CN220626590U - Test fixture for patch integrated circuit - Google Patents

Abstract

The utility model relates to the technical field of integrated circuits, in particular to a testing tool for a patch integrated circuit, which comprises a base, wherein butt joint interfaces are arranged on two sides of the base and are electrically connected with a testing instrument, and the testing tool also comprises a buckling groove, and the buckling groove and the integrated circuit patch have the same size; the butt joint contacts are arranged at the notch positions of the buckling grooves, are respectively and electrically connected with the butt joint interfaces at the two sides of the base, and are electrically butt-jointed with the butt joint contacts when the integrated circuit patch is buckled into the buckling grooves; the ejection mechanism is arranged in the buckling groove, the patch integrated circuit is tested by the test fixture, the patch circuit board can be abutted against the test instrument and tested through the butt joint contact only by placing the patch circuit board into the buckling groove with the corresponding model, the traditional mode that the contact of the test instrument is respectively abutted against the pins of the patch circuit board is abandoned, the detection efficiency is effectively improved, and the detection personnel do not need to contact the test contact with the pins at the cost of energy, so that the fatigue of the personnel is effectively avoided, and the detection efficiency is further ensured.

Description

Test fixture for patch integrated circuit

Technical Field

The utility model relates to the technical field of integrated circuits, in particular to a testing tool for a patch integrated circuit.

Background

The integrated circuit board is manufactured by adopting a semiconductor manufacturing process, a plurality of components such as transistors, resistors, capacitors and the like are manufactured on a small monocrystalline silicon wafer, and the components are combined into a complete electronic circuit according to a multilayer wiring or tunnel wiring method, but because the integrated circuit board is small and thin, the integrated circuit board cannot be automatically tested in the production and processing process, and generally, a tester holds the end head of a testing instrument to manually contact and test the integrated circuit, the efficiency is low, the effort is seriously consumed, and the tester is easy to fatigue and further influences the testing efficiency.

Disclosure of Invention

One technical problem to be solved by the present application is: how to improve the efficiency of the patch type integrated circuit board during manual detection.

For solving the technical problem, the embodiment of the application provides a test fixture for a patch integrated circuit, which comprises a base, wherein butt joint interfaces are arranged on two sides of the base, so as to be electrically connected with a test instrument, and the test fixture further comprises:

the size of the buckling groove is the same as that of the integrated circuit patch;

the butt joint contacts are arranged at the notch positions of the buckling grooves, are respectively and electrically connected with the butt joint interfaces at the two sides of the base, and are electrically butt-jointed with the butt joint contacts when the integrated circuit patch is buckled into the buckling grooves;

the ejection mechanism is arranged in the buckling groove, and pushes the ejection mechanism to store force when the integrated circuit patch is buckled in the buckling groove, so that the integrated circuit patch can be automatically ejected after the test is finished.

In some embodiments, the ejection mechanism comprises a top plate, the top plate is slidably arranged in the buckling groove, guide rail grooves are formed in the inner walls of the two sides of the buckling groove, and guide rail sliding blocks extending into the guide rail grooves are arranged on the two sides of the top plate;

and an elastic piece is further arranged between the top plate and the inner wall of the buckling groove, and the elastic piece stores energy when the integrated circuit patch extrudes the top plate to press down.

In some embodiments, the elastic member includes a first magnet embedded on the inner walls of the top plate and the buckling groove, and the poles of the opposite faces of the first magnet are the same.

In some embodiments, the base comprises a bottom frame and a buckle plate, the buckle groove is arranged on the buckle plate, the butt joint interface is arranged on the bottom frame, and the buckle plate is buckled on the bottom frame and electrically connected.

In some embodiments, the bottom frame and the buckle plate are embedded with a second magnet, and the two opposite poles of the magnet are opposite.

The utility model has at least the following beneficial effects:

compared with the prior art, through the design of base, catching groove and butt joint, the utility model provides a test fixture of paster type integrated circuit board, when the test, only need put into the catching groove of corresponding model with the paster circuit board, can dock paster circuit board and test instrument through the butt joint contact and accomplish the test, the mode of traditional butt joint with the contact of test instrument respectively with the pin of paster circuit board comes the test has been abandoned, effectively improved detection efficiency, and the inspector need not to expend energy again and contact test contact and pin, effectively avoid personnel tired, with further assurance detection efficiency.

Drawings

FIG. 1 is a schematic view of the overall structure of embodiment 1 of the present utility model;

FIG. 2 is a schematic view of the partially exploded construction of FIG. 1 according to the present utility model;

FIG. 3 is a schematic overall structure of embodiment 2 of the present utility model;

FIG. 4 is a schematic view of the buckle plate of the present utility model;

FIG. 5 is a schematic diagram of the structure of the buckle slot of different types according to the present utility model.

In the figure: 1-a base; 11-a bottom frame; 12-pinch plates; 13-magnet II; 2-a buckling groove; 3-a pair of contact points; 4-an ejection mechanism; 41-top plate; 42-a guide rail groove; 43-a guide rail slide block; 44-magnet one.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

Referring to fig. 1-2, the present utility model provides a technical solution: the utility model provides a paster integrated circuit is with test fixture, includes base 1, and base 1 both sides are provided with the butt joint interface to with test instrument electric connection, still include:

the size of the buckling groove 2 is the same as that of the integrated circuit patch;

the butt-joint contacts 3 are arranged at the notch positions of the buckling grooves 2, are respectively and electrically connected with the butt-joint interfaces at the two sides of the base 1, and are electrically butt-jointed with the butt-joint contacts 3 when the integrated circuit patch is buckled into the buckling grooves 2;

the ejection mechanism 4 is arranged in the buckling groove 2, and pushes the ejection mechanism 4 to store force when the integrated circuit patch is buckled in the buckling groove 2, so that the integrated circuit patch can be automatically ejected after the test is finished.

Through the above-mentioned characteristic combination, when testing the paster integrated circuit board like this, only need detain paster integrated circuit board into catching groove 2, this in-process, the pin of paster integrated circuit board is automatic with contact 3, with electric conduction, and the butt joint interface electric connection of contact 3 and base 1, and the butt joint interface direct electric connection detecting instrument again, therefore, in the in-process that the paster integrated circuit detained catching groove 2, automatic and detecting instrument electric butt joint, and accomplish the test, and in-process ejection mechanism 4 is pressed and is held the power, and need note that the paster integrated circuit board need be continuously pressed in catching groove 2 until accomplishing the detection, and after the detection is accomplished, cancel the pressing of paster dust collection circuit board, ejection mechanism 4 is automatic with paster integrated circuit board ejecting this moment, remove can, in order to make things convenient for continuous detection to use.

It should be noted that, for the above-mentioned characteristic ejection mechanism 4, as a technical means, the ejection mechanism includes a top plate 41, the top plate 41 is slidably disposed in the buckling groove 2, guide rail grooves 42 are formed on inner walls of two sides of the buckling groove 2, and guide rail sliding blocks 43 extending into the guide rail grooves 42 are disposed on two sides of the top plate 41;

and still be provided with the elastic component between roof 41 and catching groove 2 inner wall, the elastic component is including inlaying the magnet one 44 of establishing on roof 41 and catching groove 2 inner wall respectively, and magnet one 44 is the same with the face magnetic pole relatively, utilize magnetic repulsion to order about roof 41 to keep the notch position at catching groove 2 under the normal condition promptly, when detaining the paster type integrated circuit board this moment, extrusion roof 41 pushes down, utilize magnetic repulsion to carry out the energy storage simultaneously, and when loosening the paster type integrated circuit board, utilize the mutual exclusion magnetic force of magnet in order to push up the roof with it ejecting voluntarily, make things convenient for the separation of paster type integrated circuit board and catching groove 2, thereby make things convenient for continuous detection to use.

Example 2

Referring to fig. 3-5, on the basis of the above embodiment 1, unlike embodiment 1, another technical solution is provided herein: the base 1 comprises a bottom frame 11 and a buckle plate 12, the buckle grooves 2 are formed in the buckle plate 12, butt joint interfaces are formed in the bottom frame 11, the buckle plate 12 is buckled on the bottom frame 11 and is electrically connected, magnets II 13 are embedded in the bottom frame 11 and the buckle plate 12, the magnetic poles of the opposite faces of the magnets II 13 are opposite, so that the buckle plate 12 and the bottom frame 11 are conveniently and stably butt-jointed and fixed by utilizing magnetic attraction force, the buckle plate 12 is convenient to disassemble and assemble on the bottom frame 11, in addition, the buckle plate 12 can be provided with a plurality of buckle grooves 2 on each buckle plate 12, and each buckle plate can correspond to one type of a patch integrated circuit board, so that patches of different types can be conveniently detected by conveniently disassembling and replacing the buckle plate 12;

it should be noted that a female end of a docking plug is disposed on the bottom frame 11, the female end of the docking plug is electrically connected with the docking interface, a male end of the docking plug is disposed on the buckle plate 12, and the male end of the docking plug is electrically connected with the docking point 3, so that when the buckle plate 12 is docked with the bottom frame 11, the circuit can be automatically ensured to be conducted for detection and use.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a paster integrated circuit is with test fixture, includes base (1), and base (1) both sides are provided with the butt joint interface to with test instrument electric connection, its characterized in that: the method also comprises the following steps:

the buckling groove (2), the buckling groove (2) and the integrated circuit patch have the same size;

the butt joint contacts (3) are arranged at the notch positions of the buckling grooves (2) and are respectively and electrically connected with the butt joint interfaces at the two sides of the base (1), and are electrically connected with the butt joint contacts (3) when the integrated circuit patch is buckled into the buckling grooves (2);

the ejection mechanism (4) is arranged in the buckling groove (2), and the ejection mechanism (4) is ejected to store force when the integrated circuit patch is buckled into the buckling groove (2), so that the integrated circuit patch can be automatically ejected after the test is finished.

2. The test fixture for a chip integrated circuit according to claim 1, wherein: the ejection mechanism (4) comprises a top plate (41), the top plate (41) is arranged in the buckling groove (2) in a sliding mode, guide rail grooves (42) are formed in the inner walls of the two sides of the buckling groove (2), and guide rail sliding blocks (43) extending into the guide rail grooves (42) are arranged on the two sides of the top plate (41);

and an elastic piece is also arranged between the top plate (41) and the inner wall of the buckling groove (2), and the elastic piece stores energy when the integrated circuit patch extrudes the top plate (41) to press down.

3. The test fixture for a chip integrated circuit according to claim 2, wherein: the elastic piece comprises a first magnet (44) which is respectively embedded on the inner walls of the top plate (41) and the buckling groove (2), and the magnetic poles of the opposite surfaces of the first magnet (44) are the same.

4. A test fixture for a chip integrated circuit according to claim 3, wherein: the base (1) comprises a bottom frame (11) and a buckle plate (12), wherein the buckle groove (2) is formed in the buckle plate (12), the butt joint interface is formed in the bottom frame (11), and the buckle plate (12) is buckled on the bottom frame (11) and is electrically connected.

5. The test fixture for a chip integrated circuit according to claim 4, wherein: the bottom frame (11) and the pinch plate (12) are embedded with a magnet II (13), and the magnetic poles of the opposite surfaces of the magnet II (13) are opposite.