CN220652016U - Bicolor temperature forward COB light source - Google Patents
Bicolor temperature forward COB light source Download PDFInfo
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- CN220652016U CN220652016U CN202322335733.8U CN202322335733U CN220652016U CN 220652016 U CN220652016 U CN 220652016U CN 202322335733 U CN202322335733 U CN 202322335733U CN 220652016 U CN220652016 U CN 220652016U
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- cold light
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- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 230000009977 dual effect Effects 0.000 claims 7
- 230000000694 effects Effects 0.000 abstract description 10
- 238000005286 illumination Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000004383 yellowing Methods 0.000 abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The utility model relates to the technical field of intelligent illumination, and particularly discloses a dual-color temperature forward-mounted COB light source which comprises a COB substrate, wherein a warm light positive electrode pad, a cold light positive electrode pad, a warm light negative electrode pad, a cold light negative electrode pad, a plurality of warm light chip sets which are sequentially connected and a plurality of cold light chip sets which are sequentially connected are arranged on the COB substrate, the warm light chip sets are respectively and electrically connected with the warm light positive electrode pad and the warm light negative electrode pad, and the cold light chip sets are respectively and electrically connected with the cold light positive electrode pad and the cold light negative electrode pad. According to the utility model, through unique circuit layout, the chips are uniformly distributed in a mosaic mode, so that light spots irradiated by the lenses are uniform and free from variegation, yellowing and blushing are avoided, the light spot effect is good, the chips are tightly distributed, the space can be saved, and the manufacturing cost is reduced.
Description
Technical Field
The utility model relates to the technical field of intelligent illumination, in particular to a bicolor temperature forward-mounted COB light source.
Background
The illumination and the light, the climate and the space are perfectly integrated due to the illumination or the illumination based on the artificial book, thereby meeting the individual demands of the personnel in the special environment. Therefore, the artificial illumination has special significance for the striding of the illumination field. Office area and office lighting designed according to specific work and activities significantly improves the creativity and work efficiency of staff. People can more easily concentrate attention under good visual conditions, and pleasant dwellings and lamplight atmosphere can also improve the happiness and enthusiasm of people. On the premise of improving the performance of the prior two-color COB light source, the product is designed. COB (Chip on Board) packages, in which COB light sources generally include a substrate on which a light emitting region, a cold light positive electrode pad, a cold light negative electrode pad, a warm light positive electrode pad, a warm light negative electrode pad, and conductive lines are disposed; COB light sources are widely used in terms of long life, no pollution, high light efficiency, etc. However, the traditional COB light source adopts a dual-color temperature luminous area which is symmetrically distributed on the patch support or adopts a hemispherical transparent sealing glue for molding which is formed by alternately distributing dual-color temperature lamp beads on the patch support along the center circumference of the patch support, so that even color mixing can not be realized when the COB light source is applied to an optical device, and the phenomena of yellowing, blushing, color mixing and poor effect occur on light spots.
Disclosure of Invention
The technical problems to be solved by the utility model are that aiming at the defects in the prior art, the dual-color temperature forward-mounted COB light source is provided, the technical problems that the existing COB light source cannot achieve uniform color mixing, light spots are yellowing and bluish and have poor effect and the like are solved, through unique circuit layout, the chips are uniformly distributed in a mosaic manner, so that the light spots irradiated by the lenses are uniform and free of bluish, the condition of yellowing and bluish is avoided, the light spot effect is good, the chip distribution is compact, the space can be saved, and the manufacturing cost is reduced.
In order to solve the technical problems, the technical scheme of the utility model is as follows:
the utility model provides a double-colored temperature just adorns COB light source, includes the COB base plate, be provided with warm light positive pad, cold light positive pad, warm light negative pole pad, cold light negative pole pad, a plurality of warm light chipset that connects gradually, a plurality of cold light chipset that connects gradually on the COB base plate, warm light chipset respectively with warm light positive pad and warm light negative pole pad electric connection, cold light chipset respectively with cold light positive pad and cold light negative pole pad electric connection.
Preferably, the warm light chip set comprises a plurality of warm light chips, and each warm light chip is connected through gold wires; the cold light chip set comprises a plurality of cold light chips, and each cold light chip is connected through gold wires.
Preferably, the warm light chips and the cold light chips are longitudinally distributed at intervals in sequence, and the longitudinal column number is 5.
Preferably, the COB substrate is covered with a fluorescent glue layer, the cross section of the fluorescent glue layer is circular, and the warm light chip and the cold light chip are both located below the fluorescent glue layer.
Preferably, the light emitting surface of the COB substrate is circular, and the diameter of the light emitting surface is smaller than 14mm.
Preferably, the warm light chip and the cold light chip sequentially form a first column of chip set, a second column of chip set, a third column of chip set, a fourth column of chip set and a fifth column of chip set, and the second column of chip set and the fourth column of chip set, the first column of chip set and the fifth column of chip set are sequentially and mutually symmetrically arranged on the left side and the right side of the third column of chip set.
Preferably, the longitudinal arrangement of the first column of chip sets is sequentially configured as 1 warm light chip, 2 cold light chips, 1 warm light chip, 2 cold light chips and 1 warm light chip; the second array of chip sets is vertically arranged and is set up into 1 warm light chip, 2 cold light chips, 2 warm light chips, 1 cold light chip, 2 warm light chips, 2 cold light chips and 1 warm light chip in proper order.
Preferably, the longitudinal arrangement of the third column of chip sets is sequentially configured as 1 cold light chip, 2 warm light chips, 2 cold light chips, 2 warm light chips and 1 cold light chip.
By adopting the technical scheme, the bicolor temperature forward-mounted COB light source provided by the utility model has the following beneficial effects: the COB substrate in the dual-color temperature forward-mounted COB light source is provided with a warm light positive electrode pad, a cold light positive electrode pad, a warm light negative electrode pad, a cold light negative electrode pad, a plurality of warm light chip sets which are sequentially connected and a plurality of cold light chip sets which are sequentially connected, wherein the warm light chip sets are respectively electrically connected with the warm light positive electrode pad and the warm light negative electrode pad, the cold light chip sets are respectively electrically connected with the cold light positive electrode pad and the cold light negative electrode pad, and the cold light chip sets and the warm light chip sets are uniformly distributed in a mosaic manner through unique circuit layout, so that light spots irradiated by lenses are uniform and free of variegation, yellowing and blue-turning are avoided, the light spot effect is good, and the user experience effect is good; and the chips are closely distributed, so that the space can be saved, the manufacturing cost is reduced, and the manufacturing cost is lower.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
in the figure, a 1-COB substrate, a 2-warm light positive electrode pad, a 3-cold light positive electrode pad, a 4-warm light negative electrode pad, a 5-cold light negative electrode pad, a 6-warm light chip, a 7-cold light chip and an 8-fluorescent glue layer are arranged.
Detailed Description
The following describes the embodiments of the present utility model further with reference to the drawings. The description of these embodiments is provided to assist understanding of the present utility model, but is not intended to limit the present utility model. In addition, the technical features of the embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
As shown in fig. 1, in the structural schematic diagram of the present utility model, the dual-color temperature positive-mounting COB light source comprises a COB substrate 1, wherein a warm light positive electrode pad 2, a cold light positive electrode pad 3, a warm light negative electrode pad 4, a cold light negative electrode pad 5, a plurality of warm light chipsets sequentially connected and a plurality of cold light chipsets sequentially connected are arranged on the COB substrate 1, the warm light chipsets are respectively and electrically connected with the warm light positive electrode pad 2 and the warm light negative electrode pad 4, and the cold light chipsets are respectively and electrically connected with the cold light positive electrode pad 3 and the cold light negative electrode pad 5. It can be understood that the aluminum substrate 1 is square, the cross section of the aluminum substrate 1 can be square, rectangular or the like, the warm light positive electrode pad 2, the cold light positive electrode pad 3, the warm light negative electrode pad 4, the cold light negative electrode pad 5, the warm light chipset and the cold light chipset are all welded on the aluminum substrate 1, and can be used for accessing an external power supply, and the aluminum substrate 1 can be a universal PCB circuit board or the like, an aluminum light source substrate or the like.
Specifically, the warm light chip set comprises a plurality of warm light chips 6, and each warm light chip 6 is connected through gold wires; the cold light chip set comprises a plurality of cold light chips 7, and each cold light chip 7 is connected through gold wires; the warm light chips 6 and the cold light chips 7 are longitudinally distributed at intervals in sequence, and the longitudinal columns are 5 columns; the COB substrate 1 is covered with a fluorescent glue layer 8, the cross section of the fluorescent glue layer 8 is round, and the warm light chip 6 and the cold light chip 7 are both positioned below the fluorescent glue layer 8; the warm light positive electrode bonding pad 2 and the cold light positive electrode bonding pad 3 are both positioned at the left upper corner of the COB substrate 1, and the warm light negative electrode bonding pad 4 and the cold light negative electrode bonding pad 5 are both positioned at the right lower corner of the COB substrate 1; the warm light positive electrode bonding pad 2 and the warm light negative electrode bonding pad 4 are symmetrically arranged by taking the diagonal line of the COB substrate 1 as a symmetry axis, and the cold light positive electrode bonding pad 3 and the cold light negative electrode bonding pad 5 are symmetrically arranged by taking the diagonal line of the COB substrate 1 as a symmetry axis. It will be appreciated that the number of the warm light positive electrode pad 2, the cold light positive electrode pad 3, the warm light negative electrode pad 4 and the cold light negative electrode pad 5 can be set according to the requirement, and the utility model is not limited thereto.
Specifically, the light emitting surface of the COB substrate is circular, and the diameter of the light emitting surface is smaller than 14mm; the warm light chip and the cold light chip sequentially form a first column of chip set, a second column of chip set, a third column of chip set, a fourth column of chip set and a fifth column of chip set, and the second column of chip set and the fourth chip set, the first column of chip set and the fifth column of chip set are sequentially and mutually symmetrically arranged at the left side and the right side of the third column of chip set; the longitudinal arrangement of the first array of chip sets is sequentially provided with 1 warm light chip, 2 cold light chips, 1 warm light chip, 2 cold light chips and 1 warm light chip; the second array of chip sets is sequentially arranged into 1 warm light chip, 2 cold light chips, 2 warm light chips, 1 cold light chip, 2 warm light chips, 2 cold light chips and 1 warm light chip; the third array of chips is arranged in the longitudinal direction and is sequentially provided with 1 cold light chip, 2 warm light chips, 2 cold light chips, 2 warm light chips and 1 cold light chip. It can be understood that the positions of the warm light chip and the cold light chip can be exchanged, which is favorable for the combination arrangement of multiple wavelengths; through the arrangement mode, the COB light source can be ensured to obtain a good light spot effect, and the chip arrangement space is saved.
It can be understood that the utility model has reasonable design and unique structure, and the cold light chip group and the warm light chip group are uniformly distributed by adopting mosaic through unique circuit layout, so that the light spots irradiated by the lens are uniform and free from variegation, the condition of yellowing and blue-turning can not occur, the light spot effect is good, and the user experience effect is good; and the chips are closely distributed, so that the space can be saved, the manufacturing cost is reduced, and the manufacturing cost is lower.
The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings, but the present utility model is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the utility model, and yet fall within the scope of the utility model.
Claims (8)
1. The utility model provides a double-colored temperature normal dress COB light source, includes COB base plate, its characterized in that: the COB substrate is provided with a warm light positive electrode bonding pad, a cold light positive electrode bonding pad, a warm light negative electrode bonding pad, a cold light negative electrode bonding pad, a plurality of warm light chip sets which are sequentially connected and a plurality of cold light chip sets which are sequentially connected, wherein the warm light chip sets are respectively electrically connected with the warm light positive electrode bonding pad and the warm light negative electrode bonding pad, and the cold light chip sets are respectively electrically connected with the cold light positive electrode bonding pad and the cold light negative electrode bonding pad.
2. The dual color temperature front-mounted COB light source of claim 1, characterized in that: the warm light chip set comprises a plurality of warm light chips, and each warm light chip is connected through gold wires; the cold light chip set comprises a plurality of cold light chips, and each cold light chip is connected through gold wires.
3. The dual color temperature front-mounted COB light source of claim 2, characterized in that: the warm light chips and the cold light chips are longitudinally distributed alternately in sequence, and the longitudinal columns are 5.
4. The dual color temperature front-mounted COB light source of claim 2, characterized in that: the COB substrate is covered with a fluorescent glue layer, the cross section of the fluorescent glue layer is circular, and the warm light chip and the cold light chip are both positioned below the fluorescent glue layer.
5. The dual color temperature front-mounted COB light source of claim 1, characterized in that: the light-emitting surface of the COB substrate is circular, and the diameter of the light-emitting surface is smaller than 14mm.
6. The dual color temperature front-mounted COB light source of claim 1, characterized in that: the warm light chip and the cold light chip sequentially form a first column of chip set, a second column of chip set, a third column of chip set, a fourth column of chip set and a fifth column of chip set, and the second column of chip set and the fourth column of chip set as well as the first column of chip set and the fifth column of chip set are sequentially and mutually symmetrically arranged on the left side and the right side of the third column of chip set.
7. The dual color temperature front-mounted COB light source of claim 6, wherein: the longitudinal arrangement of the first column of chip sets is sequentially provided with 1 warm light chip, 2 cold light chips, 1 warm light chip, 2 cold light chips and 1 warm light chip; the second array of chip sets is vertically arranged and is set up into 1 warm light chip, 2 cold light chips, 2 warm light chips, 1 cold light chip, 2 warm light chips, 2 cold light chips and 1 warm light chip in proper order.
8. The dual color temperature front-mounted COB light source of claim 6, wherein: the third column of the chip sets is longitudinally arranged into 1 cold light chip, 2 warm light chips, 2 cold light chips, 2 warm light chips and 1 cold light chip in sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322335733.8U CN220652016U (en) | 2023-08-29 | 2023-08-29 | Bicolor temperature forward COB light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322335733.8U CN220652016U (en) | 2023-08-29 | 2023-08-29 | Bicolor temperature forward COB light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220652016U true CN220652016U (en) | 2024-03-22 |
Family
ID=90285552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322335733.8U Active CN220652016U (en) | 2023-08-29 | 2023-08-29 | Bicolor temperature forward COB light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220652016U (en) |
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2023
- 2023-08-29 CN CN202322335733.8U patent/CN220652016U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 529000 Zone C, third floor, building 3, No. 121, jiangmu Road, Jianghai District, Jiangmen City, Guangdong Province Patentee after: Jiangmen Laike Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 529000, Room 2603, Building 2, Waihai Longxi New City, Jianghai District, Jiangmen City, Guangdong Province Patentee before: Jiangmen Laike Semiconductor Technology Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |