CN220651208U

CN220651208U - Computer CPU heat abstractor

Info

Publication number: CN220651208U
Application number: CN202320333000.8U
Authority: CN
Inventors: 卓淑萍; 邓国明; 朱莺莺
Original assignee: Individual
Current assignee: Individual
Priority date: 2023-02-28
Filing date: 2023-02-28
Publication date: 2024-03-22
Anticipated expiration: 2033-02-28

Abstract

The utility model discloses a computer CPU heat dissipation device, which relates to the technical field of CPU heat dissipation structures and comprises a mounting seat, a heat dissipation plate and a connecting component, wherein the mounting seat is detachably arranged on the surface of a main board, the bottom of the heat dissipation plate is fixedly provided with a heat collection seat, the bottom surface of the heat collection seat is attached to the top surface of the CPU, the connecting component comprises an inserting groove formed in the outer wall of the top surface of the mounting seat, the outer wall of the heat dissipation plate is fixedly provided with a mounting plate, the bottom surface of the mounting plate is fixedly provided with a connecting column which is in sliding attachment with the inner wall of the inserting groove, the side wall of the inserting groove is provided with a guide groove, the inner wall of the guide groove is elastically provided with a sliding block, the side wall of one end of the sliding block, which is close to the inserting groove, is fixedly provided with a clamping groove for the clamping block to be inserted. The heat dissipation plate can be conveniently installed and disassembled through the cooperation of the devices, so that the time consumed by the heat dissipation plate in installation and disassembly cleaning is less, and meanwhile, the fingers are prevented from being scratched as much as possible.

Description

Computer CPU heat abstractor

Technical Field

The utility model relates to the technical field of CPU heat dissipation structures, in particular to a computer CPU heat dissipation device.

Background

A Central Processing Unit (CPU), which is one of the main devices of an electronic computer, is a core component in the computer. Its function is mainly to interpret computer instructions and process data in computer software. The CPU is a core component in the computer responsible for reading instructions, decoding the instructions and executing the instructions. The CPU mainly comprises two parts, namely a controller and an arithmetic unit, and also comprises a cache memory and a bus for realizing data and control of the connection between the cache memory and the cache memory. The three main core components of the electronic computer are CPU, internal memory and input/output device. The central processing unit mainly processes instructions, performs operations, controls time, and processes data.

When the CPU works, a large amount of heat is generated, if the heat is not timely emitted, the CPU is crashed, and if the heat is heavy, the CPU is burnt out, so that a CPU heat dissipation device is needed to dissipate the heat of the CPU, and the heat radiator plays a decisive role in the stable operation of the CPU.

The existing buckle type radiator is installed through buckles and fixing seats on two sides of the radiator in a clamping mode, so that the radiator is installed on a CPU, but the buckle on one side needs to be clamped with the fixing seats firstly in the installation process of the buckle type radiator, then the buckle on the other side needs to be pressed by force, so that the radiator can be installed very inconvenient, when the service life of the radiator is long, the buckle can be pulled open after the buckle connection part needs to be pressed downwards by force, fingers can be scratched, and unnecessary damage is caused.

Disclosure of Invention

The utility model mainly aims to provide a computer CPU heat dissipation device which can effectively solve the problems in the background technology.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: the utility model provides a computer CPU heat abstractor, includes mount pad, heating panel and coupling assembling, and mount pad detachable installs the surface at the mainboard, and the bottom fixed mounting of heating panel has the heat collection seat, and the bottom surface of heat collection seat is laminated with the top surface of CPU.

The connecting assembly comprises a plug groove formed in the outer wall of the top surface of the mounting seat, a mounting plate is fixed on the outer wall of the heat dissipation plate, a connecting column in sliding fit with the inner wall of the plug groove is fixedly mounted on the bottom surface of the mounting plate, a guide groove is formed in the side wall of the plug groove, a sliding block is elastically arranged on the inner wall of the guide groove, a clamping block is fixed on the side wall of one end of the sliding block, which is close to the plug groove, a clamping groove for the clamping block to plug is formed in the outer wall of the bottom of the connecting column, and the clamping block is bent and arranged close to the outer wall of one end of the clamping groove.

The sliding tray is offered to the top surface of guide slot, and the top surface middle part fixed mounting of sliding block has the control post, and the inside of sliding tray is extended to the one end of control post.

Further, the width of the clamping groove is not smaller than that of the clamping block, and the clamping groove is of a semicircular structure.

Further, the mounting panel and the spliced pole are provided with a plurality of, and a plurality of spliced poles are along the annular equidistance in middle part of heating panel distribution.

Further, the inserting grooves are formed in a plurality of, and the inserting grooves are distributed in an annular mode at equal intervals along the middle of the mounting seat.

Further, the outer wall of the connecting column is in sliding fit with the inner wall of the sliding groove, and the width of the guide groove is not smaller than that of the sliding groove.

Further, a plurality of cooling fins are fixedly arranged on the top surface of the cooling plate, the cooling fins are distributed at equal intervals along the annular middle part of the cooling plate, the cooling fins are fixedly connected with the heat collecting seat through copper pipes, and a fan is rotatably arranged on the top surface of the cooling plate.

Compared with the prior art, the utility model has the following beneficial effects:

according to the utility model, the heat-dissipating plate can be fixed on the top surface of the mounting seat by sliding and attaching the connecting column to the inner wall of the inserting groove and utilizing the clamping connection of the clamping connection block with the clamping connection groove when the spring releases elastic potential energy, and the heat-collecting seat at the bottom of the heat-dissipating plate is attached to the outer wall of the CPU, so that the heat-dissipating plate is more convenient to mount, and when the heat-dissipating plate is dismounted, the control column is pushed reversely to drive the sliding block to slide reversely and separate the clamping connection block from the inner wall of the clamping connection groove, and the heat-dissipating plate is pulled upwards to drive the heat-dissipating plate to separate from the mounting seat, so that the dismounting and cleaning processes of the heat-dissipating plate are more convenient.

Drawings

FIG. 1 is a schematic view of a heat dissipating plate according to the present utility model;

FIG. 2 is a schematic view of a mounting base of the present utility model;

FIG. 3 is a schematic view of a slider of the present utility model;

fig. 4 is a schematic view of a heat collecting base of the present utility model.

In the figure: 1. a mounting base; 2. a heat dissipation plate; 3. a heat sink; 4. a fan; 5. a mounting plate; 6. a guide groove; 7. a sliding block; 8. a clamping block; 9. a control column; 10. a connecting column; 11. a clamping groove; 12. and a heat collection seat.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-4, the utility model discloses a heat dissipating device for a CPU of a computer, which comprises a mounting base 1, a heat dissipating plate 2 and a connecting assembly, wherein the mounting base 1 is detachably mounted on the surface of a motherboard, a heat collecting base 12 is fixedly mounted at the bottom of the heat dissipating plate 2, the bottom surface of the heat collecting base 12 is attached to the top surface of the CPU, and after the heat collecting base 12 is attached to the CPU, heat generated by the CPU in the use process is absorbed by the heat collecting base 12.

The coupling assembling is including seting up the spliced groove at 1 top surface outer wall of mount pad, the outer wall of heating panel 2 is fixed with mounting panel 5, the bottom surface fixed mounting of mounting panel 5 has the spliced pole 10 of laminating with spliced groove inner wall slip, guide way 6 has been seted up to the lateral wall of spliced groove, the inner wall elasticity of guide way 6 is provided with slider 7, slider 7 slidable mounting is in the inside of guide way 6, fixedly connected with spring between the one end lateral wall of slider 7 and the inner wall of guide way 6, slider 7 is close to the one end lateral wall of spliced groove and is fixed with joint piece 8, joint groove 11 that supplies joint piece 8 to peg graft has been seted up to the bottom outer wall of spliced pole 10, joint piece 8 is close to the one end outer wall bending setting of joint groove 11.

The sliding tray is offered to the top surface of guide slot 6, and the top surface middle part fixed mounting of sliding block 7 has control post 9, and the inside of sliding tray is extended to the one end of control post 9.

When the heat radiation plate 2 is installed to enable the bottom surface of the heat collection seat 12 to be attached to the outer wall of the top surface of the CPU, the control column 9 is pushed reversely to drive the sliding block 7 to slide reversely on the inner wall of the guide groove 6, the connecting column 10 is inserted into the inserting groove, after the clamping block 8 is aligned with the clamping groove 11, the sliding block 7 can be reset when the spring releases elastic potential energy by loosening the control column 9, the clamping block 8 on the side wall of the sliding block is driven to be clamped with the inner wall of the clamping groove 11, and therefore the connecting column 10 and the heat radiation plate 2 can be fixed, and the heat radiation plate 2 is more convenient to install and fix.

When dismantling the clearance to heating panel 2, can drive sliding block 7 at the inner wall reverse slip of guide way 6 through reverse promotion control post 9 to drive joint piece 8 and the inner wall separation of joint groove 11, then can follow spliced pole 10 and take out inside the spliced groove, make heating panel 2 and mount pad 1 separation, and then make heating panel 2 spent time and energy less when dismantling the clearance, it is more convenient simultaneously.

The outer wall that the bending set up can make things convenient for the sliding connection process of joint piece 8 and joint groove 11 for joint piece 8 is more convenient with joint groove 11's connection.

The width of the clamping groove 11 is not smaller than the width of the clamping block 8, the clamping groove 11 is of a semicircular structure, and when the width of the clamping groove 11 is larger than the width of the clamping block 8, the clamping block 8 can be clamped with the inner wall of the clamping groove 11 when the sliding block 7 resets.

Mounting panel 5 and spliced pole 10 are provided with a plurality ofly, and a plurality of spliced poles 10 are along the annular equidistance in middle part of heating panel 2 and distribute, and the spliced groove is provided with a plurality ofly, and a plurality of spliced grooves are along the annular equidistance in middle part of mount pad 1 and distribute, and a plurality of spliced poles 10, mounting panel 5 and spliced groove's setting can be fixed the different positions of heating panel 2 respectively for the laminating of the outer wall of CPU that heat collection seat 12 bottom surface different positions homoenergetic is better, thereby makes heat collection seat 12 to the produced heat absorption effect of CPU in the use better.

The outer wall of spliced pole 10 and the inner wall slip laminating of sliding tray, the width of guide way 6 is not less than the width of sliding tray, and the width of guide way 6 is greater than the width of sliding tray can avoid control post 9 to drop from the sliding tray in the use, utilizes control post 9 to inject the direction of movement of sliding block 7 simultaneously for sliding block 7 only can follow the direction of sliding tray and carry out the removal process.

The top surface fixed mounting of heating panel 2 has a plurality of fin 3, and a plurality of fin 3 are distributed along the middle part annular equidistance of heating panel 2, and a plurality of fin 3 pass through copper pipe and heat collection seat 12 fixed connection, and fan 4 is installed in the top surface rotation of heating panel 2, utilizes the copper pipe can collect the transmission of heat by heat collection seat 12 to dispel through the rotation of fin 3 and fan 4, thereby accomplish the heat dissipation process of CPU.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A computer CPU heat dissipating double-fuselage, characterized by that: the heat-collecting device comprises a mounting seat (1), a heat-radiating plate (2) and a connecting assembly, wherein the mounting seat (1) is detachably arranged on the surface of a main board, a heat-collecting seat (12) is fixedly arranged at the bottom of the heat-radiating plate (2), and the bottom surface of the heat-collecting seat (12) is attached to the top surface of a CPU;

the connecting assembly comprises a plug-in groove formed in the outer wall of the top surface of the mounting seat (1), a mounting plate (5) is fixed on the outer wall of the heat dissipation plate (2), a connecting column (10) which is in sliding fit with the inner wall of the plug-in groove is fixedly mounted on the bottom surface of the mounting plate (5), a guide groove (6) is formed in the side wall of the plug-in groove, a sliding block (7) is elastically arranged on the inner wall of the guide groove (6), a clamping block (8) is fixedly arranged on the side wall of one end, close to the plug-in groove, of the sliding block (7), a clamping groove (11) for the clamping block (8) to be spliced is formed in the outer wall of the bottom of the connecting column (10), and one end, close to the clamping groove (11), of the clamping block (8) is bent;

the top surface of guide slot (6) has seted up the sliding tray, the top surface middle part fixed mounting of sliding block (7) has control post (9), the inside of sliding tray is extended to the one end of control post (9).

2. A computer CPU heat sink as claimed in claim 1, wherein: the width of the clamping groove (11) is not smaller than that of the clamping block (8), and the clamping groove (11) is of a semicircular structure.

3. A computer CPU heat sink as claimed in claim 1, wherein: the mounting plate (5) and the connecting columns (10) are arranged in a plurality, and the connecting columns (10) are distributed at equal intervals along the middle annular shape of the heat dissipation plate (2).

4. A computer CPU heat sink as claimed in claim 3, wherein: the plug grooves are arranged in a plurality, and the plug grooves are distributed in an annular equidistant manner along the middle part of the mounting seat (1).

5. A computer CPU heat sink as claimed in claim 4 wherein: the outer wall of the connecting column (10) is in sliding fit with the inner wall of the sliding groove, and the width of the guide groove (6) is not smaller than the width of the sliding groove.

6. A computer CPU heat sink as claimed in claim 1, wherein: the heat dissipation plate is characterized in that a plurality of heat dissipation fins (3) are fixedly arranged on the top surface of the heat dissipation plate (2), the heat dissipation fins (3) are distributed at equal intervals along the middle annular shape of the heat dissipation plate (2), the heat dissipation fins (3) are fixedly connected with the heat collection seat (12) through copper pipes, and a fan (4) is rotatably arranged on the top surface of the heat dissipation plate (2).