CN220760465U - Wafer cleaning cavity bearing mechanism - Google Patents
Wafer cleaning cavity bearing mechanism Download PDFInfo
- Publication number
- CN220760465U CN220760465U CN202322406878.2U CN202322406878U CN220760465U CN 220760465 U CN220760465 U CN 220760465U CN 202322406878 U CN202322406878 U CN 202322406878U CN 220760465 U CN220760465 U CN 220760465U
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- China
- Prior art keywords
- waste liquid
- cleaning device
- top plate
- fixedly arranged
- wafer cleaning
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- 238000004140 cleaning Methods 0.000 title claims abstract description 88
- 239000007788 liquid Substances 0.000 claims abstract description 57
- 239000002699 waste material Substances 0.000 claims abstract description 43
- 238000011084 recovery Methods 0.000 claims abstract description 11
- 238000013016 damping Methods 0.000 claims abstract description 8
- 230000003139 buffering effect Effects 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 27
- 230000035939 shock Effects 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning cavity bearing mechanism, a cleaning device is arranged on a top plate through a positioning rod, a vacuumizing mechanism is started to be matched with a sucker to adsorb and fix the cleaning device, a certain damping effect can be achieved on the cleaning device, cleaning waste liquid is discharged into a waste liquid box through a liquid discharge pipe and is primarily filtered and recycled by a filter screen, and the wafer cleaning cavity bearing mechanism has the advantages of simple integral structure, convenience in operation and high practicability; the cleaning device comprises a bottom box, a bracket, a top plate and a cleaning device, wherein the bracket is fixedly arranged at the bottom end of the inside of the bottom box, the top plate is fixedly arranged at the top of the bracket, and the cleaning device is positioned above the top plate; still including connecting fixed establishment, waste liquid recovery mechanism and damper, connect fixed establishment and install on the roof to belt cleaning device steady support, waste liquid recovery mechanism installs in the base tank, damper installs the bottom to the base tank steady support in the base tank.
Description
Technical Field
The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning cavity bearing mechanism.
Background
The wafer cleaning cavity bearing mechanism is an auxiliary device which is used for stably supporting the wafer cleaning cavity in the wafer production and processing process, is convenient for cleaning the formed wafer surface and improving the wafer quality, and is widely used in the wafer cleaning technical field; the patent of a wafer cleaning device with the application number of 202222209542.2 in the prior art discloses wafer cleaning equipment which does not need to detach a basin cover for independent cleaning after use, shortens the production time and improves the production efficiency of wafers; when the existing wafer cleaning cavity cleans the wafer, the wafer is adsorbed and fixed on the sucker, then the surface of the wafer is cleaned through the flushing mechanism, and the cleaned waste liquid is remained in the cleaning cavity; the interior of the cleaning cavity needs to be kept clean in the wafer cleaning process, the existing wafer cleaning cavity is generally and directly fixedly connected with the supporting mechanism, the cleaning cavity is inconvenient to disassemble and maintain in the later period, the flexibility is general, the cleaned waste liquid is reserved in the cleaning cavity, and pollution equipment is easy to be excited when the equipment shakes.
Disclosure of Invention
In order to solve the technical problems, the utility model provides the wafer cleaning cavity bearing mechanism which is simple and convenient to operate and convenient to separate.
The utility model relates to a wafer cleaning cavity bearing mechanism which comprises a bottom box, a bracket, a top plate and a cleaning device, wherein the bracket is fixedly arranged at the inner bottom end of the bottom box; the cleaning device comprises a top plate, a cleaning device, a waste liquid recovery mechanism, a damping mechanism, a connecting and fixing mechanism, a waste liquid recovery mechanism and a damping mechanism, wherein the connecting and fixing mechanism is arranged on the top plate and stably supports the cleaning device; when using the wafer to wash chamber and bear mechanism, install belt cleaning device on the roof through the locating lever, vacuum pumping mechanism starts the cooperation sucking disc and adsorbs fixedly to belt cleaning device, and can also play certain shock attenuation effect to belt cleaning device, wash waste liquid is discharged into the waste liquid incasement through the fluid-discharge tube and is passed through, filter screen preliminary filtration retrieves, overall structure is simple, the simple operation, the practicality is stronger.
Preferably, the connecting and fixing mechanism comprises a vacuumizing mechanism and a sucker, the vacuumizing mechanism is fixedly arranged at the bottom of the top plate, the sucker is fixedly arranged at the top of the top plate and is connected with the end part of the vacuumizing mechanism, and the sucker is provided with a plurality of groups and is uniformly distributed at the top of the top plate; the vacuumizing device is matched with the sucker to adsorb and fix the bottom of the cleaning device.
Preferably, the waste liquid recovery mechanism comprises a liquid discharge pipe, a waste liquid tank, a funnel, a connecting pipe, a filter screen and a discharge pipe, wherein the liquid discharge pipe is arranged at the output end of the cleaning device, the waste liquid tank is fixedly arranged at the inner bottom end of the bottom tank, the connecting pipe is arranged on the waste liquid tank, the funnel is fixedly arranged at the top of the connecting pipe, the funnel is positioned right below the liquid discharge pipe, the filter screen is fixedly arranged at the inner lower end of the waste liquid tank, the bottom of the connecting pipe downwards penetrates through the filter screen, and the discharge pipe is arranged at the front part of the waste liquid tank; the cleaning waste liquid is discharged into a waste liquid box through a liquid discharge pipe, and is primarily filtered and recycled by a filter screen.
Preferably, the damping mechanism comprises a buffering telescopic support, a support seat, a bottom plate and a surrounding ring, wherein the buffering telescopic support is fixedly arranged at the bottom of the bottom box, the support seat is fixedly arranged at the bottom of the buffering telescopic support, the bottom plate is fixedly arranged at the bottom of the support seat, the surrounding ring is fixedly arranged at the bottom of the bottom box, and the lower part of the surrounding ring surrounds the upper part of the support seat; the base box is subjected to shock absorption and support through the supporting seat matched with the buffer telescopic support column.
Preferably, the cleaning device further comprises a positioning rod, wherein the positioning rod is fixedly arranged at the bottom of the cleaning device, a positioning hole is formed in the middle of the top plate, and the bottom of the positioning rod is downwards inserted into the positioning groove; through the arrangement, the cleaning device is convenient to position and install.
Preferably, the cleaning device further comprises a cleaning door, and the cleaning door is arranged at the front part of the bottom box.
Preferably, the buffer telescopic support posts are provided with a plurality of groups and uniformly distributed on the support base.
Compared with the prior art, the utility model has the beneficial effects that: when using the wafer to wash chamber and bear mechanism, install belt cleaning device on the roof through the locating lever, vacuum pumping mechanism starts the cooperation sucking disc and adsorbs fixedly to belt cleaning device, and can also play certain shock attenuation effect to belt cleaning device, wash waste liquid is discharged into the waste liquid incasement through the fluid-discharge tube and is passed through, filter screen preliminary filtration retrieves, overall structure is simple, the simple operation, the practicality is stronger.
Drawings
FIG. 1 is an isometric view of the present utility model;
FIG. 2 is a schematic diagram of the front view of the present utility model;
FIG. 3 is a schematic top view of the present utility model;
FIG. 4 is a schematic view of the front cross-sectional structure of the present utility model;
FIG. 5 is an isometric cross-sectional schematic representation of the present utility model;
FIG. 6 is a schematic diagram of the front view of the attachment securing mechanism of the present utility model;
FIG. 7 is a schematic diagram of an isometric view of a connection and fixation mechanism of the present utility model;
FIG. 8 is a schematic view of the structure of the cushion telescopic strut of the present utility model;
FIG. 9 is a schematic view showing the internal structure of the waste liquid tank of the present utility model;
the reference numerals in the drawings: 1. a bottom box; 2. a bracket; 3. a top plate; 4. a cleaning device; 5. a vacuum pumping mechanism; 6. a suction cup; 7. a liquid discharge pipe; 8. a waste liquid tank; 9. a funnel; 10. a connecting pipe; 11. a filter screen; 12. a discharge pipe; 13. buffering the telescopic support column; 14. a support base; 15. a bottom plate; 16. a surrounding ring; 17. a positioning rod; 18. cleaning the door.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. This utility model may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Example 1
The wafer cleaning cavity bearing mechanism comprises a bottom box 1, a support 2, a top plate 3 and a cleaning device 4, wherein the support 2 is fixedly arranged at the bottom end of the inside of the bottom box 1, the top plate 3 is fixedly arranged at the top of the support 2, and the cleaning device 4 is positioned above the top plate 3; the device comprises a bottom box 1, a cleaning device 4, a waste liquid recovery mechanism, a shock absorption mechanism, a connecting and fixing mechanism, a supporting seat 14, a bottom plate 15 and a surrounding ring 16, wherein the connecting and fixing mechanism, the waste liquid recovery mechanism and the shock absorption mechanism are installed on the top plate 3 and stably support the cleaning device 4, the waste liquid recovery mechanism is installed in the bottom box 1, the shock absorption mechanism is installed at the bottom of the bottom box 1 and stably supports the bottom box 1, the connecting and fixing mechanism comprises a vacuumizing mechanism 5 and a sucker 6, the vacuumizing mechanism 5 is fixedly installed at the bottom of the top plate 3, the sucker 6 is fixedly installed at the top of the top plate 3 and is connected with the end part of the vacuumizing mechanism 5, the sucker 6 is provided with a plurality of groups and is uniformly distributed at the top of the top plate 3, the shock absorption mechanism comprises a buffering telescopic strut 13, a supporting seat 14, a bottom plate 15 and a surrounding ring 16, the buffering telescopic strut 13 is fixedly installed at the bottom of the bottom box 1, the supporting seat 14 is fixedly installed at the bottom of the buffering telescopic strut 13, the bottom plate 15 is fixedly installed at the bottom of the supporting seat 14, the surrounding ring 16 is fixedly installed at the bottom of the bottom box 1, the surrounding ring 16 is encircling the upper part of the supporting seat 14, the positioning rod 17 is fixedly installed at the bottom of the cleaning device 4, the top 3, the middle of the top plate 3 is provided with positioning holes, and the positioning rods 17 are downwards inserted into the positioning grooves; the cleaning device 4 is arranged on the top plate 3 through a positioning rod 17, and the vacuumizing mechanism 5 is started to be matched with the sucker 6 to adsorb and fix the cleaning device 4.
Example 2
The wafer cleaning cavity bearing mechanism comprises a bottom box 1, a support 2, a top plate 3 and a cleaning device 4, wherein the support 2 is fixedly arranged at the bottom end of the inside of the bottom box 1, the top plate 3 is fixedly arranged at the top of the support 2, and the cleaning device 4 is positioned above the top plate 3; the waste liquid recycling mechanism comprises a liquid discharge pipe 7, a waste liquid box 8, a funnel 9, a connecting pipe 10, a filter screen 11 and a discharge pipe 12, wherein the liquid discharge pipe 7 is arranged at the output end of the cleaning device 4, the waste liquid box 8 is fixedly arranged at the inner bottom end of the bottom box 1, the connecting pipe is arranged on the waste liquid box 8, the funnel 9 is fixedly arranged at the top of the connecting pipe, the funnel 9 is positioned right below the liquid discharge pipe 7, the filter screen 11 is fixedly arranged at the inner lower end of the waste liquid box 8, the bottom of the connecting pipe downwards passes through the filter screen 11, the discharge pipe 12 is arranged at the front part of the waste liquid box 8, a cleaning door 18 is arranged at the front part of the bottom box 1, and a plurality of groups of buffer telescopic supporting columns 13 are uniformly distributed on a supporting seat 14; the cleaning waste liquid is discharged into a waste liquid tank 8 through a liquid discharge pipe 7, and is preliminarily filtered and recovered by a filter screen 11.
As shown in fig. 1 to 9, when the wafer cleaning cavity bearing mechanism is used, the cleaning device 4 is installed on the top plate 3 through the positioning rod 17, the vacuumizing mechanism 5 is started to be matched with the sucker 6 to adsorb and fix the cleaning device 4, a certain damping effect can be achieved on the cleaning device 4, cleaning waste liquid is discharged into the waste liquid box 8 through the liquid discharge pipe 7 and is primarily filtered and recycled by the filter screen 11, and the wafer cleaning cavity bearing mechanism has the advantages of simple integral structure, convenience in operation and high practicability.
The vacuumizing mechanism, the sucker, the cleaning device and the filter screen of the wafer cleaning cavity bearing mechanism are purchased in the market, and a person skilled in the art only needs to install and operate according to the attached use instruction without creative labor of the person skilled in the art.
The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that it will be apparent to those skilled in the art that modifications and variations can be made without departing from the technical principles of the present utility model, and these modifications and variations should also be regarded as the scope of the utility model.
Claims (7)
1. The wafer cleaning cavity bearing mechanism comprises a bottom box (1), a support (2), a top plate (3) and a cleaning device (4), wherein the support (2) is fixedly arranged at the bottom end of the inside of the bottom box (1), the top plate (3) is fixedly arranged at the top of the support (2), and the cleaning device (4) is positioned above the top plate (3); the device is characterized by further comprising a connection fixing mechanism, a waste liquid recovery mechanism and a damping mechanism, wherein the connection fixing mechanism is installed on the top plate (3) and stably supports the cleaning device (4), the waste liquid recovery mechanism is installed in the bottom box (1), and the damping mechanism is installed at the bottom of the bottom box (1) and stably supports the bottom box (1).
2. The wafer cleaning chamber carrying mechanism according to claim 1, wherein the connection fixing mechanism comprises a vacuumizing mechanism (5) and a sucker (6), the vacuumizing mechanism (5) is fixedly arranged at the bottom of the top plate (3), the sucker (6) is fixedly arranged at the top of the top plate (3) and is connected with the end part of the vacuumizing mechanism (5), and the sucker (6) is provided with a plurality of groups and is uniformly distributed at the top of the top plate (3).
3. The wafer cleaning chamber carrying mechanism as claimed in claim 1, wherein the waste liquid recovery mechanism comprises a liquid discharge pipe (7), a waste liquid tank (8), a funnel (9), a connecting pipe (10), a filter screen (11) and a discharge pipe (12), the liquid discharge pipe (7) is installed at the output end of the cleaning device (4), the waste liquid tank (8) is fixedly installed at the inner bottom end of the bottom tank (1), the connecting pipe is installed on the waste liquid tank (8), the funnel (9) is fixedly installed at the top of the connecting pipe, the funnel (9) is located under the liquid discharge pipe (7), the filter screen (11) is fixedly installed at the inner lower end of the waste liquid tank (8), the bottom of the connecting pipe passes through the filter screen (11) downwards, and the discharge pipe (12) is installed at the front part of the waste liquid tank (8).
4. The wafer cleaning chamber carrying mechanism according to claim 1, wherein the damping mechanism comprises a buffering telescopic support (13), a supporting seat (14), a bottom plate (15) and a surrounding ring (16), the buffering telescopic support (13) is fixedly arranged at the bottom of the bottom box (1), the supporting seat (14) is fixedly arranged at the bottom of the buffering telescopic support (13), the bottom plate (15) is fixedly arranged at the bottom of the supporting seat (14), the surrounding ring (16) is fixedly arranged at the bottom of the bottom box (1), and the lower part of the surrounding ring (16) surrounds the upper part of the supporting seat (14).
5. The wafer cleaning chamber carrying mechanism according to claim 1, further comprising a positioning rod (17), wherein the positioning rod (17) is fixedly installed at the bottom of the cleaning device (4), a positioning hole is formed in the middle of the top plate (3), and the bottom of the positioning rod (17) is inserted into the positioning groove downwards.
6. A wafer cleaning chamber carrier according to claim 1, further comprising a cleaning door (18), the cleaning door (18) being mounted at the front of the bottom box (1).
7. A wafer cleaning chamber carrier according to claim 4, characterized in that the buffer telescopic struts (13) are arranged in groups and uniformly distributed on the support base (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322406878.2U CN220760465U (en) | 2023-09-06 | 2023-09-06 | Wafer cleaning cavity bearing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322406878.2U CN220760465U (en) | 2023-09-06 | 2023-09-06 | Wafer cleaning cavity bearing mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220760465U true CN220760465U (en) | 2024-04-12 |
Family
ID=90615825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322406878.2U Active CN220760465U (en) | 2023-09-06 | 2023-09-06 | Wafer cleaning cavity bearing mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220760465U (en) |
-
2023
- 2023-09-06 CN CN202322406878.2U patent/CN220760465U/en active Active
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