CN220753462U - LED support and LED device - Google Patents

Abstract

The application belongs to the technical field of display, and relates to an LED bracket and an LED device. The LED bracket comprises a bracket body and a conductive component, wherein the conductive component is arranged on the bracket body and comprises a plurality of pins, and each side edge of the bracket body is respectively and independently provided with at least one pin; the conductive assembly further comprises a plurality of conductive pieces, one ends of the conductive pieces are embedded in the bracket body to form bonding pads, the other ends of the conductive pieces extend out of the bracket body to form pins, and the pins are symmetrically arranged on the bracket body; each side of the support body is provided with at least one bonding pad independently. The LED bracket is applied to an LED device, at least one pin is respectively and independently arranged on each side edge of the bracket body, and the pins on each side edge of the bracket body provide support for the LED device during installation; and symmetrically arranging pins can facilitate the wiring layout requirement of the panel.

Description

LED support and LED device

Technical Field

The application relates to the technical field of display, and more particularly relates to an LED bracket and an LED device.

Background

The pins of the existing LED device are mostly two, the two pins are respectively positioned on two sides of the whole LED device, and the LED device is installed by being connected with a panel through the pins, so that the side surface without the pins lacks support, and the LED device is unstable to install.

Disclosure of Invention

The embodiment of the application provides an LED bracket and an LED device, which are used for solving the problem of unstable installation of the LED device in the prior art.

In order to solve the technical problems, the embodiment of the application provides an LED bracket, which adopts the following technical scheme:

an LED support, comprising: the support comprises a support body and a conductive assembly, wherein the conductive assembly is arranged on the support body and comprises a plurality of pins, and each side edge of the support body is respectively and independently provided with at least one pin; the conductive assembly further comprises a plurality of conductive pieces, one ends of the conductive pieces are embedded in the bracket body to form bonding pads, the other ends of the conductive pieces extend out of the bracket body to form pins, and the pins are symmetrically arranged on the bracket body; each side of the support body is provided with at least one bonding pad independently.

Further, the pad of one of the conductive members extends toward the middle of the holder body to form a common pad.

Further, the area of the common pad is larger than the area of the pad.

Further, the number of the conductive elements is four, and the other three welding coils are arranged around the common welding pad.

Further, the pins are trapezoidal.

Further, a protrusion is arranged on the end face, far away from the pin, of the support body, and the protrusion is located in the middle of the support body.

Further, the height of the protrusions is 30-50 um; and/or the distance between the protrusion and the side edge of the bracket body is 1.5-2 um.

In order to solve the technical problems, the embodiment of the application also provides an LED device, which adopts the following technical scheme:

an LED device comprises a light emitting chip and the LED bracket, wherein the light emitting chip is electrically connected with a bonding pad of the conductive component.

Further, the LED device further comprises packaging glue, wherein the packaging glue is arranged on the support body and covers the light-emitting chip.

Further, the number of the light emitting chips is three, the three light emitting chips are arranged on the conductive component in a triangular arrangement, and the three light emitting chips are respectively a red light chip, a green light chip and a blue light chip.

Compared with the prior art, the embodiment of the application has the following main beneficial effects: the LED bracket is applied to the LED device, at least one pin is respectively and independently arranged on each side of the bracket body, and when the LED device is mounted on the panel, the pins on each side of the bracket body provide support for the LED device, so that the LED device is more firmly connected with the panel; each side of the bracket body is respectively and independently provided with at least one bonding pad, so that the bonding pad and the pin of each conductive piece are arranged opposite to each other, and the preparation difficulty of the conductive piece is reduced; and the symmetrically arranged pins can facilitate the wiring layout requirement of the panel.

Drawings

For a clearer description of the solution of the present application, a brief introduction will be given to the drawings needed in the description of the embodiments, which are some embodiments of the present application, and from which other drawings can be obtained for a person skilled in the art without the inventive effort.

Fig. 1 is a top view of an LED mount provided in an embodiment of the present application;

FIG. 2 is a bottom view of an LED support provided in an embodiment of the present application;

FIG. 3 is a side view of an LED support provided in an embodiment of the present application;

FIG. 4 is a schematic diagram of one embodiment of the mounting light emitting chip of FIG. 1;

FIG. 5 is a schematic diagram of another embodiment of the mounted light emitting chip of FIG. 1;

fig. 6 is a side view of an LED fixture provided in an embodiment of the present application.

Reference numerals: 10. an LED bracket; 1. a bracket body; 2. a conductive member; 21. pins; 22. a bonding pad; 23. a common pad; 24. river course; 3. a protrusion; 20. a light emitting chip; 30. and (5) packaging glue.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the applications herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description and claims of the present application and in the description of the figures above are intended to cover non-exclusive inclusions. The terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

In order to better understand the technical solutions of the present application, the following description will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings.

An embodiment of the present application provides an LED support 10, as shown in fig. 1 and 2, the LED support 10 includes: the support body 1 and electrically conductive subassembly, electrically conductive subassembly locates on the support body 1, electrically conductive subassembly includes a plurality of pins 21, each side of support body 1 is equipped with at least one independently respectively pin 21.

The beneficial effect that this application embodiment provided a LED support 10 is: the LED support 10 in this application is applied to the LED device, is equipped with at least one pin 21 independently respectively at every side of support body 1, installs the LED device on the panel, and the pin 21 of every side of support body 1 all provides the support for the LED device, makes the connection of LED device and panel more firm.

Further, a receiving groove (not shown) is formed at the bottom of the bracket body 1, and the pins 21 are embedded in the receiving groove.

In this embodiment, the pins 21 are embedded into the accommodating grooves, so that the mounting surfaces of the bracket body 1 and the panel are further flattened, and the connection stability of the LED device and the panel is improved.

Further, the conductive component includes a plurality of conductive members 2, one ends of the conductive members 2 are embedded in the bracket body 1 to form bonding pads 22, and the other ends of the conductive members 2 extend to the outside of the bracket body 1 to form the pins 21.

In the present embodiment, the bonding pads 22 are used for mounting the light emitting chips 20 in the LED device (see fig. 4 to 6); specifically, the number of the conductive members 2 is at least two, so that two electrodes of the light emitting chip 20 are respectively connected to the two pads 22.

Further, each side edge of the bracket body 1 is separately provided with at least one bonding pad 22.

In this embodiment, the bonding pad 22 of each conductive member 2 is disposed opposite to the lead 21, so as to reduce the difficulty in manufacturing the conductive members 2.

Further, the pins 21 are symmetrically arranged on the bracket body 1; the symmetrical arrangement of the pins 21 can facilitate the wiring layout requirements of the panel.

Further, the conductive member 2 includes connection portions (not shown) at both ends of which the pins 21 and the pads 22 are respectively provided, and the connection portions are abutted against the side walls of the bracket body 1.

Further, the pad 22 of one of the conductive members 2 extends toward the middle of the holder body 1 to form a common pad 23.

In this embodiment, the common pad 23 increases the area of the pad 22, on the one hand, the heat dissipation efficiency of the pad 22 is improved, and when the light emitting chip 20 of the LED device is mounted on the common pad 23, the heat dissipation efficiency of the light emitting chip 20 is improved; on the other hand, the mounting space of the LED support 10 is increased, so that the LED support 10 is suitable for flip-chip light-emitting chips 20 (shown in fig. 4) and forward-mounted light-emitting chips 20 (shown in fig. 5), and the use scene of the LED support 10 is increased.

Further, the area of the common pad 23 is larger than the area of the pad 22; it is ensured that there is sufficient area for mounting the light emitting chip 20 when the LED support 10 is adapted to the front-mounted light emitting chip 20.

As shown in fig. 1 and 2, further, the number of the conductive members 2 is four, and the remaining three pads 22 (i.e., the three pads 22 that do not extend to form the common pad 23) are disposed around the common pad 23.

In this embodiment, the insulating regions between the plurality of pads 22 form the river 24.

In the present embodiment, as shown in fig. 4, when the LED device includes three flip-chip light emitting chips 20, the light emitting chips 20 cross the river 24, one electrode of the three light emitting chips 20 is connected to the pad 22 provided around the common pad 23, and the other electrode of the three light emitting chips 20 is connected to the common pad 23. As shown in fig. 5, when the LED device includes three forward-mounted light emitting chips 20, the three light emitting chips 20 are all disposed on a common pad 23, one electrode of the three light emitting chips 20 is connected to the common pad 23 by wire bonding, and the other electrode of the three light emitting chips 20 is connected to three pads 22 disposed around the common pad 23 by wire bonding, respectively.

In this embodiment, the support body 1 is a cuboid, and the connection parts of the four conductive members 2 are respectively disposed on the side walls of the support body 1.

Further, the pins 21 are trapezoidal; the trapezoid pins 21 can enlarge the contact area between the LED device and the panel, so that the LED device and the panel are more firmly connected.

As shown in fig. 3, further, a protrusion 3 is provided on an end surface of the bracket body 1 away from the pin 21, and the protrusion 3 is located in the middle of the bracket body 1.

In this embodiment, as shown in fig. 5, the bump 3 may be matched with the encapsulation glue 30 in the LED device, so as to effectively prevent water vapor from entering the LED device; and the bump 3 can reduce the use of the encapsulation cement 30.

Further, the height of the protrusion 3 is 30-50 um.

Further, the distance between the protrusion 3 and the side edge of the bracket body 1 is 1.5-2 um.

In some alternative implementations of the present embodiment, the height of the protrusion 3 is in a range between any one or any two of 30um, 35um, 40um, 45um, 50um, etc.

In some optional implementations of this embodiment, the distance between the protrusion 3 and the side edge of the bracket body 1 is in a range between any one or any two of 1.5um, 1.6um, 1.7um, 1.8um, 1.9um, 2um, and so on.

In this embodiment, the bump 3 can make the encapsulation glue 30 well combined with the bracket body 1 in this size.

The embodiment of the application further provides an LED device, as shown in fig. 6, where the LED device includes a light emitting chip 20 and the LED support 10 as described above, and the light emitting chip 20 is electrically connected to the bonding pad 22 of the conductive component.

In this embodiment, at least one pin 21 is independently provided on each side of the bracket body 1, and when the LED device is mounted on the panel, the pins 21 on each side of the bracket body 1 provide support for the LED device, so that the LED device is more firmly connected with the panel. And each side of the bracket body 1 is respectively and independently provided with at least one bonding pad 22, so that the bonding pad 22 and the pin 21 of each conductive piece 2 are arranged opposite to each other, and the preparation difficulty of the conductive piece 2 is reduced.

Further, the number of the light emitting chips 20 is three, the three light emitting chips 20 are arranged on the conductive component in a triangle shape, and the three light emitting chips 20 are respectively a red light chip, a green light chip and a blue light chip.

In this embodiment, the three light emitting chips 20 are arranged in a triangle, and the colors emitted by the three light emitting chips 20 are different, so that the color gamut display effect of the LED device is better.

In this embodiment, the LED devices are applied to the display module, and a plurality of LED device arrays may be disposed on a panel of the display module, and in two LED devices disposed adjacent to each other in the lateral direction and the longitudinal direction, the three light emitting chips 20 of each LED device are arranged in the same manner and are all arranged in a triangle or inverted triangle, so that the LED device is suitable for solid pixels;

or, arranging a plurality of LED device arrays on a panel of the display module, wherein in two LED devices which are transversely and adjacently arranged, three light emitting chips 20 of one LED device are arranged in a triangle shape, and three light emitting chips 20 of the other LED device are arranged in an inverted triangle shape; in the two LED devices disposed longitudinally adjacently, the three light emitting chips 20 of each LED device are arranged in the same manner, and are arranged in a triangle or inverted triangle, so as to be suitable for the virtual pixels.

In this embodiment, the method is applicable to the combined development of virtual pixels and physical pixels, and the driving circuit of the virtual pixels is simpler and less in cost than the physical pixels, and the driving required by virtual display is at least half less on the premise that the visual pixels watched by human eyes are the same.

As shown in fig. 6, the LED device further includes an encapsulation compound 30, where the encapsulation compound 30 is disposed on the bracket body 1 and covers the light emitting chip 20.

In this embodiment, the light emitting chip 20 is affected by temperature, humidity and other factors during the use process, and the encapsulation adhesive 30 can protect the light emitting chip 20 to prolong the service life of the light emitting chip 20.

The LED device provided by the embodiment of the application not only has good heat dissipation, but also can be used for developing virtual pixels, and further has the capability of isolating water vapor.

It is apparent that the embodiments described above are only some embodiments of the present application, but not all embodiments, the preferred embodiments of the present application are given in the drawings, but not limiting the patent scope of the present application. This application may be embodied in many different forms, but rather, embodiments are provided in order to provide a more thorough understanding of the present disclosure. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing, or equivalents may be substituted for elements thereof. All equivalent structures made by the specification and the drawings of the application are directly or indirectly applied to other related technical fields, and are also within the protection scope of the application.

Claims (9)

1. An LED support, comprising: the support comprises a support body and a conductive assembly, wherein the conductive assembly is arranged on the support body and comprises a plurality of pins, and each side edge of the support body is respectively and independently provided with at least one pin;

the conductive assembly further comprises a plurality of conductive pieces, one ends of the conductive pieces are embedded in the bracket body to form bonding pads, the other ends of the conductive pieces extend out of the bracket body to form pins, and the pins are symmetrically arranged on the bracket body;

each side edge of the bracket body is respectively and independently provided with at least one bonding pad;

the end face, far away from the pins, of the support body is provided with a protrusion, and the protrusion is located in the middle of the support body.

2. The LED cradle of claim 1, wherein the pad of one of the conductive members extends toward the middle of the cradle body forming a common pad.

3. The LED support of claim 2, wherein the common pad has an area greater than an area of the pad.

4. The LED fixture of claim 2, wherein the number of conductive members is four and the remaining three of the solder bumps are disposed around the common pad.

5. The LED cradle of any one of claims 1-4, wherein the pins are trapezoidal.

6. The LED fixture of claim 5 wherein the protrusions have a height of 30-50 um; and/or the distance between the protrusion and the side edge of the bracket body is 1.5-2 um.

7. An LED device comprising a light emitting chip and an LED mount according to any one of claims 1 to 6, the light emitting chip being electrically connected to a pad of the conductive member.

8. The LED device of claim 7, further comprising an encapsulant disposed on the mount body and covering the light emitting chip.

9. The LED device of claim 7, wherein the number of light emitting chips is three, the three light emitting chips are arranged in a triangular arrangement on the conductive member, and the three light emitting chips are a red light chip, a green light chip, and a blue light chip, respectively.