CN220606353U - Electromagnetic shielding heat dissipation system and electronic equipment - Google Patents

Abstract

The application provides an electromagnetic shielding heat dissipation system and electronic equipment, wherein the electromagnetic shielding heat dissipation system comprises a circuit board, an electronic device, a first shielding piece and a heat dissipation piece; the electronic device is electrically connected to the circuit board and is provided with a metal piece; the first shielding piece is electrically connected to the circuit board and is in conductive contact with the metal piece; the first shielding piece is internally provided with a containing cavity for containing the electronic device and used for shielding electromagnetic radiation of the electronic device; the first shielding piece is provided with an opening, and at least part of the metal piece extends out of the opening; the part of the metal piece extending out of the opening is in heat conduction connection with the heat dissipation piece. According to the electronic device, the metal piece on the electronic device can be provided with the part which can extend out from the opening of the first shielding piece, so that the part of the metal piece extending out of the opening can radiate heat through the air outside the first shielding piece and the radiating piece, and therefore, the shielding of electromagnetic radiation of the electronic device is realized, and efficient radiating of the electronic device is realized.

Description

Electromagnetic shielding heat dissipation system and electronic equipment

Technical Field

The application relates to the technical field of electromagnetic shielding and heat dissipation, in particular to an electromagnetic shielding and heat dissipation system and electronic equipment.

Background

Wireless communication devices typically have a processor therein that is subject to digital noise radiation during operation, for which reason a shield, typically constructed of sheet metal, is typically placed around the processor to shield the radiation, but the shield typically requires the processor to be entirely enclosed within the shield, which can affect the heat dissipation of the processor.

Disclosure of Invention

An object of the present application is to provide an electromagnetic shielding heat dissipation system and an electronic device, so as to realize efficient heat dissipation while realizing electromagnetic shielding for a processor.

The first aspect of the application provides an electromagnetic shielding heat dissipation system, which comprises a circuit board, an electronic device, a first shielding piece and a heat dissipation piece; the electronic device is electrically connected to the circuit board, and a metal piece is arranged on the electronic device; the first shielding piece is electrically connected to the circuit board, and is in conductive contact with the metal piece; a cavity for accommodating the electronic device is arranged in the first shielding piece and is used for shielding electromagnetic radiation of the electronic device; the first shielding piece is provided with an opening, and at least part of the metal piece extends out of the opening; the part of the metal piece extending out of the opening is in heat conduction connection with the heat dissipation piece.

According to the electromagnetic shielding heat dissipation system, the metal piece on the electronic device can be provided with the part which can extend out from the opening of the first shielding piece, so that the part of the metal piece extending out of the opening can dissipate heat through the air outside the first shielding piece and the heat dissipation piece, and therefore, the shielding of electromagnetic radiation of the electronic device is achieved, and efficient heat dissipation of the electronic device is achieved.

In one possible implementation, the heat sink is insulated from the circuit board and the first shield, respectively. The heat dissipation part is electrically isolated from each electronic component and network on the circuit board, the circuit board can directly expose the structural part in the air environment outside the first shielding part under the condition of no isolated power supply, potential safety hazards such as electric leakage and short circuit are avoided, heat dissipation can be carried out in the external environment of the first shielding part, the heat dissipation part can directly dissipate conducted heat to the air environment, and heat dissipation efficiency is improved.

In one possible implementation, the metal piece includes a first portion and a second portion, the first portion protruding from the second portion, at least part of the first portion protruding from the opening; a step part is formed between the second part and the first part, and the edge of the opening is overlapped with the step part.

The area of the first part is smaller than that of the second part, so that the step part is formed on the second part at a position between the edge of the second part and the edge of the first part, and the step part can provide space for connection with the first shielding piece, namely, the first shielding piece can be lapped on the step part at the edge of the opening, and the first shielding piece and the metal piece are electrically connected.

In one possible implementation, the edge of the opening protrudes into the cavity.

The edge of the opening can be a partial area adjacent to the opening on the first shielding piece, the partial area can be bent to a certain angle in the inner containing cavity of the first shielding piece, the bent part is inclined, and the whole first shielding piece can be of a metal sheet metal structure and has smaller thickness, so that the bent part has certain elastic deformation capacity.

In one possible implementation manner, the electromagnetic shielding heat dissipation system further includes a second shielding member, the second shielding member is disposed on the step portion, and the first shielding member is connected with the second shielding member.

The second shielding piece also has conductivity, can be an independent structural piece and can be independently arranged on the step part, so that the step part is convenient to cover the whole body, the area of electromagnetic shielding is increased, and the electromagnetic shielding effect is improved. Meanwhile, the first shielding piece and the second shielding piece can be electrically connected conveniently.

In one possible implementation manner, the second shielding member is a conductive cloth, a conductive adhesive or a metal elastic sheet, so that the second shielding member has better electromagnetic shielding performance, and is convenient to connect to the step part. .

In one possible implementation, the first shield is integrally formed with the second shield.

The first shielding piece and the second shielding piece can be made of the same material, and the second shielding piece can be synchronously formed in the forming process of the first shielding piece, so that the structural strength of connection of the first shielding piece and the second shielding piece can be ensured, and meanwhile, the processing and the manufacturing are convenient.

In one possible implementation, the opening edge of the first shield overlaps the second shield, thereby facilitating assembly of the first shield with the electronic device.

In one possible implementation, the electromagnetic shielding heat dissipation system further includes a heat conductive material, one side of the heat conductive material is in heat conductive contact with the metal piece, and a side of the heat conductive material away from the metal piece is in heat conductive contact with the heat dissipation piece.

The heat conducting material is arranged between the metal piece and the heat radiating piece, heat generated by the electronic device can be conducted to the heat conducting material through the metal piece, the heat conducting material has good heat conducting performance, the heat can be further conducted to the heat radiating piece, and the heat is radiated to the external air environment through the heat radiating piece, so that the heat can be efficiently conducted to the outside.

In one possible implementation manner, the heat conducting material is a heat conducting gel, a heat conducting silicone grease or a heat conducting pad, and the materials can enable the heat conducting material to have good heat conducting performance, and meanwhile, the reliability of connection between the heat conducting material and the metal piece and the heat dissipation piece can be ensured. .

In one possible implementation, the material of the first shield is metal.

In one possible implementation, the electromagnetic shielding heat dissipation system further includes a shield, and an end of the first shielding member remote from the heat dissipation member is connected to the shield.

Wherein, can be fixed connection between this protector and the radiating member, also can be mutual contact, partial heat in the appearance intracavity also can be conducted to the protector through first shield to can distribute to outside air environment through the protector in, thereby also be favorable to promoting radiating efficiency, simultaneously, this protector also can provide the protection for this electromagnetic shield radiating system, increase of service life.

The second aspect of the application also provides an electronic device, which comprises the electromagnetic shielding heat dissipation system provided by the first aspect of the application.

In one possible implementation manner, the electronic device includes a first housing and a second housing, at least part of the first housing is the heat dissipation element, and at least part of the second housing is the protection element in the electromagnetic shielding heat dissipation system, so that the structure of the electromagnetic shielding heat dissipation system is simplified, and space inside the electronic device is saved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of an electromagnetic shielding heat dissipation system according to an embodiment of the present disclosure;

FIG. 3 is a schematic illustration of an electronic device sealed with sheet metal;

fig. 4 is a schematic structural diagram of an electromagnetic shielding heat dissipation system according to another embodiment of the present application.

Reference numerals:

1-a circuit board;

2-an electronic device;

21-a metal piece;

211-a first part;

212-a second portion;

213-step;

3-a first shield;

31-a cavity;

32-opening;

33-edge;

4-a heat sink;

5-a second shield;

6-a thermally conductive material;

7-guard;

100-an electronic device;

110-a first housing;

120-a second housing;

200-sheet metal housing;

300-a first thermally conductive layer;

400-a second thermally conductive layer;

500-heat sink.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.

Detailed Description

For a better understanding of the technical solutions of the present application, embodiments of the present application are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

In the description of the present application, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance unless explicitly specified or limited otherwise; the term "plurality" means two or more, unless specified or indicated otherwise; the terms "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

For a wireless communication device, a central processing unit (Central Processing Unit, CPU) generally exists in the wireless communication device, and digital noise radiation exists in the CPU during the operation process, and the digital noise radiation can cause the electromagnetic wave interference radiation of the device to exceed the standard, so that a shielding cover is generally considered to be added on a chip of the CPU to solve the chip radiation problem. However, such a shield can cause the CPU to be in a relatively closed environment, affecting CPU heat dissipation.

For this reason, the present embodiment provides an electromagnetic shielding and heat dissipation system, which may be applied to an electronic device, fig. 1 is a schematic structural diagram of an electronic device 100 provided in the embodiment of the present application, referring to fig. 1, fig. 1 exemplarily shows that the electronic device 100 is a wireless Access Point (AP), and of course, the electronic device may also be an electronic device with a chip digital noise radiation shielding requirement and a chip heat dissipation requirement, such as a wireless router, a mobile phone, a computer, an augmented reality (augmented reality, AR) device, a Virtual Reality (VR) device, an artificial intelligence (artificial intelligence, AI) device, a wearable device, a vehicle-mounted device, a smart home device, and/or a smart city device.

Fig. 2 is a schematic structural diagram of an electromagnetic shielding and heat dissipation system according to an embodiment of the present application, and referring to fig. 2, the electromagnetic shielding and heat dissipation system includes a circuit board 1, an electronic device 2, a first shielding member 3, and a heat dissipation member 4. The circuit board 1 may be a printed circuit board 1 (Printed Circuit Board, PCB), and various electronic components for implementing different functions are electrically connected to the circuit board 1, and part of the electronic components generate electromagnetic radiation during use and generate a large amount of heat, and the electronic component 2 may be a chip, for example.

The material of the first shielding member 3 may be metal, the first shielding member 3 is electrically connected to the circuit board 1, the metal member 21 is disposed on the electronic device 2, and the first shielding member 3 is in conductive contact with the metal member 21, so that an electrical loop is formed between the first shielding member 3, the circuit board 1 and the electronic device 2, and a cavity 31 for accommodating the electronic device 2 is disposed in the first shielding member 3, electromagnetic waves radiated by the electronic device 2 to the outside can be shielded by the first shielding member 3, and electromagnetic interference is reduced. In which, for example, when the electronic device 2 is a chip, the metal member 21 may be a metal Lid on the chip.

The first shielding member 3 is provided with an opening 32, at least part of the metal member 21 on the electronic device 2 can extend out of the opening 32, that is, the electronic device 2 is not entirely enclosed in the first shielding member 3, the metal member 21 of the electronic device 2 can extend out of the opening 32 of the first shielding member 3, so that the part of the metal member 21 extending out of the opening 32 can be exposed to air outside the first shielding member 3 and can be in heat conduction connection with the heat dissipation member 4, and therefore effective heat dissipation of the electronic device 2 can be achieved through the air outside the first shielding member 3 and the heat dissipation member 4.

Thus, the electromagnetic shielding and heat dissipating system provided by the embodiment of the present application can realize that the metal member 21 on the electronic device 2 has a part of the part capable of protruding from the opening 32 of the first shielding member 3, the part of the metal member 21 extending out of the opening 32 is allowed to dissipate heat through the air outside the first shielding member 3 and the heat dissipating member 4, thereby realizing both shielding of electromagnetic radiation of the electronic device 2 and efficient heat dissipation of the electronic device 2.

When the electromagnetic shielding and heat dissipation system is applied to electronic equipment, the electromagnetic shielding and heat dissipation system can be integrally arranged in the electronic equipment, or the electronic equipment can comprise a shell, the heat dissipation piece 4 of the electromagnetic shielding and heat dissipation system can be reused as the shell of the electronic equipment, namely, part of the shell can be used as the heat dissipation piece 4, so that the occupation of the electromagnetic shielding and heat dissipation system on the space in the electronic equipment can be reduced.

Illustratively, the material of the heat sink 4 may be metal, so as to enhance the heat dissipation effect of the heat sink 4 on the electronic device 2.

In one implementation manner, the heat dissipation part 4 is respectively insulated from the circuit board 1 and the first shielding part 3, that is, the heat dissipation part 4 is electrically isolated from each electronic component and network on the circuit board 1, the circuit board 1 can directly expose the structural part in the air environment outside the first shielding part 3 without isolating power supply, potential safety hazards such as electric leakage and short circuit are not caused, and heat dissipation can be performed in the external environment of the first shielding part 3, so that the heat dissipation part 4 can directly dissipate conducted heat to the air environment, and the heat dissipation efficiency is improved.

Illustratively, the heat sink 4 has no physical connection relationship with the first shielding member 3 and the circuit board 1, or the heat sink 4 may be supported by an insulating structural member at a position of non-circuit connection on the circuit board 1, or on a structure on the electronic device. Illustratively, as described above, the heat sink 4 may also be part of a housing on the electronic device, and heat dissipation from the electronic device 2 may also be achieved by multiplexing the structure of the electronic device.

In one implementation, referring to fig. 2, the electromagnetic shielding heat dissipation system further includes a heat conducting material 6, where a side of the heat conducting material 6 is in heat conducting contact with the metal piece 21, and a side of the heat conducting material 6 away from the metal piece 21 is in heat conducting contact with the heat dissipation piece 4. The heat conducting material 6 is disposed between the metal member 21 and the heat dissipating member 4, and the heat generated by the electronic device 2 can be conducted to the heat conducting material 6 through the metal member 21, and the heat conducting material 6 has good heat conductivity, and can further conduct the heat to the heat dissipating member 4, and dissipate the heat to the external air environment through the heat dissipating member 4, thereby being beneficial to efficiently conducting the heat to the outside.

The heat conducting material 6 may be a layered structure, a block structure, or the like, and after the heat conducting material 6 is disposed between the metal member 21 and the heat dissipating member 4, a certain distance is provided between the heat dissipating member 4 and the metal member 21, and the distance can avoid the safety risk of electric leakage, short circuit, or the like caused by the contact between the heat dissipating member 4 and the first shielding member 3. Meanwhile, the heat conducting material 6 is also an insulating material, so that heat conduction capacity can be realized, insulation between the heat radiating piece 4 and the metal piece 21 can be realized, and electric leakage or short circuit is avoided.

In one implementation, the heat conducting material 6 may be a heat conducting gel, a heat conducting silicone grease or a heat conducting pad, which may provide the heat conducting material 6 with good heat conducting performance, and may ensure the reliability of the connection between the heat conducting material 6 and the metal member 21 and the heat dissipation member 4. Of course, in other embodiments, the heat conductive material 6 may be other materials with good heat conductivity, which is not limited in this embodiment.

In addition, fig. 3 is a schematic view of sealing the electronic device 2 by using the sheet metal housing 200, referring to fig. 3, when the electronic device 2 is disposed in the sheet metal housing 200, the electronic device 2 cannot leak from the sheet metal to the external air environment, and in order to achieve heat dissipation, it is generally considered that a first heat conducting layer 300 is disposed between the inner wall surface of the housing and the electronic device 2, and another second heat conducting layer 400 is disposed between the outer wall surface of the sheet metal housing 200 and the heat dissipation member 500, and the heat can be dissipated through the first heat conducting layer 300, the sheet metal housing 200, the second heat conducting layer 400 and the heat dissipation member 500 in sequence, that is, at least two heat conducting layers are required to conduct the heat in the sheet metal housing 200 to the heat dissipation member 500, and dissipate the heat through the heat dissipation member 500. However, the use of a double or more heat conductive layer results in an increase in heat dissipation resistance, a significant decrease in heat dissipation efficiency, and an increase in heat dissipation cost.

In this embodiment, by enabling at least part of the metal member 21 to leak from the opening 32 on the first shielding member 3, heat can be conducted from the electronic device 2 to the heat sink 4 by using only one layer of the heat conducting material 6 between the metal member 21 and the heat sink 4, and heat does not need to pass through other heat conducting materials 6 and the first shielding member 3, so that thermal resistance can be reduced and heat dissipation efficiency can be improved.

In one implementation, referring to fig. 2, the metal piece 21 includes a first portion 211 and a second portion 212, the first portion 211 protrudes from the second portion 212, at least part of the first portion 211 protrudes from the opening 32, a step 213 is formed between the second portion 212 and the first portion 211, and an edge 33 of the opening 32 overlaps the step 213.

Wherein the area of the first portion 211 is smaller than that of the second portion 212, so that the second portion 212 is formed with the step 213 at a position between the edge 33 of the second portion 212 and the edge 33 of the first portion 211, the step 213 may provide a space for connection with the first shielding member 3, that is, the first shielding member 3 may overlap the step 213 at the edge 33 of the opening 32, so as to electrically connect the first shielding member 3 with the metal member 21.

In addition, the shape and size of the opening 32 may be approximately consistent with the shape and size of the first portion 211, so that at least a portion of the first portion 211 may be ensured to pass through the opening 32, and a larger area for shielding electromagnetic radiation may be ensured, so that good heat dissipation may be achieved, and a better effect of shielding electromagnetic radiation may be obtained.

In this embodiment, the first portion 211 and the second portion 212 may be integrally formed, that is, the first portion 211 and the second portion 212 may be formed at one time during the process of forming the metal piece 21, so as to ensure the reliability of the integral structure of the metal piece 21, and facilitate the processing and manufacturing.

In one implementation, referring to fig. 2, the edge 33 of the opening 32 on the first shield 3 protrudes into the cavity 31. The edge 33 of the opening 32 may be a partial area of the first shielding member 3 adjacent to the opening 32, and this partial area may be bent into the inner cavity 31 of the first shielding member 3 by a certain angle, so that the bent portion may take an inclined posture.

In one implementation, referring to fig. 2, the electromagnetic shielding heat dissipation system further includes a second shielding member 5, the second shielding member 5 is disposed at the step 213, and the first shielding member 3 is connected with the second shielding member 5. The second shielding member 5 also has conductivity, and the second shielding member 5 may be an independent structural member and may be independently mounted on the step portion 213, so that the step portion 213 is covered integrally, thereby increasing the area of electromagnetic shielding and improving the electromagnetic shielding effect. At the same time, the electrical connection of the first shielding member 3 and the second shielding member 5 may be facilitated, and for example, the edge 33 of the first shielding member 3 at the opening 32 may be fixedly connected to the second shielding member 5, or may overlap the second shielding member 5. In this embodiment, the edge 33 of the opening 32 of the first shielding member 3 overlaps the second shielding member 5, thereby facilitating assembly of the first shielding member 3 with the electronic device 2.

In one implementation, the second shielding member 5 may be a conductive cloth, a conductive adhesive or a metal elastic sheet, so that the second shielding member 5 has better electromagnetic shielding performance, and meanwhile, the second shielding member 5 is convenient to be connected to the step portion 213.

In one implementation, fig. 4 is a schematic structural diagram of an electromagnetic shielding heat dissipation system according to another embodiment of the present application, and referring to fig. 4, the first shielding member 3 and the second shielding member 5 may be integrally formed. That is, the first shielding member 3 and the second shielding member 5 may be made of the same material, and the second shielding member 5 may be formed simultaneously during the forming process of the first shielding member 3, so that the structural strength of the connection between the first shielding member 3 and the second shielding member 5 can be ensured, and the processing and the manufacturing are facilitated. In this embodiment, the second shielding member 5 may overlap the step portion 213, that is, the state where the second shielding member 5 is in contact with the step portion 213 is maintained, without being fixedly connected by a process such as gluing, welding, etc., thereby facilitating the assembly of the first shielding member 3 with the electronic device 2.

In one implementation, the electromagnetic shielding heat dissipation system further comprises a shielding member 7, and an end of the first shielding member 3 remote from the heat dissipation member 4 is connected to the shielding member 7. Wherein, this protector 7 can be fixed connection between the radiating member 4, also can be mutual contact, and the partial heat in the appearance chamber 31 also can be conducted to the protector 7 through first shield member 3 to can distribute to outside air environment through the protector 7 in, thereby also be favorable to promoting radiating efficiency, simultaneously, this protector 7 also can provide the protection for this electromagnetic shield radiating system, increase of service life.

When the electromagnetic shielding and heat dissipating system is applied to an electronic device, the shielding member 7 can also be used for multiplexing a structure on the electronic device, for example, multiplexing a housing of the electronic device, so that a part of the structure on the housing is used as the shielding member 7, thereby being beneficial to simplifying the structure and saving the space occupied by the electromagnetic shielding and heat dissipating system in the electronic device.

In one implementation, referring to fig. 1, the electronic device 100 may include a first housing 110 and a second housing 120, where the first housing 110 may be made of a metal material, at least a portion of the first housing 110 may be used as the heat sink 4 in the electromagnetic shielding and heat dissipating system, and the second housing 120 may be made of a plastic material, at least a portion of the second housing 120 may be used as the shielding member 7 in the electromagnetic shielding and heat dissipating system, so as to facilitate simplifying the structure of the electromagnetic shielding and heat dissipating system and saving space inside the electronic device 100.

The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and variations may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims (14)

1. An electromagnetic shielding heat dissipation system, comprising:

a circuit board;

the electronic device is electrically connected to the circuit board, and a metal piece is arranged on the electronic device;

a first shield electrically connected to the circuit board, the first shield in conductive contact with the metal member; a cavity for accommodating the electronic device is arranged in the first shielding piece and is used for shielding electromagnetic radiation of the electronic device; the first shielding piece is provided with an opening, and at least part of the metal piece extends out of the opening;

and the part of the metal piece extending out of the opening is in heat conduction connection with the heat dissipation piece.

2. The electromagnetic shielding heat dissipation system of claim 1, wherein the heat sink is insulated from the circuit board and the first shield, respectively.

3. The electromagnetic shielding heat dissipation system of claim 1, wherein the metallic member comprises a first portion and a second portion, the first portion protruding from the second portion, at least a portion of the first portion protruding from the opening;

a step part is formed between the second part and the first part, and the edge of the opening is overlapped with the step part.

4. The electromagnetic shielding heat dissipation system of claim 3, wherein an edge of the opening protrudes into the cavity.

5. The electromagnetic shielding heat dissipation system of claim 3, further comprising a second shield disposed at the step, the first shield being coupled to the second shield.

6. The electromagnetic shielding heat dissipation system of claim 5, wherein the second shielding member is a conductive cloth, a conductive paste, or a metal dome.

7. The electromagnetic shielding heat dissipation system of claim 5, wherein the first shield is integrally formed with the second shield.

8. The electromagnetic shield heat dissipation system of claim 5, wherein an opening edge of the first shield overlaps the second shield.

9. The electromagnetic shield heat dissipation system of any of claims 1-8, further comprising a thermally conductive material having a side in thermally conductive contact with the metallic member and a side of the thermally conductive material remote from the metallic member in thermally conductive contact with the heat sink.

10. The electromagnetic shielding heat dissipation system of claim 9, wherein the thermally conductive material is a thermally conductive gel, a thermally conductive silicone, or a thermally conductive pad.

11. The electromagnetic shielding heat dissipation system of any of claims 1-10, wherein the material of the first shield is metal.

12. The electromagnetic shield heat dissipation system of any of claims 1-11, further comprising a shield, wherein an end of the first shield remote from the heat sink is connected to the shield.

13. An electronic device comprising the electromagnetic shielding heat dissipation system of any one of claims 1-12.

14. The electronic device of claim 13, wherein the electronic device comprises a first housing and a second housing, at least a portion of the first housing being the heat sink and at least a portion of the second housing being a shield in the electromagnetic shielding heat dissipation system.