CN220750921U - Heat exchange chip, heat exchange core body and heat exchange device - Google Patents

Heat exchange chip, heat exchange core body and heat exchange device Download PDF

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Publication number
CN220750921U
CN220750921U CN202321451427.4U CN202321451427U CN220750921U CN 220750921 U CN220750921 U CN 220750921U CN 202321451427 U CN202321451427 U CN 202321451427U CN 220750921 U CN220750921 U CN 220750921U
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heat exchange
turbulence
structures
spoiler
turbulence structures
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CN202321451427.4U
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范静
潘刚
尚阳
孟祥涛
程鹏
苏本展
宋金良
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Huawei Digital Power Technologies Co Ltd
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Huawei Digital Power Technologies Co Ltd
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Abstract

The application provides a heat exchange chip, a heat exchange core body and a heat exchange device. The heat exchange chip comprises a first surface and at least two rows of turbulence structures arranged on the first surface. In the above-mentioned spoiler structure, each row of spoiler structures includes a plurality of spoiler structures that are arranged at intervals along the same direction; and, the orthographic projection of two adjacent rows of turbulence structures on the first surface is symmetrical along the central line between the two. The extending direction of the central line is the same as the direction of the interval arrangement of the plurality of turbulent structures in each row of turbulent structures. For any one of the spoiler structures, the spoiler structure may be a convex hull or a concave pit located on the first surface. The turbulence structure is specifically a symmetrical structure and has a central axis. The spoiler structure includes a curved wall surface disposed around the central axis, the curved wall surface protruding in a direction away from the first surface. The flow disturbing structure has a smaller backflow area formed on the first surface, and has smaller resistance to air flow, so that the heat exchange effect of the air flow is enhanced when the air flow flows through the first surface.

Description

Heat exchange chip, heat exchange core body and heat exchange device
Technical Field
The application relates to the technical field of heat exchange, in particular to a heat exchange chip, a heat exchange core body and a heat exchange device.
Background
Electronic equipment such as a server in a data center can generate a large amount of heat during operation, the electronic equipment needs to be cooled through a cooling system, normal operation of the electronic equipment is guaranteed, and an indirect evaporative cooling system can cool the electronic equipment, so that the electronic equipment is a cooling system widely applied at present. The core heat exchange component of the indirect evaporative cooling system is a heat exchange core body, and the heat exchange core body is formed by stacking a plurality of heat exchange chips. In the application process, when two airflows with temperature difference flow through two sides of the heat exchange chip, the two airflows can realize indirect heat exchange through the heat exchange chip, and after heat exchange, the airflows with reduced temperature can cool electronic equipment of the data center.
In order to enhance the heat exchange effect of the air flow when flowing through the heat exchange chip, a turbulence structure can be arranged on the surface of the heat exchange chip. In the prior art, the turbulence structure is a cuboid groove or protrusion distributed on the surface of the heat exchange chip. However, the turbulent flow structure can enable the surface of the heat exchange chip to be provided with a rectangular concave area, when the air flow passes through the concave area on the surface of the heat exchange chip, a part of the air flow stays in the concave area, and is difficult to continue flowing and participate in the subsequent heat exchange process with the heat exchange chip; meanwhile, the vertical side wall of the turbulent flow structure can also form a barrier to the flow of the air flow, so that the resistance of the air flow is large, and the heat exchange effect of the heat exchange chip is improved.
Disclosure of Invention
The application provides a heat exchange chip, heat exchange core and heat transfer device through optimizing vortex structure to improve the heat transfer effect of air current when flowing through the heat exchange chip.
In a first aspect, the present application provides a heat exchange chip. The heat exchange chip may be understood as a plate type structure having a certain thickness, and includes a first surface perpendicular to the thickness direction with reference to the thickness direction of the heat exchange chip. During the heat exchange process, the air flow may flow over the first surface of the heat exchange chip. In order to improve the heat exchange effect of the air flow when flowing through the first surface, the first surface is provided with a plurality of at least two rows of turbulence structures, and each row of turbulence structures comprises a plurality of turbulence structures which are arranged at intervals along the same direction. In the heat exchange process, along the arrangement direction of the turbulence structures, the air flow can sequentially pass through the plurality of turbulence structures, and under the action of the turbulence structures, the heat exchange effect of the air flow and the heat exchange chip is enhanced. When the at least two rows of turbulence structures are specifically arranged, the orthographic projection of the two rows of turbulence structures on the first surface can be symmetrically arranged about the central line between the two rows of turbulence structures. The extending direction of the central line is the same as the direction of the interval arrangement of the plurality of turbulent structures in each row of turbulent structures. When the first surface of the heat exchange chip is provided with the multi-row turbulence structures according to the rules, the arrangement of the multi-row turbulence structures can be regular, so that the turbulence of the air flow when flowing through the first surface can be standardized, and the heat exchange effect of the air flow can be further enhanced.
For any one turbulence structure, the turbulence structure is a symmetrical structure, and the turbulence structure has a central axis. The extending direction of the central axis is parallel to the thickness direction of the heat exchange chip. Specifically, the turbulence structure includes a curved wall surface disposed about the central axis, and the wall surface structure of the curved wall surface is convex in a direction away from the first surface, such that the wall surface structure of the curved wall surface bulges outwardly with respect to the inner cavity of the curved wall surface from a bottom end of the curved wall surface proximate to the first surface to a top end of the curved wall surface distal to the first surface.
The curved wall surface arranged by the turbulence structure can be a spherical surface, a paraboloid, an ellipsoid or other curved surfaces with streamline characteristics. When the airflow passes through the turbulence structure, the airflow can flow along the smooth curved side wall of the turbulence structure, so that the resistance of the airflow is small, the flow speed of the airflow is improved, and the heat exchange effect of the airflow is improved. In addition, the turbulent flow structure can further enable the occupation of the backflow area of the first surface to be smaller, the occupation of the strong heat exchange area to be larger, and further the air flow reserved in the backflow area is reduced, more air flow can carry out strong heat exchange with the heat exchange chip in the flowing process, and the heat exchange effect of the air flow and the heat exchange chip is further improved.
When specifically setting up above-mentioned vortex structure, above-mentioned vortex structure includes a plurality of first cross-sections, and the central axis of vortex structure is crossed to every first cross-section, and all is perpendicular with first surface. Specifically, any two first cross sections intersect, and the intersection line of any two first cross sections is located on the central axis of the turbulence structure. For any one of the first cross sections, the first cross section comprises two curved boundaries located on two sides of the central axis, each curved boundary is located on the curved side wall, and each curved boundary protrudes towards a direction away from the first surface. Specifically, each curved boundary is a smooth curve, and each curved boundary comprises a first end and a second end, and the distances from each point contained in the curved boundary to the central axis of the turbulence structure are gradually reduced from the first end to the second end; and, from the first end to the second end, the distances from the first surface to the points included in the curved boundary gradually increase.
The above-mentioned turbulence structure further includes a plurality of second cross sections parallel to the first surface in addition to the first cross section, and each of the second cross sections has the same shape, for example, each of the second cross sections may be circular, elliptical, or other shapes other than circular and elliptical, which is not limited in this application; meanwhile, the area of each second section is different, and specifically, the area of the second section gradually decreases along the central axis of the turbulence structure and away from the direction of the first surface. The extending direction of the central axis of the turbulent structure and the thickness direction of the heat exchange chip may be set to be identical.
In terms of shape, the turbulence structures may be convex hulls located on the first surface, or pits located on the first surface. In addition, taking a heat exchange chip as an example, aiming at the first surface of the heat exchange chip, a plurality of turbulence structures arranged on the first surface can be convex hulls or pits. Still further, in other embodiments, for the first surface of the heat exchange chip, among the plurality of turbulence structures disposed on the first surface, a part of the turbulence structures may be convex hulls, and another part of the turbulence structures may be concave pits.
When the turbulence structures are arranged according to the change rule of the second sections, the areas of the second sections can be gradually reduced to zero along the central axis of the turbulence structures and in the direction away from the first surface. Specifically, when the second cross section is circular, the turbulence structure may be a spherical cap structure. When the second section is elliptical, the turbulence structure may be an ellipsoidal spherical cap structure. The structure of the turbulent flow structure is simple, and when the airflow flows through the turbulent flow structure, the resistance is small, and the heat exchange effect of the airflow is good.
Or when the turbulence structures are arranged according to the change rule of the second sections, the areas of the second sections can be gradually reduced to a preset value larger than zero, at this time, the top of the arranged turbulence structures, which is far away from the first surface, is provided with a platform area, and the edge of the platform area is connected with the curved wall surface. Correspondingly, when the second cross section is circular, the turbulence structure is a spherical crown structure with a platform area at one end far away from the first surface. When the second section is elliptical, the turbulence structure is an ellipsoidal spherical crown structure with a platform area at one end far away from the first surface.
In one possible embodiment, the spoiler structure extends in a first direction. The first direction is parallel to the first surface, and along the first direction, the turbulence structure has a maximum length dimension. The turbulence structure having the above features is a strip-shaped structure disposed along the first direction as a whole. When the vortex structure is specifically arranged, the extending direction of the vortex structure and the flowing direction of the air flow are perpendicular or an included angle formed by the extending direction of the vortex structure and the flowing direction of the air flow is an acute angle, so that the vortex structure can play a good role in the flow process of the air flow.
When the turbulence structure is arranged on the first surface of the heat exchange chip, a plurality of flow channels can be arranged on the first surface, and the turbulence structure is arranged in the flow channels. One row of turbulence structures or a plurality of rows of turbulence structures can be arranged in each flow passage. If the extending direction of the flow channel is denoted as a second direction, the second direction is the same as the direction in which the plurality of turbulence structures included in each row of turbulence structures are arranged at intervals.
The first direction of the turbulence structures and the second direction of the flow channels comprise a plurality of possible arrangements. In one possible arrangement, the first direction of the turbulence structures is perpendicular to the second direction of the flow channels. Under the above arrangement, when the air flow flows through the flow channel on the first surface, the first direction of the turbulence structure may be perpendicular to the flowing direction of the air flow, so as to play a turbulence effect on the air flow.
In another possible arrangement, the angle between the first direction of the turbulence structure and the second direction of the flow channel is acute, i.e. the turbulence structure is arranged obliquely in the flow channel. The arrangement mode can enable the air flow to flow in the flow channel of the first surface, the resistance of the turbulence structure to the air flow is small, a good turbulence effect can be generated, and the heat exchange effect of the heat exchange chip is improved.
Under the two setting forms, the turbulent flow structures with more quantity can be arranged along the extending direction of the flow channel, so that the air flow can obtain better heat exchange effect under the action of the arranged turbulent flow structures in the process of passing through the flow channel.
If the included angle between the first direction of the turbulence structure and the second direction of the flow channel is denoted by θ, θ may be set to satisfy: θ is more than or equal to 30 degrees and less than or equal to 60 degrees. The value of θ may be 35 °, 40 °, 45 °, 50 °, 55 °, or any other value within the above range, which is not limited in this application. The turbulence structure can generate smaller resistance to the air flow flowing on the first surface and has better turbulence effect; meanwhile, the turbulence structure can generate smaller resistance and better turbulence effect on the air flow flowing to the other surface of the heat exchange chip, which is away from the first surface, so that the heat exchange capacity of the heat exchange chip is improved.
For the multiple rows of turbulence structures arranged on the first surface, the arrangement of the multiple turbulence structures contained in each row of turbulence structures comprises multiple forms. In one possible form, in the same row of spoiler structures, the spoiler structures are disposed at intervals along the second direction, and each spoiler structure extends along the same direction. That is, in the same row of turbulence structures, the first directions in which the maximum lengths of each turbulence structure are located are parallel to each other. In the case that the orthographic projections of two adjacent rows of turbulence structures on the first surface are symmetrical with respect to the center line therebetween, the orthographic projections of two turbulence structures arranged side by side in each pair on the first surface may be arranged in a V-shape.
In another possible form, in the same row of spoiler structures, two adjacent spoiler structures have different extending directions, and orthographic projections of the two spoiler structures on the first surface are symmetrically arranged about a center line therebetween.
Besides the arrangement form, in the same row of turbulence structures, a plurality of turbulence structures can be arranged randomly or in other arrangement rules, and the arrangement form is not listed in one by one. In the two adjacent rows of turbulence structures, the orthographic projections of the two rows of turbulence structures on the first surface may be arranged in parallel or in other forms besides being symmetrical about the center line between the two, which is not listed in the application.
If two different turbulence structures are distinguished by the convex hull and the concave pit, each turbulence structure can be the convex hull or the concave pit in the same row of turbulence structures when the two different turbulence structures are specifically arranged. Or, in the same row of turbulence structures, part of the turbulence structures can be convex hulls, and part of the turbulence structures are pits. In one possible combination, in the same row of turbulence structures, any two adjacent turbulence structures are respectively a convex hull and a concave pit, i.e. the convex hulls and the concave pits are alternately arranged in sequence. Under the above-mentioned combined form, the air current can flow through convex closure and pit alternately to when the air current flows to the pit from the convex closure, the air current can flow downwards along the surface of convex closure and get into in the pit, thereby can reduce the backward flow district of air current in the pit, improve the heat transfer effect of air current. Meanwhile, when the air flow flows from the concave pit to the convex hull, the air flow can flow upwards to the surface of the convex hull along the side wall of the concave pit, so that a backflow area formed by the convex hull and the first surface can be correspondingly reduced, and the heat exchange effect of the air flow is improved.
In the same row of turbulence structures, on the basis that the turbulence structures are arranged in a mode that convex hulls and pits are alternately arranged, two turbulence structures which are arranged in parallel can be correspondingly arranged into the convex hulls and the pits aiming at two adjacent rows of turbulence structures. In order to describe the effect of the above combination, first, the second surface of the heat exchange chip is defined, and the second surface of the heat exchange chip is perpendicular to the thickness direction of the heat exchange chip and is away from the first surface of the heat exchange chip. Secondly, it should be understood that the above-mentioned turbulent structure may have turbulent effects on both the first surface and the second surface of the heat exchange chip, and specifically, if the same turbulent structure is a convex hull on the first surface, the same turbulent structure is a concave pit on the second surface correspondingly, and vice versa. Under the above-mentioned combined form, the arrangement rule of vortex structure on the first surface of heat exchange chip can be the same with the arrangement rule of vortex structure on the second surface to make the air current all have good heat transfer effect when flowing through first surface and second surface.
When the first surface of the heat exchange chip forms the flow channel, a plurality of partition walls can be arranged on the first surface, and the flow channel is formed by a gap between two adjacent partition walls. The spoiler structure is specifically disposed between two adjacent partition walls, and at least a part of the spoiler structure in the spoiler structure adjacent to the partition walls may be set as a convex hull. When the convex hull is specifically arranged, the convex hull can be obliquely arranged, and gradually approaches the partition wall along the flow direction of the airflow. In the process of air flow in the flow channel, the convex hulls can guide the air flow to the partition wall and form vortex perpendicular to the flow direction, and the vortex can promote mixing between the air flows, so that the heat exchange effect of the air flows is further improved.
In a second aspect, the present application further provides a heat exchange core, where the heat exchange core includes a plurality of heat exchange chips provided in the first aspect, and the plurality of heat exchange chips are stacked along a third direction Z. The third direction Z is consistent with the thickness direction of the heat exchange chip.
In the heat exchange core, at the first surface of each heat exchange chip, from one end close to the first surface to the other end far away from the first surface, the turbulent flow structures are all provided with the characteristic of gradual shrinkage, and each turbulent flow structure is provided with a curved wall surface, so that when the airflow passes through the turbulent flow structure, the airflow can flow along the curved wall surface of the turbulent flow structure, and the resistance to the airflow is reduced. In addition, the turbulent flow structure can further enable the occupation of the backflow area of the first surface to be smaller, the occupation of the strong heat exchange area to be larger, and further the air flow reserved in the backflow area is reduced, more air flow can carry out strong heat exchange with the heat exchange chip in the flowing process, the heat exchange effect of the air flow and the heat exchange chip is further improved, and the heat exchange capacity of the heat exchange core is enhanced.
In a third aspect, the present application further provides a heat exchange device, where the heat exchange device includes a chassis and the heat exchange core provided in the second aspect, and when the heat exchange core is specifically set, the heat exchange core is located in the chassis.
In the working process of the heat exchange device, two airflows with temperature difference pass through two air inlets correspondingly arranged on the side wall of the case to enter the case, then enter the heat exchange core body, realize heat exchange in the heat exchange core body, and finally pass through two air outlets correspondingly arranged on the side wall of the case to flow out of the case. In the heat exchange core, the air current can flow through in the clearance between two heat exchange chips to, through the vortex structure of locating the first surface of heat exchange chip, under the effect of above-mentioned vortex structure that this application set up, the air current can produce better heat transfer effect with the heat exchange chip, thereby has strengthened the heat transfer ability of heat exchange core, makes heat transfer device have good cooling effect to the heat source, or, can make heat transfer device have good heating effect to the cold source.
Drawings
Fig. 1 is an application scenario diagram of a heat exchange device provided in an embodiment of the present application;
fig. 2 is a schematic diagram of an internal structure of a heat exchange device according to an embodiment of the present application;
Fig. 3 is a schematic structural diagram of a heat exchange core provided in an embodiment of the present application;
fig. 4 is a schematic structural diagram of a heat exchange chip provided in an embodiment of the present application;
fig. 5 is a schematic structural diagram of a spoiler structure according to an embodiment of the present disclosure;
FIG. 6 is a schematic view of a first cross-section of the spoiler structure shown in FIG. 5;
FIG. 7 is another schematic view of the spoiler structure shown in FIG. 5;
fig. 8 is a schematic structural diagram of a spoiler structure according to an embodiment of the present disclosure;
fig. 9 is a schematic structural diagram of another heat exchange chip provided in an embodiment of the present application;
fig. 10 is a schematic layout view of a turbulence structure located on a first surface of a heat exchange chip according to an embodiment of the present application;
fig. 11 is a schematic layout view of a turbulence structure located on a first surface of a heat exchange chip according to an embodiment of the present application;
fig. 12 is a schematic layout view of a turbulence structure located on a first surface of a heat exchange chip according to an embodiment of the present application;
fig. 13 is a schematic layout diagram of a turbulence structure located on a first surface of a heat exchange chip according to an embodiment of the present application;
fig. 14 is a schematic layout view of a turbulence structure located on a first surface of a heat exchange chip according to an embodiment of the present application;
Fig. 15 is a schematic flow diagram of an air flow between a convex hull and a partition wall according to an embodiment of the present application.
Reference numerals:
1-a heat exchange device; 10-a case; 101-a first space; 102-a second space; 103-a third space; 104-fourth space; 11-a first inlet; 12-a first outlet; 13-a second inlet; 14-a second outlet;
20-a heat exchange core;
30-a heat exchange chip; 301-a first surface; 302-flow channel;
40-turbulence structure; 40 a-convex hull; 40 b-pit; 400-curved wall surface; 41-first section; 410-curved boundary; 410 a-a first curved boundary; 410 b-a second curved boundary; 411-first end; 412-a second end; 42-second section; 43-land area;
401-a first spoiler structure; 402-a second spoiler structure; 403-a third spoiler structure; 404-fourth turbulence structures;
50-turbulence columns;
60-partition wall.
Detailed Description
In order to facilitate understanding of the heat exchange chip, the heat exchange core body and the heat exchange device provided by the embodiment of the application, an application scene of the heat exchange chip, the heat exchange core body and the heat exchange device is introduced first. Fig. 1 is an application scenario diagram of a heat exchange device provided in an embodiment of the present application, as shown in fig. 1, in the application scenario, the heat exchange device 1 is applied to an IT (internet technology ) machine room 2, and the heat exchange device 1 is communicated with the IT machine room 2 to dissipate heat of IT equipment 201 in the IT machine room 2. Specifically, during the use process, the air flow a in the IT machine room 2 is delivered to the inside of the heat exchange device 1 as indoor return air, and the outdoor air flow B is delivered to the inside of the heat exchange device 1 as fresh air, wherein the air flow a and the air flow B are two air flows with temperature difference. In the heat exchange device 1, the air flow a and the air flow B can exchange heat, after which the temperature of the air flow a is reduced and sent back to the IT machine room 2, and the temperature of the air flow B is increased and discharged outside the heat exchange device 1. The air flow A with lower temperature flows back to the IT machine room 2 and can exchange heat with the IT equipment 201, so that the purpose of heat dissipation of the IT equipment 201 is achieved.
Besides the data center, the heat exchange device 1 can also be applied to scenes such as workshops, markets or families. In addition, according to actual needs, the heat exchange device 1 can be used for realizing the purpose of cooling and the purpose of heating.
In addition, the heat exchange device 1 can exchange heat between two different types of liquid besides two different types of air flows. In the embodiment of the present application, the heat exchange device 1 is used for realizing heat exchange between two air flows with temperature difference as an example.
Fig. 2 is a schematic structural diagram of a heat exchange device according to an embodiment of the present application, and as shown in fig. 2, the heat exchange device 1 includes a chassis 10 and a heat exchange core 20 disposed inside the chassis 10. The heat exchange core 20 is a core heat exchange component of the heat exchange device 1, and the heat exchange device 1 utilizes the heat exchange core 20 to enable two air flows with temperature difference to realize heat exchange so as to achieve the purpose of cooling or heating.
The manner of disposing the heat exchange core 20 in the cabinet 10 is not particularly limited, and for example, in the embodiment shown in fig. 2, the inner cavity of the cabinet 10 is divided into a first space 101, a second space 102, a third space 103 and a fourth space 104 which are not communicated with each other according to the disposed position of the heat exchange core 20. Meanwhile, the side wall of the cabinet 10 is provided with a first inlet 11, a first outlet 12, a second inlet 13, and a second outlet 14. Wherein the first inlet 11 communicates with the first space 101, the first outlet 12 communicates with the third space 103, the second inlet 13 communicates with the second space 102, and the second outlet 14 communicates with the fourth space 104. Two air flows with temperature difference are represented by air flow A and air flow B, wherein the air flow A can enter the heat exchange core 20 through the first inlet 11 and the first space 101, the air flow B can enter the heat exchange core 20 through the second inlet 13 and the second space 102, and the air flow A and the air flow B realize heat exchange in the process of flowing through the heat exchange core 20. After heat exchange, air flow a may exit the enclosure 10 through the third space 103 and the first outlet 12, and air flow B may exit the enclosure 10 through the fourth space 104 and the second outlet 14.
The flow paths of the air streams a and B may be arranged in a crisscross shape within the heat exchange core 20, or may be arranged in other possible forms, which the present application is not limited to.
Fig. 3 is a schematic structural diagram of a heat exchange core provided in an embodiment of the present application, as shown in fig. 3, the heat exchange core 20 includes a plurality of heat exchange chips 30, and the plurality of heat exchange chips 30 are stacked along a third direction Z. The heat exchange chip 30 may be understood as a plate-type structure having a certain thickness, and the thickness direction of the heat exchange chip 30 is the third direction Z.
The number of heat exchange chips 30 included in the heat exchange core 20 is not limited, and may be specifically set according to heat exchange requirements. For example, in the embodiment shown in FIG. 3, the heat exchange core 20 includes three heat exchange chips 30. In other embodiments, the heat exchange core 20 may also include four, five, six, or other numbers of heat exchange chips 30, not expressly shown herein.
Fig. 4 is a schematic structural diagram of a heat exchange chip provided in an embodiment of the present application, and as shown in fig. 4, the heat exchange chip 30 includes a first surface 301, where the first surface 301 is perpendicular to a third direction Z. During the heat exchange process, the air flow may flow over the first surface 301 of the heat exchange chip 30 and heat exchange with the first surface 301 occurs. In order to enhance the heat exchange effect of the air flow when passing through the first surface 301, the first surface 301 is provided with a plurality of turbulence structures 40, and the turbulence structures 40 can increase turbulence of the air flow and expand the surface area of the heat exchange chip 30, thereby enhancing the heat exchange effect.
With continued reference to fig. 4, the spoiler structure 40 is a symmetrical structure from a structural point of view, and the spoiler structure 40 has a central axis OP extending in a direction parallel to the third direction Z. The spoiler structure 40 includes a curved wall surface 400 disposed around a central axis OP, an area surrounded by the curved wall surface 400 gradually contracts toward the central axis OP in a direction away from the first surface 301, and the wall surface structure of the curved wall surface 400 bulges in a direction away from the first surface 301. In the embodiment shown in fig. 4, the wall structure of the curved wall 400 bulges outwardly with respect to the lumen of the curved wall 400 from the bottom end of the curved wall 401 near the first surface 301 to the top end of the curved wall 401 remote from the first surface 301.
The curved wall 401 may be spherical, parabolic, ellipsoidal, or any other curved surface having a streamlined shape.
Fig. 5 is a schematic structural diagram of a spoiler structure provided in this embodiment, as shown in fig. 5, the spoiler structure 40 includes a plurality of first sections 41, and for any one of the first sections 41, the first section 41 passes through a central axis OP of the spoiler structure 40, and the first section 41 is perpendicular to the first surface 301. The first cross section 41 may be understood as a first reference plane M passing through the central axis OP of the spoiler structure 40 and perpendicular to the first surface 301 1 N 1 And (5) intercepting the pattern layer structure at the section of the turbulent flow structure 40 and the first turbulent flow structure 40. When a first reference plane M 1 N 1 When rotated about the central axis OP of the spoiler structure 40, a plurality of first cross-sections 41 at different positions can be obtained.
Fig. 6 is a schematic view of a first cross section included in the spoiler structure, as shown in fig. 6, the first cross section 41 and the curved wall 400 intersect to form two curved boundaries 410, the two curved boundaries 410 are located at two sides of the central axis OP, each curved boundary 410 is a smooth curve, and each curved boundary 410 protrudes toward a direction away from the first surface 301. Taking any one of the curved boundaries 410 as an example, the curved boundary 410 includes a first end 411 and a second end 412, and the first end 411 and the second end 412 are a head end and a tail end of the curved boundary, respectively. The curved boundary 410 gradually approaches the central axis OP of the spoiler structure 40 during the extending from the first end 411 to the second end 412, and the curved boundary 410 gradually moves away from the first surface 301 of the heat exchange chip 30.
Specifically, from the first end 411 to the second end 412, the curved boundary 410 includes a distance h from each point to the central axis OP of the spoiler structure 40 1 Gradually decreasing so that the curved boundary 410 has a tendency to gradually approach the central axis OP of the spoiler structure 40 in the above-described direction; and, the distances h from the first surface 301 to the points included in the curved boundary 410 2 Gradually increasing so that the curved boundary 410 has a tendency to gradually move away from the first surface 301 of the heat exchange chip 30 in the above-described direction.
From a slope point of view, the slopes of the curved boundaries 410 have a gradual trend, and the slopes of two curved boundaries 410 located within the same first section 41 have positive and negative fractions and have opposite trends. For convenience of description, the intersection of the first section 41 and the curved wall 400 forms two curved boundaries 410, which are respectively denoted as a first curved boundary 410a and a second curved boundary 410b. When the first curved boundary 410a and the second curved boundary 410b are specifically set according to the slope, the slope of the first curved boundary 410a and the slope of the second curved boundary 410b include a plurality of possible variations. In one possible variation, as shown in fig. 6, the slope of the first curved boundary 410a may have a gradually decreasing trend, e.g., from the first end 411 to the second end 412 of the first curved boundary 410a, with the slope of the first curved boundary 410a gradually changing from positive infinity to zero. With continued reference to fig. 6, unlike the trend exhibited by the slope of the first curved boundary 410a, the slope of the second curved boundary 410b may have a gradually increasing trend, e.g., from the first end 411 to the second end 412 of the second curved boundary 410b, with the slope of the second curved boundary 410b gradually changing from minus infinity to zero.
In another possible form, the slope of the first curved boundary 410a may exhibit a trend of increasing and then decreasing. For example, from the first end 411 to the second end 412 of the first curved boundary 410a, the slope of the first curved boundary 410a gradually increases from zero to a first preset value, and then gradually decreases from the first preset value to zero again. The slope of the second curved boundary 410b may be a trend of gradually decreasing and then gradually increasing, for example, from the first end 411 to the second end 412 of the second curved boundary 410b, the slope of the second curved boundary 410b gradually decreases from zero to a second preset value, and then gradually increases from the second preset value to zero.
The slope of the curved boundary 410 at the end point includes a variety of possibilities. For the first end 411 of the curved boundary 410, the slope of the curved boundary 410 at this location may be infinite, i.e., a tangent line passing through the first end 411 of the curved boundary 410 is perpendicular to the first surface 301. Alternatively, the slope of the curved boundary 410 at the first end 411 may be a first predetermined value, i.e., a tangent line passing through the first end 411 of the curved boundary 410 is disposed obliquely with respect to the first surface 301. For the second end 412 of the curved boundary 410, the slope of the curved boundary 410 at this location may be zero, i.e., a tangent line to the second end 412 that crosses the curved boundary 410 is parallel to the first surface 301. Alternatively, the slope of the curved boundary 410 at the second end 412 may be a second predetermined value, i.e., a tangent line passing through the second end 412 of the curved boundary 410 is disposed obliquely with respect to the first surface 301.
The curved boundary 410 may include a variety of possible shapes, for example, the curved boundary 410 may be a circular arc, a parabola, an elliptical boundary, or other types of curves, without limitation. The curved boundaries 410 are located on the curved wall 400 disposed around the central axis OP, and accordingly, the curved wall 400 may be spherical, parabolic, ellipsoidal, or other curved surface with streamline characteristics.
In one possible arrangement, the first ends 411 of the different curved boundaries 410 may be located at the connecting edge of the spoiler structure 40 and the first surface 301, so that the curved surface formed by combining the plurality of curved boundaries 410 is directly connected with the first surface 301, which simplifies the structure of the spoiler structure 40, and facilitates manufacturing of the spoiler structure 40. In another possible arrangement, the second ends 412 in the different curved boundaries 410 may also intersect at a point, and the slope at the point of the second ends 412 may be set to zero, such that the airflow experiences less resistance as it flows over the top of the spoiler structure 40.
In the spoiler structure 40 provided in the present application, the spoiler structure 40 has a smooth curved wall surface 400 provided around a central axis OP, and an area surrounded by the curved wall surface 400 gradually contracts toward the central axis OP in a direction away from the first surface 301. During the process of passing through the turbulence structure 40, the air flow can flow along the curved wall 400, so that the resistance of the air flow is small. Under the condition that the output power of a fan for providing power for the flow of the air flow is unchanged, the reduction of the air flow resistance can enable the flow speed of the air flow to be improved, so that the air flow quantity in heat exchange with the heat exchange chip 30 is increased in unit time, and further the heat exchange effect of the air flow and the heat exchange chip 30 is improved.
The turbulent flow structure 40 can further make the occupation of the backflow area of the first surface 301 smaller and the occupation of the strong heat exchange area larger, so that the air flow remained in the backflow area is reduced, and more air flow can perform strong heat exchange with the heat exchange chip 30 in the flowing process, so that the heat exchange effect of the air flow and the heat exchange chip 30 is further improved. In addition, when the air flows through the turbulence structure 40, the air can impact and reattach to the surface of the turbulence structure 40, and the phenomena of air impact and reattach can strengthen the heat exchange between the air and the surface of the heat exchange chip 30, so as to further improve the heat exchange effect of the air.
To further understand the features of the spoiler structure 40, the spoiler structure 40 further includes a second cross-section 42, as shown in fig. 4. The number of second sections 42 is plural, and each second section 42 is parallel to the first surface 301. It should be appreciated that each spoiler structure 40 comprises a first section 41 and a second section 42, the first section 41 and the second section 42 being shown in two different spoiler structures 40, respectively, in fig. 4 for the sake of clarity of the position of the first section 41 and the second section 42 in the spoiler structures 40.
Fig. 7 is another schematic view of the turbulence structure provided in the embodiment of the present application, as shown in fig. 7, the second section 42 included in the turbulence structure 40 may be understood as a second reference plane M parallel to the first surface 301 2 N 2 And (5) intercepting the turbulent flow structure 40, wherein the pattern layer structure at the section of the turbulent flow structure 40. When the second reference plane M 2 N 2 When moving in the third direction Z, a plurality of second cross sections 42 at different positions of the spoiler structure 40 can be obtained. The shape of each second section 42 is the same in the plurality of second sections 42 included in the spoiler structure 40, for example, each second section 42 may be circular, elliptical, or have a shape with streamline characteristics other than circular and elliptical, which is not limited in this application. Also, the area of each second section 42 is different, and the area of the second section 42 gradually decreases in a direction away from the first surface 301.
In the above-described spoiler structure 40, the different second cross sections 42 have the same shape and different areas, and if one of the second cross sections 42 is taken as a reference plane, the other second cross sections 42 can be formed in a different scale by enlarging or reducing the reference plane.
When the spoiler structure 40 is disposed according to the variation law of the second cross-section 42, a plurality of different spoiler structures 40 can be obtained. In the embodiment shown in fig. 5, the spoiler 40 has a highest point away from the top of the first surface 301. From the perspective of the curved wall 400 included in the spoiler structure 40, the curved wall 400 is away from the top end of the first surface 301 and is retracted to a point on the central axis OP. From the perspective of the first section 41 included in the spoiler structure 40, the second ends 412 of the curved boundaries 410 intersect at a point in the plurality of first sections 41 included in the spoiler structure 40. From the perspective of the second sections 42 included in the spoiler structure 40, the areas of the plurality of second sections 42 included in the spoiler structure 40 gradually decrease to zero along the direction away from the first surface 301.
Fig. 8 is another schematic view of the above-mentioned turbulence structure according to the embodiment of the present application, as shown in fig. 8, a top portion of the turbulence structure 40 away from the first surface 301 has a platform area 43. From the perspective of the curved wall 400 included in the spoiler structure 40, the curved wall 400 is located at a certain area of the central axis OP Zhou Cewei away from the top end of the first surface 301. From the perspective of the first section 41 included in the spoiler structure 40, each of the first sections 41 included in the spoiler structure 40 includes a linear boundary between two curved boundaries 410, and the linear boundary connects the second ends of the two curved boundaries 410. From the perspective of the second sections 42 included in the spoiler structure 40, the areas of the plurality of second sections 42 included in the spoiler structure 40 gradually decrease to a predetermined value along a direction away from the first surface 301.
In an alternative embodiment, the turbulence structure 40 is a spherical cap structure. In particular, the spherical cap structure may be a hemisphere, or less than a hemisphere. When the spoiler structure 40 is a hemisphere, two curved boundaries 410 located on the same first section 41 among the plurality of first sections 41 included in the spoiler structure 40 are symmetrically disposed about the central axis OP, and the two curved boundaries 410 are connected to form a semicircle. When the spherical crown structure is less than a half sphere, two curved boundaries 410 located at the same first section 41 are symmetrically disposed about the central axis OP, and the two curved boundaries 410 are connected to form a minor arc among the plurality of first sections 41 included in the spoiler structure 40. Any of the second cross sections 42 included in the spoiler structure 40 is entirely circular.
In another alternative embodiment, as shown in fig. 5, the spoiler structure 40 may also be an ellipsoidal crown structure. The spoiler structure 40 may be a half ellipsoid or less than a half ellipsoid. When the spoiler structure 40 is a half ellipsoid, two curved boundaries 410 located on the same first section 41 among the plurality of first sections 41 included in the spoiler structure 40 are symmetrically disposed about the central axis OP, and the two curved boundaries 410 are connected to form a half ellipsoid boundary line. When the spoiler structure 40 is less than half an ellipsoid, two curved boundaries 410 located on the same first section 41 are symmetrically disposed about the central axis OP, and a curve formed by connecting the two curved boundaries 410 is smaller than half an ellipsoid boundary line, among the plurality of first sections 41 included in the spoiler structure 40. Any of the second cross sections 42 included in the spoiler structure 40 has a complete elliptical shape.
As shown in fig. 4, in one structure of the heat exchange chip 30 provided in the embodiment of the present application, the turbulence structure 40 may be a convex hull 40a located on the first surface 301 of the heat exchange chip 30. With respect to the first surface 301, the convex hull 40a is convex in a direction away from the first surface 301. As the airflow passes over convex hull 40a, the airflow may flow upward along the surface of convex hull 40a relative to first surface 301 and continue beyond convex hull 40a.
In addition to the heat exchange chip 30 shown in fig. 4, fig. 9 is a schematic structural diagram of another heat exchange chip provided in the embodiment of the present application, and as shown in fig. 9, the turbulence structures 40 are pits 40b located on the first surface 301 of the heat exchange chip 30. The pits 40b are recessed with respect to the first surface 301 in a direction away from the first surface 301, thereby forming recessed areas in the first surface 301. As the air flow passes through the pocket 40b, the air flow may flow downward relative to the first surface 301 to enter the recessed area, and may exchange heat with the heat exchange chip 30 during the flow through the recessed area.
In a specific arrangement, in one heat exchange chip 30, for the same first surface 301, the plurality of turbulence structures 40 disposed on the first surface 301 may be convex hulls 40a, or pits 40b. Still alternatively, in other embodiments, in one heat exchange chip 30, for the same first surface 301, among the plurality of turbulence structures 40 disposed on the first surface 301, a portion of the turbulence structures 40 may be the pits 40b, and another portion of the turbulence structures 40 may be the convex hulls 40a.
It should be noted that, when the spoiler structure 40 is the convex hull 40a, the "direction away from the first surface 301" as used herein refers to a direction away from the first surface 301, and the convex hull 40a protrudes. When the spoiler structure 40 is a pit 40b, the "direction away from the first surface 301" as used herein refers to a direction away from the first surface 301 and the pit 40b is recessed.
When the turbulence structure 40 is disposed on the heat exchange chip 30, if the turbulence structure 40 is a convex hull 40a on the first surface 301 of the heat exchange chip 30, the same turbulence structure 40 may form a pit 40b on the second surface of the heat exchange chip 30; the second surface is perpendicular to the thickness direction of the heat exchange chip 30 and faces away from the first surface 301 of the heat exchange chip 30. Conversely, if the spoiler structure 40 is the concave pit 40b on the first surface 301 of the heat exchange chip 30, the same spoiler structure 40 may form the convex hull 40a on the second surface of the heat exchange chip 30. For the same heat exchange chip 30, the air flow a and the air flow b are used to represent different air flows, and when the air flow a passes through the first surface 301, the turbulence structure 40 can enhance the heat exchange effect of the air flow a; the same turbulence structure 40 can enhance the heat exchanging effect of the air flow b when the air flow b passes through the second surface.
As a whole, as shown in fig. 4, the spoiler structure 40 may be strip-shaped and extend in the first direction. Wherein the first direction is parallel to the first surface 301 of the heat exchange chip 30. For convenience of description, the first direction is denoted by the direction X. When the spoiler structure 40 is specifically disposed, the spoiler structure 40 can have a maximum length dimension along the first direction X.
Specifically, as can be seen from the foregoing description, the plurality of second sections 42 included in the spoiler structure 40 gradually decrease along the direction away from the first surface 301, and the second section 42 located at the connection between the spoiler structure 40 and the first surface 301 is the largest one of the plurality of second sections 42 included in the spoiler structure 40. Therefore, the maximum length dimension of the spoiler structure 40 is the maximum length dimension of the second cross section 42 at the junction between the spoiler structure 40 and the first surface 301. Specifically, as shown in fig. 4, the edge of the second section 42 includes a first edge point X disposed along the first direction X 1 And a second edge point X 2 First edge point X 1 And a second edge point X 2 The length therebetween may form the maximum length dimension described above. In the second section 42, a first edge point X 1 And is different from the first edge point X 1 Second edge point X 2 Distance between any other edge points than the second edge point X 2 And is different from the first edge point X 1 Second edge point X 2 Distance between other edge points than the first edge point X 1 Second edge point X 2 The distance between the two other points is smaller than the first edge point X 1 And a second edge point X 2 Distance between them.
When the turbulence structure 40 is disposed on the first surface 301 of the heat exchange chip 30, the flow channel 302 may be disposed on the first surface 301, and the turbulence structure 40 may be disposed in the flow channel 302. The flow channel 302 defines a flow path of the air flow in the gap between the adjacent two heat exchange chips 30, so that the air flow can flow in the extending direction of the flow channel 302 when passing through the gap between the adjacent two heat exchange chips 30. It will be appreciated that the same air flow, when passing through the gap between two adjacent heat exchange chips 30, passes over the first surface 301 of the heat exchange chip 30 located below, and also passes over the second surface of the heat exchange chip 30 located above.
In the heat exchange core 20 formed by stacking a plurality of heat exchange chips 30, the extending directions of the flow passages 302 located at the first surfaces 301 of any adjacent two heat exchange chips 30 may be set to be perpendicular to each other for the two heat exchange chips 30. That is, for the same heat exchange chip 30, the air flow passing through the first surface 301 of the heat exchange chip 30 and the air flow passing through the second surface of the heat exchange chip 30 are perpendicular to each other. If the air flow a is the air flow passing through the first surface 301 of the heat exchange chip 30, the air flow b is the air flow passing through the second surface of the heat exchange chip 30, then the included angle α between the first direction X of the same turbulence structure 40 and the flow direction of the air flow a, and the included angle β between the first direction X of the same turbulence structure 40 and the flow direction of the air flow b satisfy β=90 ° - α.
In a specific arrangement, if the extending direction of the flow channel 302 is denoted as the second direction Y, the first direction X of the spoiler 40 and the second direction Y of the flow channel 302 include a plurality of possible arrangements. In one possible arrangement, the first direction X of the spoiler 40 is perpendicular to the second direction Y of the runner 302. In the above arrangement, when the air flow a passes through the first surface 301 of the heat exchange chip 30, the first direction X of the spoiler structure 40 is perpendicular to the flow direction of the air flow a. When the air flow b passes through the second surface of the same heat exchange chip 30, the first direction X of the same turbulence structure 40 is parallel to the flow direction of the air flow b. In contrast, the turbulence structure 40 can play a better role in turbulence on the airflow a, and can enhance the heat exchange effect of the airflow a.
In another possible arrangement, the first direction X of the spoiler structure 40 and the second direction Y of the runner 302 are parallel, i.e. the spoiler structure 40 is arranged along the extending direction of the runner 302. In the above arrangement, when the air flow a passes through the first surface 301 of the heat exchange chip 30, the first direction X of the spoiler structure 40 is parallel to the flow direction of the air flow a. When the air flow b passes through the second surface of the same heat exchange chip 30, the first direction X of the same turbulence structure 40 is perpendicular to the flow direction of the air flow b. In contrast, the turbulence structure 40 may perform a better turbulence effect on the airflow b, and may enhance the heat exchange effect of the airflow b.
In yet another possible arrangement, the angle between the first direction X of the spoiler structure 40 and the second direction Y of the runner 302 is an acute angle, i.e. the spoiler structure 40 is obliquely arranged within the runner 302. The above arrangement forms can make the resistance of the turbulent structure 40 to the air flow smaller in the process of flowing the air flow in the flow channel 302, and can generate better turbulent effect, thereby being beneficial to further improving the heat exchange effect of the heat exchange chip 30. Also, in the above arrangement, when the air flow a passes through the first surface 301 of the same heat exchange chip 30, the first direction X of the spoiler structure 40 is disposed obliquely with respect to the flow direction of the air flow. If the angle formed by the first direction X of the spoiler structure 40 and the flow direction of the air flow is denoted by α, 0 ° < α <90 °. When the air flow b passes through the second surface of the same heat exchange chip 30, the first direction X of the same turbulence structure 40 is also disposed obliquely with respect to the flow direction of the air flow b. If β represents the angle between the first direction X of the spoiler structure 40 and the flow direction of the airflow, 0 ° < β <90 °. That is, on the first surface 301 and the second surface of the same heat exchange chip 30, the first direction X of the same turbulence structure 40 can be inclined relative to the flow direction of the air flow, so that on the first surface 301 and the second surface of the same heat exchange chip 30, the resistance of the turbulence structure 40 to the air flow is smaller, and a better turbulence effect can be generated, which is beneficial to further improving the heat exchange effect of the heat exchange chip 30.
It should be noted that, the first direction X represents an installation direction of the maximum length dimension of the spoiler structure 40, and the second direction Y represents a length direction of the runner 302. The first direction X and the second direction Y may be understood as a straight line without an arrow.
In a specific arrangement, if the included angle between the first direction X of the turbulence structure 40 and the second direction Y of the flow channel 302 is represented by θ on the first surface 301 of the heat exchange chip 30, θ may be made to satisfy: θ is more than or equal to 30 degrees and less than or equal to 60 degrees. The value of θ may be specifically 35 °, 40 °, 45 °, 50 °, 55 °, or other values satisfying the above range, which is not limited in this application.
On the first surface 301 of the heat exchange chip 30, the second direction Y of the flow channel 302 is consistent with the flow direction of the air flow, and the above α satisfies: alpha is more than or equal to 30 degrees and less than or equal to 60 degrees. According to the corresponding relation between alpha and beta, beta satisfies the following conditions: beta is more than or equal to 30 degrees and less than or equal to 60 degrees. In the above range, the values of α and β may be relatively close and may be changed within a small range of 30 ° to 60 °, so that the air flow a and the air flow b may both obtain good heat exchange effects on both sides of the same heat exchange chip 30, thereby being beneficial to enhancing the heat exchange capability of the heat exchange chip 30.
Fig. 10 is a schematic layout diagram of a plurality of turbulence structures provided in the embodiment of the present application on a first surface of a heat exchange chip, as shown in fig. 10, the first surface 301 is provided with at least two rows of turbulence structures 40, where each row of turbulence structures 40 includes a plurality of turbulence structures 40 arranged at intervals along the same direction. If each row of spoiler structures 40 is denoted as one spoiler row 50, the first surface 301 may be provided with at least two spoiler rows 50, and the plurality of spoiler structures 40 included in each spoiler row 50 may be disposed at intervals along the second direction Y. During the heat exchange process, the air flow may sequentially pass through the plurality of turbulence structures 40 along the second direction Y. Under the action of the turbulence structure 40, the heat exchange effect between the air flow and the heat exchange chip 30 is enhanced.
In particular, the spoiler structures 40 located in the same spoiler row 50 have a plurality of possible arrangements. As shown in fig. 10, the plurality of spoiler structures 40 included in the same spoiler row 50 may extend in the same direction. Specifically, the included angle formed by the first direction X of any two adjacent turbulence structures 40 and the second direction Y of the flow channel 302 is an acute angle, and the magnitude of the acute angle is the same; in addition, the first directions X of the different spoiler structures 40 are parallel to each other. Formally, each spoiler structure 40 is obliquely arranged in the same direction.
When the number of the spoiler rows 50 is plural, the plural spoiler rows 50 may be disposed side by side in the flow passage 302, and the spoiler structures 40 in each spoiler row 50 may be arranged in the above-described arrangement. In any two adjacent spoiler rows 50, the two spoiler structures 40 arranged in parallel may be disposed obliquely in the same direction, or may be disposed in other manners. As shown in fig. 10, the orthographic projections of the adjacent two spoiler columns 50 on the first surface 301 are symmetrical along the center line between the adjacent two spoiler columns 50. The extending direction of the center line is the same as the direction in which the plurality of spoiler structures 40 included in each spoiler row 50 are arranged at intervals.
Specifically, in the two adjacent spoiler columns 50, two spoiler structures 40 arranged in parallel are a first spoiler structure 401 and a second spoiler structure 402, an included angle θ formed by a first direction X of the first spoiler structure 401 and a second direction Y of the runner 302 is an acute angle, and the included angles θ formed by the first direction X of the second spoiler structure 402 and the second direction Y of the runner 302 are the same; in addition, the first direction X of the first spoiler structure 401 and the first direction X of the second spoiler structure 402 are disposed to intersect. Structurally, the orthographic projections of the two spoiler structures 40 on the first surface 301 are symmetrically disposed about a centerline therebetween. When the turbulence structure 40 is disposed on the first surface 301 of the heat exchange chip 30, the arrangement of the turbulence structure 40 can be optimized in the above manner, so that the turbulence of the airflow in a local range can be standardized, and the heat exchange effect of the airflow can be further enhanced.
Fig. 11 is another arrangement schematic diagram of a plurality of turbulence structures on a first surface of a heat exchange chip according to the embodiment of the present application, as shown in fig. 11, in the same turbulence column 50, two adjacent turbulence structures 40 have different extending directions, and the orthographic projections of the two turbulence structures on the first surface 301 are symmetrically arranged with respect to a center line therebetween.
Specifically, in the same spoiler row 50, any two adjacent spoiler structures 40 are a third spoiler structure 403 and a fourth spoiler structure 404, an included angle θ formed by a first direction X of the third spoiler structure 403 and a second direction Y of the runner 302, and an included angle θ formed by the first direction X of the fourth spoiler structure 404 and the second direction Y of the runner 302 are acute angles, and the magnitudes of the acute angles are the same; in addition, the first direction X of the third spoiler structure 403 and the first direction X of the fourth spoiler structure 404 are disposed to intersect. Structurally, the orthographic projections of any adjacent two spoiler structures 40 located in the same spoiler row 50 on the first surface 301 may be symmetrically disposed about a center line therebetween.
When the number of the spoiler rows 50 is plural, the plural spoiler rows 50 may be disposed side by side in the flow passage 302, and the spoiler structures 40 in each spoiler row 50 may be arranged in the above-described arrangement. In any two adjacent spoiler rows 50, the two spoiler structures 40 arranged in parallel may be disposed obliquely in the same direction, or may be disposed in other manners. As shown in fig. 11, the orthographic projection of the adjacent two spoiler columns 50 on the first surface 301 is symmetrical along the center line between the adjacent two spoiler columns 50. The extending direction of the center line is the same as the direction in which the plurality of spoiler structures 40 included in each spoiler row 50 are arranged at intervals. When the turbulence structure 40 is disposed on the first surface 301 of the heat exchange chip 30, the arrangement of the turbulence structure 40 can be optimized in the above manner, so that the turbulence of the airflow in a local range can be standardized, and the heat exchange effect of the airflow can be further enhanced.
Of course, the spoiler structures 40 in the same spoiler array 50 may also be arranged in other forms, which are not listed here. In addition, when the spoiler rows 50 are plural, in any two adjacent spoiler rows 50, the extending directions of the two spoiler structures 40 arranged in parallel may be set to be parallel to each other; alternatively, the orthographic projections of the two spoiler structures 40 arranged in parallel on the first surface 301 may be set to be symmetrical with respect to the center line therebetween; still alternatively, the two spoiler structures 40 arranged in parallel may be arranged in other ways, which are not specifically recited in the present application.
If the convex hull 40a and the concave pit 40b are used to distinguish two different spoiler structures 40, when the spoiler structures 40 in the same spoiler column 50 are specifically arranged, the spoiler structures 40 may be the convex hull 40a or the concave pit 40b. Still alternatively, the plurality of spoiler structures 40 in the same spoiler column 50 may also be a combination of the convex hull 40a and the concave pit 40b.
Fig. 12 is another arrangement schematic diagram of a plurality of turbulence structures provided in this embodiment on a first surface of a heat exchange chip, as shown in fig. 12, the turbulence structures 40 filled with lines are convex hulls 40a, the turbulence structures 40 filled with black dots are concave pits 40b, and in the same turbulence column 50, any two adjacent turbulence structures 40 may be respectively convex hulls 40a and concave pits 40b, that is, convex hulls 40a and concave pits 40b are sequentially and alternately arranged. In the above combination, the air flow may alternately flow through the convex hull 40a and the concave pit 40b, and, when the air flow flows from the convex hull 40a to the concave pit 40b, the air flow may flow down along the surface of the convex hull 40a and into the concave pit 40b, so that the reflux area of the air flow in the concave pit 40b may be reduced, and the impact and reattachment are advantageously formed on the surface of the concave pit 40b to improve the heat exchange effect. Meanwhile, when the air flows from the concave pit 40b to the convex hull 40a, the air can flow upwards to the surface of the convex hull 40a along the side wall of the concave pit 40b, so that the reflux area formed by the convex hull 40a and the first surface 301 can be correspondingly reduced, and the impact and reattachment are formed on the surface of the convex hull 40a, so that the heat exchange effect is improved.
In the same spoiler column 50, on the basis that the spoiler structures 40 are arranged in the form of alternately arranging the convex hulls 40a and the concave pits 40b, for two adjacent spoiler columns 50, two spoiler structures 40 arranged in parallel may be both the convex hulls 40a or both the concave pits 40b.
Fig. 13 is another schematic layout diagram of a plurality of turbulence structures provided in this embodiment on the first surface of the heat exchange chip, as shown in fig. 13, in the same turbulence column 50, on the basis that the turbulence structures 40 are arranged in an alternating manner of convex hulls 40a and concave pits 40b, for two adjacent turbulence columns 50, two turbulence structures 40 arranged in parallel may be correspondingly arranged as convex hulls 40a and concave pits 40b. In the above combination, the arrangement rule of the turbulence structures 40 on the first surface 301 of the heat exchange chip 30 may be the same as the arrangement rule of the turbulence structures 40 on the second surface of the same heat exchange chip 30, so that the airflow has good heat exchange effect when flowing through the first surface 301 and the second surface.
Fig. 14 is another schematic layout diagram of a plurality of turbulence structures provided in the embodiment of the present application on the first surface of the heat exchange chip, in the embodiment shown in fig. 14, the layout rule of the convex hull 40a and the concave pit 40b is the same as that of the convex hull 40a and the concave pit 40b in the embodiment shown in fig. 13, and the number of turbulence columns 50 in the flow channel 302 is different. Specifically, in the embodiment shown in fig. 13, two turbulence columns 50 are disposed in the flow channel 302; in the embodiment shown in fig. 14, four spoiler rows 50 are disposed in the flow channel 302. In other embodiments, other numbers of spoiler arrays 50 may be disposed within the runner 302, which is not specifically recited herein.
Specifically, when the first surface 301 of the heat exchange chip 30 forms the flow channel 302, a plurality of partition walls 70 may be disposed on the first surface 301, and the flow channel 302 may be formed by a space between two adjacent partition walls 70; the spoiler structure 40 is particularly disposed between the adjacent two partition walls 70, and, among the spoiler structures 40 adjacent to the partition walls 70, at least a portion of the spoiler structure 40 may be provided as a convex hull 40a for guiding a portion of the air flow to the partition walls 70.
Fig. 15 is a flow schematic diagram of an air flow between a convex hull and a partition wall, as shown in fig. 15, in the case that a turbulence structure 40 close to the partition wall 70 is a convex hull 40a, by setting an inclination mode of the convex hull 40a, the convex hull 40a can have the function of guiding part of the air flow to the partition wall 70, so that a vortex perpendicular to the flow direction is formed, and the formation of the vortex can promote mixing between the air flows, so that the effect of enhancing heat exchange is further achieved. Referring to fig. 13 and 15 together, taking the case of the flow of the air from left to right as an example, the distance between the convex hull 40a and the partition wall 70 may be gradually reduced in the flow direction of the air, that is, the convex hull 40a gradually approaches the partition wall 70, on the basis of the inclined arrangement of the convex hull 40 a. When the air flows through the convex hull 40, a part of the air flows can flow to the partition wall 70 under the flow guiding effect of the convex hull 40a, so that the air flows can form vortex which is perpendicular to the flowing direction near the partition wall 70, and the vortex formation promotes the mixing between the air flows, so that the effect of enhancing heat exchange is further achieved.
In particular, in the two spoiler rows 50 adjacent to the partition wall 70, the plurality of spoiler structures 40 included in the spoiler rows 50 may be each provided as the convex hulls 40a, or the spoiler structures 40 may be alternately provided in the form of the convex hulls 40a and the concave pits 40 b. Thus, mixing between the airflows can be promoted at both sides of the partition wall 70, further improving the heat exchanging effect of the airflows.
When the partition wall 70 is specifically formed on the first surface 301 of the heat exchange chip 30, the partition wall 70 may be provided as an integral structure, for example, the partition wall 70 may be provided as a continuous, uninterrupted strip structure. Alternatively, the partition wall 70 may be provided in a discontinuous segment structure. Structurally, the partition 70 includes a plurality of sub-partitions which are spaced apart and are sequentially arranged along the direction of the flow path 302 at the edges of the flow path 302.
In the heat exchange core 20 and the heat exchange device 1 using the heat exchange chip 30, resistance to the airflow can be reduced in the heat exchange process, and a backflow area formed when the airflow flows through the first surface 301 can be smaller, and the airflow retained in the backflow area is correspondingly reduced, so that more airflow can exchange heat with the heat exchange chip 30 in the flowing process, further, the heat exchange effect of the airflow and the heat exchange chip 30 is improved, the heat exchange capability of the heat exchange core 20 is enhanced, and the heat exchange device 1 has a good cooling effect on a heat source, or the heat exchange device 1 has a good heating effect on a cold source.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.

Claims (16)

1. The heat exchange chip is characterized by comprising a first surface and at least two rows of turbulence structures arranged on the first surface;
each row of turbulence structures comprises a plurality of turbulence structures which are arranged at intervals along the same direction in the at least two rows of turbulence structures; in the at least two rows of turbulence structures, orthographic projections of the adjacent two rows of turbulence structures on the first surface are symmetrical along a central line between the adjacent two rows of turbulence structures, and the extending direction of the central line is the same as the direction of the plurality of turbulence structures in each row of turbulence structures at intervals;
the turbulence structures are convex hulls or pits positioned on the first surface; the turbulence structure is a symmetrical structure and is provided with a central axis; the spoiler structure includes a curved wall surface disposed about the central axis, the curved wall surface protruding in a direction away from the first surface.
2. The heat exchange chip of claim 1, wherein the turbulence structure further comprises a plurality of first cross sections passing through the central axis and perpendicular to the first surface, each of the first cross sections and the curved wall surfaces intersect to form two curved boundaries, the two curved boundaries are respectively located at two sides of the central axis, and each of the curved boundaries is convex towards a direction away from the first surface;
each of the curved boundaries includes a first end and a second end, the curved boundary gradually approaching the central axis from the first end to the second end, and the curved boundary gradually moving away from the first surface.
3. The heat exchange chip of claim 1 or 2, wherein the top of the turbulator structure remote from the first surface has a land region, and an edge of the land region is connected to the curved wall surface.
4. The heat exchange chip of claim 1 or 2, wherein the flow disturbing structure extends in a first direction and has a maximum length dimension along the first direction;
the first direction is parallel to the first surface.
5. The heat exchange chip of claim 4, wherein the turbulence structure is an ellipsoidal spherical cap structure.
6. The heat exchange chip of claim 1 or 2, wherein the plurality of turbulence structures included in each row of turbulence structures extend in the same direction.
7. The heat exchange chip according to claim 1 or 2, wherein each of the plurality of turbulence structures comprises a plurality of turbulence structures, and orthographic projections of two adjacent turbulence structures on the first surface are symmetrically arranged about a center line between the two turbulence structures.
8. The heat exchange chip of claim 4, wherein the first surface is further provided with a plurality of flow channels, and each flow channel is internally provided with at least one row of turbulence structures;
each flow channel extends along a second direction, and the second direction is the same as the direction in which a plurality of turbulence structures included in each row of turbulence structures are arranged at intervals;
the included angle between the first direction and the second direction is an acute angle.
9. The heat exchange chip of claim 8, wherein an angle between the first direction and the second direction is θ, and θ is 30 ° or less and 60 ° or less.
10. The heat exchange chip according to claim 1 or 2, wherein each of the plurality of turbulence structures comprises any two adjacent turbulence structures respectively comprising a convex hull and a concave pit.
11. The heat exchange chip of claim 10, wherein each of the plurality of turbulence structures extends in the same direction;
or, in the plurality of turbulence structures included in each row of turbulence structures, orthographic projections of two adjacent turbulence structures on the first surface are symmetrically arranged about a central line between the two turbulence structures.
12. The heat exchange chip according to claim 1 or 2, wherein two turbulence structures arranged side by side in two adjacent rows are convex hulls and concave pits, respectively.
13. The heat exchange chip of claim 12, wherein each of the plurality of turbulence structures extends in the same direction;
or, in the plurality of turbulence structures included in each row of turbulence structures, orthographic projections of two adjacent turbulence structures on the first surface are symmetrically arranged about a central line between the two turbulence structures.
14. The heat exchange chip according to claim 1 or 2, wherein the first surface is further provided with a plurality of partition walls, a gap between two adjacent partition walls forms a flow channel, and at least one row of turbulence structures are arranged in the flow channel;
And in the turbulence structures adjacent to the partition walls, at least part of the turbulence structures are convex hulls.
15. A heat exchange core body, characterized by comprising a plurality of heat exchange chips according to any one of claims 1 to 14, and a plurality of the heat exchange chips being stacked.
16. A heat exchange device comprising a housing and the heat exchange core of claim 15, the heat exchange core being located within the housing.
CN202321451427.4U 2023-06-07 2023-06-07 Heat exchange chip, heat exchange core body and heat exchange device Active CN220750921U (en)

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CN202321451427.4U CN220750921U (en) 2023-06-07 2023-06-07 Heat exchange chip, heat exchange core body and heat exchange device

Applications Claiming Priority (1)

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CN202321451427.4U CN220750921U (en) 2023-06-07 2023-06-07 Heat exchange chip, heat exchange core body and heat exchange device

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