CN220606404U

CN220606404U - Space diversified array type multifunctional radiator capable of being precisely guided and rapidly positioned

Info

Publication number: CN220606404U
Application number: CN202322265453.4U
Authority: CN
Inventors: 金耀权; 季巧伟
Original assignee: Zhejiang Newlink Technology Co ltd
Current assignee: Zhejiang Newlink Technology Co ltd
Priority date: 2023-08-22
Filing date: 2023-08-22
Publication date: 2024-03-15
Anticipated expiration: 2033-08-22

Abstract

The application relates to but accurate direction is multi-functional radiator of space pluralism array type of location fast for dispel the heat to DC-DC collection module, include: the novel radiator is provided with a plurality of radiating bulges, positioning columns and guide columns, wherein the radiating bulges form a plurality of longitudinal radiating grooves and a plurality of transverse radiating grooves, and the positioning and fixing are realized through the cooperation of the guide columns and the DC-DC acquisition module; wherein, a novel radiator corresponds to a DC-DC acquisition module to form a module, and a plurality of modules can be stacked up and down and spliced left and right; the mounting assembly is used for mounting the DC-DC acquisition module to dissipate heat so that the bottom of the DC-DC acquisition module is suspended; and one end of the fixing component is connected with the positioning column in a matched manner, and the other end of the fixing component is connected with the mounting component and is used for fixing one or more modules on the mounting component. This application has the effect that promotes the radiating effect, reduces the radiator volume, improves assembly efficiency.

Description

Space diversified array type multifunctional radiator capable of being precisely guided and rapidly positioned

Technical Field

The application relates to a radiator, in particular to a space diversified array type multifunctional radiator capable of being precisely guided and rapidly positioned.

Background

In lithium battery production, formation and capacity-division testing are extremely important procedures in the manufacturing process, and the formation and capacity-division testing are carried out on the lithium battery through charge and discharge testing equipment, and often, the charge and discharge testing equipment is mostly provided with a sufficient number of DC-DC acquisition modules to improve space utilization rate and production capacity.

On the one hand, the DC-DC acquisition module integrates a plurality of devices such as inductors, power transistors, high-heat chips, high-heat resistors and the like, the difference of the heights of the devices is large, the heat productivity is not uniform, the distribution of the high-heat devices is scattered and the quantity of the types of the high-heat devices is large because of the complexity of a circuit, once the system runs for a long time, various components on the DC-DC acquisition module can generate a large amount of unbalanced heat, if the heat cannot be timely emitted, the heat can be accumulated on a printed circuit board, at the moment, the printed circuit board and electronic components on the printed circuit board can continuously rise in temperature, the measurement precision can be slightly reduced, and the integrated circuit can be seriously burned. The traditional heat management system generally solves the heat dissipation problem by means of forced air cooling, partial high-heat element installation of a radiator, optimization of printed circuit board layout and the like, and because of the complexity and integration of a microelectronic circuit, the dispersion of each electronic element, the non-uniformity of encapsulation and the like, various radiators with different styles are often adopted to be directly adhered to the surface of a high-heat element through a thermal phase change heat conducting pad, so that the radiator is complicated in pattern type and too many in assembly procedures and is difficult to manage, and the risk hidden dangers such as vibration falling, short circuit due to incomplete installation in-place offset, unsatisfactory heat dissipation effect due to poor contact, unbalanced heat dissipation and the like caused by the adhesion of the radiator cannot be thoroughly solved.

On the other hand, in order to improve space utilization, a plurality of DC-DC acquisition modules are often subjected to space array stacking installation, and the traditional stacking installation generally carries out fixed installation through support or sliding rail drawing or concave-convex stacking matching, so that the requirements on layout space or operation space are larger, the weight of the modules with relatively poor adjustability is relatively heavier, and meanwhile, the requirements on processing and assembling parts are relatively tighter, so that mass production is not facilitated. Because of the reliability requirements of the device, the stacked DC-DC acquisition modules also need to be reliably grounded to reduce signal interference.

Therefore, there is a need for a space-variant array-type multifunctional radiator capable of precisely guiding and rapidly positioning to solve the problems in the prior art.

Disclosure of Invention

The object of the present application is to provide a spatially diverse array-type multifunctional radiator which can be precisely guided and rapidly positioned, aiming at the problems existing in the prior art.

In order to achieve the purpose of the application, the application adopts the following technical scheme: but accurate direction is multi-functional radiator of space pluralism array type of location fast for dispel the heat to DC-DC collection module, include:

the novel radiator is provided with a plurality of radiating bulges, positioning columns and guide columns, wherein the radiating bulges form a plurality of longitudinal radiating grooves and a plurality of transverse radiating grooves, and the positioning and fixing are realized through the cooperation of the guide columns and the DC-DC acquisition module;

wherein, a novel radiator corresponds to a DC-DC acquisition module to form a module, and a plurality of modules can be stacked up and down and spliced left and right;

the mounting assembly is used for mounting the DC-DC acquisition module to dissipate heat so that the bottom of the DC-DC acquisition module is suspended;

and one end of the fixing component is connected with the positioning column in a matched manner, and the other end of the fixing component is connected with the mounting component and is used for fixing one or more modules on the mounting component.

Working principle and beneficial effect: 1. compared with the prior art, the novel radiator is matched with the mounting assembly and the fixing assembly, so that risk hidden dangers such as unbalanced heat dissipation, unsatisfactory heat dissipation effect, vibration falling, offset short circuit and the like can be effectively avoided; the weight can be moderately reduced, the layout and circulation space can be reduced, and a certain cost reduction effect is achieved; meanwhile, the reliability of the DC-DC acquisition module is guaranteed by integrating multiple functions of precise guiding, quick positioning and stage connection; meanwhile, the matching adjustment of the space between the multiple arrays is achieved by simply changing local fixed parts, so that the flexibility is enhanced; meanwhile, the assembly process of the radiator is moderately reduced, and the production efficiency and the primary qualification rate are effectively improved.

2. The longitudinal radiating grooves and the transverse radiating grooves are used for guiding trend of convection air in different directions, and different installation modes of redundancy are used for matching refrigerant sources.

Further, the bottom of each guide post is provided with a mounting hole, the upper novel radiator, the lower novel radiator and the DC-DC acquisition module are fixed through the guide male and female studs, the top of each guide male and female stud is provided with a threaded section, and the bottom of each guide male and female stud is provided with a threaded hole. The mounting hole not only plays a role in mounting and fastening, but also plays a role in connecting the ground in a stage through a metal contact metal pressing mode, and the guide male and female studs can separate a distance between the DC-DC acquisition module and the novel radiator, so that the novel radiator can radiate heat well.

Further, an element avoidance space is formed in the bottom of the novel radiator so as to avoid protruding elements of the DC-DC acquisition module. The element avoidance space is designed into avoidance spaces with different shapes according to different elements on the DC-DC acquisition module. On the premise of increasing the heat radiating area, heat of unbalanced high-heat elements at all positions is converged on the novel radiator, and then balanced heat radiation is carried out through the longitudinal heat radiating grooves and the transverse heat radiating grooves, so that the heat radiating effect is enhanced, meanwhile, elements on the DC-DC acquisition module can be effectively pressed, and adverse phenomena such as vibration falling and offset of the elements are reduced.

Further, the mounting assembly comprises a bottom plate, press riveting pins for positioning the guide female and male studs and press riveting studs matched with the fixing assembly. The bottom plate is used as a base, the press riveting pin is inserted into the bottom of the guide female and male stud, so that the guide female and male stud can be positioned, and then the press riveting pin is fixed on the press riveting stud through the fixing assembly, so that the radiator can be assembled, and the operation is convenient.

Further, the fixing assembly comprises a fixing stud, a fixing pressing plate for connecting the fixing stud and the positioning column, and a fastener for fixing the fixing pressing plate and the fixing stud. The fixed pressing plate is inserted into the positioning column and placed on the fixed stud, and the fixed pressing plate is fixed through the fastener, so that the operation is convenient, and the assembly difficulty can be greatly reduced.

Further, the top of the fixed stud is provided with a threaded hole, the bottom of the fixed stud is provided with a threaded section, and the top of the press riveting stud is provided with a threaded hole. Therefore, the fastener can be conveniently fixed on the fixing stud, and the fixing stud can be conveniently fixed on the press riveting stud.

Further, the left end and the right end of the fixed pressing plate are respectively provided with a waist-shaped hole, two adjacent novel radiators can be fixed through the fixed pressing plate, and the distance between the two novel radiators is adjusted through the waist-shaped holes. Thus, the distance between the two novel radiators can be conveniently adjusted.

Further, the novel radiator is manufactured by an integral die-casting molding process. Compared with the traditional welding or cutting means, the integral die-casting forming process can omit a plurality of parts, omit a plurality of welding spots, omit complex assembly, greatly improve the processing efficiency and the integral strength of parts and reduce the cost.

Further, the novel radiator is made of YL104. The YL104 heat conductivity coefficient can be about 1.2-1.5 times of that of the traditional die-casting aluminum, and the heat dissipation effect is better.

Further, the DC-DC acquisition module further comprises a thermal phase change heat conduction pad, wherein the thermal phase change heat conduction pad is arranged between a heating element of the DC-DC acquisition module and the novel radiator and is used for conducting heat. Improving the heat conduction effect.

Drawings

FIG. 1 is a perspective view of the present application;

FIG. 2 is a diagram comparing an acquisition module employing the present application with a prior acquisition module employing a conventional heat sink;

FIG. 3 is a schematic diagram of the cooperation of the DC-DC acquisition module of the present application with a novel heat sink;

fig. 4 is a schematic diagram comparing the minimum pitch array of the present application with a conventional heat sink.

In the figure, 1, a novel radiator; 11. positioning columns; 12. a guide post; 13. a longitudinal heat sink; 14. a transverse heat dissipation groove; 15. a mounting hole; 16. an element avoidance space; 2. a DC-DC acquisition module; 21. a printed circuit board; 22. a thermal phase change thermal pad; 23. guiding the male and female studs; 3. a mounting assembly; 31. a bottom plate; 32. riveting pins; 33. riveting a stud; 4. a fixing assembly; 41. fixing a stud; 42. a fixed pressing plate; 43. a fastener; 5. a redundant discharge assembly; 6. a conventional radiator; 61. the brackets are stacked.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application are within the scope of the protection of the present application.

It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "up," "down," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not refer to or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus the above terms should not be construed as limiting the present application.

As shown in fig. 1, the space-diversified-array-type multifunctional radiator capable of precisely guiding and rapidly positioning comprises:

in this embodiment, the DC-DC collection module 2 mainly comprises a printed circuit board 21, a thermal phase change heat conduction pad 22, a guiding male and female stud 23, and other parts, and the printed circuit board 21 integrates a complex microelectronic circuit.

The thermal phase change heat conducting pad 22 contains various patterns to match different high heat elements, so that the problem of poor heat dissipation effect caused by inconsistent welding heights of the elements can be solved, a certain elastic buffering pressing element can be played to reduce loosening of the elements, in order to improve the heat conduction effect, the preferable heat conduction coefficient is 3.0w/m.k, the guiding male and female studs 23 not only play the functions of precise guiding, quick positioning and stage connection, but also play the role of limiting the stacking height, the stacking height of the upper layer and the lower layer of the DC-DC acquisition module can be adjusted according to different project requirements, the heat dissipation effect can be improved to a certain extent by properly amplifying the stacking height interval, and the flexibility is enhanced.

The novel radiator 1 is provided with a plurality of radiating bulges, a positioning column 11 and a guide column 12, wherein the radiating bulges form a plurality of longitudinal radiating grooves 13 and a plurality of transverse radiating grooves 14, and the positioning and fixing are realized by the cooperation of the guide column 12 and the DC-DC acquisition module 2; wherein, a novel radiator 1 corresponds to a DC-DC acquisition module 2 to form a module, and a plurality of modules can be stacked up and down and spliced left and right front and back;

in this embodiment, as shown in fig. 2-3, the novel radiator 1 is composed of functional features such as a positioning column 11, a guiding column 12, a longitudinal heat dissipation groove 13, a transverse heat dissipation groove 14, a mounting hole 15, an element avoidance space 16, and the like.

The positioning column 11 is mainly used for fixing the left and right two-row DC-DC acquisition modules 2, plays a role in quick positioning, the guide column 12 is combined with the guide male and female studs 23, the mounting hole 15 can play a role in precise guide, quick positioning and stage connection, the longitudinal heat dissipation grooves 13 and the transverse heat dissipation grooves 14 are mainly used for guiding trend of convection air in different directions, the redundant different mounting modes are used for matching a refrigerant source, the mounting hole 15 plays a role in mounting and fastening, the stage connection is also played through a metal contact metal pressing mode, the element avoiding space 16 is used for designing avoidance spaces of different shapes according to different elements on the DC-DC acquisition modules 2, the distance between a high heat element and the novel radiator 1 is matched on the basis of reducing the thickness of the thermal phase change heat conduction pad 22 as much as possible, heat of the unbalanced high heat element at all places is converged on the novel radiator 1 on the premise of increasing heat dissipation area, the heat dissipation effect is balanced through the longitudinal heat dissipation grooves 13 and the transverse heat dissipation grooves 14, meanwhile, the element on the DC-DC acquisition module 2 can be effectively pressed, and poor heat dissipation phenomena such as falling and offset are reduced.

Preferably, the novel radiator 11 adopts an integral die-casting molding process, in order to enhance the heat conduction effect, the novel radiator 1 does not adopt the traditional die-casting aluminum material with relatively low heat conduction coefficient such as ADC12/A380 and the like, but adopts the die-casting aluminum material with relatively high heat conduction coefficient, the preferred die-casting aluminum material can be YL104 and the like, and the heat conduction coefficient of the die-casting aluminum material can be about 1.2-1.5 times that of the traditional die-casting aluminum.

As shown in fig. 2 and 4, compared with the conventional radiator 6, the novel radiator 1 reduces the stacking support 61, not only reduces the weight, but also saves circulation space such as logistics and packaging due to the reduction of the volume of the appearance, the minimum distance between the left and right arrays of the conventional radiator 6 is 10mm, the minimum distance between the left and right arrays of the novel radiator 1 is 0mm, and the novel radiator has more flexibility in terms of strict space requirements.

The mounting assembly 3 is used for mounting the DC-DC acquisition module 2 to dissipate heat so that the bottom of the DC-DC acquisition module 2 is suspended;

in this embodiment, the mounting assembly 3 mainly comprises a bottom plate 31, a press riveting pin 32, a press riveting stud 33, and other parts, the press riveting pin 32 can precisely guide with the guiding male and female studs 23, and the press riveting stud 33 is used for mounting the fixing stud 41.

And one end of the fixing component 4 is connected with the positioning column 11 in a matching way, and the other end of the fixing component is connected with the mounting component 3 and is used for fixing one or more modules on the mounting component 3.

In this embodiment, the fixing assembly 4 mainly comprises parts such as a fixing stud 41, a fixing pressing plate 42, a fastener 43, etc., the top of the fixing stud 41 is provided with a threaded hole, the bottom is provided with a threaded section, and the top of the press riveting stud 33 is provided with a threaded hole. The height of the fixing stud 41 can be matched with the height of the guiding male and female studs 23 to realize the adjustment and change of the stacking height, the preferable material can be 304 stainless steel, and the shape of the fixing pressing plate 42 can be adjusted and changed along with the left and right stacking spacing of the acquisition module.

The fixed platen 42 is equipped with a kidney-shaped hole about both ends respectively, can fix two adjacent novel radiators 1 about through this fixed platen 42, adjust the interval of two novel radiators 1 through kidney-shaped hole, the quantity that fixed subassembly 4 used generally when novel radiator 1 diversified array is 2 (n+1), wherein n is the column number of stacking about, and the fixed subassembly 4 quantity that traditional radiator 6 used generally is 4n, when n is greater than or equal to 2, the fixed subassembly 4 quantity of novel radiator 1 than traditional radiator 6 can be few (i.e. 4n- (2 (n+1)) > 1, wherein n is greater than or equal to 2), can reduce production assembly process, effectively promote production efficiency and one pass qualification rate.

Preferably, a redundant discharge assembly 5 is also included, for a reserved function, which can be configured when the system needs to be discharged to 1.2V or more below 2V.

The detailed description of the present application is not prior art, and thus is not described in detail herein.

It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.

Although the terms of the novel heat sink 1, the positioning posts 11, the guide posts 12, the longitudinal heat dissipation grooves 13, the lateral heat dissipation grooves 14, the mounting holes 15, the element avoidance spaces 16, the DC-DC collection module 2, the printed circuit board 21, the thermal phase change thermal pads 22, the guide male and female studs 23, the mounting assembly 3, the bottom plate 31, the rivet pins 32, the rivet studs 33, the fixing assembly 4, the fixing studs 41, the fixing press plates 42, the fasteners 43, the redundancy discharge assembly 5, the conventional heat sink 6, the stacking support 61, and the like are used more herein, the possibility of using other terms is not excluded. These terms are used merely for convenience in describing and explaining the essence of the present application; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present application.

The present application is not limited to the above-mentioned preferred embodiments, and any person can obtain other products in various forms under the teaching of the present application, but any changes in shape or structure of the products are within the scope of protection of the present application.

Claims

1. But accurate direction is multi-functional radiator of space pluralism array type of location fast for dispel the heat to DC-DC collection module, its characterized in that includes:

one novel radiator corresponds to one DC-DC acquisition module to form one module, and a plurality of modules can be stacked up and down and spliced left and right in front and back;

2. The space diversified array type multifunctional radiator capable of being precisely guided and rapidly positioned according to claim 1, wherein each guide post is provided with a mounting hole at the bottom, the upper and lower two novel radiators and the fixation of the novel radiator and the DC-DC acquisition module are realized through guide male and female studs, each guide male and female stud is provided with a threaded section at the top and a threaded hole at the bottom.

3. The space-diversified-array-type multifunctional radiator capable of being precisely guided and rapidly positioned according to claim 1, wherein an element avoidance space is arranged at the bottom of the novel radiator so as to avoid protruding elements of the DC-DC acquisition module.

4. The space-diversified array-type multifunctional radiator capable of being precisely guided and rapidly positioned according to claim 2, wherein the mounting assembly comprises a bottom plate, press-riveting pins for positioning the guide male and female studs and press-riveting studs for being matched with the fixing assembly.

5. The precision-oriented fast positioning space-diversity array-type multifunctional radiator according to claim 4, wherein the fixing assembly comprises a fixing stud, a fixing pressure plate for connecting the fixing stud and the positioning column, and a fastener for fixing the fixing pressure plate and the fixing stud.

6. The space-diversified array type multifunctional radiator capable of being precisely guided and rapidly positioned according to claim 5, wherein the top of the fixing stud is provided with a threaded hole, the bottom of the fixing stud is provided with a threaded section, and the top of the press-riveting stud is provided with a threaded hole.

7. The space-diversified-array-type multifunctional radiator capable of being precisely guided and rapidly positioned according to claim 5, wherein a waist-shaped hole is respectively arranged at the left end and the right end of the fixed pressing plate, two adjacent novel radiators at the left end and the right end can be fixed through the fixed pressing plate, and the distance between the two novel radiators is adjusted through the waist-shaped holes.

8. The spatially diverse array-type multifunctional heat sink capable of being precisely guided and rapidly positioned according to any one of claims 1 to 7, wherein the novel heat sink is manufactured by an integral die-casting process.

9. The spatially diverse array type multifunctional heat sink capable of being precisely guided and rapidly positioned according to claim 8, wherein the novel heat sink is made of YL104.

10. The spatially diverse array-type multifunctional heat sink with precise guiding and rapid positioning function according to any one of claims 1-7, further comprising a thermal phase change heat conduction pad arranged between the heating element of the DC-DC acquisition module and the novel heat sink for conducting heat.