CN220691023U - Automatic monitoring device for microsystem module batch aging test - Google Patents
Automatic monitoring device for microsystem module batch aging test Download PDFInfo
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- CN220691023U CN220691023U CN202321321928.0U CN202321321928U CN220691023U CN 220691023 U CN220691023 U CN 220691023U CN 202321321928 U CN202321321928 U CN 202321321928U CN 220691023 U CN220691023 U CN 220691023U
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- 238000012360 testing method Methods 0.000 title claims abstract description 108
- 230000032683 aging Effects 0.000 title claims abstract description 102
- 238000012806 monitoring device Methods 0.000 title claims abstract description 23
- 238000006243 chemical reaction Methods 0.000 claims abstract description 52
- 238000000034 method Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
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- 238000002474 experimental method Methods 0.000 description 1
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Abstract
The utility model relates to the technical field of integrated circuit testing, and particularly discloses an automatic monitoring device for a batch aging test of microsystem modules, which comprises a batch aging microsystem module carrier plate, a serial port level conversion plate, an auxiliary test plate and an upper computer, wherein the batch aging microsystem module carrier plate is connected with the serial port level conversion plate, the auxiliary test plate is connected with the serial port level conversion plate, and the upper computer is connected with the auxiliary test plate; the serial port level conversion board comprises a conversion base and a wire arrangement base, wherein the conversion base comprises a TTL level signal input port and an RS232 level signal output port, the TTL level signal input port is connected with the serial port output end of the batch aging microsystem module carrier board, and the RS232 level signal output port is connected with the auxiliary test board through the wire arrangement base. The automatic monitoring device for the microsystem module batch aging test has the advantages of low cost, high flexibility, strong expansibility and miniaturization.
Description
Technical Field
The utility model relates to the technical field of integrated circuit testing, in particular to an automatic monitoring device for a microsystem module batch aging test.
Background
The microsystem module has the advantages of outstanding performance, multiple functions, small occupied volume and the like, and is widely applied to modern electronic equipment. However, after the micro system module is manufactured, the performance of the micro system module needs to be evaluated and bottomed, the aging test is an indispensable test, and whether the designed micro system module is qualified or not can be detected by performing the aging test. The aging test is to make the micro system module to be tested work in a specific high temperature environment and record each operation state parameter in the working process. However, the aging test of the microsystem module generally takes a long time, a few tens of hours, and thousands of hours.
In the current aging test, the time of the aging test is too long, so that the record of the running state of the tester is a time-consuming, labor-consuming and error-prone matter. When the microsystem module is used for batch aging test, the recording difficulty of the testers can rise exponentially.
Disclosure of Invention
In order to solve the defects in the prior art, the utility model provides the automatic monitoring device for the batch aging test of the microsystem modules, which has the advantages of simple structure, low cost, strong flexibility, real-time automatic display and record of the running state and can be applied to the aging test of the microsystem modules with different requirements.
As a first aspect of the present utility model, an automatic monitoring device for a batch aging test of microsystem modules is provided, including a batch aging microsystem module carrier, a serial port level conversion board, an auxiliary test board, and an upper computer in a PC, where the batch aging microsystem module carrier is connected to the serial port level conversion board, the auxiliary test board is connected to the serial port level conversion board, and the upper computer is connected to the auxiliary test board; the serial port level conversion board comprises a conversion base and a wire arrangement base, wherein the conversion base comprises a TTL level signal input port and an RS232 level signal output port, the TTL level signal input port is connected with the serial port output end of the batch aging microsystem module carrier board, and the RS232 level signal output port is connected with the auxiliary test board through the wire arrangement base.
Further, microsystem modules to be subjected to the aging test are placed on the batch aging microsystem module carrier plate;
the batch aging microsystem module carrier plate can send the aging running state of the microsystem module to the auxiliary test board through the serial port level conversion board;
the auxiliary test board can integrate and analyze the received aging running state of the microsystem module, and send the analysis result of the aging running state of the microsystem module to an upper computer;
and the upper computer can analyze the received aging operation state analysis result of the microsystem module to obtain an aging test result of the microsystem module to be subjected to the aging test.
Further, the batch aging microsystem module carrier board is connected with the serial port level conversion board through a TTL signal line.
Further, the auxiliary test board is connected with the serial port level conversion board through an RS232 signal line.
Further, the upper computer is connected with the auxiliary test board through an RS232 signal line.
Further, the auxiliary test board comprises a main control unit, and the main control unit is an FPGA.
The automatic monitoring device for the microsystem module batch aging test has the following advantages: the serial port level conversion board, the auxiliary test board and the upper computer are added to the aging microsystem module carrier board, the auxiliary test board can analyze the running state data sent by the batch aging microsystem module and then send the running state data to the upper computer, the upper computer can receive and analyze the batch running state data sent by the auxiliary test board, the running state data can be displayed intuitively in real time, and the running state data can be stored after the test is finished for analysis and inspection of a designer; the number of the aging microsystem modules can be specifically expanded according to the designed serial port level conversion board, so that the flexibility and the expandability of the system are improved.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model, and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the description serve to explain, without limitation, the utility model.
Fig. 1 is a schematic structural diagram of an automatic monitoring device for batch aging test of microsystem modules according to the present utility model.
Fig. 2 is a schematic structural diagram of a serial port level conversion board provided by the present utility model.
Fig. 3 is a circuit diagram of a conversion base provided by the utility model.
Detailed Description
In order to further describe the technical means and effects adopted by the utility model to achieve the preset aim, the following is a detailed description of specific implementation, structure, characteristics and effects of an automatic monitoring device for batch aging test of microsystem modules according to the utility model with reference to the accompanying drawings and preferred embodiments. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe the embodiments of the utility model herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In the explanation of the present utility model, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly, unless otherwise indicated. For example, the connection may be a fixed connection, or may be a connection through a special interface, or may be an indirect connection via an intermediary. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In this embodiment, as shown in fig. 1-2, the automatic monitoring device for the batch aging test of the microsystem modules includes a batch aging microsystem module carrier, a serial port level conversion board, an auxiliary test board and an upper computer in a PC, where the batch aging microsystem module carrier is connected with the serial port level conversion board, the auxiliary test board is connected with the serial port level conversion board, and the upper computer is connected with the auxiliary test board; the serial port level conversion board comprises a conversion base and a wire arrangement base, wherein the conversion base comprises a TTL level signal input port and an RS232 level signal output port, the TTL level signal input port is connected with the serial port output end of the batch aging microsystem module carrier board, and the RS232 level signal output port is connected with the auxiliary test board through the wire arrangement base.
According to the automatic monitoring device for the batch aging test of the microsystem modules, the microsystem modules to be subjected to the aging test are placed on the batch tested microsystem module carrier plates, then communication connection is established between the upper computer and the auxiliary test board, and the upper computer can also receive the to-be-tested microsystem module test results fed back by the auxiliary test board, so that the aging function of the microsystem modules can be analyzed conveniently.
Specifically, microsystem modules to be subjected to aging tests are placed on the batch aging microsystem module carrier plate;
the batch aging microsystem module carrier plate can send the aging running state of the microsystem module to the auxiliary test board through the serial port level conversion board;
the auxiliary test board can integrate and analyze the received aging running state of the microsystem module, and send the analysis result of the aging running state of the microsystem module to an upper computer;
and the upper computer can analyze the received aging operation state analysis result of the microsystem module to obtain an aging test result of the microsystem module to be subjected to the aging test.
In this embodiment, the microsystem module for the aging test is placed in the batch aging microsystem module carrier, the batch aging microsystem module carrier is integrally placed in a required high-temperature environment to perform a test for a required length, and whether the microsystem module meets the aging test qualification condition or not is judged according to the test qualification condition during and after the test is finished, namely, the qualified microsystem module is screened out, and the saved test data can be independently analyzed, so that test data basis can be provided for later design microsystem modules, and the success rate of the design microsystem module is improved.
Because of the aging test of batch execution and automatic monitoring, each microsystem module needs to be numbered, one of the two methods is to solidify the number when solidifying the test program, when the test is started, the batch aging microsystem module carrier plate can directly send the microsystem module number and running state data to the auxiliary test board through the serial port level conversion board; and the other is that after the system is operated, the micro-system module number is sent to the batch aging micro-system module carrier plate through the upper computer, and the batch aging micro-system module carrier plate reports operation state data after receiving the micro-system module number. Since the microsystem module test program must have a curing step, the first method is chosen to determine the number of microsystem modules for convenience.
Specifically, the batch aging microsystem module carrier board is connected with the serial port level conversion board through a TTL signal line. The auxiliary test board is connected with the serial port level conversion board through an RS232 signal line. The upper computer is connected with the auxiliary test board through an RS232 signal line.
The system comprises a batch of tested microsystem module carrier plates, an auxiliary test board, a programmable power supply and a control module, wherein the batch of tested microsystem module carrier plates are electrically connected with the auxiliary test board, and the programmable power supply is used for providing working power for the batch of tested microsystem module carrier plates and the auxiliary test board.
It should be appreciated that when the programmable power supply is energized, the automatic monitoring device circuit enters a powered-on state after being energized, and starts to work from an initial state.
It can be understood that the communication between the auxiliary test board and the upper computer can be realized through a communication interface, so that the states of the microsystem modules of the n-channel to-be-aged test can be monitored in real time.
Preferably, the communication interface comprises an RS232 communication interface.
In this embodiment, the batch aging microsystem module carrier board is powered on and self-started, monitors its own running state at any time, and sends its own running state to the auxiliary test board through the serial port level conversion board via the RS232 interface.
Preferably, the auxiliary test board comprises a main control unit, and the main control unit is an FPGA. The auxiliary test board analyzes the running state data sent by the batch aging microsystem module carrier board, encapsulates the running state data into one or more packets of data packets with specific protocols, and sends the data packets to the upper computer for use. Because the auxiliary test boards need to simultaneously carry out batch serial port communication, in consideration of economy, practicability and flexibility, an FPGA is selected as a main control unit, and serial port control logic with the corresponding number of the batch aging microsystem module carrier boards is instantiated in the FPGA by utilizing the programmable characteristic of the FPGA logic.
In this embodiment, the upper computer analyzes and displays the received running state data of the batch aging microsystem module carrier board sent by the auxiliary test board. And the running state of the batch aging microsystem module carrier plate can be displayed and recorded in real time according to the set condition for judging whether the batch aging microsystem module carrier plate is qualified or not.
In this embodiment, the main control unit receives the running state data of the aging microsystem modules sent by the batch aging microsystem module carrier board, and integrates the state data and sends the integrated state data to the upper computer. The upper computer is started and automatically enters a receiving state, so that the running state of the microsystem module in the aging experiment can be automatically displayed in real time, and whether the microsystem module runs normally or not is monitored.
In this embodiment, as shown in fig. 2, the serial port level conversion board includes a conversion seat and a flat cable seat, the RS232 serial port signal wires of the batch aging microsystem module carrier board are constrained and fixed on the conversion seat, and the relationship between the number of conversion circuits in the conversion seat and the aging microsystem module carrier board is as follows:
in the formula (1), m represents the number of conversion circuits in the conversion seat, n represents the number of the aging microsystem module carrier plates, n is more than or equal to 1, and n is a natural number. The winding displacement seat is connected with the auxiliary test board, and the number of the winding displacement needles in the winding displacement seat is as follows:
m 1 ＝2n (2)
in the formula (2), m 1 Representing the number of pins in the pin header. n represents the number of the aging microsystem module carrier plates, n is more than or equal to 1, and n is a natural number. And the Pin-To-Pin in the conversion seat is directly connected with the Pin in the wire arrangement seat on the serial port level conversion plate.
In this embodiment, as shown in fig. 3, the conversion base is composed of a chip for converting TTL to RS232 level and a capacitor resistor configured correspondingly, and the main function is to convert TTL level to RS232 level.
It should be noted that, the process of performing the aging parameter analysis and sending the control command by the upper computer is well known to those skilled in the art, and will not be described herein.
In this embodiment, a test program for marking the serial number of the microsystem module is solidified in the batch aging microsystem module, the running state of the test program is sent to the auxiliary test board in real time through the serial port level conversion board via the RS232 interface, the auxiliary test board analyzes the running state data, and packages the running state data into one or more packets of data packets with a specific protocol to send to the upper computer, and the upper computer displays the running state of the batch aging microsystem module in real time.
The automatic monitoring device can realize synchronous test and monitoring of the aging running states of independent and batch microsystem modules, simplifies batch aging test structures by designing a serial port level conversion board and an auxiliary test module, gathers running state information to the serial port level conversion board through an RS232 interface, and then uniformly reports the running state information to an upper computer for display, storage and analysis through the auxiliary test module.
The working principle of the automatic monitoring device for the batch aging test of the microsystem modules provided by the utility model is described in the foregoing, and is not repeated here.
Therefore, the automatic monitoring device for the batch aging test of the microsystem modules provided by the utility model can automatically monitor the aging running state of the microsystem modules by only placing the microsystem modules on the batch tested microsystem module carrier plates through the power button without complex manual operation, thereby improving the operability and the working efficiency of the test. The automatic running state monitoring device can improve the testing efficiency of the microsystem module while realizing the automatic running state monitoring, and has the advantages of strong operability and accurate testing data.
The present utility model is not limited to the above-mentioned embodiments, but is intended to be limited to the following embodiments, and any modifications, equivalents and modifications can be made to the above-mentioned embodiments without departing from the scope of the utility model.
Claims (6)
1. The automatic monitoring device for the batch aging test of the microsystem modules is characterized by comprising a batch aging microsystem module carrier plate, a serial port level conversion plate, an auxiliary test board and an upper computer in a PC (personal computer), wherein the batch aging microsystem module carrier plate is connected with the serial port level conversion plate, the auxiliary test board is connected with the serial port level conversion plate, and the upper computer is connected with the auxiliary test board; the serial port level conversion board comprises a conversion base and a wire arrangement base, wherein the conversion base comprises a TTL level signal input port and an RS232 level signal output port, the TTL level signal input port is connected with the serial port output end of the batch aging microsystem module carrier board, and the RS232 level signal output port is connected with the auxiliary test board through the wire arrangement base.
2. The automatic monitoring device for batch aging test of microsystem modules according to claim 1, wherein microsystem modules to be subjected to the aging test are placed on a carrier plate of the batch aging microsystem modules;
the batch aging microsystem module carrier plate can send the aging running state of the microsystem module to the auxiliary test board through the serial port level conversion board;
the auxiliary test board can integrate and analyze the received aging running state of the microsystem module, and send the analysis result of the aging running state of the microsystem module to an upper computer;
and the upper computer can analyze the received aging operation state analysis result of the microsystem module to obtain an aging test result of the microsystem module to be subjected to the aging test.
3. The automatic monitoring device for batch aging tests of microsystem modules according to claim 1, wherein the batch aging microsystem module carrier is connected with the serial port level conversion board through a TTL signal line.
4. The automatic monitoring device for batch aging tests of microsystem modules according to claim 1, wherein the auxiliary test board is connected with the serial port level conversion board through an RS232 signal line.
5. The automatic monitoring device for batch aging tests of microsystem modules according to claim 1, wherein the upper computer is connected with the auxiliary test board through an RS232 signal line.
6. The automatic monitoring device for batch aging tests of microsystem modules according to claim 1, wherein the auxiliary test board comprises a main control unit, and the main control unit is an FPGA.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321321928.0U CN220691023U (en) | 2023-05-29 | 2023-05-29 | Automatic monitoring device for microsystem module batch aging test |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202321321928.0U CN220691023U (en) | 2023-05-29 | 2023-05-29 | Automatic monitoring device for microsystem module batch aging test |
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| CN220691023U true CN220691023U (en) | 2024-03-29 |
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| CN202321321928.0U Active CN220691023U (en) | 2023-05-29 | 2023-05-29 | Automatic monitoring device for microsystem module batch aging test |
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