CN220776315U - Heat dissipation assembly and power conversion device - Google Patents
Heat dissipation assembly and power conversion device Download PDFInfo
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- CN220776315U CN220776315U CN202320460827.5U CN202320460827U CN220776315U CN 220776315 U CN220776315 U CN 220776315U CN 202320460827 U CN202320460827 U CN 202320460827U CN 220776315 U CN220776315 U CN 220776315U
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- heat
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 title abstract description 56
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 55
- 238000003466 welding Methods 0.000 claims description 32
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 239000000463 material Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000014509 gene expression Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The embodiment of the application provides a heat dissipation assembly and a power conversion device. The heat dissipation assembly includes: the circuit board comprises a first surface and a second surface which are oppositely arranged, and a through hole penetrating through the first surface and the second surface is formed in the circuit board; a power device disposed on the first surface and covering the through hole; the first radiator comprises a body and a boss part convexly arranged on the body, the body is positioned on one side of the second surface of the circuit board, the boss part is accommodated in the through hole, and one surface of the boss part, which is away from the body, is connected with the power device. Because the boss part of the first radiator is accommodated in the through hole, the boss part is connected with the power device, the thermal resistance of the circuit board can be effectively reduced, the low thermal resistance connection between the first radiator and the power device is realized, the heat dissipation efficiency of the heat dissipation assembly is effectively improved, and the heat dissipation effect of the first radiator on the power device is effectively improved.
Description
Technical Field
The present disclosure relates to semiconductor technology, and more particularly, to a heat dissipating assembly and a power conversion device.
Background
The power devices are typically disposed on a circuit board. The power device generates a large amount of heat during operation, and effective heat dissipation is required to be performed on the power device, so that the power device can operate effectively and safely. The heat dissipation mode of the power device mainly comprises the following steps: the method (1) is that a radiator and/or a thermal interface material are/is arranged on the surface of the circuit board, which is away from the power device, for radiating; the second mode is that a radiator and/or a thermal interface material are/is arranged on one side of the power device, which is away from the circuit board, to radiate heat; mode (3), mode (1) is combined with mode (2). However, the heat dissipation efficiency of the heat sink to the power device is affected due to the large thermal resistance of the circuit board and the large thermal resistance of the thermal interface material.
Disclosure of Invention
The embodiment of the application provides a heat dissipation assembly and a power conversion device capable of improving heat dissipation efficiency.
In a first aspect, embodiments of the present application provide a heat dissipating assembly, the heat dissipating assembly comprising: the circuit board comprises a first surface and a second surface which are oppositely arranged, and a through hole penetrating through the first surface and the second surface is formed in the circuit board; a power device disposed on the first surface and covering the through hole; the first radiator comprises a body and a boss portion, wherein the body and the circuit board are arranged in a stacked mode and are connected with the second surface, the boss portion is arranged on one side of the body, which faces the second surface, in a protruding mode, the boss portion is contained in the through hole, and one face, which faces away from the body, of the boss portion is connected with the power device.
Because the boss part of the first radiator is accommodated in the through hole and is connected with the power device, the heat dissipation path of the power device is shortened, the low thermal resistance connection between the first radiator and the power device is realized, the heat dissipation efficiency of the heat dissipation assembly is effectively improved, and the heat dissipation effect of the first radiator on the power device is effectively improved.
According to a first aspect, in one possible implementation manner of the present application, the power device includes a first portion and a second portion disposed on the first portion, where the second portion covers the through hole, a projection area of the second portion on a projection plane is a, a projection area of the boss portion on the projection plane is B, and the following conditions are satisfied by the a and the B: a is more than or equal to 1.2B, and the lamination direction of the power device and the circuit board is perpendicular to the projection surface.
A is more than or equal to 1.2B, so that the connection area of the first radiator and the second part is large enough, on one hand, the connection strength and the connection stability between the power device and the first radiator are enhanced, and on the other hand, the heat dissipation effect of the first radiator on the power device is improved.
According to a first aspect, in a possible implementation manner of the present application, the heat dissipation assembly further includes a first solder, where the first solder is disposed on the boss portion and is contained in the through hole, and at least one of the second portion and the circuit board is fixedly connected with the first solder.
At least one of the second part and the circuit board is fixedly connected with the first welding object, so that the first radiator is effectively fixed on at least one of the circuit board and the power device.
According to a first aspect, in one possible implementation manner of the present application, the boss portion includes a top surface and a side surface that are connected and set up, the top surface is towards the second portion is set up, the side surface is towards the side wall of the through hole is set up, the first weld includes a first welding portion and a second welding portion, the first welding portion and the second welding portion are all accommodated in the through hole, the top surface passes through the first welding portion and the second portion is fixed connection, the second welding portion is fixed connection in between the side surface and the circuit board.
The boss part is closely contacted with the second part through the first welding part, the second part, the first welding part and the first radiator are connected to form a low-resistance heat path, and the heat dissipation effect of the first radiator on the power device can be effectively improved. The second welding part is fixedly connected between the side surface and the circuit board. The circuit board is connected with the second welding part to form a low-resistance heat path, so that the heat dissipation efficiency of the heat dissipation assembly is further improved.
In one possible implementation of the present application, according to the first aspect, the heat dissipating assembly further comprises a solder mask layer between the second surface and the body, the solder mask layer being arranged close to the second soldering portion,
the solder mask is a metal layer plated on the body, or the solder mask is a flame retardant, or the solder mask is adhesive glue.
The solder mask layer is used for reducing solder from overflowing or flowing out of the through hole to the body in the process of forming the first solder on the boss part through a welding process, and can also reduce the generation of bubbles, so that the welding quality between the top surface of the boss part and the second part is improved.
According to a first aspect, in a possible implementation manner of the present application, the heat dissipation assembly further includes a first thermal interface layer, where the first thermal interface layer is accommodated in the through hole, and the first thermal interface layer is located between a side of the boss portion away from the body and the power device.
In a possible implementation manner of the present application, according to the first aspect, the heat dissipation assembly further includes a second solder, and the second solder is connected between a side of the body facing the second surface and the second surface.
The body is connected with the circuit board through the second welding object, so that the body can form a transverse through flow and a heat dissipation channel, and the heat dissipation efficiency of the heat dissipation assembly is further improved. Because the body is connected with the circuit board through the second welding object, the stress of the contact surface between the boss part and the second part can be effectively avoided, the possibility of damage of the power device is reduced, and the service life of the power device is prolonged. The body is connected with the circuit board through the second welding object, so that the contact surface between the first radiator and the circuit board is increased, the connection reliability between the first radiator and the circuit board is improved, and the possibility that the first radiator is separated from the circuit board due to external force collision or vibration is reduced.
In a possible implementation manner of the present application, according to the first aspect, the first heat spreader further includes an auxiliary heat dissipation portion, where the auxiliary heat dissipation portion is disposed on a side of the body away from the power device.
The auxiliary heat dissipation part increases the heat conduction area of the first radiator, and is beneficial to enhancing the heat dissipation efficiency and the heat dissipation effect of the heat dissipation component.
According to a first aspect, in a possible implementation manner of the present application, the heat dissipation assembly further includes a second thermal interface layer and a second heat sink, and the circuit board, the body, the second thermal interface layer and the second heat sink are sequentially stacked.
The second thermal interface layer is used to insulate the first heat spreader from the second heat spreader. The increase of radiator quantity can improve the radiating efficiency of radiating component.
In a second aspect, embodiments of the present application provide a power conversion device, including a heat dissipation assembly according to the first aspect.
In a third aspect, embodiments of the present application provide an electrical energy conversion device comprising a power conversion apparatus according to the second aspect.
Drawings
Fig. 1 is a block diagram of a power conversion apparatus according to a first embodiment of the present application;
fig. 2 is a schematic diagram of a stacked structure of a heat dissipating assembly according to a first embodiment of the present disclosure;
fig. 3 is a schematic diagram of a stacked structure of a heat dissipating assembly according to a second embodiment of the present disclosure;
fig. 4 is a schematic diagram of a stacked structure of a heat dissipating assembly according to a third embodiment of the present disclosure;
fig. 5 is a schematic diagram of a stacked structure of a heat dissipating assembly according to a fourth embodiment of the present disclosure;
fig. 6 is a schematic diagram of a stacked structure of a heat dissipating assembly according to a fifth embodiment of the present disclosure;
fig. 7 is a schematic diagram of a stacked structure of a heat dissipating assembly according to a sixth embodiment of the present disclosure;
fig. 8 is a schematic diagram of a stacked structure of a heat dissipating assembly according to a seventh embodiment of the present application.
Detailed Description
Referring to fig. 1, a first embodiment of the present application provides an electric energy conversion device 1000, where the electric energy conversion device 1000 is provided with a power conversion device 1001, that is, the power conversion device 1001 is mounted on the electric energy conversion device 1000. The power conversion device 1001 is provided with a heat dissipation assembly 100a.
Referring to fig. 2, the heat dissipation assembly 100a includes a circuit board 10, a power device 20 and a first heat sink 30. The circuit board 10 includes a first surface 12 and a second surface 14 disposed opposite to each other. The circuit board 10 is provided with a through hole 16 penetrating the first surface 12 and the second surface 14. The through hole 16 is for receiving a portion of the first heat sink 30. The power device 20 is disposed on the first surface 12 and covers the via 16. The first heat sink 30 includes a main body 32 and a boss portion 34 protruding from the main body 32. The body 32 is stacked with the circuit board 10 and connected with the second surface 14. The boss 34 is provided protruding from a side of the body 32 facing the second surface 14. The boss portion 34 is accommodated in the through hole 16. The side of the boss portion 34 facing away from the body 32 is connected to the power device 20.
Because the boss portion 34 of the first radiator 30 is accommodated in the through hole 16, and the boss portion 34 is connected with the power device 20, the thermal resistance of the circuit board 10 can be effectively reduced, the low thermal resistance connection between the first radiator 30 and the power device 20 is realized, the heat dissipation efficiency of the heat dissipation assembly 100a is effectively improved, and the heat dissipation effect of the first radiator 30 on the power device 20 is effectively improved.
The heat dissipation assembly 100a provided by the application can be applied to various power conversion devices 1001 needing to adopt high-power devices, and the power conversion devices 1001 can be mounted on the electric energy conversion equipment 1000 to complete various electric power functions of the equipment. For example, the heat dissipation assembly 100a of the present application may be applied to the field of power systems of electric vehicles, that is, the electric energy conversion device 1000 may be an electric vehicle, where the power conversion device 1001 may be a motor controller, and the power device 20 is a power conversion unit assembled in the motor controller; the power conversion device 1001 may be an On-board Charger (OBC), and the power device 20 may be an energy conversion unit; the power conversion device 1001 may also be a low voltage control power supply, the power device 20 be a DC-DC conversion unit therein, and so on. In addition, the heat dissipation assembly 100a of the present application is not limited to the field of electric vehicles, but can be widely applied to the field of conventional industrial control, for example, uninterrupted power supply (UPS, uninterruptible Power Supply) of a data center, an inverter of a photovoltaic power generation device, a power supply of a server, a charging stack, a rectifying module, a lithium battery, and the like.
The power device 20 includes a first portion 22 and a second portion 24 disposed on the first portion 22. The first portion 22 may be disposed around the second portion 24 with the second portion 24 partially exposed to the second portion 24. The first portion 22 may include a package on the power device 20. The second portion 24 covers the through hole 16. The second portion 24 may be a pad on the power device 20 for connection with the boss portion 34. The power device 20 may be a chip device, and the power device 20 may also be a plug-in device.
In the present embodiment, the first heat sink 30 is a metal heat sink. The boss portion 34 has a substantially cylindrical shape. The boss portion 34 includes a top surface 342 and a side surface 344 that are connected. The top surface 342 is disposed toward the second portion 24 for connection with the second portion 24. The side 344 is disposed toward the side wall of the through hole 16 for connection with the circuit board 10. The top surface 342 is a plane, and no hollow area may be disposed on the top surface 342, so that the connection area between the top surface 342 and the second portion 24 is as large as possible, so as to increase the connection area between the boss 34 and the second portion 24, and thereby increase the heat conduction area between the first heat spreader 30 and the second portion 24. The top surface 342 is generally circular. It is to be understood that the shape of the boss 34 is not limited in this application, and may be, for example, a square column, a round table, an irregular column, or the like, and the shape of the top surface 342 is not limited in this application, and the top surface 342 may be circular, square, hexagonal, or the like, or an irregular shape.
The heat sink assembly 100a further includes a first weld 40, the first weld 40 including a first weld 42 and a second weld 44. The first and second solder portions 42 and 44 are each accommodated in the through hole 16. The top surface 342 is fixedly connected with the power device 20 through the first welding portion 42, so that the boss portion 34 is connected with the power device 20. The boss 34 is closely contacted with the second portion 24 through the first welding portion 42, and the second portion 24, the first welding portion 42 and the first heat sink 30 are connected to form a low-resistance heat path, so that the heat dissipation effect of the first heat sink 30 on the power device 20 can be effectively improved. The second solder 44 is fixedly connected between the side 344 and the circuit board 10. The connection of the circuit board 10 and the second solder 44 forms a low-resistance thermal path, further improving the heat dissipation efficiency of the heat dissipation assembly 100a.
The heat dissipation assembly 100a further includes a second solder 50, wherein the second solder 50 is connected between the side of the body 32 facing the circuit board 10 and the second surface 14, and the second solder 50 is used for fixedly connecting the body 32 and the circuit board 10. In the present embodiment, the second weld 50 is fixedly connected to the second weld 44. Since the body 32 is connected to the circuit board 10 through the second solder 50, the body 32 can form a lateral through-flow and a heat dissipation channel, which is further beneficial to improving the heat dissipation efficiency of the heat dissipation assembly 100a. Because the body 32 is connected with the circuit board 10 through the second solder 50, the stress on the contact surface between the boss portion 34 and the second portion 24 can be effectively avoided, the possibility of damage to the power device 20 is reduced, and the service life of the power device 20 is prolonged. The body 32 is connected with the circuit board 10 through the second solder 50, so that the contact surface between the first radiator 30 and the circuit board 10 is increased, the connection reliability between the first radiator 30 and the circuit board 10 is improved, and the possibility that the first radiator 30 is separated from the circuit board 10 due to collision or vibration of external force is reduced.
In the present embodiment, the first solder 40 and the second solder 50 may be solder.
In the present embodiment, the projection area of the second portion 24 on a projection surface is a, the projection area of the boss portion 34 on the projection surface is B, and the following conditions are satisfied for a and B: a is more than or equal to 1.2B, and the stacking direction of the power device 20 and the circuit board 10 is perpendicular to the projection surface. A is more than or equal to 1.2B, so that the connection area of the first radiator 30 and the second part 24 is large enough, on one hand, the connection strength and the connection stability between the power device 20 and the first radiator 30 are improved, and on the other hand, the heat dissipation effect of the first radiator 30 on the power device 20 is improved.
In some embodiments of the present application, the first heat sink 30 may be connected to the power device 20 or the circuit board 10 in other manners, for example, the first heat sink 30 may be fixed to the circuit board 10 by a fastener.
Referring to fig. 3, a heat dissipating assembly 100b is provided in the second embodiment, and the heat dissipating assembly 100b provided in the second embodiment is different from the heat dissipating assembly 100a provided in the first embodiment in that the first heat sink 30 in the heat dissipating assembly 100b further includes an auxiliary heat dissipating portion 36, and the auxiliary heat dissipating portion 36 is disposed on a side of the body 32 away from the power device 20.
The material of the auxiliary heat sink 36 may be different from or the same as the material of the main body 32. The auxiliary heat sink 36 may have a toothed columnar shape or a spike columnar shape. The auxiliary heat dissipation portion 36 increases the heat conduction area of the first heat sink 30, which is beneficial to enhancing the heat dissipation efficiency and heat dissipation effect of the heat dissipation assembly 100 b.
Referring to fig. 4, a third embodiment of the present application provides a heat dissipating assembly 100c, and the heat dissipating assembly 100c provided by the third embodiment is different from the heat dissipating assembly 100a provided by the first embodiment in that the heat dissipating assembly 100c further includes a solder mask layer 60, the solder mask layer 60 is located between the second surface 14 and the body 32, and the solder mask layer 60 is disposed near the second welding portion 44. The solder mask layer 60 is used to reduce the solder from overflowing or flowing out of the through hole 16 onto the body 32 during the formation of the first solder 40 at the boss portion 34 by the soldering process, and also to reduce the generation of bubbles, thereby improving the quality of soldering between the top surface 342 of the boss portion 34 and the second portion 24. In the present embodiment, the solder resist layer 60 is a solder resist. The solder resist is a high temperature resistant coating, which can make welding only performed on the welding spots needing welding, and protect the welding spots not needing welding. The solder resist is used to prevent bridging and short circuit.
In the third embodiment, the solder resist layer 60 is connected between the second solder portion 44 and the second solder 50.
Referring to fig. 5, a heat dissipating assembly 100d is provided in the fourth embodiment, and the heat dissipating assembly 100c provided in the third embodiment is different from the heat dissipating assembly 100c provided in the third embodiment at least in that a portion of the solder mask layer 60 is accommodated in the through hole 16, the solder mask layer 60 is a metal layer plated on the body 32, and a material of the metal layer may be, but is not limited to, nickel or copper.
The second solder 50 is connected between the second surface 14 and the side of the body 32 facing the second surface 14, the second solder 50 may be connected to the solder mask 60, and the second solder 50 may not be connected to the solder mask 60.
Referring to fig. 6, a heat dissipating assembly 100e is provided in the fifth embodiment of the present application, and the heat dissipating assembly 100e provided in the fifth embodiment is different from the heat dissipating assembly 100a provided in the first embodiment at least in that the heat dissipating assembly 100e omits the second solder between the second surface 14 and the body 32, the solder mask 60 is an adhesive, and the adhesive may be a thermosetting adhesive or the like. The solder mask layer 60 is connected between the second surface 14 and the body 32.
Referring to fig. 7, a heat dissipating assembly 100f is provided in a sixth embodiment of the present application, where the heat dissipating assembly 100f provided in the sixth embodiment is different from the heat dissipating assembly 100a provided in the first embodiment at least in that the heat dissipating assembly 100f further includes a first thermal interface layer 70, and the first thermal interface layer 70 is connected between the top surface 342 and the second portion 24, so as to insulate the power device 20 and the first heat sink 30 from each other, and improve the reliability of the heat dissipating assembly 100 f. The first thermal interface layer 70 is made of a thermal interface material (thermal interface materials, TIM).
Referring to fig. 8, a heat dissipating assembly 100g is provided in a seventh embodiment of the present application, and the heat dissipating assembly 100g provided in the seventh embodiment is different from the heat dissipating assembly 100a provided in the first embodiment at least in that the heat dissipating assembly 100f further includes a second thermal interface layer 80 and a second heat sink 90, and the body 32, the second thermal interface layer 80 and the second heat sink 90 are sequentially stacked. The second thermal interface layer 80 serves to insulate the first heat sink 30 and the second heat sink 90 from each other. The increase in the number of heat sinks can improve the heat dissipation efficiency of the heat dissipation assembly 100 g. The materials of the first heat sink 30 and the second heat sink 90 may be the same or different.
In the case of no conflict or contradiction, the first to seventh embodiments of the present application may be combined with each other.
It is to be understood that the terms such as "comprises" and "comprising," when used in this application, specify the presence of stated features, operations, or components, and are not to be limited to one or more additional features, operations, or components. In this application, terms such as "comprising" and/or "having" are to be construed to mean that a particular feature, number, operation, constituent element, component, or combination thereof is specified, but is not to be construed to exclude the presence or addition of one or more other features, numbers, operations, constituent elements, components, or combination thereof.
Furthermore, in this application, the expression "and/or" includes any and all combinations of the words listed in association. For example, the expression "a and/or B" may include a, may include B, or may include both a and B.
In this application, expressions including ordinal numbers such as "first" and "second" and the like may modify each element. However, such elements are not limited by the above expression. For example, the above description does not limit the order and/or importance of the elements. The above description is only intended to distinguish one element from another element. For example, the first user device and the second user device indicate different user devices, although both the first user device and the second user device are user devices. Similarly, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present application.
When a component is referred to as being "connected" or "connected" to another component, it should be understood that: the component is not only directly connected or connected to other components, but there can also be another component between the component and the other components. On the other hand, where components are referred to as being "directly connected" or "directly accessed" to other components, it should be understood that there are no components between them.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A heat dissipating assembly, the heat dissipating assembly comprising:
the circuit board comprises a first surface and a second surface which are oppositely arranged, and a through hole penetrating through the first surface and the second surface is formed in the circuit board;
a power device disposed on the first surface and covering the through hole;
the first radiator comprises a body and a boss portion, wherein the body and the circuit board are arranged in a stacked mode and are connected with the second surface, the boss portion is arranged on one side of the body, which faces the second surface, in a protruding mode, the boss portion is contained in the through hole, and one face, which faces away from the body, of the boss portion is connected with the power device.
2. The heat dissipating assembly of claim 1 wherein the power device comprises a first portion and a second portion disposed on the first portion, the second portion covering the through hole, a projected area of the second portion on a projection plane being a, a projected area of the boss portion on the projection plane being B, the a and the B satisfying the following conditions: a is more than or equal to 1.2B, and the lamination direction of the power device and the circuit board is perpendicular to the projection surface.
3. The heat dissipating assembly of claim 2 further comprising a first solder disposed on the boss portion and received in the through hole, at least one of the second portion and the circuit board being fixedly connected to the first solder.
4. The heat dissipating assembly of claim 3 wherein said boss portion comprises a top surface and a side surface disposed in conjunction, said top surface disposed toward said second portion and said side surface disposed toward a side wall of said through hole,
the first welding object comprises a first welding part and a second welding part, the first welding part and the second welding part are contained in the through hole, the top surface is fixedly connected with the second part through the first welding part, and the second welding part is fixedly connected between the side surface and the circuit board.
5. The heat dissipating assembly of claim 4 further comprising a solder mask between said second surface and said body, said solder mask being disposed proximate said second weld,
the solder mask is a metal layer plated on the body, or the solder mask is a flame retardant, or the solder mask is adhesive glue.
6. The heat sink assembly of claim 3 further comprising a first thermal interface layer received in the through hole, the first thermal interface layer being located between a side of the boss portion remote from the body and the power device.
7. The heat dissipating assembly of claim 3, further comprising a second weld connected between a side of the body facing the second surface and the second surface.
8. The heat dissipating assembly of claim 1, wherein the first heat sink further comprises an auxiliary heat sink portion disposed on a side of the body remote from the power device.
9. The heat spreading assembly according to any one of claims 1 to 8, further comprising a second thermal interface layer and a second heat spreader, wherein the circuit board, the body, the second thermal interface layer and the second heat spreader are stacked in this order.
10. A power conversion device comprising a heat dissipating assembly according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320460827.5U CN220776315U (en) | 2023-02-28 | 2023-02-28 | Heat dissipation assembly and power conversion device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320460827.5U CN220776315U (en) | 2023-02-28 | 2023-02-28 | Heat dissipation assembly and power conversion device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220776315U true CN220776315U (en) | 2024-04-12 |
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ID=90616913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320460827.5U Active CN220776315U (en) | 2023-02-28 | 2023-02-28 | Heat dissipation assembly and power conversion device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220776315U (en) |
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2023
- 2023-02-28 CN CN202320460827.5U patent/CN220776315U/en active Active
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