position is supported by the upper turntable 103.

Furthermore, through the optimized design, the whole formed by the application can further improve the use effect.

It should be further added that, in the implementation, according to an embodiment of the present utility model, the present utility model further includes a CCD camera 70 for monitoring the soldering state of the incoming material soldering portion of the PCB board;

The CCD camera 70 is mounted on the upper end surface of the upper turntable 103 and is located between the first solder pump 20 and the second solder pump 30.

Therefore, when the application is actually used, the CCD camera 70 works to monitor the welding state of the welding part of the incoming material of the PCB, so that real-time monitoring and knowing can be realized, and because the CCD camera 70 is arranged on the upper end surface of the upper turntable 103 and is positioned between the first soldering tin pump 20 and the second soldering tin pump 30, the CCD camera 70 is shared no matter the first soldering tin pump 20 works or the second soldering tin pump 30 works, and the use cost of the CCD camera 70 can be reduced, so that two CCD cameras 70 are not needed.

It should be further noted that, in implementation, according to an embodiment of the present utility model, the first solder pump 20 and the second solder pump 30 are preferably electromagnetic solder pumps.

In addition, in a specific implementation, according to an embodiment of the present utility model, the first lifting member 40 and the second lifting member 50 are symmetrically disposed at two sides of the central axis of the fixing ring 60, so that the first solder pump 20 and the second solder pump 30 are also symmetrically disposed, and when the turntable bracket 10 rotates from the first position to the second position, the rotation angle is 180 degrees, so that the rotation position and the lifting height of the first solder pump 20 and the second solder pump 30 can be well switched synchronously during the rotation process.

And in practice, the jacking device 106 is preferably a screw drive linear module, an electro-hydraulic lifting module, or a cylinder drive linear module, which are common in the prior art, and details thereof are not described herein.

Other embodiments, etc., are not illustrated herein.

In summary, in the embodiment of the intelligent switching device 1000 for solder pump provided by the application, under the combination of the turntable bracket 10, the first lifting member 40, the second lifting member 50 and the fixing ring 60, the first solder pump 20 and the second electromagnetic pump can be driven to rotate to the corresponding welding position and lift the corresponding welding point by lifting the corresponding welding point by a certain height according to actual needs, in this process, mainly, the turntable bracket 10 rotates to enable the first solder pump 20 and the second electromagnetic pump to perform position switching and lifting switching, especially when a welding point at a certain welding position on a PCB board is large or small, only the top surface of the arched sloping table 601 is just opposite to the corresponding welding position, so that under the rotation of the turntable bracket 10, the first solder pump 20 can be driven to rotate to the corresponding welding position and lift the preset stroke to weld the corresponding welding point by the small welding point, and the second solder pump 30 can be driven to rotate to the corresponding position and lift the corresponding welding point by the small welding point, and the whole welding point can be driven to the soldering point by the small welding point, and the whole welding machine can occupy a large size, and the size of the whole welding machine can be reduced, and the size can be reduced compared with the welding device.

And, adopt the pivoted mode to carry out the switching of position and high-order switching to first soldering tin pump 20 with second soldering tin pump 30, compare in the prior art the operation mode, easy and simple to handle, and relatively speaking, first soldering tin pump 20 with the equal motion path of second soldering tin pump 30 is short for it moves fast, can effectively improve the work efficiency of whole soldering tin machine.

Furthermore, the intelligent switching device 1000 for the soldering tin pump provided by the application is very strong in practicality and excellent in use effect, so that the intelligent switching device has very good market popularization value, is very popular, and can be effectively popularized.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims (10)

1. The intelligent switching device for the soldering tin pump is characterized by comprising a turntable bracket, a first soldering tin pump, a second soldering tin pump, a first lifting piece, a second lifting piece and a fixing ring;

the first lifting piece and the second lifting piece are both arranged on the turntable bracket in an up-and-down movable way; the first soldering tin pump is fixedly arranged at the top of the first lifting piece; the second soldering tin pump is fixedly arranged at the top of the second lifting piece;

The fixed ring frame is arranged outside the bottom of the turntable type bracket, and the upper end surface of the fixed ring frame is provided with a section of arched sloping platform in a surrounding manner; the bottom of the first lifting piece is provided with a first lower convex piece which is propped against the upper end face of the fixed ring and can rotate along the upper end face of the fixed ring; the bottom of the second lifting piece is provided with a second lower convex piece which is propped against the upper end face of the fixed ring and can rotate along the upper end face of the fixed ring;

When the turntable bracket rotates to a first position, the first downward convex piece is propped against the upper top surface of the arched sloping platform so as to drive the first lifting piece to lift up and jack up the first soldering tin pump; when the turntable bracket rotates to the second position, the second downward convex piece is propped against the upper top surface of the arched sloping platform so as to drive the second lifting piece to rise and jack up the second soldering tin pump.

2. The intelligent switching device of the soldering tin pump according to claim 1, wherein the turntable bracket comprises a fixed base, a lower turntable rotatably sleeved on the upper part of the fixed base, an upper turntable erected above the lower turntable, a rotation driving motor downwards fixedly arranged on the upper end surface of the lower turntable and a gear coaxially fixedly arranged outside a rotating shaft at the lower end of the rotation driving motor;

The first lifting piece and the second lifting piece are both arranged on the upper turntable in an up-and-down movable way; the fixed ring frame is arranged outside the fixed base, a certain gap is formed between the inner surface of the fixed ring frame and the outer peripheral surface of the fixed base, and a circle of rotating teeth are arranged on the inner surface of the fixed ring frame; the gear is positioned in the gap and meshed with the rotating teeth.

3. The intelligent switching device of a solder pump according to claim 2, wherein both lower ends of the arched ramp are smoothly transited to the upper end surface of the fixing ring.

4. The intelligent switching device of a solder pump according to claim 3, wherein the first downward protruding member comprises a first fixed cylinder arranged at the bottom of the first lifting member and a first ball clamped in the first fixed cylinder; the second lower convex part comprises a second fixed cylinder arranged at the bottom of the second lifting part and a second ball clamped in the second fixed cylinder;

The lower part of the first fixed cylinder is provided with a first necking; the lower part of the first ball is exposed to the first necking; the lower part of the second fixed cylinder is provided with a second necking; the lower part of the second ball is exposed at the second shrinkage.

5. The intelligent switching device of a solder pump according to claim 4, wherein the first lifting member comprises a first top support plate, a first bottom support plate and a plurality of first guide posts uniformly connected between the periphery of the lower bottom surface of the first top support plate and the periphery of the upper end surface of the first bottom support plate;

The first soldering tin pump is upwards and fixedly arranged on the first top supporting plate; the upper turntable is provided with a plurality of first guide holes for correspondingly sleeving a plurality of first guide posts; the first fixed cylinder of the first lower convex piece is vertically fixed on the lower bottom surface of the first bottom supporting plate.

6. The intelligent switching device of a soldering tin pump according to claim 5, wherein the middle part of the first top support plate is provided with a first mounting opening penetrating through the upper end face and the lower end face of the first top support plate; the upper rotary disc is provided with a first through hole penetrating through the upper end face and the lower end face of the upper rotary disc and facing the first mounting hole; the upper part of the first soldering tin pump is clamped in the first mounting port, and the lower part of the first soldering tin pump downwards passes through the first through port.

7. The intelligent switching device of a solder pump according to claim 6, wherein the second lifting member comprises a second top support plate, a second bottom support plate and a plurality of second guide posts uniformly connected between the periphery of the lower bottom surface of the second top support plate and the periphery of the upper end surface of the second bottom support plate;

The second soldering tin pump is fixedly arranged on the second top supporting plate upwards; the upper turntable is provided with a plurality of second guide holes for correspondingly sleeving and fixing a plurality of second guide posts; the second fixing cylinder of the second lower convex piece is vertically and fixedly arranged on the lower bottom surface of the second bottom supporting plate.

8. The intelligent switching device of the soldering tin pump according to claim 7, wherein the middle part of the second top supporting plate is provided with a second mounting opening penetrating through the upper end face and the lower end face of the second top supporting plate; the upper rotary disc is also provided with a second through hole penetrating through the upper end face and the lower end face and facing the second mounting hole; the upper part of the second soldering tin pump is clamped in the second mounting port, and the lower part of the second soldering tin pump downwards passes through the second through port.

9. The intelligent switching device of a solder pump according to claim 7, wherein the turntable bracket further comprises a jacking device;

The jacking device is connected between the lower turntable and the upper turntable; when the jacking device controls the upper rotary table to ascend for a preset stroke, the jacking device can jack the first jacking plate and/or the second jacking plate.

10. The intelligent switching device of a solder pump according to any one of claims 2-9, further comprising a CCD camera for monitoring a soldering state of a solder joint of the incoming PCB;

The CCD camera is arranged on the upper end face of the upper rotary table and is positioned between the first soldering tin pump and the second soldering tin pump.