CN220708604U

CN220708604U - Pressure sensor

Info

Publication number: CN220708604U
Application number: CN202322249978.9U
Authority: CN
Inventors: 吕萍; 李刚; 梅嘉欣; 瞿滕汇睿
Original assignee: Memsensing Microsystems Suzhou China Co Ltd
Current assignee: Memsensing Microsystems Suzhou China Co Ltd
Priority date: 2023-08-21
Filing date: 2023-08-21
Publication date: 2024-04-02
Anticipated expiration: 2033-08-21

Abstract

An embodiment of the present utility model discloses a pressure sensor, wherein the pressure sensor includes: a first substrate; the first isolation layer is arranged on the first substrate in a lamination mode; at least one groove is formed in the first isolation layer; the force sensitive body is embedded in the groove and comprises a substrate, and the substrate is provided with a first surface and a second surface which are opposite in the thickness direction of the substrate; the substrate includes a first cavity received within the body of the substrate and a force sensitive membrane positioned between the first cavity and the first surface of the substrate; the first cavity comprises a bottom and a top which are oppositely arranged, and the top is in direct contact with the force sensitive membrane; the force sensitive body comprises a plurality of first bonding pads, and the plurality of first bonding pads are positioned on one side of the force sensitive film, which is away from the first cavity; the stress bearing body is arranged on the first surface; the force bearing body at least partially covers the orthographic projection of the cavity on the first surface. According to the utility model, the temperature characteristic and the linearity are better, and the utility model is suitable for the severe environment of high temperature and high pressure.

Description

Pressure sensor

Technical Field

The utility model relates to the technical field of sensors, in particular to a pressure sensor.

Background

The battery has expansion behavior during charging and discharging, can expand and contract to different degrees according to different charging and discharging voltages, temperatures and the like, and can optimize the battery core assembly structural member only by the well-known expansion behavior of the battery core under all conditions, and meanwhile, the safety performance and early failure of the battery can be accurately estimated. It is therefore necessary to implant pressure sensors before the cells and the cells to detect the expansion force and temperature of the cells. Flexible pressure sensors are commonly used in the art.

However, the flexible pressure sensor detects poor pressure linearity and requires relatively high back-end calibration circuitry. In some special applications, such as high temperature, harsh environments, the properties of the flexible material in the flexible pressure sensor may change, affecting the output of the sensor.

Disclosure of Invention

The embodiment of the utility model provides a pressure sensor, which has better temperature characteristics and high linearity and can be applied to severe environments.

In order to solve the technical problems, the embodiment of the utility model discloses the following technical scheme:

in one aspect, there is provided a pressure sensor comprising:

a first substrate;

a first isolation layer stacked on the first substrate; at least one groove is formed in the first isolation layer;

at least one force sensitive body, each force sensitive body is embedded in the groove, the force sensitive body comprises a substrate, and the substrate is provided with a first surface and a second surface which are opposite in the thickness direction of the substrate; the substrate includes a first cavity housed inside a body of the substrate and a force sensitive membrane located between the first cavity and the first surface of the substrate; in the thickness direction of the substrate, the first cavity comprises a bottom and a top which are oppositely arranged, and the top is in direct contact with the force sensitive film;

the force sensitive body comprises a plurality of first bonding pads, the plurality of first bonding pads are positioned on one side of the force sensitive film, which is away from the first cavity, in the thickness direction of the substrate, and the first bonding pads output signals about deformation of the force sensitive film.

In addition to or in lieu of one or more of the features disclosed above, the pressure sensor further comprises:

the stress bearing body is arranged on the first surface; in the thickness direction of the substrate, the orthographic projection of the stressed carrier on the first surface is at least partially overlapped with the orthographic projection of the cavity on the first surface.

In addition to or in lieu of one or more of the features disclosed above, the pressure sensor further includes a second isolation layer configured as the force bearing body, the second isolation layer being laminated to the first isolation layer.

In addition to or in lieu of one or more of the features disclosed above, the second isolation layer is a flexible circuit board or a glue layer.

In addition to or in lieu of one or more of the features disclosed above, the circumferential side wall of the force-sensitive body is isolated from the walls of the groove.

In addition to or in lieu of one or more of the features disclosed above, the first surface is raised or flush with a side of the first spacer layer facing away from the first substrate.

In addition to one or more features disclosed above, or alternatively, the material of the first isolation layer is at least one of a solder resist layer or an epoxy resin.

In addition to or in lieu of one or more of the features disclosed above, a stiffener is affixed to a side of the first substrate remote from the force sensitive body; in the thickness direction of the force sensitive body, the groove is in the range of orthographic projection of the reinforcing plate on the first substrate.

In addition to or in lieu of one or more of the features disclosed above, the pressure sensor further comprises a plurality of piezoresistors electrically connected in one-to-one correspondence with the plurality of first bonding pads; the piezoresistors are arranged on one side of the force sensitive film far away from the first cavity, and the resistance values of the piezoresistors change along with the deformation of the force sensitive film.

In addition to or as an alternative to one or more of the features disclosed above, the force-sensitive body further comprises:

a plurality of conductive vias extending through the force sensitive body for routing signals of the first pads from the first surface to the second surface.

In addition to or as an alternative to one or more of the features disclosed above, the first substrate has a first lead thereon;

the force sensitive body is isolated from the first substrate, and a first isolation cavity communicated with the conductive through hole and the lead is arranged between the second surface and the first piece;

and a conductive piece is arranged in the first isolation cavity so that the conductive through hole is electrically connected with the first lead.

In addition to or as an alternative to one or more of the features disclosed above, the conductive member includes at least one of a solder ball, a conductive paste, and a conductive silver paste.

In addition to or in lieu of one or more of the features disclosed above, at least one support is disposed within the first isolation chamber, the support being disposed between the force sensitive body and the first substrate.

In addition to or as an alternative to one or more of the features disclosed above, the support includes a pressure equalizing solder ball or pad;

the gasket is made of at least one of insulating glue, a solder mask layer, metal or silicon.

In addition to or in lieu of one or more of the features disclosed above, a second substrate configured as the force bearing body with a second lead disposed therein;

the first surface is provided with a first bonding pad at a position corresponding to the second lead, the first bonding pad is electrically connected with the piezoresistor, and a second conductive medium is filled between the first bonding pad and the second lead so as to electrically connect the first bonding pad and the second lead.

In addition to or in lieu of one or more of the features disclosed above, a fourth barrier layer is provided between the second substrate and the force-sensitive membrane to transfer the force-induced deformation of the second substrate through the fourth barrier layer to the force-sensitive membrane.

In addition to or in lieu of one or more of the features disclosed above, a third spacer layer is provided between the second surface and the first substrate to provide a spacer support for the substrate.

In addition to or in lieu of one or more of the features disclosed above, the pressure sensor further comprises a first electrode plate and a second electrode plate; the first electrode plate and the second electrode plate are respectively arranged on the top and the bottom in the first cavity in an opposite mode, and the first electrode plate is connected with the force sensitive film; the first electrode plate and the second electrode plate are respectively and electrically connected with the corresponding first bonding pads, and the first electrode plate and the second electrode plate form a capacitor structure;

the first electrode plate changes the distance with the second electrode plate along with the stress deformation of the force-sensitive film, and then the capacitance value of the capacitance structure also changes along with the distance so as to sense the pressure born by the force-sensitive film.

In addition to or in lieu of one or more of the features disclosed above, a plurality of conductive vias are provided through the body of the substrate on the substrate, the plurality of conductive vias being electrically connected to the plurality of first pads, respectively, to transmit the pressure signal from the first surface to the second surface;

and a first lead is arranged in the first substrate and is electrically connected with a second bonding pad arranged on one surface of the substrate facing the base direction, and a solder ball is arranged between the second bonding pad and the conductive through hole.

In addition to, or in lieu of, one or more of the features disclosed above, the pressure sensor may further comprise a temperature sensor disposed within the first substrate or disposed on the first surface of the force-sensitive body.

In addition to or as an alternative to one or more of the features disclosed above, when the number of grooves is plural, the grooves are arranged in an array in the first separator layer.

One of the above technical solutions has the following advantages or beneficial effects: according to the technical scheme, the substrate with the cavity and the force sensitive film is used as a pressure sensing element, so that the pressure sensing element has better temperature characteristics and linearity, and is suitable for severe environments with high temperature and high pressure. And the force sensitive body is arranged in the groove of the first isolation layer, so that the influence of external force except the thickness direction of the substrate on the force sensitive body is avoided, and the force sensitive body can accurately output the pressure information born by the thickness direction of the substrate.

Drawings

The technical solution and other advantageous effects of the present utility model will be made apparent by the following detailed description of the specific embodiments of the present utility model with reference to the accompanying drawings.

FIG. 1 is a schematic cross-sectional view of a pressure sensor according to an embodiment of the present utility model;

FIG. 2 is a schematic cross-sectional view of a pressure sensor according to another embodiment of the present utility model;

FIG. 3 is a schematic cross-sectional view of a pressure sensor according to another embodiment of the present utility model;

FIG. 4 is a schematic cross-sectional view of a pressure sensor according to another embodiment of the present utility model;

FIG. 5 is a schematic cross-sectional view of a pressure sensor according to another embodiment of the present utility model;

FIG. 6 is a schematic cross-sectional view of a pressure sensor according to another embodiment of the present utility model;

FIG. 7 is a schematic cross-sectional view of a pressure sensor according to another embodiment of the present utility model;

FIG. 8 is a schematic cross-sectional view of a pressure sensor according to another embodiment of the present utility model;

FIG. 9 is a schematic cross-sectional view of a pressure sensor according to another embodiment of the present utility model;

FIG. 10 is a schematic diagram of an array structure of a pressure sensor according to an embodiment of the present utility model;

FIG. 11 is a schematic cross-sectional view of a pressure sensor disposed in a force member to be detected according to an embodiment of the present utility model;

in the figure: 1-a pressure sensor; 10-a first substrate; 20-a first isolation layer; 21-grooves; 30-a second barrier layer; 4-force sensitive body; 40-substrate; 41-cavity; 42-force sensitive membrane; 43-a first isolation chamber; 50-conductive vias; 60-solder balls; 61-equalizing solder balls; 70-a first lead; 80-a temperature sensor; 100-gaskets; 110-a first conductive medium; 121-a second conductive medium; 122-a first pad; 123-a second lead; 124-a third isolation layer; 125-a fourth barrier layer; 130-a reinforcing plate; 141-a first electrode plate; 142-a second electrode plate; 161-a first output signal; 162-a second output signal; 163-a third output signal; 164-a fourth output signal; 18-a first output voltage; 19-a second output voltage; 201-a first force member to be detected; 202-a second force member to be detected; 203-a third force member to be detected.

Detailed Description

In order to make the objects, technical solutions and advantageous effects of the present utility model more apparent, the present utility model will be further described in detail with reference to the accompanying drawings and detailed description. It should be understood that the detailed description is intended to illustrate the utility model, and not to limit the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present utility model, the meaning of "plurality" means two or more, unless specifically defined otherwise.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; the connection may be mechanical connection, direct connection or indirect connection through an intermediate medium, and may be internal connection of two elements or interaction relationship of two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.

Example 1

Referring to fig. 1, fig. 1 shows a schematic cross-sectional structure of a pressure sensor according to an embodiment of the present utility model, where the pressure sensor provided in the present application includes: a first substrate 10, a first isolating layer 20, a force-sensitive body 4 and a second isolating layer 30. The first substrate 10 is a plate-like structure extending in a plane, typically in the shape of a parallelepiped. The first and second spacers 20 and 30 are sequentially laminated on the first substrate 10 in the thickness direction of the first substrate 10. The first separator 20 includes a groove 21 provided in the body of the first separator 20, the groove 21 penetrating the groove 21 in the thickness direction of the first separator 20, and the force-sensitive body 4 being accommodated in the groove 21.

With continued reference to fig. 1, the force sensing body 4 includes a substrate 40, output terminals, and conductive vias 50. The substrate 40 includes a cavity 41, a force sensitive membrane 42, output terminals, and conductive vias 50. The substrate 40 has opposite first and second surfaces in its thickness direction, wherein the first and second surfaces each extend in parallel planes. The first surface of the substrate 40 is in the same plane as the upper surface of the first isolation layer 20, and the first surface of the force sensitive body 4 abuts against the second isolation layer 30. The substrate 40 comprises a cavity 41 accommodated inside the body of the substrate 40, which cavity 41 is arranged below the first surface and has a certain size in an extension plane parallel to the first surface. The base 40 is spaced apart from the first substrate 10 to form a first isolation cavity 43 between the second surface of the base 40 and the first substrate 10.

In some embodiments, the pressure sensor further comprises a force bearing body disposed on the first surface of the force sensitive body 4, and an orthographic projection of the force bearing body on the first surface and an orthographic projection of the cavity 41 on the first surface at least partially overlap in a thickness direction of the substrate 40.

In some embodiments, the pressure sensor further comprises a second isolation layer 30, the second isolation layer 30 covering the first isolation layer 20 and a side surface of the force sensitive body 4 facing away from the first substrate 10. In one aspect, the second barrier layer may act as a protective layer for the pressure sensor to prevent moisture intrusion or external scratches. On the other hand, in the present embodiment, the second separator layer 30 may be configured as a force carrier as a medium for force transmission.

The force sensitive membrane 42 is located between the cavity 41 of the substrate 40 and the first surface. The force sensing body 4 further includes a plurality of piezoresistors (not shown), and a plurality of output terminals are electrically connected to the plurality of piezoresistors in a one-to-one correspondence. In this embodiment, the output terminal is a first pad 122 (shown in fig. 5) disposed on the force sensitive film 42 opposite to the cavity 41, and the first pad is used to output a signal about the magnitude of deformation of the force sensitive film 42. The first pad 122 and the varistor are both disposed on the first surface. The varistor is arranged in the orthographic projection of the cavity 41 on the first surface in the thickness direction of the substrate 40. The force sensing body 4 typically includes four piezoresistors which are equally spaced about the center of the force sensing diaphragm 42 and which form a bridge circuit. The first pad 122 generates an output signal when the resistivity of the piezo-resistor changes when the force sensitive membrane 42 is deformed. In other embodiments, the number and layout positions of the piezoresistors and the first pads 122 may be set according to practical situations, which is not particularly limited in the embodiments of the present utility model. .

The conductive via 50 is formed by deep silicon etching on the substrate 40 using a through silicon via process to form a via through the body of the substrate 40 in the thickness direction thereof. The through-holes are filled with a stop isolation layer and electroplated with copper to form conductive through-holes 50 through the substrate 40. The end of the conductive via 50 near the second surface of the base 40 corresponds to a second pad (not shown) on the surface of the first substrate 10 facing the base 40, and the second pad is electrically connected to the first lead 70 in the first substrate 10. The first isolation cavity 43 is provided with a solder ball 60, and the solder ball 60 is respectively connected with the corresponding conductive through hole 50 and the second bonding pad in a soldering manner, so that the conductive through hole 50 is electrically connected with the first lead 70 in the first substrate 10 through the solder ball 60. In the present embodiment, a pair of conductive vias 50 are provided in the base 40, the pair of conductive vias 50 are provided on both sides in the first width direction passing through the cavity 41, and two solder balls 60 respectively soldered to the pair of conductive vias 50 are provided in the first isolation chamber 43. Alternatively, the positions of the conductive vias 50 may be set according to the actual situation of the first pads 122, which is not particularly limited herein.

The force sensitive membrane 42 is used to sense pressure or pressure. Illustratively, in the present embodiment, the second isolation layer 30 is strained by pressure and transferred to the force sensitive film 42, the force sensitive film 42 is deformed, the resistivity of the force sensitive film 42 is changed by piezoresistive effect, and the first pad 122 generates a pressure signal, which is sequentially led out through the conductive through hole 50 and the solder ball 60, and finally is output from the first lead 70 on the first substrate 10.

Specifically, the thickness of the first substrate 10 is 70 micrometers to 100 micrometers. The thickness of the first separator 20 is 100 micrometers to 200 micrometers.

Specifically, the width of the groove 21 in any direction is slightly larger than the width of the base 40, the base 40 is fixedly mounted on the first substrate 10 through the solder balls 60, and the circumferential side wall of the base 40 is isolated from the wall of the groove 21, so as to avoid that the force applied to the first isolation layer 20 is transferred to the base 40 transversely, and the deformation of the force sensitive film 42 is caused to output an erroneous pressure signal. The first surface of the substrate 40 slightly protrudes from the surface of the first barrier layer 20 facing the second barrier layer 30 so that the second barrier layer 30 can better conform to the first surface of the substrate 40, and the first barrier layer 20 is pressed and the resulting deformation can be accurately transferred to the first surface of the substrate 40.

Specifically, the substrate 40 is a si—si bonded structure or a pure silicon structure. The cavity 41 may be formed by etching the cavity 41 on the substrate 40 and then bonding, or may be formed by rapid thermal annealing the cavity 41 on the substrate 40, or may be formed by anisotropic isotropic etching and epitaxy on the substrate 40.

Specifically, the second isolation layer 30 may be a flexible circuit board without patterns, or may be a glue layer.

Compared with the prior art, the pressure sensor provided by the application has the advantages that the force sensing body 4 with the cavity 41 and the force sensing membrane 42 is used as a pressure sensing element, has better temperature characteristics and linearity, and is suitable for severe environments with high temperature and high pressure. And the force sensitive body 4 is arranged in the groove 21 of the first isolation layer 20, so that the influence of external force except the thickness direction of the substrate 40 on the substrate 40 is avoided, and the force sensitive body 4 can accurately output the pressure information born by the thickness direction.

In the case of example 2,

referring to fig. 2, fig. 2 is a schematic cross-sectional structure of a pressure sensor according to embodiment 2 of the present utility model, compared to embodiment 1, in the first isolation chamber 43 of the pressure sensor according to embodiment 2, a plurality of pressure equalizing solder balls 61 are further disposed in addition to the solder balls 60, the plurality of pressure equalizing solder balls 61 are uniformly disposed between the second surface and the first substrate 10, and the pressure equalizing solder balls 61 are supportably disposed between the second surface and the first substrate 10 to maintain stability and balance of the substrate 40 during stress. The solder balls 61 are disposed between the first substrate 10 and the base 40 using a re-routing process.

Example 3

Referring to fig. 3, fig. 3 is a schematic cross-sectional structure of a pressure sensor according to embodiment 3 of the present utility model, and in comparison with embodiment 1, a spacer 100 is further disposed in the first isolation chamber 43 of the pressure sensor according to embodiment 3, and the spacer 100 is supportingly disposed between the second surface and the first substrate 10 to maintain stability and balance of the substrate 40 during stress. The pad 100 is made of at least one of insulating glue, solder mask, metal or silicon. In this embodiment, a one-piece gasket 100 is disposed within the first isolation chamber 43; alternatively, a plurality of spacers 100 may be disposed in the first isolation chamber 43 according to the actual situation of the first substrate 10, and the shape and distribution position of the spacers 100 are not specifically limited herein.

Example 4

Referring to fig. 4, fig. 4 is a schematic cross-sectional structure of a pressure sensor according to embodiment 4 of the present utility model, and in comparison with embodiment 1, the pressure sensor according to embodiment 4 includes a first conductive medium 110 instead of the solder balls 60 in embodiment 1, the first conductive medium 110 has a conductive property, and the first conductive medium 110 connects the conductive via 50 and the second pad on the first substrate 10 to enable a pressure signal to be transmitted to the first lead 70 in the first substrate 10 through the first conductive medium 110. Specifically, the material of the first conductive medium 110 is conductive adhesive or conductive silver paste. The material of the first conductive medium 110 is preferably conductive adhesive, so that the first conductive medium 110 made of conductive adhesive has good supporting effect on the substrate 40 in the first isolation cavity 43 while ensuring the transmission of pressure signals, and the stability and balance of the substrate 40 in the stress process are maintained.

Example 5

Referring to fig. 5, fig. 5 is a schematic cross-sectional view of a pressure sensor according to embodiment 5 of the present utility model, and in comparison with embodiment 1, the pressure sensor according to embodiment 5 includes a reinforcing plate 130, wherein the reinforcing plate 130 has a sheet-like structure, and the reinforcing plate 130 is disposed on a side of the first substrate 10 away from the base 40. The stiffening plate 130 has a structural reinforcement effect on the pressure sensor of the present application, so as to avoid the connection disconnection failure between the components caused by the excessive bending of the first substrate 10 in the stress process of the present application. In the thickness direction of the base 40, the groove 21 is within the orthographic projection coverage of the reinforcing plate 130 on the first substrate 10. The reinforcing plate 130 is made of metal, preferably stainless steel.

Example 6

Referring to fig. 6, fig. 6 is a schematic cross-sectional view of a pressure sensor according to embodiment 6 of the present utility model, and compared with embodiment 1, the force sensing body 4 of the pressure sensor of the present embodiment is accommodated in the recess 21, and a third isolation layer 124 is disposed between the second surface of the substrate 40 and the first substrate 10 to support and isolate the substrate 40. The force sensing body 4 in this embodiment does not have a conductive via 50 and the first substrate 10 is not provided with a first lead 70 therein. In the present embodiment, the second isolation layer 30 is configured as the second substrate 31, and the first surface of the base 40 is slightly lower than the surface of the first isolation layer 20 facing the second substrate 31, so that a second isolation cavity is formed between the first surface and the second substrate 31. A fourth isolation layer 125 is disposed in the second isolation chamber, the fourth isolation layer 125 is disposed between the second substrate 31 and the force sensitive film 42, and the fourth isolation layer 125 couples the external pressure applied to the second substrate 31 to the force sensitive film 42. A pair of first pads 122 is provided on the first surface of the substrate 40 in the width direction of the substrate 40 perpendicular to the thickness direction of the substrate 40, the pair of first pads 122 being provided at both side positions of the force sensitive film 42, respectively. The first bonding pad 122 is electrically connected to the first bonding pad of the force sensitive film 42, and a surface of the first bonding pad 122 facing the second substrate 31 is provided with a second conductive medium 121. At least one pair of metal connections is disposed in the second substrate 31, the position of the second lead 123 facing the base 40 corresponds to the second conductive medium 121, and the second conductive medium 121 is electrically connected to the second lead 123. The pressure signal generated by the deformation of the force sensitive film 42 is led out through the first bonding pad 122, the second conductive medium 121, and the second lead 123 in order.

Specifically, the material of the fourth isolation layer 125 is at least one of an insulating glue, a solder mask, silicon oxide or silicon nitride. When the material of the fourth isolation layer 125 is silicon, silicon oxide or silicon nitride, the third fourth isolation layer 125 and the fourth isolation layer 125 are formed by etching during the production process. The second conductive medium 121 is made of conductive silver paste or conductive adhesive, preferably conductive adhesive.

In this embodiment, the pressure signal generated by the force applied by the pressure sensor can be directed from the direction of the applied force.

Example 7

Referring to fig. 7, fig. 7 is a schematic cross-sectional structure of a pressure sensor according to embodiment 7 of the present utility model, and compared to embodiment 1, the pressure sensor further includes a capacitor, which includes a first electrode plate 141 and a second electrode plate 142. The capacitor is arranged in the cavity 41. The cavity 41 has opposite top and bottom portions in the thickness direction of the substrate 40, the top portion abutting the force sensitive membrane 42. The first and second electrode plates 141 and 142 are oppositely disposed on the top and bottom, respectively. In the thickness direction of the substrate 40, the orthographic projections of the first electrode plate 141 and the second electrode plate 142 on the first surface overlap. In this embodiment, a pair of first pads 122 are disposed on both sides of the force sensitive film, and the first electrode plate 141 and the second electrode plate 142 are electrically connected to the first pads 122 on both sides, respectively. When the force of the second isolation layer 30 is transferred to the force sensitive film 42, the force sensitive film 42 deforms, resulting in a smaller space between the first electrode plate 141 and the second electrode plate 142, a larger capacitance of the capacitor, and the capacitor generates a pressure signal, which is sequentially led out through the first pad 122, the conductive via 50 and the solder ball 60, and finally output from the first lead 70 on the first substrate 10.

Example 8

Referring to fig. 8, fig. 8 is a schematic cross-sectional structure of a pressure sensor according to embodiment 8 of the present utility model, and compared to embodiment 1, the pressure sensor according to embodiment 8 further includes a temperature sensor 80, the temperature sensor 80 is disposed in the first substrate 10, and the temperature sensor 80 is electrically connected to the circuit in the first substrate 10. The temperature sensor 80 is manufactured during the processing of the first substrate 10. In the present embodiment, the temperature sensor 80 is a resistance temperature detector, and the resistance value of the resistance temperature detector increases with increasing temperature and decreases with decreasing temperature to output temperature information. Further, the resistance temperature detector is made of at least one of metal platinum, metal nickel or metal copper. The material of the resistance temperature detector is preferably metallic copper, which is compatible with the manufacture of the first substrate 10, so as to reduce the difficulty of the production process and the production cost.

Example 9

Referring to fig. 9, fig. 9 is a schematic cross-sectional structure of a pressure sensor according to embodiment 9 of the present utility model, wherein the pressure sensor according to embodiment 9 further includes a temperature sensor 80 compared to embodiment 1, and the temperature sensor 80 according to embodiment 3 is disposed on the first surface of the substrate 40 compared to the temperature sensor 80 according to embodiment 2. The temperature sensor 80 may be a resistor formed by ion implantation or a diode formed by ion implantation. When the temperature sensor 80 is a resistor, the resistance value of the resistor increases with an increase in temperature and decreases with a decrease in temperature; when the temperature sensor 80 is a diode, the resistance value of the diode becomes smaller with an increase in temperature and becomes larger with a decrease in temperature to output a temperature signal. The temperature sensor 80 transfers temperature information from the first surface to the second surface through the conductive via 50 penetrating the base 40, and then leads out a temperature signal from a circuit on the first substrate 10 through the solder ball 60 and the second pad which are sequentially soldered to each other (the conductive via 50 and the solder ball 60 which are electrically connected to the temperature sensor 80 are not shown in the drawing).

Referring to fig. 10, fig. 10 is a schematic diagram of an array structure of a pressure sensor according to an embodiment of the present utility model, a plurality of arrays are disposed on a first isolation layer 20 and disposed in grooves 21, and a force sensing body 4 is disposed in each groove 21, and a pressure signal of the force sensing body 4 is led out through a first lead 70 in a first substrate 10 (not shown in the figure). Illustratively, two force sensing bodies 4 are shown, the pressure signals output by a force sensing body 4 are a first output signal 161 and a second output signal 162, respectively, the first output signal 161 and the second output signal 162 correspond to a first output voltage 18, the pressure signals output by another force sensing body 4 are a third output signal 163 and a fourth output signal 164, respectively, and the third output signal 163 and the fourth output signal 164 correspond to a second output voltage 19. The change in magnitude of each output voltage shows the magnitude and change in pressure experienced by the force-sensitive body 4 corresponding thereto. In the present embodiment, the first separator 20 is provided with a 3×3 layout of the force-sensitive body 4; alternatively, other numbers of force-sensitive bodies 4 and suitable arrangements may be used as the case may be, without specific limitation.

Referring to fig. 11, fig. 11 is a schematic cross-sectional structure of a force to be detected according to an embodiment of the present utility model, where a first force to be detected part 201, a second force to be detected part 202, and a third force to be detected part 203 are sequentially abutted. Illustratively, the first, second, and third force-to-be-detected components 201, 202, 203 are electrical cores. The first to-be-detected force member 201, the second to-be-detected force member 202, and the third to-be-detected force member 203 have pressures, such as expansion forces or pressing forces, in directions toward the adjacent to-be-detected force members. The pressure sensor 1 is arranged at adjacent positions among the first to-be-detected force component 201, the second to-be-detected force component 202 and the third to-be-detected force component 203, and the stress direction of the pressure sensor 1 is parallel to the pressure direction. When the force to be detected is subjected to external force or is heated and expanded in the using process, the pressure received by different force to be detected parts or different areas of the same force to be detected is different, the stress degree of the pressure sensor 1 in different areas is different, and then the output pressure signals are different, and the pressure of the local area can be predicted by detecting the output change of the pressure sensor 1. In some special applications, such as battery pack detection, the pressure sensor 1 can detect the early expansion force of the battery pack, and predict the occurrence of the bulge of the battery pack so as to improve the safety of the product applied by the pressure sensor 1.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims

1. A pressure sensor, comprising:

a first substrate;

2. The pressure sensor of claim 1, wherein the pressure sensor further comprises:

3. The pressure sensor of claim 1, further comprising a second isolation layer covering the first isolation layer and a surface of the force sensitive body on a side facing away from the first substrate.

4. The pressure sensor of claim 3, wherein the second isolation layer is a flexible circuit board or a glue layer.

5. The pressure sensor of claim 1, wherein the circumferential side wall of the force sensing body is isolated from the walls of the recess.

6. The pressure sensor of claim 1, wherein the first surface is convex or flush with a side of the first isolation layer facing away from the first substrate.

7. The pressure sensor of claim 1, wherein the material of the first isolation layer is at least one of a solder mask layer or an epoxy.

8. The pressure sensor of claim 1, wherein a stiffening plate is attached to a side of the first substrate remote from the force sensitive body; in the thickness direction of the force sensitive body, the groove is in the range of orthographic projection of the reinforcing plate on the first substrate.

9. The pressure sensor of claim 2, further comprising a plurality of piezoresistors electrically connected in one-to-one correspondence with the plurality of first bonding pads; the piezoresistors are arranged on one side of the force sensitive film far away from the first cavity, and the resistance values of the piezoresistors change along with the deformation of the force sensitive film.

10. The pressure sensor of claim 9, wherein the force sensing body further comprises:

11. The pressure sensor of claim 10, wherein,

a first lead is arranged on the first substrate;

the force sensitive body is isolated from the first substrate, and a first isolation cavity communicated with the conductive through hole and the lead is arranged between the second surface and the first substrate;

12. The pressure sensor of claim 11, wherein the conductive member comprises at least one of solder balls, conductive paste, and conductive silver paste.

13. The pressure sensor of claim 11, wherein at least one support is disposed within the first isolation chamber, the support being disposed between the force sensing body and the first substrate.

14. The pressure sensor of claim 13, wherein the support comprises a pressure equalizing solder ball or pad;

15. The pressure sensor of claim 9, further comprising a second substrate configured as the force bearing body, the second substrate having a second lead disposed therein;

the first bonding pad is arranged at the position corresponding to the second lead on the first surface and is electrically connected with the piezoresistor, and a second conductive medium is filled between the first bonding pad and the second lead so as to electrically connect the first bonding pad and the second lead.

16. The pressure sensor of claim 15, wherein a fourth isolation layer is disposed between the second substrate and the force-sensitive membrane to transfer the force-induced deformation of the second substrate through the fourth isolation layer to the force-sensitive membrane.

17. The pressure sensor of claim 15, wherein a third spacer layer is disposed between the second surface and the first substrate to provide a spacer support for the substrate.

18. The pressure sensor of claim 1, further comprising a first electrode plate and a second electrode plate; the first electrode plate and the second electrode plate are respectively arranged at the top and the bottom in the first cavity in an opposite mode, and the first electrode plate is connected with the force sensitive film; the first electrode plate and the second electrode plate are respectively and electrically connected with the corresponding first bonding pads, and the first electrode plate and the second electrode plate form a capacitor structure;

the first electrode plate changes the distance with the second electrode plate along with the stress deformation of the force-sensitive film, so that the capacitance value of the capacitance structure also changes along with the distance to sense the pressure born by the force-sensitive film.

19. The pressure sensor of claim 18, wherein,

a plurality of conductive through holes penetrating through the body of the substrate are formed in the substrate, and are respectively and electrically connected with the plurality of first bonding pads so as to transmit the signals from the first surface to the second surface;

20. The pressure sensor of claim 1, further comprising a temperature sensor disposed within the first substrate or disposed on the first surface of the force sensing body.

21. The pressure sensor of claim 1, wherein when the number of grooves is plural, the grooves are arranged in an array arrangement in the first separator layer.