CN220731526U - High-color-gamut CSP (chip scale package) structure and electronic equipment - Google Patents

Abstract

The utility model provides a high-color-gamut CSP packaging structure and electronic equipment, which comprises a substrate, wherein a plurality of mounting areas are arranged on the substrate in an array manner, a chip set is arranged in the mounting areas, two adjacent chip sets are mutually spaced, so that the chip sets form a matrix structure, reflection strips are arranged on two sides of the mounting areas, the height of each reflection strip is higher than that of the chip set, inclined surfaces are arranged on two opposite sides of each reflection strip on two sides of the mounting areas, an obtuse angle is formed between each inclined surface and the top surface of each reflection strip, fluorescent glue layers are filled between the two adjacent reflection strips, each chip set comprises two first chips arranged at intervals and a second chip arranged between the two first chips, double powder does not need to be proportioned, and the manufacturing yield is higher.

Description

High-color-gamut CSP (chip scale package) structure and electronic equipment

Technical Field

The utility model belongs to the technical field of CSP packaging, and particularly relates to a high-color-gamut CSP packaging structure and electronic equipment.

Background

Along with the development of technology, the application field of the LED device is wider and wider, the backlight field in the LED field occupies a very heavy share, the backlight packaging field is highly competitive, and the development of the high-color-gamut CSP lamp bead for realizing cost reduction accords with the current development trend in order to meet the market demand;

at present, a single chip is arranged on a substrate through a sheet arranging machine, a red powder and green powder mixture is molded above the chip through a molding process, and the high-color-gamut lamp bead is manufactured.

Disclosure of Invention

Based on the above, the utility model aims to provide a high-color-gamut CSP packaging structure and electronic equipment, so as to solve the problems of relatively dispersed CIE falling points and high matching difficulty caused by the need of double-powder mixing matching of the existing high-color-gamut lamp beads.

The utility model provides the following technical scheme, a high-color-gamut CSP packaging structure, which comprises: including the base plate, the array is equipped with a plurality of installation region on the base plate, be provided with the chipset in the installation region, and adjacent two the chipset is mutual to be spaced, so that a plurality of the chipset forms matrix structure, the both sides of installation region are provided with the reflection strip, the height of reflection strip is higher than the height of chipset, the inclined plane has all been seted up to the both sides that the reflection strip is relative of installation region both sides, the inclined plane with form the obtuse angle between the top surface of reflection strip, adjacent two it has the fluorescence glue film to fill between the reflection strip, the chipset includes two first chips that the interval set up and sets up two second chip between the first chip.

Compared with the prior art, the utility model has the beneficial effects that: through opaque and good white glue of reflectivity (reflection strip), can effectually reflect the sidelight of chip to make high colour gamut CSP packaging structure's trilateral luminous, can promote the concentration of light, thereby promote lamp pearl luminance. The blue light chip is matched with the green powder chip and then is matched with the single powder KSF red powder to manufacture the high-color-gamut lamp bead, the difficulty of a packaging and dispensing process is reduced, double powder is not required to be matched, and the high-color-gamut lamp bead with higher yield and more stability is manufactured. The high-color-gamut lamp beads are manufactured by single-powder KSF red powder, so that the use of green powder is reduced, and the cost of the lamp beads is reduced.

Further, two transverse lines and two vertical lines are arranged at the top of the substrate at intervals to form a rectangular area on the substrate, and all the mounting areas are respectively arranged in the rectangular area.

Further, the distance between one transverse line and one side edge of the substrate close to one transverse line is equal to the distance between the other transverse line and the other side edge of the substrate close to the other transverse line, and the distance between one vertical line and one end edge of the substrate close to one vertical line is equal to the distance between the other vertical line and the other end edge of the substrate close to the other vertical line.

Further, the distance between the second chip and the first chip ranges from 200um to 400um.

Further, the first chip is a blue light chip, and the second chip is a green light chip.

Further, the height of the reflection strip is equal to the height of the fluorescent glue layer.

Further, the obtuse angle is in the range of 100-140 degrees.

The utility model also provides electronic equipment comprising the high-color-gamut CSP packaging structure.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a high-color-gamut CSP package structure provided in an embodiment of the present utility model;

fig. 2 is a top view of a high color gamut CSP package structure provided by an embodiment of the present utility model;

fig. 3 is a schematic structural diagram of a substrate according to an embodiment of the present utility model in a state where a plurality of mounting areas are formed;

fig. 4 is a schematic structural diagram of a chip set in a matrix structure according to an embodiment of the present utility model.

Reference numerals illustrate: 10. a substrate; 11. a mounting area; 12. a chipset; 121. a first chip; 122. a second chip; 13. a reflective strip; 131. inclined surface, 14, fluorescent glue layer; 20. a rectangular region; 21. erecting a scribing line; 22. and (5) traversing the line.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and intended to illustrate embodiments of the utility model and should not be construed as limiting the utility model.

In the description of the embodiments of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the embodiments of the present utility model and simplify description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present utility model, the meaning of "plurality" is two or more, unless explicitly defined otherwise.

In the embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.

As shown in fig. 1 and 2, in an embodiment of the present utility model, there is provided a high color gamut CSP package structure including: the chip comprises a substrate, wherein a plurality of mounting areas 11 are arranged on the substrate in an array manner, chip groups 12 are arranged in the mounting areas 11, and two adjacent chip groups 12 are mutually spaced, so that a plurality of chip groups 12 form a matrix structure, and the intervals between every two adjacent chip groups 12 in the matrix structure are consistent. Adjacent two side lines of the adjacent mounting areas 11 overlap each other. The mounting area 11 is formed by a plurality of parallel unit cells, a plurality of chip sets 12 are in one-to-one correspondence with the unit cells, and the chip sets 12 are disposed in the unit cells. The fluorescent glue layer is a KSF fluorescent glue layer.

Reflective strips 13 are arranged on two sides of the mounting area 11, the height of the reflective strips is higher than that of the chip set 12, inclined surfaces are arranged on two opposite sides of the reflective strips 13 on two sides of the mounting area 11, an obtuse angle is formed between the inclined surfaces and the top surface of the reflective strips 13, the reflection strip 13 is a white glue formed by spraying, the white glue is opaque and has good reflection effect, and the side light of the chip can be effectively reflected through the opaque and good reflection white glue, so that three sides of the high-color-gamut CSP packaging structure emit light, the light concentration degree can be improved, and the brightness of the lamp beads is improved. Through the inclined surfaces are formed on two opposite sides of the reflecting strips 13 on two sides of the installation area 11, two symmetrically arranged inclined surfaces are formed, side light can be reflected outwards, and the light utilization rate is improved.

A fluorescent glue layer is filled between two adjacent reflecting strips 13, the chip set 12 comprises two first chip 121 rectangular areas arranged at intervals and a second chip 122 vertical score line arranged between the two first chip 121 rectangular areas, the first chip 121 rectangular areas are blue light chips, and the second chip 122 vertical score line is a green light chip. The blue light chip is matched with the green powder chip and then is matched with the single powder KSF red powder to manufacture the high-color-gamut lamp bead, the difficulty of a packaging and dispensing process is reduced, double powder is not required to be matched, and the high-color-gamut lamp bead with higher yield and more stability is manufactured. The high-color-gamut lamp beads are manufactured by single-powder KSF red powder, so that the use of green powder is reduced, and the cost of the lamp beads is reduced.

Further, two transverse lines and two vertical lines are arranged at intervals on the top of the substrate, so as to form a rectangular area on the substrate, and all the mounting areas 11 are respectively arranged in the rectangular area. Further, the distance between one of the transverse lines and one side edge of the substrate adjacent to one of the transverse lines is equal to the distance between the other transverse line and the other side edge of the substrate adjacent to the other transverse line, and the distance between one of the vertical lines and one side edge of the substrate adjacent to one of the vertical lines is equal to the distance between the other vertical line and the other side edge of the substrate adjacent to the other vertical line. Four corner points of the rectangular area can be used as positioning points, so that the effect of positioning the mounting area 11 arranged on the substrate is achieved.

The spacing between the vertical scribe line of the second chip 122 and the rectangular area of the first chip 121 ranges from 200um to 400um. Preferably, the spacing between the vertical scribe line of the second chip 122 and the rectangular area of the first chip 121 is 200um, 300um, or 330um or 400um. In this embodiment, the spacing between the vertical scribe line of the second chip 122 and the rectangular region of the first chip 121 is 330um.

Further, the height of the reflective strip 13 is equal to the height of the fluorescent glue layer, so that the top surface of the fluorescent glue layer is level with the top surface of the reflective strip 13.

Wherein the obtuse angle ranges from 100 ° to 140 °, preferably the inclined surface has an inclination angle of 100 °, 120 ° or 140 °, in this embodiment, the inclined surface has an inclination angle of 120 °.

In the implementation, first, two transverse lines and two vertical lines are engraved on a substrate to form a rectangular area on the substrate, and a plurality of mounting areas 11 are arranged side by side with each other, please refer to fig. 3;

arranging two blue light chips into a substrate cell through a sheet arranging machine, arranging one green light chip between the two blue light chips through the sheet arranging machine, and forming a plurality of chip sets 12 in parallel so that the plurality of chip sets 12 form a matrix structure, as shown in fig. 4;

white glue is sprayed on two sides of the mounting area 11 to form a reflective strip 13, see fig. 2;

and (5) performing molding on the KSF fluorescent glue on the surface of the substrate by molding, so as to complete CSP lamp bead packaging.

In summary, in the high-color-gamut CSP packaging structure of the above embodiment of the present utility model, the side light of the chip can be effectively reflected by the opaque white glue (reflective strip) with good reflectivity, so that three sides of the high-color-gamut CSP packaging structure emit light, and the concentration of light can be improved, thereby improving the brightness of the lamp beads. The blue light chip is matched with the green powder chip and then is matched with the single powder KSF red powder to manufacture the high-color-gamut lamp bead, the difficulty of a packaging and dispensing process is reduced, double powder is not required to be matched, and the high-color-gamut lamp bead with higher yield and more stability is manufactured. The high-color-gamut lamp beads are manufactured by single-powder KSF red powder, so that the use of green powder is reduced, and the cost of the lamp beads is reduced.

The present utility model also provides an electronic device including the high-color-gamut CSP package mentioned in the above embodiment, and since the high-color-gamut CSP package has the more stable high-color-gamut beads, the electronic device in the present embodiment also has the advantage of the more stable high-color-gamut beads.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims (8)

1. The utility model provides a high colour gamut CSP packaging structure, its characterized in that includes the base plate, the array is equipped with a plurality of installation region on the base plate, be provided with the chipset in the installation region, and adjacent two the chipset is mutual spaced, so that a plurality of the chipset forms the matrix structure, the both sides of installation region are provided with the reflection strip, the height of reflection strip is higher than the height of chipset, the inclined plane has all been seted up to the both sides that the reflection strip is relative of installation region both sides, the inclined plane with form the obtuse angle between the top surface of reflection strip, adjacent two it has the fluorescent glue film to fill between the reflection strip, the chipset includes two first chips that the interval set up and sets up two second chip between the first chip.

2. The high color gamut CSP packaging structure of claim 1, wherein two transverse scribe lines and two vertical scribe lines are provided at intervals on top of the substrate to form a rectangular area on the substrate, all of the mounting areas being disposed within the rectangular area, respectively.

3. The high-gamut CSP packaging structure according to claim 2, wherein a distance from one of the cross-hatching lines to one side of the substrate adjacent to one of the cross-hatching lines is equal to a distance from another one of the cross-hatching lines to another side of the substrate adjacent to another one of the cross-hatching lines, and a distance from one of the vertical hatching lines to one side of the substrate adjacent to one of the vertical hatching lines is equal to a distance from another one of the vertical hatching lines to another side of the substrate adjacent to another one of the vertical hatching lines.

4. The high color gamut CSP packaging structure of claim 1, wherein a pitch between the second chip and the first chip ranges from 200um to 400um.

5. The high color gamut CSP packaging structure of claim 1, wherein the first chip is a blue light chip and the second chip is a green light chip.

6. The high color gamut CSP packaging structure of claim 1, wherein the height of the reflective strip is equal to the height of the phosphor paste layer.

7. The high color gamut CSP packaging structure according to claim 1, wherein the obtuse angle ranges from 100 ° to 140 °.

8. An electronic device comprising the high color gamut CSP packaging structure of any one of claims 1-7.