CN220693431U - FPC circuit board compression fittings - Google Patents

FPC circuit board compression fittings Download PDF

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Publication number
CN220693431U
CN220693431U CN202321469051.XU CN202321469051U CN220693431U CN 220693431 U CN220693431 U CN 220693431U CN 202321469051 U CN202321469051 U CN 202321469051U CN 220693431 U CN220693431 U CN 220693431U
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China
Prior art keywords
pressing plate
circuit board
adjusting rod
lower pressing
sliding
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CN202321469051.XU
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Chinese (zh)
Inventor
姚炳祥
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Huizhou Lianmeng Technology Co ltd
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Huizhou Lianmeng Technology Co ltd
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Abstract

The utility model belongs to the technical field of circuit board production, in particular to an FPC circuit board pressing device, which comprises a lower pressing plate, wherein a positioning guide rail is arranged at the outer side edge of the lower pressing plate, a first sliding block is slidably arranged on the positioning guide rail, a stop block bracket is arranged above the first sliding block, a positioning stop block is arranged on the stop block bracket, a feed sliding block is arranged at the lower end of the lower pressing plate, the feed sliding block is slidably arranged in a sliding rail, a supporting frame is arranged at one side of the sliding rail, which is far away from the lower pressing plate, a heat preservation cover is arranged at the top end of the inner side of the supporting frame, an upper pressing plate is arranged in the heat preservation cover, the position of the positioning stop block can be adjusted through sliding of the first sliding block on the positioning guide rail, each layer of placed circuit board can be positioned, and the positioning guide rail is arranged at the outer side edge of the lower pressing plate, so that the position adjustment of the positioning stop block can be met, the integrity of the lower pressing plate is maintained, and the circuit board is prevented from deforming when being pressed.

Description

FPC circuit board compression fittings
Technical Field
The utility model relates to the technical field of circuit board production, in particular to an FPC circuit board pressing device.
Background
The circuit board mainly comprises a bonding pad, a via hole, a mounting hole, a wire, a component, a connector and the like, when the application requirement is more complicated, the circuits can be arranged into a multi-layer structure and pressed together, and through hole circuits are built between the layers to be communicated with the circuits of each layer, so that the circuit board can lead the circuits to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimizing the layout of electric appliances.
The document with the prior art publication number of CN215581968U provides a circuit board positioning and laminating equipment, and the device includes workstation and laminating equipment, positioning mechanism and feeding mechanism, and the device passes through positioning mechanism, guarantees to level and align between every layer of circuit board, can not influence the lamination result.
Although the device has more beneficial effects, the following problems still exist: the device is through seting up the spout on the pressfitting board to the activity adjustment between the mounting, however, seting up the spout on the pressfitting board has destroyed the integrality of pressfitting board, so that when carrying out pressfitting production to the circuit board, make the circuit board that is in spout top flow into the spout in the deformation condition, make the circuit board warp. In view of this, we propose a FPC board bonding apparatus.
Disclosure of Invention
In order to make up the defects in the prior art, the runner is arranged on the pressing plate to damage the integrity of the pressing plate, so that the problem that the circuit board above the runner is easy to deform when the circuit board is pressed and produced to flow into the runner, and the circuit board deforms is solved.
The technical scheme adopted for solving the technical problems is as follows: the FPC circuit board pressing device comprises a lower pressing plate, wherein a positioning guide rail is arranged at the outer side edge of the lower pressing plate, a first sliding block is slidably arranged on the positioning guide rail, a stop block support is arranged above the first sliding block, a positioning stop block is arranged on the stop block support, a feeding sliding block is arranged at the lower end of the lower pressing plate, the feeding sliding block is slidably arranged in a sliding rail, a supporting frame is arranged at one side of the sliding rail, which is far away from the lower pressing plate, a heat preservation cover is arranged at the top end of the inner side of the supporting frame, an upper pressing plate is arranged in the heat preservation cover, the position of the positioning stop block can be adjusted through sliding of the first sliding block on the positioning guide rail, each layer of placed circuit board can be positioned, so that the circuit boards can be aligned smoothly, the position adjustment of the positioning stop block can be met through the positioning guide rail arranged at the outer side edge of the lower pressing plate, the integrity of the lower pressing plate is maintained, and the circuit board is prevented from deforming when being pressed.
Preferably, a first adjusting rod is connected to a side surface of the first slider, the other end of the first adjusting rod is fixedly connected to the positioning guide rail, the lower end surface of the first slider is tightly attached to the upper end surface of the lower pressing plate to be arranged, and the furthest end of the first slider moving away from the lower pressing plate can enable the first slider to be separated from the area range of the lower pressing plate, and the first slider is conveniently driven to slide on the positioning guide rail by the aid of the first adjusting rod.
Preferably, a second adjusting rod is connected between the two feeding sliding blocks which are slidably connected to the sliding rail, the other end of the second adjusting rod is fixedly connected to the sliding rail, and the second adjusting rod is used for conveniently driving the lower pressing plate to perform demolding and mold feeding production.
Preferably, the lower terminal surface laminating of top board is installed and is pressed the gasbag, just it is middle low marginal high arc structure to press the lower terminal surface structure of gasbag, just it is high pressure resistant gasbag to press the gasbag, utilizes to press the gasbag and conveniently makes the circuit board thickness position all can the inseparable contact.
Preferably, the upper end face of the upper pressing plate is fixedly provided with a regulating rod IV and a guide rod respectively, the regulating rod IV passes through the heat insulation cover and is fixedly connected to the support frame, and the guide rod passes through the heat insulation cover and is connected to the support frame in a penetrating manner.
Preferably, the upper end face of the heat preservation cover is connected with a third adjusting rod, and the upper end of the third adjusting rod is fixedly connected to the supporting frame. The heat preservation cover is utilized to facilitate the heat preservation.
The utility model has the advantages that:
1. according to the utility model, the position of the positioning stop block can be adjusted by sliding the first sliding block on the positioning guide rail, so that each layer of placed circuit boards can be positioned, and can be aligned smoothly;
2. according to the utility model, through the elastic deformation structure of the compression air bag, when the circuit board is compressed, the compression air bag can be tightly pressed at each position of the circuit board according to different thicknesses of different positions of the circuit board, so that the phenomenon that the circuit board cannot be contacted with the upper pressing plate due to the fact that the thickness of the circuit board is different is prevented.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is an enlarged side view of a lower platen and slide block of the present utility model;
FIG. 3 is a schematic view of an enlarged semi-sectional structure of the upper platen area of the present utility model;
fig. 4 is an enlarged side view of the compression balloon of the present utility model.
In the figure: 1. a lower pressing plate; 2. positioning a guide rail; 3. a first sliding block; 4. a stopper bracket; 5. positioning a stop block; 6. a feed slide; 7. a slide rail; 8. a support frame; 9. a thermal insulation cover; 10. an upper press plate; 11. compressing the air bag; 301. an adjusting rod I; 701. an adjusting rod II; 901. an adjusting rod III; 1001. adjusting the lever IV; 1002. a guide rod.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1, an FPC circuit board pressing device includes a lower platen 1, a positioning guide rail 2 is provided at an outer edge of the lower platen 1, a first slider 3 is slidably mounted on the positioning guide rail 2, a stop block bracket 4 is mounted above the first slider 3, a positioning stop block 5 is mounted on the stop block bracket 4, a feed slider 6 is mounted at a lower end of the lower platen 1, the feed slider 6 is slidably disposed in a slide rail 7, a support frame 8 is mounted at one side of the slide rail 7 far from the lower platen 1, a thermal insulation cover 9 is provided at an inner top end of the support frame 8, and an upper platen 10 is provided in the thermal insulation cover 9;
when the circuit board is pressed, firstly, the first slider 3 slides on the positioning guide rail 2 according to the pressing requirement of the circuit board, the stop block bracket 4 and the connected positioning stop block 5 are driven to adjust the distance between the circuit board and the lower pressing plate 1, then each layer of circuit board is laid on the lower pressing plate 1, after the circuit board is laid, the second feeding slider 6 is driven to move to one side of the upper pressing plate 10 on the sliding rail 7 by driving the retraction of the second adjusting rod 701, the lower pressing plate 1 drives the laid circuit board to move to the position right below the upper pressing plate 10, then the fourth adjusting rod 1001 is driven to stretch out, the upper pressing plate 10 is driven to move downwards, the circuit board is pressed by utilizing the mutual extrusion of the upper pressing plate 10 and the lower pressing plate 1, and each layer of circuit boards are tightly combined together to form the whole circuit board.
Referring to fig. 2, a side surface of a first slider 3 is connected with a first adjusting rod 301, the other end of the first adjusting rod 301 is fixedly connected to a positioning guide rail 2, the lower end surface of the first slider 3 is closely attached to the upper end surface of a lower pressing plate 1, and the most distal end of the first slider 3 moving in a direction away from the lower pressing plate 1 can enable the first slider 3 to be separated from the area range of the lower pressing plate 1;
during operation, the first adjusting rod 301 drives the first sliding block 3 to slide on the positioning guide rail 2, so that the position of the positioning stop block 5 mounted on the stop block support 4 on the lower pressing plate 1 can be adjusted, after all layers of circuit boards are completely paved on the lower pressing plate 1, the positioning function of the positioning stop block 5 is completed, at the moment, the first adjusting rod 301 needs to be controlled to retract, the first sliding block 3 is driven to move on the positioning guide rail 2 to one side far away from the lower pressing plate 1, the positioning stop block 5 is separated from the area of the lower pressing plate 1, the upper pressing plate 10 can be conveniently pressed down, the circuit boards are contacted with the lower pressing plate 1 to be pressed, the lower end face of the positioning stop block 5 is tightly attached to the upper end face of the lower pressing plate 1, gaps between the positioning stop block 5 and the lower pressing plate 1 can be reduced, and the thinner circuit board layers are prevented from being blocked into the gaps to generate dislocation.
A second adjusting rod 701 is connected between the two feeding sliding blocks 6 which are connected to the sliding rail 7 in a sliding way, and the other end of the second adjusting rod 701 is fixedly connected to the sliding rail 7;
during operation, the lower pressure plate 1 can be driven to move to the position right below the upper pressure plate 10 by utilizing the retraction of the adjusting rod II 701, so that the upper pressure plate 10 can conveniently fall down and the lower pressure plate 1 can simultaneously squeeze a circuit board, and the lower pressure plate 1 can be driven to move to the side far away from the upper pressure plate 10 by utilizing the extension of the adjusting rod II 701, so that the lower pressure plate 1 can be conveniently used for collecting products or placing raw materials of each layer on the lower pressure plate 1.
Referring to fig. 4, a compression air bag 11 is mounted on the lower end surface of an upper pressing plate 10 in a fitting manner, the lower end surface of the compression air bag 11 is of an arc-shaped structure with a high middle low edge, and the compression air bag 11 is of a high-pressure resistant air bag;
when the circuit board is extruded by the contact of the upper pressing plate 10 and the lower pressing plate 1, the pressing air bag 11 of the upper pressing plate 10 is contacted with the uppermost end surface of the circuit board, and due to the arc-shaped structure of the pressing air bag 11, the pressing air bag 11 is firstly contacted with the middle position of the circuit board, then the pressing air bag 11 is gradually contacted with the circuit board from the middle to the outer side edge of the circuit board by the point forming surface, and the circuit board is paved, so that the phenomenon that the circuit board is tilted at some positions, cavity bubbles and the like are generated at the position where the circuit board bulges due to the fact that the upper pressing plate 10 simultaneously extrudes the whole surface of the circuit board can be avoided, and when the circuit board is pressed, the pressing air bag 11 can be tightly pressed at each position of the circuit board according to different thicknesses of different positions of the circuit board, and the phenomenon that the positions cannot be contacted with the upper pressing plate 10 due to the fact that the thickness of the circuit board is different is prevented.
Referring to fig. 3, an adjusting rod four 1001 and a guide rod 1002 are fixedly installed on the upper end surface of the upper pressing plate 10 respectively, the adjusting rod four 1001 passes through the heat insulation cover 9 to be fixedly connected to the support frame 8, and the guide rod 1002 passes through the heat insulation cover 9 to be connected to the support frame 8 in a penetrating manner;
when the circuit board is pressed, the upper pressing plate 10 can be driven to move downwards through the extension of the adjusting rod four 1001 to jointly press the circuit board with the lower pressing plate 1, and when the upper pressing plate 10 moves, the guide rod 1002 can be driven to move in a telescopic mode on the supporting frame 8, and the stability of the upper pressing plate 10 during moving downwards is improved through the guide rod 1002.
The upper end face of the heat preservation cover 9 is connected with a third adjusting rod 901, and the upper end of the third adjusting rod 901 is fixedly connected to the support frame 8;
when the circuit board is pressed, the circuit board can be heated, so that each layer of the circuit board can be welded, then each layer of the circuit board is tightly combined together in a pressure applying mode, and in the heating pressing process, the heat insulation cover 9 can be put down through the extension of the adjusting rod three 901 to wrap the outer sides of the upper pressing plate 10 and the lower pressing plate 1, so that the heating and heat insulation effects are achieved.
When the circuit board is pressed, the first sliding block 3 slides on the positioning guide rail 2 according to the pressing requirement of the circuit board, the stop block bracket 4 and the connected positioning stop block 5 are driven to adjust the distance between the circuit board and the lower pressing plate 1, then each layer of circuit board is laid on the lower pressing plate 1, after the circuit board is laid, the second feeding sliding block 6 is driven to retract on the sliding rail 7 to move towards one side of the upper pressing plate 10, the lower pressing plate 1 drives the laid circuit board to move to the position right below the upper pressing plate 10, the fourth adjusting rod 1001 is driven to stretch out, the upper pressing plate 10 is driven to move downwards, the circuit boards are pressed by the aid of the mutual extrusion of the upper pressing plate 10 and the lower pressing plate 1, and each layer of circuit boards are tightly combined together to form the whole circuit board.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.

Claims (6)

1. The FPC circuit board pressing device is characterized by comprising a lower pressing plate (1), wherein a positioning guide rail (2) is arranged at the outer side edge of the lower pressing plate (1), a first sliding block (3) is slidably arranged on the positioning guide rail (2), a stop block support (4) is arranged above the first sliding block (3), a positioning stop block (5) is arranged on the stop block support (4), a feeding sliding block (6) is arranged at the lower end of the lower pressing plate (1), the feeding sliding block (6) is slidably arranged in a sliding rail (7), a supporting frame (8) is arranged at one side, far away from the lower pressing plate (1), of the sliding rail (7), a heat preservation cover (9) is arranged at the top end of the inner side of the supporting frame (8), and an upper pressing plate (10) is arranged in the heat preservation cover (9).
2. The FPC board pressing device according to claim 1, wherein: the side of the first slider (3) is connected with a first adjusting rod (301), the other end of the first adjusting rod (301) is fixedly connected to the positioning guide rail (2), the lower end face of the first slider (3) is tightly attached to the upper end face of the lower pressing plate (1) to be arranged, and the furthest end of the first slider (3) moving in the direction away from the lower pressing plate (1) can enable the first slider (3) to be separated from the area range of the lower pressing plate (1).
3. The FPC board pressing device according to claim 2, wherein: a second adjusting rod (701) is connected between the two feeding sliding blocks (6) which are connected to the sliding rail (7) in a sliding way, and the other end of the second adjusting rod (701) is fixedly connected to the sliding rail (7).
4. A FPC board pressing device according to claim 3, characterized in that: the lower end face of the upper pressing plate (10) is attached to the pressing air bag (11), the lower end face of the pressing air bag (11) is of an arc-shaped structure with a middle low edge, and the pressing air bag (11) is of a high-pressure-resistant air bag.
5. The FPC board pressing device according to claim 4, wherein: the upper end face of the upper pressing plate (10) is fixedly provided with a fourth adjusting rod (1001) and a guide rod (1002), the fourth adjusting rod (1001) penetrates through the heat preservation cover (9) to be fixedly connected to the support frame (8), and the guide rod (1002) penetrates through the heat preservation cover (9) to be connected to the support frame (8) in a penetrating mode.
6. The FPC board pressing device according to claim 5, wherein: the upper end face of the heat preservation cover (9) is connected with a third adjusting rod (901), and the upper end of the third adjusting rod (901) is fixedly connected to the support frame (8).
CN202321469051.XU 2023-06-09 2023-06-09 FPC circuit board compression fittings Active CN220693431U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321469051.XU CN220693431U (en) 2023-06-09 2023-06-09 FPC circuit board compression fittings

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321469051.XU CN220693431U (en) 2023-06-09 2023-06-09 FPC circuit board compression fittings

Publications (1)

Publication Number Publication Date
CN220693431U true CN220693431U (en) 2024-03-29

Family

ID=90405649

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321469051.XU Active CN220693431U (en) 2023-06-09 2023-06-09 FPC circuit board compression fittings

Country Status (1)

Country Link
CN (1) CN220693431U (en)

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