CN220606381U - Heating, temperature measuring and conductive integrated chip - Google Patents
Heating, temperature measuring and conductive integrated chip Download PDFInfo
- Publication number
- CN220606381U CN220606381U CN202322204185.5U CN202322204185U CN220606381U CN 220606381 U CN220606381 U CN 220606381U CN 202322204185 U CN202322204185 U CN 202322204185U CN 220606381 U CN220606381 U CN 220606381U
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- layer
- heating
- insulating layer
- temperature sensor
- electrode
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 51
- 239000010410 layer Substances 0.000 claims description 117
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229920006335 epoxy glue Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 12
- 239000011521 glass Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910001006 Constantan Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Abstract
The utility model discloses a heating, temperature measuring and conducting integrated chip, comprising: the heating layer, the temperature sensor layer, the electrode layer, the first insulating layer and the second insulating layer; the heating layer, the temperature sensor layer and the electrode layer are sequentially laminated; the first insulating layer is arranged between the heating layer and the temperature sensor layer; the second insulating layer is disposed between the temperature sensor layer and the electrode layer. According to the utility model, the display screen can be accurately heated by being adhered to the display screen and electrified, so that the problem of fog generation of the display screen is effectively solved, and the demisting effect is stable; meanwhile, the temperature of the display screen can be known in real time through the temperature sensor.
Description
Technical Field
The utility model relates to the technical field of heating, temperature measurement and conduction, in particular to a heating, temperature measurement and conduction integrated chip.
Background
In modern society, electronic devices and display technologies are widely used as important tools for people to acquire information and interact with each other. However, in some specific environments, especially in cold winter or under high humidity conditions, the display surface may condense due to temperature differences, resulting in mist formation. This can seriously affect the visibility and definition of the display screen, and reduce the visual experience and information transfer effect of the user, so it is significant to solve this problem.
Conventionally, various methods have been employed to solve the problem of display screen fogging, such as coating the surface of the display screen with an anti-fog coating, using a heating device, and the like. However, these methods tend to be unsatisfactory in terms of defogging effect and unstable.
Disclosure of Invention
According to an embodiment of the present utility model, there is provided a heating, temperature measuring and conductive integrated chip, comprising: the heating layer, the temperature sensor layer, the electrode layer, the first insulating layer and the second insulating layer;
the heating layer, the temperature sensor layer and the electrode layer are sequentially laminated;
the first insulating layer is arranged between the heating layer and the temperature sensor layer;
the second insulating layer is disposed between the temperature sensor layer and the electrode layer.
Further, the electrode layer is composed of an electrode bar that is not closed.
Further, the electrode bar is made of copper.
Further, the method further comprises the following steps: a third insulating layer and a fourth insulating layer; the third insulating layer is arranged above the heating layer; the fourth insulating layer is disposed under the electrode layer.
Further, the first insulating layer, the second insulating layer, the third insulating layer, and the fourth insulating layer are all polyimide films.
Further, the method further comprises the following steps: a first adhesive layer and a second adhesive layer;
the first bonding layer is arranged between the first insulating layer and the temperature sensor layer and is used for bonding the first insulating layer and the temperature sensor layer;
the second bonding layer is arranged between the second insulating layer and the electrode layer and used for bonding the second insulating layer and the electrode layer.
Further, the first adhesive layer and the second adhesive layer are acrylic or epoxy resin glue.
According to the heating, temperature measuring and conducting integrated sheet provided by the embodiment of the utility model, the display screen can be accurately heated by being adhered to the display screen and electrified, so that the problem of fog generation of the display screen is effectively solved, and the demisting effect is stable; meanwhile, the temperature of the display screen can be known in real time through the temperature sensor.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the technology claimed.
Drawings
FIG. 1 is a schematic diagram of a heating, temperature measuring and conductive integrated chip according to an embodiment of the present utility model.
Detailed Description
The preferred embodiments of the present utility model will be described in detail below with reference to the attached drawings, which further illustrate the present utility model.
Firstly, a heating, temperature measuring and conducting integrated sheet according to an embodiment of the present utility model will be described with reference to fig. 1, and is attached to a display screen, wherein the display screen is made of conductive heating glass, and the display screen is directly attached to the display screen and is electrified, so that the display screen can be heated, and the display screen is placed to generate fog, so that the application scene is wide.
As shown in fig. 1, the heating, temperature measuring and conducting integrated chip of the embodiment of the utility model is provided with a heating layer 1, a temperature sensor layer 2, an electrode layer 3, a first insulating layer 4 and a second insulating layer 5.
Specifically, as shown in fig. 1, a heating layer 1, a temperature sensor layer 2, and an electrode layer 3 are sequentially laminated; the first insulating layer 4 is arranged between the heating layer 1 and the temperature sensor layer 2; the second insulating layer 5 is provided between the temperature sensor layer 2 and the electrode layer 3. The heating layer in the embodiment consists of a heating sheet, and the heating sheet is made of constantan or nichrome; the temperature sensor layer is composed of a temperature sensor, the material of the temperature sensor is nickel-iron alloy, and the temperature sensor can know the temperature of the display screen in real time.
Further, the electrode layer 3 is composed of an electrode bar which is not closed, and the electrode bar is not closed, so that a loop is prevented from being formed, and a short circuit is caused. When in use, the electrode layer is connected with an external power supply.
Further, the electrode strip is made of copper, preferably brass, and has good conductivity, mechanical property, corrosion resistance, thermal stability, fatigue resistance, oxidation resistance and plasticity.
Further, as shown in fig. 1, the method further comprises: a third insulating layer 6 and a fourth insulating layer 7; the third insulating layer 6 is arranged above the heating layer 1; a fourth insulating layer 7 is provided under the electrode layer 3. In this embodiment, the fourth insulating layer 7 is only disposed at the portion where the electrode layer 3 does not contact the heating glass, and the portion where the electrode layer 3 contacts the heating glass is not provided with an insulating layer, which is exposed, so that the electrode layer 3 contacts the heating glass, and the electrode layer 3 and the heating glass are adhered together by the melted conductive metal, thereby realizing conductive heating of the heating glass. The heating effect is stable, and the defogging effect is stable.
Further, the first insulating layer 4, the second insulating layer 5, the third insulating layer 6 and the fourth insulating layer 7 are all polyimide films, and polyimide has excellent mechanical properties, is insoluble in organic solvents, can resist extremely low temperature, has good dielectric properties, and has little vacuum off-gassing amount and high radiation resistance.
Further, as shown in fig. 1, the method further comprises: a first adhesive layer 8 and a second adhesive layer 9; the first bonding layer 8 is arranged between the first insulating layer 4 and the temperature sensor layer 2 and is used for bonding the first insulating layer 4 and the temperature sensor layer 2; the second adhesive layer 9 is disposed between the second insulating layer 5 and the electrode layer 3, and is used for bonding the second insulating layer 5 and the electrode layer 3.
Further, the first adhesive layer 8 and the second adhesive layer 9 are acrylic or epoxy resin glue, and the epoxy resin glue is preferable in this embodiment, and the epoxy resin has good electrical insulation property.
The present embodiment further includes: polyimide reinforcing layer 10, polyimide reinforcing layer 10 is provided under fourth insulating layer 7.
When in use, the heating, temperature measuring and conducting integrated sheet is stuck on the heating glass, and the heating glass is adhered together by the melted conducting metal, so that the conducting heating is realized. The temperature sensor of the temperature sensor layer can be used for knowing the temperature of the heating glass in real time.
Above, the heating, temperature measuring and conducting integrated chip according to the embodiment of the utility model is described with reference to fig. 1, and the heating, temperature measuring and conducting integrated chip is adhered to a display screen and electrified, so that the display screen can be accurately heated, the problem of fog generation of the display screen is effectively solved, and the demisting effect is stable; meanwhile, the temperature of the display screen can be known in real time through the temperature sensor.
It should be noted that in this specification the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of additional identical elements in a process, method, article, or apparatus that comprises an element.
While the present utility model has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the utility model. Many modifications and substitutions of the present utility model will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the utility model should be limited only by the attached claims.
Claims (7)
1. A heating, temperature measuring and conductive integrated chip comprising: the heating layer, the temperature sensor layer, the electrode layer, the first insulating layer and the second insulating layer;
the heating layer, the temperature sensor layer and the electrode layer are sequentially laminated;
the first insulating layer is arranged between the heating layer and the temperature sensor layer;
the second insulating layer is disposed between the temperature sensor layer and the electrode layer.
2. The heating, temperature measuring and conducting integrated chip of claim 1, wherein the electrode layer is comprised of non-closed electrode strips.
3. The heating, temperature measuring and conductive integrated chip of claim 2, wherein the electrode strip is copper.
4. The heating, temperature measuring and conductive integrated chip of claim 1, further comprising: a third insulating layer and a fourth insulating layer; the third insulating layer is arranged above the heating layer; the fourth insulating layer is arranged below the electrode layer.
5. The heating, temperature measuring and conductive integrated chip of claim 4, wherein the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer are polyimide films.
6. The heating, temperature measuring and conductive integrated chip of claim 1, further comprising: a first adhesive layer and a second adhesive layer;
the first bonding layer is arranged between the first insulating layer and the temperature sensor layer and is used for bonding the first insulating layer and the temperature sensor layer;
the second bonding layer is arranged between the second insulating layer and the electrode layer and is used for bonding the second insulating layer and the electrode layer.
7. The heating, temperature measuring and conductive integrated chip of claim 6, wherein said first adhesive layer and said second adhesive layer are acrylic or epoxy glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322204185.5U CN220606381U (en) | 2023-08-16 | 2023-08-16 | Heating, temperature measuring and conductive integrated chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322204185.5U CN220606381U (en) | 2023-08-16 | 2023-08-16 | Heating, temperature measuring and conductive integrated chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220606381U true CN220606381U (en) | 2024-03-15 |
Family
ID=90173674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322204185.5U Active CN220606381U (en) | 2023-08-16 | 2023-08-16 | Heating, temperature measuring and conductive integrated chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220606381U (en) |
-
2023
- 2023-08-16 CN CN202322204185.5U patent/CN220606381U/en active Active
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