CN220724381U - Steel band plating bath with circulation clarification plant - Google Patents
Steel band plating bath with circulation clarification plant Download PDFInfo
- Publication number
- CN220724381U CN220724381U CN202322175665.3U CN202322175665U CN220724381U CN 220724381 U CN220724381 U CN 220724381U CN 202322175665 U CN202322175665 U CN 202322175665U CN 220724381 U CN220724381 U CN 220724381U
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- purifying
- pipe
- tank
- purification
- filter
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- 238000007747 plating Methods 0.000 title claims abstract description 54
- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 26
- 239000010959 steel Substances 0.000 title claims abstract description 26
- 238000005352 clarification Methods 0.000 title description 2
- 238000009713 electroplating Methods 0.000 claims abstract description 53
- 238000000746 purification Methods 0.000 claims abstract description 42
- 239000007788 liquid Substances 0.000 claims abstract description 41
- 239000012535 impurity Substances 0.000 claims abstract description 30
- 238000005192 partition Methods 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 28
- 229910052759 nickel Inorganic materials 0.000 abstract description 14
- 238000001914 filtration Methods 0.000 abstract description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052742 iron Inorganic materials 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 229910021645 metal ion Inorganic materials 0.000 abstract description 4
- 239000000243 solution Substances 0.000 description 30
- 238000000034 method Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000010926 purge Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009388 chemical precipitation Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005202 decontamination Methods 0.000 description 1
- 230000003588 decontaminative effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The steel strip electroplating bath with the circulating purifying equipment comprises an electroplating bath main body, wherein the bottom of the electroplating bath main body is communicated with the purifying equipment; the purifying device comprises a purifying tank, and the plating bath main body is communicated with the purifying tank through a liquid outlet pipe and a liquid inlet pipe respectively; the purification tank is internally provided with a plurality of clapboards, the clapboards divide the purification tank into a plurality of purification areas, and the bottoms of two adjacent purification areas are communicated through the purification assembly. The purity of the electroplating solution is guaranteed through step-by-step filtration, when one filter element of the filter is used for fault or long time, the shutdown of the purifying equipment is avoided, the continuity of the purifying work is guaranteed, the electroplating operation and the purifying work of the electroplating solution are realized, the impurities of metal ions such as copper, iron and the like in the electroplating solution can be removed, the purity of the electroplating solution is further guaranteed, and the brightness range and the hardness of the nickel plating layer are improved.
Description
Technical Field
The utility model relates to the technical field of electroplating, in particular to a steel belt electroplating tank with circulating purification equipment.
Background
Electroplating refers to the process of electroplating by depositing a metal layer or alloy layer on the surface of a conductive body, such as metal, by an electrolytic reaction in a metal salt solution under the action of direct current, for example, a specific electroplating process is described by using an electroplating process to form a nickel coating on the surface of a steel belt, wherein metal nickel is electrically connected to an anode of a power supply, the conductive steel belt is electrically connected to a cathode of the power supply, wherein a metal nickel plate and the steel belt are immersed in an electroplating solution, negative ions and positive ions in the electroplating solution are regularly moved under the action of direct current, the steel belt of the cathode gradually deposits a layer of metal nickel, and the metal nickel plate of the anode is continuously dissolved to supplement nickel ions consumed in the electroplating solution.
The nickel plated steel strip adopts a roll-to-roll continuous electroplating process, and in the electroplating process, when suspended solid particles in the electroplating solution are adhered to the surface of a plating layer formed on the surface of the steel strip, the problems of reduced flatness, light loss, slow light starting and the like of the plating layer are caused, so that the corrosion resistance of the plating layer is reduced, the impurity removal of the solid particles is mainly carried out through a filter in the prior art, for example, the Chinese patent number is CN210826427U, an electroplating bath filtering and stirring device is disclosed, an external filter 200 is adopted for filtering and removing the impurity from the electroplating solution in the electroplating bath 100, although the fixed impurity in the electroplating solution can be filtered, the impurity in the electroplating solution is gradually trapped by a filter element along with the progress of the electroplating process, thus the pressure of the filter is increased, the flow is reduced, the stirring requirement of high-speed nickel plating cannot be met, the problem of plating layer quality is caused, the filter element needs to be replaced, and the continuity of electroplating work is affected.
In addition, the filter can only remove fixed impurities in the electroplating solution, raw materials or workpieces can also bring metal ion impurities, iron and copper ion impurities have a large influence on nickel plating quality, and the prior art generally adopts a chemical precipitation mode such as an acid solution for removing the impurities, however, on one hand, the operation of adding chemical reagents is complicated, a certain proportion is required, on the other hand, the generated precipitate is piled up in an electroplating tank, and cleaning is required at regular time, so that the electroplating continuity is influenced.
Disclosure of Invention
In order to solve the technical problems in the prior art, the utility model provides a steel strip electroplating bath with circulating purification equipment.
The technical scheme of the utility model is as follows:
the steel strip electroplating bath with the circulating purification equipment comprises an electroplating bath main body, wherein the bottom of the electroplating bath main body is communicated with the purification equipment;
the purifying equipment comprises a purifying tank, and the plating tank main body is communicated with the purifying tank through a liquid outlet pipe and a liquid inlet pipe respectively;
a plurality of clapboards are arranged in the purifying tank, the clapboards divide the purifying tank into a plurality of purifying areas, and the bottoms of two adjacent purifying areas are communicated through a purifying assembly;
the liquid outlet pipe and the liquid inlet pipe are respectively communicated with the purifying areas at the two ends.
In order to avoid overflow to cause the plating bath main part to stop supplying liquid to the purifying tank, guarantee the continuity of purifying and electroplating work, the height of many baffles increases gradually from the drain pipe to the feed liquor pipe direction. The plating solution in the rear purge zone may overflow into the front purge zone.
The steel strip electroplating bath with the circulating purification equipment comprises a first U-shaped pipe communicated with two adjacent purification areas, and a first filter is connected to the transverse pipe of the first U-shaped pipe. The first U-shaped pipe and the first filter are used for main filtration of the plating solution.
In order to ensure the purification work, the first U-shaped pipe is connected with a second U-shaped pipe in parallel, and a transverse pipe of the second U-shaped pipe is connected with a second filter. The second U-shaped pipe and the second filter are used for standby filtration, and the normal operation of electroplating liquid purification can not be influenced when the filter element is replaced or the filter fails.
In order to ensure normal flow purification of the electroplating solution, two vertical pipes of the first U-shaped pipe and the second U-shaped pipe are respectively provided with a first valve. The first valve is used to control communication of the plurality of purge zones.
In order to ensure that the first filter is in fault or the first filter is controlled to be closed when the filter core is replaced, one side of the first filter is provided with a second valve, and the second valve is arranged on the inner side of the second U-shaped pipe. And setting a second valve.
In order to further ensure the purity of the electroplating solution, the liquid inlet pipe is communicated with the purifying tank through a group of purifying components, and the first U-shaped pipe of the purifying component is respectively connected with the liquid inlet pipe and the purifying tank. The purification assembly between the feed pipe and the purification tank is the last stage of filtration.
As described above, the apertures of the first filter and the second filter are gradually decreased from the liquid outlet pipe to the liquid inlet pipe. The front side uses the large aperture to filter the impurity of great granule to guarantee filterable efficiency, the rear side uses the filter core of aperture to guarantee filterable quality.
In order to ensure the brightness range and hardness of the nickel plating layer, any purifying area in the middle is provided with a impurity removing power source which is connected with a cathode plate and an anode plate. Impurities such as copper, iron and the like contained in the electroplating solution can be removed by matching the impurity removing power supply with the two polar plates.
Preferably, the cathode plate is provided with an uneven surface. The rugged surface can enable the impurities to be deposited or reduced in the concave parts, so that the treatment effect on the copper, iron and other plasma impurities is improved.
The utility model has the beneficial effects that: the utility model relates to a steel strip plating bath with circulating purifying equipment, which is characterized in that a purifying tank is communicated with the outside of the plating bath, the purifying tank is divided into a plurality of purifying areas, the purity of plating solution is ensured by filtering step by step, each group of purifying components is connected with two groups of filters in parallel, when one filter element of the filtering machines is failed or used for a long time, the other filtering machine is used, the shutdown of the purifying equipment is avoided, the continuity of purifying work is ensured, the electroplating operation and the plating solution purifying work are carried out simultaneously, and impurity removing power sources are arranged in the purifying areas, and by matching with two polar plates, the purity of the plating solution is further ensured, and the brightness range and hardness of a nickel plating layer are improved.
Drawings
The aspects and advantages of the present application will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the utility model.
In the drawings:
FIG. 1 is a schematic diagram of the connection of the components of the present utility model;
FIG. 2 is a schematic view of the interior of an intermediate purification zone;
the components represented by the reference numerals in the figures are:
1. a plating tank main body; 2. a purifying tank; 3. a liquid outlet pipe; 4. a liquid inlet pipe; 5. a partition plate; 6. a decontamination area; 7. a purification assembly; 71. a first U-shaped tube; 72. a first filter; 73. a second U-shaped tube; 74. a second filter; 75. a first valve; 76. a second valve; 8. impurity removal power supply; 9. a cathode plate; 10. an anode plate.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings.
Examples
The embodiment provides a steel strip electroplating bath with circulation purifying equipment, see fig. 1, including plating bath main part 1 for the nickel plating of steel strip, there is purifying equipment in plating bath main part 1 bottom intercommunication, and the plating solution in the plating bath main part 1 flows into purifying equipment and purifies, returns in the plating bath main part 1 at last, accomplishes the purification to the plating solution in the groove, has improved the purity degree of plating solution, and the following expansion concrete description.
In this embodiment, as shown in fig. 1, the purifying apparatus includes a purifying tank 2, the plating bath main body 1 is respectively communicated with the purifying tank 2 through a liquid outlet pipe 3 and a liquid inlet pipe 4, the plating solution in the plating bath main body 1 can enter the purifying tank 2 through the liquid outlet pipe 3, then return to the plating bath main body 1 through the liquid inlet pipe 4, and the liquid outlet pipe 3 is at the upper opening of the purifying tank 2, the plating solution is directly put into the purifying tank 2 at the opening, and the liquid inlet pipe 4 is communicated with the bottom of the purifying tank 2, specifically, a plurality of partition boards 5 are arranged in the purifying tank 2, the partition boards 5 are consistent with the width in the purifying tank 2, a plurality of independent purifying areas 6 can be divided into the purifying tank 2, specifically, in this embodiment, the partition boards 5 are totally arranged in two, the purifying tank 2 are divided into three independent purifying areas 6, the liquid outlet pipe 3 is communicated with the purifying area 6 at the head end, and is arranged above the corresponding purifying area 6, the liquid inlet pipe 4 is communicated with the purifying area 6 at the tail end (the purifying area 2 is located at the head end and the purifying area 2), the two end and the solid components 7 can be removed by the two adjacent to the purifying areas 7 in order to remove the purifying components of the purifying components.
As one of the main inventive concepts of the present design, the purification assembly 7 includes two filters disposed in parallel, respectively, a first filter 72 and a second filter 74, the first filter 72 communicates two adjacent purification areas 6 through a first U-shaped pipe 71, and the first filter 72 is installed at a horizontal pipe of the first U-shaped pipe 71, the second filter 74 is connected in parallel through a second U-shaped pipe 73 at the horizontal pipe of the first U-shaped pipe 71, and a second valve 76 is disposed at one side of the first filter 72, both the first filter 72 and the second valve 76 are disposed between two vertical pipes of the first U-shaped pipe, the second valve 76 can be used for controlling whether the plating solution passes through the first filter 72, a first valve 75 is installed at both vertical pipes of the first U-shaped pipe 71 and the second U-shaped pipe 73, respectively, for controlling inflow and outflow of the plating solution and whether the plating solution passes through the second filter 74, and when the first filter 72 fails or the filter element needs to be replaced for a long time, the second valve 76 can be closed, the two first valves 75 are opened, and the second valve 75 is controlled, or the continuous maintenance of the plating solution is continuously supplied to the main body of the purification assembly 7.
In this embodiment, the purifying component 7 is provided with three groups, two groups of purifying areas 6 are arranged at the bottoms of the three purifying areas and are communicated with each other, the third group is arranged between the liquid inlet pipe 4 and the purifying tank 2, that is, the purifying area 6 at the tail end is communicated with the liquid inlet pipe 4, and two vertical pipes of the first U-shaped pipe 71 of the purifying component 7 are respectively connected with the purifying tank 2 and the liquid inlet pipe 4 for filtering at the last stage.
Further, the aperture of the filters (the first filter 72 and the second filter 74) of the three groups of purifying components 7 is gradually decreased from the liquid outlet pipe 3 to the direction of the liquid inlet pipe 4, in this embodiment, the aperture of the purifier filter core between the head end and the second section is 10 micrometers, impurities with larger particles are filtered, filtering efficiency is guaranteed, the aperture of the purifier filter core between the second section purifying area 6 and the third section is 5 micrometers, impurities with smaller particles are further filtered, if the electroplating effect is worse according to actual needs, the adopted filter core between the liquid inlet pipe 4 and the purifying tank 2 is 1 micrometer, filtering is further carried out, and generally, after both sides of the electroplating liquid are filtered, the electroplating liquid is purified very cleanly, so that the filter between the liquid inlet pipe 4 and the purifying tank 2 can not be provided with the filter core, the purified electroplating liquid can be pressed into the electroplating bath main body 1 through high-pressure large flow, the stirring effect of the electroplating liquid can be achieved, and the stirring requirement of high-speed nickel plating can be met.
In this embodiment, the heights of the plurality of baffles 5 sequentially increase from the liquid outlet pipe 3 to the liquid inlet pipe 4, that is, along the direction of the flow of the plating solution, the height of the baffles 5 increases, as shown in fig. 2, so that if the flow is large in the purifying process, the flow can overflow into the front purifying area 6, but not flow into the subsequent purifying area 6, so that the plating solution can pass through the bottom purifying component 7, and the purity of the plating solution is improved.
As another main inventive concept of the present design, in order to influence the brightness and hardness of the nickel plating layer due to some metal ion impurities such as copper and iron during the electroplating process, a current impurity removing device is disposed in any one of the middle purifying areas 6, the middle purifying area 6 refers to any one of the purifying areas 6 from which the front and rear ends are removed, in this embodiment, the current impurity removing device is disposed in the second purifying area 6, the current impurity removing device includes an impurity removing power source 8, the impurity removing power source 8 is connected with a cathode plate 9 and an anode plate 10, the anode plate 10 is disposed with two plates, the cathode plate 9 is disposed between the anode plates 10, and when the impurity removing power source 8 is powered on, the effect of the cathode plate 9 and the anode plate 10 precipitates or reduces the metal ions in the electroplating solution on the cathode plate 9.
Further preferably, in order to improve the efficiency of removing impurities, the area of the cathode plate 9 is larger than that of the anode plate 10, most of the reaction is performed on the surface of the cathode plate 9, and the anode plate 10 is planar, and the cathode plate 9 is provided with a corrugated shape or a corrugated shape, so that impurities are precipitated or reduced at the recessed part, and the purification efficiency is improved.
Claims (10)
1. The steel strip electroplating bath with the circulating purification equipment comprises an electroplating bath main body (1), and is characterized in that the bottom of the electroplating bath main body (1) is communicated with the purification equipment;
the purifying device comprises a purifying tank (2), and the plating tank main body (1) is communicated with the purifying tank (2) through a liquid outlet pipe (3) and a liquid inlet pipe (4) respectively;
a plurality of partition boards (5) are arranged in the purifying tank (2), the partition boards (5) divide the purifying tank (2) into a plurality of purifying areas (6), and the bottoms of two adjacent purifying areas (6) are communicated through a purifying assembly (7);
the liquid outlet pipe (3) and the liquid inlet pipe (4) are respectively communicated with the purification areas (6) at the two ends.
2. The steel strip plating tank with circulating purification apparatus according to claim 1, characterized in that the height of the plurality of separators (5) increases in order from the outlet pipe (3) to the inlet pipe (4).
3. The steel strip plating tank with circulating purification apparatus according to claim 1, characterized in that the purification assembly (7) comprises a first U-shaped pipe (71) communicating with two adjacent purification areas (6), a first filter (72) being connected at a transversal pipe of the first U-shaped pipe (71).
4. A steel strip plating tank with a circulating purification apparatus according to claim 3, characterized in that a second U-shaped pipe (73) is connected in parallel to the horizontal pipe of the first U-shaped pipe (71), and a second filter (74) is connected to the horizontal pipe of the second U-shaped pipe (73).
5. The steel strip plating tank with circulating purification apparatus of claim 4, wherein a first valve (75) is provided at both vertical pipes of the first U-shaped pipe (71) and the second U-shaped pipe (73).
6. The steel strip plating tank with circulating purification apparatus of claim 5, wherein one side of the first filter (72) is provided with a second valve (76), and the second valve (76) is provided inside the second U-shaped pipe (73).
7. A steel strip plating tank with a circulating purification apparatus according to claim 3, characterized in that the feed pipe (4) is connected to the purification tank (2) by a set of purification modules (7), the first U-shaped pipe (71) of the purification modules (7) being connected to the feed pipe (4) and the purification tank (2), respectively.
8. The steel strip plating bath with circulating purification apparatus of claim 4, wherein the pore diameters of the filter elements of the first filter (72) and the second filter (74) decrease from the liquid outlet pipe (3) to the liquid inlet pipe (4) in sequence.
9. The steel strip plating tank with the circulating purification apparatus according to claim 1, characterized in that a impurity removal power source (8) is provided in any one of the purification areas (6) in the middle, and the impurity removal power source (8) is connected with a cathode plate (9) and an anode plate (10).
10. A steel strip plating bath with a circulating purification apparatus according to claim 9, characterized in that the cathode plate (9) is provided as a rugged surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322175665.3U CN220724381U (en) | 2023-08-14 | 2023-08-14 | Steel band plating bath with circulation clarification plant |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322175665.3U CN220724381U (en) | 2023-08-14 | 2023-08-14 | Steel band plating bath with circulation clarification plant |
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CN220724381U true CN220724381U (en) | 2024-04-05 |
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CN202322175665.3U Active CN220724381U (en) | 2023-08-14 | 2023-08-14 | Steel band plating bath with circulation clarification plant |
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2023
- 2023-08-14 CN CN202322175665.3U patent/CN220724381U/en active Active
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