CN220697577U

CN220697577U - FPC bonding device capable of cleaning USC

Info

Publication number: CN220697577U
Application number: CN202321840687.0U
Authority: CN
Inventors: 陈铭洲; 冯鑫杰; 苏超民; 卢振东; 王森杰; 诸旻昊
Original assignee: Tdg Machinery Technology Co ltd
Current assignee: Tdg Machinery Technology Co ltd
Priority date: 2023-07-12
Filing date: 2023-07-12
Publication date: 2024-04-02
Anticipated expiration: 2033-07-12

Abstract

The utility model discloses an FPC bonding device capable of cleaning USCs, which comprises a material taking part, a cleaning carrier and a bonding part of built-in USC cleaning devices, wherein the material taking part is used for conveying an FPC to be cleaned to the cleaning carrier, and the bonding part cleans the lower FPC to be cleaned through the built-in USC cleaning devices and then transmits the cleaned FPC to enter an FPC logistics line to a bonding station for bonding operation. After the FPC to be cleaned is conveyed to the cleaning carrying platform through the material taking part, the built-in USC cleaning device of the bonding part is utilized to clean the lower FPC to be cleaned, and finally the FPC is conveyed into the FPC logistics line to the bonding station to be subjected to bonding operation.

Description

FPC bonding device capable of cleaning USC

Technical Field

The utility model relates to the technical field of USC cleaning, in particular to an FPC bonding device capable of cleaning USC.

Background

In the bonding equipment of the flexible panel, the bonding equipment uses conductive particles in the ACF to connect electrodes between the FPC and the flexible panel so as to conduct, and meanwhile, the conduction short circuit between two adjacent electrodes can be avoided, so that the purpose of conducting only in the Z-axis direction is achieved. The FPC will carry particles when taken out from the Tray, and if the FPC is not cleaned before being conveyed to the bonding station, the particles on the electrode will affect the product quality after bonding the FPC and the flexible screen.

In the prior art, two cleaning modes are mainly adopted:

the first operation mode is as follows: manually cleaning the Tray and FPC.

The second mode of operation: the industry has specialized equipment for cleaning FPC and Tray, including material taking arm, carrier, cleaning device, and material discharging arm. And the personnel put the Tray with the FPC into the cleaning equipment, the material taking arm conveys the FPC in the Tray onto the carrier, then the FPC passes through the cleaning device, the blanking arm is used for loading the Tray, and finally the personnel put the Tray with the FPC into the bonding equipment.

The cleaning equipment is arranged outside the bonding equipment, and a person carries the Tray with the FPC into the bonding equipment, so that secondary pollution can be caused. The Tray of the FPC is not cleaned, and particles attached to the surface of the Tray may cause secondary pollution when the Tray is put into the FPC after cleaning the FPC.

Disclosure of Invention

The utility model aims to provide the FPC bonding device capable of carrying out USC cleaning, which does not cause secondary pollution, realizes that after FPC is taken out from a Tray and cleaned, the FPC directly enters bonding equipment without being contacted by personnel and without contacting the Tray, has small USC cleaning volume, can be embedded into the bonding equipment, basically does not influence the size of the original equipment, and has high USC cleaning efficiency so as to meet the beat requirement of the bonding equipment.

In order to solve the technical problems, the embodiment of the utility model provides an FPC bonding device capable of cleaning USC, which comprises a material taking part, a cleaning carrier and a bonding part of a built-in USC cleaning device, wherein the material taking part is used for conveying an FPC to be cleaned to the cleaning carrier, and the bonding part is used for cleaning the lower FPC to be cleaned through the built-in USC cleaning device and then transmitting the cleaned FPC to enter an FPC logistics line to a bonding station for bonding operation.

The FPC cleaning device further comprises a blanking part arranged on the bonding part and used for carrying the cleaned FPC to be cleaned out of the cleaning carrier to enter the FPC commodity line.

The device further comprises a PLC (programmable logic controller) connected with the material taking component, the cleaning carrier, the bonding component and the blanking component, and the PLC is used for receiving control instructions and controlling the running states of the material taking component, the cleaning carrier, the bonding component and the blanking component.

The material taking component is a material taking mechanical arm, and the material discharging component is a material discharging mechanical arm.

The cleaning carrier comprises a carrier platform, a height adjusting part, an X-axis adjusting part and a Y-axis adjusting part which are sequentially connected from top to bottom, wherein the PLC is connected with the cleaning carrier platform, and the three-dimensional space position of the carrier platform is adjusted by controlling the states of the height adjusting part, the X-axis adjusting part and the Y-axis adjusting part.

The cleaning device further comprises an alignment component arranged on the cleaning carrier and the bonding component, and the alignment component is used for aligning the carrying platform of the cleaning carrier with the USC nozzle of the USC cleaning device.

The cleaning and marking device is characterized by further comprising a cleaning and marking component arranged on the cleaning carrying platform and used for manufacturing cleaning time and cleaning and finishing marks for finishing cleaning bonding equipment.

The device also comprises a display connected with the PLC controller, the cleaning carrier and the alignment component, and the display is used for displaying the running states of the cleaning carrier and the alignment component.

The device also comprises a communication module connected with the PLC controller and used for receiving control instructions or outputting operation data of components connected with the PLC controller.

The communication module comprises a WIFI module, a 4G module, a 5G module and a Zigbee module.

Compared with the prior art, the FPC bonding device capable of cleaning USC has the following advantages:

after the FPC to be cleaned is conveyed to the cleaning carrier by the material taking component, the lower FPC to be cleaned is cleaned by using the built-in USC cleaning device of the bonding component, and finally the FPC to be cleaned is transmitted into a standard FPC logistics line to a bonding station for bonding operation, and the cleaning of the FPC is automatically completed due to the completion of the cleaning of the FPC by the built-in USC cleaning device of the bonding component

In the whole process, the USC cleaning device carries out automatic cleaning to the FPC to be cleaned below the USC spray head, finally the blanking part carries out the cleaned FPC to be cleaned, which is completed, from the cleaning carrying platform into a standard FPC object streamline, no contact of personnel after cleaning is needed, no secondary pollution is caused, the cleaning device directly carries logistics to a bonding station through the FPC, the cleaning efficiency is high, the cleaning device directly enters bonding equipment under the condition that the FPC is taken out from the Tray to be cleaned, the contact of personnel is avoided, the contact of the personnel is avoided, the bonding equipment is not contacted, the USC cleaning volume is small, the size of original equipment is basically not influenced, the USC cleaning efficiency is high, and the beat requirement of the bonding equipment is met.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an embodiment of an FPC bonding device capable of USC cleaning according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a pick-up assembly of one embodiment of an FPC bonding apparatus capable of USC cleaning according to an embodiment of the present utility model;

FIG. 3 is a schematic diagram illustrating a cleaning stage according to an embodiment of the FPC bonding apparatus capable of USC cleaning according to the present utility model;

FIG. 4 is a schematic structural view of a blanking member of an embodiment of an FPC bonding apparatus capable of USC cleaning according to an embodiment of the present utility model;

FIG. 5 is a schematic diagram illustrating a cleaning configuration of one embodiment of an FPC bonding device capable of USC cleaning according to an embodiment of the present utility model;

wherein, get material part-10, wash the microscope carrier-20, USC cleaning device-30, unloading part-40, USC shower nozzle-31, FPC-50.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, fig. 1 is a schematic structural diagram of an embodiment of an FPC bonding device capable of USC cleaning according to an embodiment of the present utility model; FIG. 2 is a schematic diagram of a pick-up assembly of one embodiment of an FPC bonding apparatus capable of USC cleaning according to an embodiment of the present utility model; FIG. 3 is a schematic diagram illustrating a cleaning stage according to an embodiment of the FPC bonding apparatus capable of USC cleaning according to the present utility model; FIG. 4 is a schematic structural view of a blanking member of an embodiment of an FPC bonding apparatus capable of USC cleaning according to an embodiment of the present utility model; fig. 5 is a schematic diagram illustrating a cleaning structure of an embodiment of an FPC bonding device capable of USC cleaning according to an embodiment of the present utility model.

In a specific embodiment, the FPC bonding device capable of performing USC cleaning includes a material taking component 10, a cleaning carrier 20 and a bonding component of a built-in USC cleaning device 30, wherein the material taking component is used for conveying an FPC to be cleaned to the cleaning carrier, and the bonding component cleans the underlying FPC50 to be cleaned by the built-in USC cleaning device 30 and then transmits the cleaned FPC to enter an FPC logistics line to a bonding station to perform bonding operation.

The FPC50 to be cleaned is conveyed to the cleaning carrying platform 20 through the material taking part 10, the USC cleaning device 30 cleans the FPC50 to be cleaned below the USC nozzle, finally the discharging part 40 conveys the FPC50 to be cleaned which is completed to be cleaned out of the cleaning carrying platform 20 to enter a material flow line of the FPC50, the FPC50 does not need to be installed in a Tray, no secondary pollution is caused, the FPC50 is conveyed to a bonding station directly, the cleaning efficiency is high, after the FPC50 is taken out of the Tray to be cleaned, the FPC50 directly enters bonding equipment under the conditions of not being contacted by personnel and not contacting the Tray, the USC cleaning volume is small, the USC cleaning device can be embedded into the bonding equipment, the original equipment size is basically not influenced, the USC cleaning efficiency is high, and the beat requirement of the bonding equipment is met.

In this application, although the cleaning stage 20 and the USC cleaning device 30 need not to be in direct contact with each other manually, there may be situations of manual operation, such as grabbing the object, opening and closing the USC cleaning device 30, placing the object back, etc., which have high requirements for manual operation, and require precise monitoring of an operation process, and when the operation cannot occur, in order to improve cleaning efficiency, in an embodiment, the FPC50 bonding apparatus capable of performing USC cleaning further includes a PLC controller connected to the material taking component 10, the cleaning stage 20, the USC cleaning device 30, and the blanking component 40, and is configured to receive a control instruction, and control the operation states of the material taking component 10, the cleaning stage 20, the USC cleaning device 30, and the blanking component 40.

And the PLC receives the control instruction and controls the running states of the material taking part 10, the cleaning carrier 20, the USC cleaning device 30 and the blanking part 40, so that after the control parameters are set, the automatic control of the operation of each part is realized.

It should be noted that the present application includes, but is not limited to, a PLC controller, and other control devices may be used, for example, a single-chip microcomputer may be used to control a stepper motor, a servo motor, etc.

In order to realize collection and replacement of objects, the device can be realized by the same component, and can also be realized by different components, the structure and the material of the material taking component 10 and the material discharging component 40 are not limited, in one embodiment, the material taking component 10 is a material taking mechanical arm, and the material discharging component 40 is a material discharging mechanical arm.

Other mechanisms besides the mechanical arm can be adopted for processing.

Since in the actual operation process, the cleaning is mainly performed on a specific position, but there may be a situation of a position deviation, in one embodiment, in order to facilitate position adjustment, the cleaning stage 20 includes a carrying platform, a height adjusting portion, an X-axis adjusting portion, and a Y-axis adjusting portion that are sequentially connected from top to bottom, and the PLC controller is connected to the cleaning stage 20, and adjusts the three-dimensional space position of the carrying platform by controlling the states of the height adjusting portion, the X-axis adjusting portion, and the Y-axis adjusting portion.

The relative positions of the height adjusting part, the X-axis adjusting part and the Y-axis adjusting part are not limited in this application, and include, but are not limited to, the above-described structures, and the adjustment range is not limited.

Still further, in order to improve the cleaning efficiency, in one embodiment, the FPC50 bonding apparatus capable of USC cleaning further includes an alignment member disposed on the cleaning stage 20 and the USC cleaning device 30, for aligning the loading platform of the cleaning stage 20 with the USC nozzle 31 of the USC cleaning device 30.

Alignment of the load platform of the cleaning stage 20 with the USC head 31 of the USC cleaning device 30 by alignment means improves the accuracy of the cleaning position, including but not limited to using opto-electronic device alignment.

Furthermore, because the size of the particles is smaller in the actual device, the subsequent process cannot confirm whether the cleaning is completed, and in one embodiment, the FPC50 bonding device capable of performing USC cleaning further includes a cleaning marking component disposed on the glass carrier, and the cleaning marking component is used for making a cleaning time and a cleaning completion mark for the cleaning completion bonding equipment.

And the cleaning time and the cleaning completion mark are manufactured for the bonding equipment through the cleaning and marking part, so that the confirmation cleaning can be realized, and the use reliability is improved.

The structure and the marking mode of the cleaning marking component are not limited, and laser marking can be adopted, or other square marks are arranged, such as spraying special marks, and the like.

To further improve the management efficiency, in an embodiment, the FPC50 bonding device capable of USC cleaning further includes a display connected to the PLC controller, the cleaning stage 20, and the alignment member, for displaying the operation states of the cleaning stage 20 and the alignment member.

The display displays the shape bodies of all the parts, so that the current cleaning state can be obtained, and whether the equipment is in fault or not can be obtained according to the current cleaning state, and the rapid maintenance is realized.

The structure, size and display mode of the display are not limited in the application.

Still further, in order to implement remote control, in an embodiment, the FPC50 bonding device capable of USC cleaning further includes a communication module connected to the PLC controller, for receiving a control command or outputting operation data of a component connected to the PLC controller.

And the communication module receives the control instruction or outputs the operation data of the components connected with the PLC, so that remote control and data acquisition are realized, and the control efficiency is improved.

The structure, the type and the setting position of the communication module are not limited, and the communication module comprises a WIFI module, a 4G module, a 5G module and a Zigbee module.

In one embodiment, the USC cleaning process of the FPC50 bonding device that may perform USC cleaning is as follows:

the material taking arm conveys the FPC50 in the Tray to the carrying platform; the carrier passes through the USC cleaning device 30, and USC cleaning is performed under the USC shower head 31; the blanking arm takes materials from the carrier and enters a standard FPC50 material flow line.

The USC cleaning principle is as follows: the back of the FPC50 is provided with a vacuum air flow which adsorbs the FPC50 on the carrier, ultrasonic air flow is sprayed into the USC nozzle to separate particles after the air layer on the surface of the FPC50 is damaged, and meanwhile, the vacuum air flow adsorbs the particles into the nozzle and then is discharged out of the device through an exhaust pipeline in the device. The stage moves from left to right/right to clean the electrodes on the FPC 50.

To sum up, the embodiment of the application provides a can carry out clear FPC bonding device of USC carries to waiting to wash the FPC through getting the material part to wash the microscope carrier, USC cleaning device is to USC shower nozzle below wait to wash the FPC of wasing, and finally unloading part will accomplish abluent waiting to wash the microscope carrier and get into standard FPC thing streamline, need not pack into the Tray, does not have secondary pollution, directly carries the commodity circulation to bonding station through FPC, and cleaning efficiency is high, realizes that FPC takes out clean from the Tray after, directly gets into bonding equipment under the condition of not contacting by personnel and not contacting the Tray, and USC cleaning volume is little can imbed in bonding equipment, does not basically influence former equipment size, and USC cleaning efficiency is high to satisfy bonding equipment's beat requirement.

The FPC bonding device capable of carrying out USC cleaning is described in detail above. The principles and embodiments of the present utility model have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present utility model and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the utility model can be made without departing from the principles of the utility model and these modifications and adaptations are intended to be within the scope of the utility model as defined in the following claims.

Claims

1. The utility model provides a can carry out clear FPC bonding device of USC, its characterized in that includes getting material part, washs the bonding part of microscope carrier and built-in USC cleaning device, get material part and be used for with waiting to wash FPC transport to wash the microscope carrier, bonding part is through built-in USC cleaning device washs the below get into FPC commodity circulation line and bond the station and carry out the bonding operation.

2. The USC-cleanable FPC bonding apparatus of claim 1, further comprising a blanking member disposed on said bonding member for carrying said cleaned FPC out of said cleaning stage into said FPC stream.

3. The USC-cleanable FPC bonding apparatus of claim 2, further comprising a PLC controller coupled to said take-out member, said purge mount, said bonding member, and said blanking member for receiving control instructions and controlling the operational status of said take-out member, said purge mount, said bonding member, and said blanking member.

4. The USC cleaning FPC bonding device of claim 3, wherein said pick-out means is a pick-out robot and said drop-out means is a drop-out robot.

5. The USC cleaning FPC bonding device according to claim 4, wherein the cleaning stage comprises a carrying platform, a height adjusting part, an X-axis adjusting part and a Y-axis adjusting part which are sequentially connected from top to bottom, the PLC controller is connected with the cleaning stage, and the three-dimensional space position of the carrying platform is adjusted by controlling the states of the height adjusting part, the X-axis adjusting part and the Y-axis adjusting part.

6. The USC cleaning enabled FPC bonding apparatus of claim 5, further comprising alignment means provided on said cleaning stage, said bonding means for aligning a carrier platform of said cleaning stage with a USC shower head of said USC cleaning device.

7. The USC cleaning FPC bonding apparatus of claim 6, further comprising a cleaning marking means provided on said cleaning stage for making a cleaning time and a cleaning completion mark for a cleaning completion bonding apparatus.

8. The USC cleanable FPC bonding apparatus of claim 7, further comprising a display coupled to said PLC controller, said cleaning stage, said alignment member for displaying an operational status of said cleaning stage, said alignment member.

9. The USC cleanable FPC bonding device of claim 8, further comprising a communication module coupled to the PLC controller for receiving control instructions or outputting operational data of components coupled to the PLC controller.

10. The USC cleanable FPC bonding device of claim 9, wherein the communication module comprises a WIFI module, a 4G module, a 5G module, and a Zigbee module.