CN220724339U - Vapor deposition equipment and substrate supporting device thereof - Google Patents
Vapor deposition equipment and substrate supporting device thereof Download PDFInfo
- Publication number
- CN220724339U CN220724339U CN202322238340.5U CN202322238340U CN220724339U CN 220724339 U CN220724339 U CN 220724339U CN 202322238340 U CN202322238340 U CN 202322238340U CN 220724339 U CN220724339 U CN 220724339U
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- substrate
- substrate support
- top plate
- sleeve
- base
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- 239000000758 substrate Substances 0.000 title claims abstract description 181
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 16
- 238000006243 chemical reaction Methods 0.000 claims description 30
- 238000009826 distribution Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 5
- 229910052801 chlorine Inorganic materials 0.000 claims description 5
- 239000000460 chlorine Substances 0.000 claims description 5
- 238000010926 purge Methods 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000376 reactant Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 11
- 238000005336 cracking Methods 0.000 abstract description 8
- 239000011435 rock Substances 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 24
- 238000004140 cleaning Methods 0.000 description 11
- 239000012495 reaction gas Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The vapor deposition equipment and its substrate bearing device includes one base with top plate for bearing substrate and sleeve below the top plate and one substrate bearing ring for bearing the edge area of the substrate and for taking and placing the substrate. The utility model adopts the substrate supporting ring as the movable component to realize the picking and placing of the substrate, lightens the weight of the manipulator and prolongs the service life of the manipulator. The bottom and the side surface of the substrate supporting ring are completely wrapped by the base, so that the temperature difference between the inner side and the outer side of the substrate supporting ring is reduced, the temperature uniformity of the substrate supporting ring is improved, and the risk of cracking or deformation of the substrate supporting ring is reduced. The roof on the base is as fixed part, keeps firm contact with the sleeve all the time, prevents that the roof from taking place dislocation and rocking along with sleeve rotatory in-process, has reduced the risk that the substrate takes place to rock at rotatory in-process, has finally improved the temperature homogeneity of substrate.
Description
Technical Field
The utility model relates to vapor deposition equipment and a substrate supporting device thereof.
Background
In the current vapor deposition equipment, especially in the metal vapor chemical deposition MOCVD equipment, a substrate is placed on a tray in a reaction cavity, a heater is arranged below the tray, an annular heat preservation sleeve is arranged around the heater, and the heat preservation sleeve supports the tray and drives the tray to rotate. When the deposition operation is performed, the heater heats the tray first, the tray transfers heat to the substrate, and maintaining the uniformity of the surface temperature of the substrate is an important factor for ensuring the process effect.
After the deposition process is finished, the processed substrate is required to be taken out from the reaction cavity, a new substrate to be processed is placed into the reaction cavity, a mechanical arm is generally used for clamping the tray, the tray and the whole substrate on the tray are taken out from the reaction cavity, the processed substrate is taken out from the tray, the new substrate to be processed is placed on the tray, and then the tray and the whole substrate are sent into the reaction cavity again by the mechanical arm.
In order to facilitate clamping of the manipulator, the outer edge of the tray needs to protrude out of the heat-insulating sleeve, so that the diameter of the tray is larger than that of the heat-insulating sleeve, and the heater cannot directly heat the outer edge of the tray because the heater is positioned in the heat-insulating sleeve, so that the temperature difference exists between the central area of the tray and the outer edge, the tray is easy to crack, and the service life of the tray is shortened. And the temperature of the tray is uneven, so that the substrate is heated unevenly, the temperature uniformity of the substrate is seriously affected, and the yield of the substrate is reduced.
In addition, for large-size substrates, the corresponding tray size also becomes larger, the weight of the tray is heavy, the manipulator easily shakes when clamping the heavy tray, and even the manipulator is deformed, so that the service life of the manipulator is influenced.
The statements herein merely provide background information related to the present disclosure and may not necessarily constitute prior art.
Disclosure of Invention
The utility model aims to provide vapor deposition equipment and a substrate supporting device thereof, which improve the temperature uniformity of the substrate supporting device and a substrate, reduce the cracking risk of devices caused by temperature difference, lighten the weight of a manipulator and prolong the service life of the equipment.
In order to achieve the above object, the present utility model provides a substrate holding apparatus for use in a vapor deposition apparatus, comprising:
the base comprises a top plate and a sleeve, wherein the top plate is used for supporting a substrate, and the sleeve is arranged below the top plate and used for supporting the top plate;
and the substrate supporting ring is positioned on the base and is used for supporting the edge area of the substrate and realizing the picking and placing of the substrate.
The base includes:
and the rotary driving system is connected with the sleeve and is used for driving the base to rotate.
The top plate and the sleeve are integrally formed, or the top plate and the sleeve are separately arranged.
The substrate supporting ring is provided with a substrate supporting part and a clamping part, the substrate supporting part is positioned at the inner side of the substrate supporting ring and used for supporting the substrate, and the clamping part is positioned at the outer side of the substrate supporting ring and used for being clamped by the manipulator.
The base is provided with an annular groove for accommodating the substrate supporting ring.
Optionally, the clamping portion of the substrate supporting ring protrudes from the outer wall of the sleeve.
Optionally, the outer wall of the clamping portion of the substrate support ring is wrapped by the inner wall of the annular groove.
The substrate support apparatus further comprises: and the jacking mechanism is arranged inside the base and is used for jacking the substrate supporting ring.
The climbing mechanism comprises: at least three ejector pins and a driving device connected with the ejector pins.
The base is provided with at least three through holes, the number and the positions of the through holes are matched with those of the ejector rods, and the ejector rods can penetrate through the through holes to jack up the substrate supporting rings.
The top plate and the sleeve are arranged in a split mode, a flange portion is arranged on the inner side of the sleeve and used for supporting the top plate and the substrate supporting ring, and the through hole is formed in the flange portion.
The through hole is positioned below the clamping part of the substrate supporting ring.
The present utility model also provides a vapor deposition apparatus comprising:
the reaction chamber, there are substrate inlets and outlets on the cavity wall of the said reaction chamber;
the gas spray head is arranged at the top of the reaction cavity;
the substrate supporting device is arranged in the reaction cavity;
and a heating device disposed within the substrate support.
The gas showerhead has at least a reactant gas distribution line and a purge gas distribution line.
The clean gas distribution line is connected to an external clean gas source, the clean gas being chlorine.
An anti-corrosion coating is arranged on the inner wall of the reaction cavity.
The heating apparatus includes: the heater and the heat insulating plate are arranged below the top plate, and the heat insulating plate is arranged below the heater.
The utility model adopts the substrate supporting ring as the movable component to realize the picking and placing of the substrate, lightens the weight of the manipulator and prolongs the service life of the manipulator. When the substrate is taken and placed, the top plate is left in the reaction chamber, so that the top plate can be cleaned in situ while the reaction chamber is cleaned by cleaning gas (such as chlorine). In some embodiments, the bottom and the side surfaces of the substrate supporting ring are completely wrapped by the base, so that the temperature difference between the inner side and the outer side of the substrate supporting ring is reduced, the temperature uniformity of the substrate supporting ring is improved, and the risk of cracking or deformation of the substrate supporting ring is reduced. The roof on the base is as fixed part, keeps firm contact with the sleeve all the time, prevents that the roof from taking place dislocation and rocking along with sleeve rotatory in-process, has reduced the risk that the substrate takes place to rock at rotatory in-process, has finally improved the temperature homogeneity of substrate.
Drawings
Fig. 1 is a schematic structural view of a vapor deposition apparatus according to the present utility model.
Fig. 2 is a schematic view of a substrate support apparatus in accordance with one embodiment of the present utility model.
Fig. 3 is a schematic view of a substrate support apparatus in accordance with another embodiment of the present utility model.
Fig. 4 is a schematic view of a substrate support apparatus in accordance with yet another embodiment of the present utility model.
Detailed Description
The following describes a preferred embodiment of the present utility model with reference to fig. 1 to 4.
As shown in fig. 1, the present utility model provides a vapor deposition apparatus, comprising a reaction chamber 1, wherein a substrate supporting device 2 is disposed in the reaction chamber 1 for supporting a substrate 3, and a heating device 4 is disposed in the substrate supporting device 2 for heating the substrate 3. A substrate inlet and outlet 11 is arranged on the wall of the reaction chamber 1, and a manipulator (not shown in the figure) takes and places a substrate through the substrate inlet and outlet 11. A gas spray head 5 is arranged at the top of the reaction cavity 1, the gas spray head 5 is provided with at least one path of reaction gas distribution pipeline 51, the reaction gas distribution pipeline 51 is connected to an external gas source 6 and is used for conveying reaction gas stored in the external gas source 6 to the surface of the substrate 3 through the gas spray head 5, the gas spray head 5 is also provided with one path of cleaning gas distribution pipeline 52, the cleaning gas distribution pipeline 52 is connected to an external cleaning gas source 7, cleaning gas is stored in the external cleaning gas source 7, and chlorine is mainly used as the cleaning gas. After the deposition process in the reaction chamber 1 is finished, the robot takes out the prepared substrate through the substrate inlet and outlet 11, and then the cleaning gas is conveyed into the reaction chamber 1 by using the cleaning gas distribution pipeline 52 to clean the interior of the reaction chamber 1, so as to prevent the residual particulate matters of the reaction gas from polluting the processing devices in the chamber. Since the cleaning gas is corrosive, it is necessary to provide an anti-corrosion coating 12 on the inner wall of the reaction chamber 1 to protect the reaction chamber 1 from corrosion.
In one embodiment of the utility model, as shown in fig. 2, the substrate support apparatus 2 comprises a base 201 and a substrate support ring 202 positioned on the base 201. The base 201 comprises a top plate 203, a sleeve 204 and a rotary driving system 205, the top plate 203 is used for supporting the substrate 3, the sleeve 204 is arranged below the top plate 203 and is used for supporting the top plate 203, the top plate 203 and the sleeve 204 can be integrally formed or separately arranged, and the rotary driving system 205 is connected with the sleeve 204 and is used for driving the base 201 to rotate so as to drive the substrate 3 to rotate. Most of the area of the substrate 3 extending outwards from the central area is supported by the top plate 203, the edge area of the top plate 203 is provided with an annular groove 206, and the substrate supporting ring 202 is placed in the annular groove 206, so that the substrate supporting ring 202 can support the edge area of the substrate 3, the depth of the annular groove 206 ensures that the lower surface of the substrate 3 is in effective contact with both the top plate 203 and the substrate supporting ring 202, thereby preventing the substrate 3 from being emptied and ensuring the reliability of heat conduction.
The substrate support ring 202 has a substrate support portion 2021 and a clamping portion 2022, the substrate support portion 2021 is located at an inner side of the substrate support ring 202 and is used for supporting an edge region of the substrate 3, and the clamping portion 2022 is located at an outer side of the substrate support ring 202 and is used for being clamped by a robot. In this embodiment, the cross section of the annular groove 206 is not completely closed, but only has a bottom edge and an inner side edge, but lacks an outer side edge, so that the clamping portion 2022 protrudes from the outer wall of the sleeve 204, and the manipulator can avoid rubbing with the sleeve 204 or the top plate 203 when clamping the clamping portion 2022, so that the substrate picking and placing process is safer and more stable.
In this embodiment, the substrate supporting ring 202 is used as a movable component to realize the picking and placing of the substrate, thereby reducing the weight of the manipulator and prolonging the service life of the manipulator. Because the top plate 203 does not need to be moved, the gap between the top plate 203 and the sleeve 204 can be smaller or even be an integral part, thereby reducing the risk of shaking the substrate 3 in the rotation process and finally improving the temperature uniformity of the substrate.
In another embodiment of the present utility model, as shown in fig. 3, the top plate 203 and the sleeve 204 are integrally formed. The top plate 203 and the sleeve 204 are made of graphite, and the top plate 203 and the sleeve 204 are used as a whole, so that the temperature is more easily and uniformly distributed, and the temperature is uniformly conducted to the substrate supporting ring 202 and the substrate 3, so that the substrate 3 is uniformly conducted, and the temperature uniformity of the substrate is improved; in addition, the temperature difference between the central area and the edge area of the top plate 203 is low, so that the risk of cracking the disk is avoided. Further, since the top plate 203 and the sleeve 204 are integrally provided, there is no gap between the top plate 203 and the sleeve 204, so that the risk of shaking the substrate 3 during rotation is reduced to the maximum extent, and the temperature uniformity of the substrate is improved.
In this embodiment, the annular groove 206 is completely closed, and has a cross-section with a bottom edge, an inner side edge, and an outer side edge, such that the substrate support ring 202 is positioned in the annular groove 206, and in particular, the outer wall of the clamping portion 2022 is wrapped around the inner wall of the annular groove 206. By completely wrapping the bottom and the side surfaces of the substrate support ring 202 by the base 201, the problem that the heat dissipation of the clamping portion 2022 of the substrate support ring 202 is too fast is avoided, the temperature difference between the inner side and the outer side of the substrate support ring 202 is reduced, the temperature uniformity of the substrate support ring 202 is improved, and the risk of cracking or deformation of the substrate support ring 202 is reduced.
In this embodiment, since the clamping portion 2022 of the substrate supporting ring 202 is no longer exposed to the outside of the base 201, in order to implement taking and placing of the substrate 3, a lifting mechanism 207 is added in the base 201, where the lifting mechanism 207 includes at least three lifting rods 2072, and a driving device 2071 connected to the lifting rods 2072, correspondingly, at least three through holes 208 are provided on the top plate 203, and the through holes 208 are provided below the substrate supporting ring 202, and under the driving of the driving device 2071, the lifting rods 2072 can penetrate through the through holes 208 to lift the substrate supporting ring 202 to a position with a sufficient distance between the clamping portion 2022 and the base 201, and this position enables a manipulator to clamp the clamping portion 2022, so as to take out the processed substrate. After the robot places the substrate support ring 202 loaded with a new substrate to be processed on the lift pins 2072, the driving device 2071 drives the lift pins 2072 to descend until the substrate support ring 202 and the substrate are placed on the upper surface of the base 201. The number and positions of the through holes 208 are matched with those of the ejector pins 2072, the through holes 208 are arranged below the clamping parts 2022 of the substrate supporting ring 202, and the positions of the through holes 208 are far away from the position where the substrate 3 is placed because the clamping parts 2022 are positioned on the outer side of the substrate supporting ring 202, so that the top plate 203 below the substrate 3 is ensured to be intact, and the heated uniformity and uniformity of the substrate 3 are ensured.
In this embodiment, the heating apparatus 4 includes a heater 401 disposed below the top plate 203 and a plurality of heat insulating boards 402 disposed below the heater 401, and the heat insulating boards 402 prevent the heat emitted from the heater 401 from diffusing downward, so that most of the heat emitted from the heater 401 is conducted to the top plate 203 and the substrate support ring 202, and prevent excessive heat transfer to the bottom wall of the reaction chamber, resulting in an excessively high temperature of the bottom wall of the reaction chamber.
In still another embodiment of the present utility model, as shown in fig. 4, the top plate 203 and the sleeve 204 are separately provided in comparison with the solution of fig. 3, so that maintenance or replacement of the top plate 203 is facilitated. The top plate 203 and the sleeve 204 are made of graphite, so that heat conduction is fast, and the temperature difference between the central area and the edge area of the top plate 203 is low, so that the risk of cracking the disc is avoided.
In this embodiment, an annular flange portion 2041 is disposed at the inner side of the sleeve 204, an annular groove matched with the flange portion 2041 is correspondingly disposed at the bottom of the top plate 203, the flange portion 2041 extends into the annular groove to support the top plate 203, so that stable contact between the top plate 203 and the sleeve 204 is achieved, the top plate 203 can be fixed on the sleeve 204, dislocation and shaking of the top plate 203 in the process of rotating along with the sleeve 204 are prevented, the risk of shaking of the substrate 3 in the rotating process is reduced to the greatest extent, and finally temperature uniformity of the substrate is improved. The annular groove 206 is formed on the flange 2041 and the top surface of the top plate 203, the substrate support ring 202 is disposed in the annular groove 206, which is equivalent to the way that the flange 2041 and the top plate 203 wrap the substrate support ring 202 together and completely wrap the bottom and the side surfaces of the substrate support ring 202, so that the excessive heat dissipation of the clamping portion 2022 of the substrate support ring 202 is avoided, the temperature difference between the inner side and the outer side of the substrate support ring 202 is reduced, the temperature uniformity of the substrate support ring 202 is improved, and the risk of cracking or deformation of the substrate support ring 202 is reduced. The clamping portion 2022 of the substrate support ring 202 is located on top of the flange portion 2041, so that the through hole 208 is disposed on the flange portion 2041, and the through hole 208 is located below the clamping portion 2022, and since the clamping portion 2022 is located outside the substrate support ring 202, the position of the through hole 208 is far from the position where the substrate 3 is placed, ensuring that the top plate 203 below the substrate 3 is intact, thereby ensuring uniformity and homogeneity of heating of the substrate 3.
The utility model adopts the substrate supporting ring as the movable component to realize the picking and placing of the substrate, lightens the weight of the manipulator and prolongs the service life of the manipulator. When the substrate is taken and placed, the top plate is left in the reaction chamber, so that the top plate can be cleaned in situ while the reaction chamber is cleaned by cleaning gas (such as chlorine).
In some embodiments, the bottom and the side surfaces of the substrate supporting ring are completely wrapped by the base, so that the temperature difference between the inner side and the outer side of the substrate supporting ring is reduced, the temperature uniformity of the substrate supporting ring is improved, and the risk of cracking or deformation of the substrate supporting ring is reduced. The roof on the base is as fixed part, keeps firm contact with the sleeve all the time, prevents that the roof from taking place dislocation and rocking along with sleeve rotatory in-process, has reduced the risk that the substrate takes place to rock at rotatory in-process, has finally improved the temperature homogeneity of substrate.
It should be noted that, in the embodiments of the present utility model, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the embodiments, and do not indicate or imply that the apparatus or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
While the present utility model has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the utility model. Many modifications and substitutions of the present utility model will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the utility model should be limited only by the attached claims.
Claims (17)
1. A substrate support apparatus for use in a vapor deposition apparatus, comprising:
the base comprises a top plate and a sleeve, wherein the top plate is used for supporting a substrate, and the sleeve is arranged below the top plate and used for supporting the top plate;
and the substrate supporting ring is positioned on the base and is used for supporting the edge area of the substrate and realizing the picking and placing of the substrate.
2. The substrate support apparatus of claim 1, wherein the base comprises:
and the rotary driving system is connected with the sleeve and is used for driving the base to rotate.
3. The substrate support apparatus of claim 1, wherein the top plate and the sleeve are integrally formed or the top plate and the sleeve are separately provided.
4. The substrate support apparatus of claim 3, wherein the substrate support ring has a substrate support portion and a clamping portion, the substrate support portion being positioned inside the substrate support ring for supporting the substrate, the clamping portion being positioned outside the substrate support ring for being clamped by a robot.
5. The substrate support apparatus of claim 4, wherein the base has an annular recess therein for receiving the substrate support ring.
6. The substrate support apparatus of claim 5, wherein the clamping portion of the substrate support ring protrudes from the outer wall of the sleeve.
7. The substrate support apparatus of claim 5, wherein the outer wall of the clamping portion of the substrate support ring is surrounded by the inner wall of the annular groove.
8. The substrate support apparatus of claim 7, wherein the substrate support apparatus further comprises: and the jacking mechanism is arranged inside the base and is used for jacking the substrate supporting ring.
9. The substrate support apparatus of claim 8, wherein the jacking mechanism comprises: at least three ejector pins and a driving device connected with the ejector pins.
10. The substrate support apparatus of claim 9, wherein the base has at least three through holes, the number and location of the through holes being matched to the number and location of the pins, the pins being capable of lifting the substrate support ring through the through holes.
11. The substrate support apparatus of claim 10, wherein the top plate and the sleeve are provided separately, the sleeve having a flange portion on an inner side thereof for supporting the top plate and the substrate support ring, the through hole being provided on the flange portion.
12. The substrate support apparatus of any one of claims 9-11, wherein the through-hole is located below a clamping portion of the substrate support ring.
13. A vapor deposition apparatus, comprising:
the reaction chamber, there are substrate inlets and outlets on the cavity wall of the said reaction chamber;
the gas spray head is arranged at the top of the reaction cavity;
a substrate support apparatus according to any one of claims 1 to 12, disposed within the reaction chamber;
and a heating device disposed within the substrate support.
14. The vapor deposition apparatus of claim 13, wherein the gas showerhead has at least a reactant gas distribution line and a purge gas distribution line.
15. The vapor deposition apparatus of claim 14, wherein the purge gas distribution line is connected to an external purge gas source, the purge gas being chlorine.
16. The vapor deposition apparatus of claim 13, wherein an anti-corrosion coating is disposed on an inner wall of the reaction chamber.
17. The vapor deposition apparatus of claim 13, wherein the heating apparatus comprises: the heater and the heat insulating plate are arranged below the top plate, and the heat insulating plate is arranged below the heater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322238340.5U CN220724339U (en) | 2023-08-18 | 2023-08-18 | Vapor deposition equipment and substrate supporting device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322238340.5U CN220724339U (en) | 2023-08-18 | 2023-08-18 | Vapor deposition equipment and substrate supporting device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220724339U true CN220724339U (en) | 2024-04-05 |
Family
ID=90485059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322238340.5U Active CN220724339U (en) | 2023-08-18 | 2023-08-18 | Vapor deposition equipment and substrate supporting device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220724339U (en) |
-
2023
- 2023-08-18 CN CN202322238340.5U patent/CN220724339U/en active Active
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