CN220606160U

CN220606160U - Multilayer circuit board

Info

Publication number: CN220606160U
Application number: CN202322248892.4U
Authority: CN
Inventors: 梁成财; 黄昕; 曾昭雄; 于光均
Original assignee: Hefei Anhai Semiconductor Co ltd
Current assignee: Hefei Anhai Semiconductor Co ltd
Priority date: 2023-08-21
Filing date: 2023-08-21
Publication date: 2024-03-15
Anticipated expiration: 2033-08-21

Abstract

The multilayer circuit board provided by the embodiment of the utility model comprises a top-layer PCB substrate, a bottom-layer PCB substrate and a middle-layer PCB substrate group, wherein the bottom-layer PCB substrate, each middle-layer PCB substrate and the top-layer PCB substrate are stacked up and down into a whole in the sequence from bottom to top; each PCB substrate is provided with a first area, a second area and a third area, and the corresponding areas of the PCB substrates after being stacked up and down are overlapped; the first area of each PCB substrate is provided with a first through hole, and the first through holes are overlapped after the PCB substrates are stacked up and down; a winding is arranged in a second area of each middle layer PCB substrate; the upper surface of the third area of the top-layer PCB substrate and/or the lower surface of the third area of the bottom-layer PCB substrate are/is provided with a power circuit; and the power supply circuit is electrically connected with the winding. The technical problems of large size, low efficiency and high energy consumption when the conventional transformer and the power circuit are combined are solved. Low production cost and high cost performance of the product.

Description

Multilayer circuit board

Technical Field

The utility model relates to the field of circuit boards, in particular to a multilayer circuit board.

Background

The existing transformer and power circuit are separately arranged on different circuit boards, when the power circuit needs to be combined with the transformer for use, the circuit board where the transformer is positioned and the circuit board where the power circuit is positioned need to be assembled and electrically connected, and finally the finished product has large size, low efficiency and high energy consumption and is not suitable for electronic equipment with small size or thin type.

Disclosure of Invention

The multilayer circuit board provided by the embodiment of the utility model solves the technical problems of large size, low efficiency and high energy consumption when the conventional transformer and the power circuit are combined.

In order to solve the technical problems, the embodiment of the utility model provides a multi-layer circuit board, which comprises a top-layer PCB substrate, a bottom-layer PCB substrate and a middle-layer PCB substrate group, wherein the middle-layer PCB substrate group comprises at least one middle-layer PCB substrate, and the bottom-layer PCB substrate, the middle-layer PCB substrates and the top-layer PCB substrate are stacked into a whole from bottom to top in sequence;

each PCB substrate is provided with a first area, a second area and a third area, and the corresponding areas of each PCB substrate after being stacked up and down are overlapped;

the first areas of the PCB substrates are provided with first through holes, and the first through holes are overlapped after the PCB substrates are stacked up and down; the first through hole is used for installing a core column of the upper magnetic core and a core column of the lower magnetic core;

the second area of each middle-layer PCB substrate is provided with a winding, the winding surrounds a first through hole on the middle-layer PCB substrate, the windings on the middle-layer PCB substrate group comprise N primary side windings, M secondary side windings and P auxiliary side windings, N, M is an integer greater than or equal to 1, P is an integer greater than or equal to 0, all or part of the primary side windings are connected in series and/or in parallel, all or part of the secondary side windings are connected in series and/or in parallel, and all or part of the auxiliary side windings are connected in series and/or in parallel;

a power circuit is arranged on the upper surface of the third area of the top-layer PCB substrate and/or the lower surface of the third area of the bottom-layer PCB substrate; and the power supply circuit is electrically connected with the winding.

Further, a second through hole is formed in all or part of the second region of the middle-layer PCB substrate except for the windings and/or the third region, and a first electrical connector is disposed in the second through hole and is used for electrical connection between the windings.

Further, a third through hole or a first through groove is formed in the third area of all or part of the PCB substrate, and a second electric connector is arranged in the third through hole or the first through groove and is used for electrically connecting a power circuit with the winding and/or electrically connecting the power circuit inside.

Further, each PCB substrate is also provided with two symmetrically arranged fourth areas, and the corresponding fourth areas are overlapped after the PCB substrates are stacked up and down; and/or each PCB substrate is also provided with at least one fifth area, and the corresponding fifth areas are overlapped after each PCB substrate is stacked up and down.

Further, a fourth through hole or a second through groove is formed in the fourth area of each PCB substrate, the corresponding fourth through hole or the corresponding second through groove is overlapped after the PCB substrates are stacked up and down, and the fourth through hole and the second through groove are used for installing auxiliary parts of the upper magnetic core and the lower magnetic core.

Further, a fifth through hole or a third through slot is formed in the fifth area of each PCB substrate, and the corresponding fifth through hole or the corresponding third through slot after stacking the PCB substrates up and down is overlapped, and the fifth through hole and the third through slot are used for installing components in the power circuit.

Further, the first region is located in the middle of each PCB substrate, the second region is annular surrounding the first region, the fourth region is symmetrically disposed on two sides of an outer ring of the second region and is matched with the outer ring of the second region in shape, the fifth region is disposed at the edge of each PCB substrate, and the third region is disposed between the fourth region and the fifth region.

Further, the power supply circuit comprises a power supply input circuit, a main control circuit, a first switch element circuit and a power supply output circuit, wherein,

the input end of the power input circuit is connected with an external power signal, and the output end of the power input circuit is connected with the first input end of the main control circuit and the input end of the primary winding; the power input circuit is used for processing the external power signal to obtain a first direct current power signal;

the first output end of the main control circuit is connected with the output end of the primary winding through the first switching element circuit; the main control circuit generates a switch control signal according to signals received by each input end of the main control circuit, and the on-off of the first switch element circuit is controlled by the switch control signal;

the power output circuit is connected with the secondary winding and is used for processing a second direct current power signal output by the secondary winding to obtain a direct current supply signal and supplying power to an external load.

Further, the power supply circuit further comprises an output feedback circuit, wherein,

the input end of the output feedback circuit is connected with the secondary winding, the output end of the output feedback circuit is connected with the second input end of the main control circuit, and the output feedback circuit is used for generating a feedback signal according to a second direct current power supply signal output by the secondary winding and transmitting the feedback signal to the second input end of the main control circuit.

Further, the power supply circuit further comprises an auxiliary circuit, wherein the input end of the auxiliary circuit is connected with the auxiliary side winding, and the output end of the auxiliary circuit is connected with the third input end of the main control circuit.

Advantageous effects

The multilayer circuit board provided by the embodiment of the utility model has the advantages that the windings of the transformer, the magnetic core units for installing the transformer and the power supply circuit are arranged on the same multilayer circuit board, the integration of the transformer and the power supply circuit is realized, the size of a finished product is small, the thickness is thin, the efficiency is high, the energy consumption is small, and the multilayer circuit board is suitable for electronic equipment with small size or thin type. Low production cost and high cost performance of the product.

Additional features and corresponding advantages of the utility model will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the utility model.

Drawings

Fig. 1 is a schematic diagram of a multi-layer circuit board according to a second embodiment of the present utility model;

fig. 2 is a schematic diagram of a power integration module according to a second embodiment of the utility model;

fig. 3 is a schematic diagram of a magnetic core unit according to a second embodiment of the present utility model.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the following detailed description of the embodiments of the present utility model is given with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

Embodiment one:

the following describes the embodiments of the present utility model in further detail. The embodiment provides a multilayer circuit board, which mainly comprises a top layer PCB substrate, a bottom layer PCB substrate and a middle layer PCB substrate group, wherein the middle layer PCB substrate group comprises at least one middle layer PCB substrate, and the bottom layer PCB substrate, each middle layer PCB substrate and the top layer PCB substrate are stacked up and down into a whole in the sequence from bottom to top;

the first area of each PCB substrate is provided with a first through hole, and the first through holes are overlapped after the PCB substrates are stacked up and down; the first through hole is used for installing a core column of the upper magnetic core and a core column of the lower magnetic core;

the second area of each middle layer PCB substrate is provided with a winding, the winding surrounds a first through hole on the middle layer PCB substrate, the winding on the middle layer PCB substrate group comprises N primary side windings, M secondary side windings and P auxiliary side windings, N, M is an integer greater than or equal to 1, P is an integer greater than or equal to 0, all or part of the primary side windings are connected in series and/or in parallel, all or part of the secondary side windings are connected in series and/or in parallel, and all or part of the auxiliary side windings are connected in series and/or in parallel;

the upper surface of the third area of the top-layer PCB substrate and/or the lower surface of the third area of the bottom-layer PCB substrate are/is provided with a power circuit; and the power supply circuit is electrically connected with the winding.

After the bottom layer PCB substrate, each middle layer PCB substrate and the top layer PCB substrate are stacked up and down into a whole in the sequence from bottom to top, the surface of the top layer PCB substrate and the bottom layer PCB substrate, on which the power circuit is manufactured, faces outwards.

In some embodiments, each PCB substrate is a PCB substrate of the same shape and size. The first region, the second region, the third region, the fourth region, and the fifth region may be artificially defined on each PCB substrate, and each region on the same PCB substrate is not overlapped with each other.

The winding is mainly arranged on the middle layer PCB substrate, the upper surface of the top layer PCB substrate and the lower surface of the bottom layer PCB substrate are exposed parts of each PCB substrate after being stacked up and down in sequence, and the power supply circuit is arranged on the upper surface of the top layer PCB substrate and/or the lower surface of the bottom layer PCB substrate.

The first through hole may be provided by punching. The first through hole penetrates through the thickness of the whole PCB substrate. The first through hole is mainly used for installing a core column of an upper magnetic core and a core column of a lower magnetic core of the transformer, and the core column of the magnetic core and the core column of the lower magnetic core are attached in the first through hole. The cross-sectional shape of the first through-hole may be determined according to the shapes of the legs of the upper and lower cores of the transformer, and the cross-sectional shape of the first through-hole includes, but is not limited to, circular, square.

Windings of the second region of each intermediate layer PCB substrate, including but not limited to the following: the coil which is manufactured on the upper surface of the middle-layer PCB substrate and is in a surrounding shape can be printed by copper foil wires, and the coil can be in a flat shape. The windings may be primary, secondary or auxiliary.

For the middle layer PCB substrate group, the windings may include N primary side windings, M secondary side windings, and P secondary side windings, N, M is an integer greater than or equal to 1, and P is an integer equal to 0 or greater than 0.

All or part of the primary windings are connected in series and/or in parallel to form a primary winding unit, namely the primary winding unit comprises a single primary winding or comprises two or more primary windings connected in series and/or in parallel; all or part of the secondary windings are connected in series and/or in parallel to form a secondary winding unit, namely the secondary winding unit comprises a single secondary winding or comprises two or more secondary windings connected in series and/or in parallel; all or part of the auxiliary side windings are connected in series and/or in parallel to form an auxiliary side winding unit, i.e. the auxiliary side winding unit comprises a single auxiliary side winding or comprises two or more auxiliary side windings connected in series and/or in parallel.

The primary winding unit is coupled to the secondary winding unit, and the secondary winding unit may be coupled to the secondary winding unit. The primary winding unit and the secondary winding unit may be alternately stacked. The auxiliary side winding units and the auxiliary side winding units may be alternately stacked. The primary and auxiliary windings may be provided on the same intermediate layer PCB substrate. The middle layer PCB substrate group is provided with at least one primary winding unit and at least one secondary winding unit, and the secondary winding units can be arranged or not.

In some embodiments, a second through hole is provided in all or part of the second region of the middle layer PCB substrate except for the windings, and/or a third region, and a first electrical connector is provided in the second through hole, the first electrical connector being used for electrical connection between windings, and serial connection and/or parallel connection between windings is achieved. Such as series and/or parallel connection between primary windings in the primary winding unit and series and/or parallel connection between secondary windings in the secondary winding unit. The first electrical connection may be a metal line or be realized by copper deposition in the second via. The aperture, shape and number of the second through holes are determined according to actual needs.

In some embodiments, a third through hole or a first through slot is provided on a third area of all or part of the PCB substrate, and a second electrical connector is provided in the third through hole or the first through slot, the second electrical connector being used for electrical connection of the power supply circuit with the winding and/or internal electrical connection of the power supply circuit. For example, an electrical connection between the power supply circuit and the primary winding unit, the secondary winding unit and/or the auxiliary winding unit is achieved. For example, the electric connection between the electric connection line of the power input unit, the electric connection line of the main control unit, the electric connection line of the first switch element and the electric connection line of the power output unit in the power circuit is realized. The second electrical connection may be a metal wire or be realized by copper deposition in the third via, the first via. The aperture, shape and quantity of the third through hole and the first through groove are determined according to actual needs.

In some embodiments, each PCB substrate further has two symmetrically disposed fourth regions, and the corresponding fourth regions overlap after each PCB substrate is stacked up and down; and/or each PCB substrate is also provided with at least one fifth area, and the corresponding fifth areas are overlapped after each PCB substrate is stacked up and down. The fourth region is mainly used for mounting the magnetic core unit. The fifth area is mainly used for mounting components in the power supply circuit.

In some embodiments, a fourth region of each PCB substrate is provided with a fourth through hole or a second through slot, and the corresponding fourth through hole or the corresponding second through slot of each PCB substrate after stacking up and down overlaps, and the fourth through hole and the second through slot are used for installing the auxiliary parts of the upper magnetic core and the lower magnetic core. The fixed mounting of the magnetic core unit is facilitated, and meanwhile, the electromagnetic induction efficiency between the magnetic core unit and the winding is improved.

In some embodiments, a fifth through hole or a third through slot is disposed in a fifth area of each PCB substrate, and the corresponding fifth through hole or the corresponding third through slot of each PCB substrate after stacking up and down is overlapped, and the fifth through hole and the third through slot are used for mounting components in the power circuit. Components include, but are not limited to, chips, resistors, capacitors, etc.

In some embodiments, the first region is located in the middle of each PCB substrate, the second region is annular around the first region, the fourth region is symmetrically disposed on two sides of an outer ring of the second region and is adapted to the shape of the outer ring of the second region, the fifth region is disposed at an edge of each PCB substrate, and the third region is disposed between the fourth region and the fifth region.

In some embodiments, the power supply circuit includes a power input circuit, a master circuit, a first switching element circuit, and a power output circuit, wherein,

the input end of the power input circuit is connected with an external power signal, and the output end of the power input circuit is connected with the first input end of the main control circuit and the input end of the primary winding; the power input circuit is used for processing the external power signal to obtain a first direct-current power signal;

the first output end of the main control circuit is connected with the output end of the primary winding through a first switching element circuit; the main control circuit generates a switch control signal according to signals received by the input ends of the main control circuit, and the first switch element circuit is controlled to be turned on or off by the switch control signal;

the power output circuit is connected with the secondary winding and is used for processing the second direct current power supply signal output by the secondary winding to obtain a direct current supply signal and supplying power to the external load.

In some embodiments, the power supply circuit further comprises an output feedback circuit, wherein,

In some embodiments, the power circuit further comprises an auxiliary circuit, wherein an input of the auxiliary circuit is connected to the auxiliary side winding and an output of the auxiliary circuit is connected to a third input of the main control circuit. The auxiliary circuit may include: the third resistor, the second diode and the first filter circuit are connected in series. The output end of the auxiliary circuit can be connected with the second input end of the main control circuit through a second capacitor.

In some embodiments, the power supply circuit further comprises a snubber circuit connected between the input and output of the primary winding; the buffer circuit may comprise a first diode, a first circuit and a second circuit connected in series, wherein the first circuit comprises one first resistor, or at least two first resistors connected in parallel; the second circuit comprises at least one second resistor and at least one first capacitor which are connected in parallel.

In some embodiments, the power input circuit may include an over-current protection circuit, a filtering circuit, a safety protection circuit, and/or a rectifying circuit.

The embodiment of the utility model also provides a power supply integrated module which mainly comprises the multilayer circuit board provided by the embodiment of the utility model, a magnetic core unit and at least one component,

the magnetic core unit comprises an upper magnetic core and a lower magnetic core, the upper magnetic core and the lower magnetic core respectively comprise a bottom plate, a core column arranged in the middle of the bottom plate and auxiliary parts arranged on two sides of the bottom plate, the upper magnetic core and the lower magnetic core are correspondingly and symmetrically arranged on the multilayer circuit board, and the core column of the upper magnetic core and the core column of the lower magnetic core are accommodated in the first through hole and are attached;

the components are mounted in the power supply circuit of the upper surface of the third region of the top-layer PCB substrate and/or the lower surface of the third region of the bottom-layer PCB substrate.

In some embodiments, the auxiliary portion of the magnetic core unit is mounted in a fourth through hole or a second through slot of a fourth region of the multilayer circuit board.

In some embodiments, the component is mounted in a fifth through hole or a third through slot of a fifth region of the multilayer circuit board.

Embodiment two:

specific embodiments of the present utility model will be described in further detail below with reference to the accompanying drawings and examples of implementation. Fig. 1 is a schematic diagram of a multi-layer circuit board according to a second embodiment of the present utility model, where the multi-layer circuit board mainly includes: the top layer PCB substrate 21, the bottom layer PCB substrate 22 and the middle layer PCB substrate group, wherein the middle layer PCB substrate group comprises two middle layer PCB substrates 23, and the bottom layer PCB substrate 22, each middle layer PCB substrate 23 and the top layer PCB substrate 21 are stacked into a whole from bottom to top; each PCB substrate is provided with a first area, a second area B, a third area C, a fourth area and a fifth area, and the corresponding areas of the PCB substrates after being stacked up and down are overlapped;

a first region of each PCB substrate is provided with a first through hole A, and the first through holes A are overlapped after the PCB substrates are stacked up and down; the first through hole A is used for installing a core column of the upper magnetic core and a core column of the lower magnetic core;

the second area of each intermediate layer PCB substrate 23 is provided with windings (not shown in the figure) around which the windings are wound in a first through hole a, in this embodiment, the windings on the intermediate layer PCB substrate group comprise 1 primary side winding, 1 secondary side winding and 1 secondary side winding, the primary side winding and the secondary side winding are provided on the same intermediate layer PCB substrate 23, and the secondary side winding is provided on another intermediate layer PCB substrate 23;

the upper surface of the third region C of the top PCB substrate 21 and the lower surface (not shown) of the third region of the bottom PCB substrate 22 are provided with a power circuit (not shown);

a fourth through hole D1 and a second through groove D2 are symmetrically arranged in a fourth area of each PCB substrate, the corresponding fourth through hole D1 and the corresponding second through groove D2 are overlapped after the PCB substrates are stacked up and down, and the fourth through hole D1 and the second through groove D2 are used for installing auxiliary parts of an upper magnetic core and a lower magnetic core;

a fifth area of each PCB substrate is provided with a third through slot E, the corresponding third through slots E are overlapped after the PCB substrates are stacked up and down, and the third through slots E are used for installing components in a power circuit;

the first area is positioned in the middle of each PCB substrate, the second area B is annular surrounding the first area, the fourth area is symmetrically arranged on two sides of the outer ring of the second area B and is matched with the outer ring of the second area B in shape, the fifth area is arranged at the edge of each PCB substrate, and the third area C is arranged between the fourth area and the fifth area;

a third through hole C1 is provided in the third region C of each PCB substrate, and a second electrical connector (not shown) is provided in the third through hole C1, and a part of the second electrical connector is used for electrically connecting the power circuit with the winding and another part of the second electrical connector is used for electrically connecting the power circuit internally.

Fig. 2 is a schematic diagram of a power integrated module according to a second embodiment of the present utility model, where the power integrated module mainly includes a multilayer circuit board shown in fig. 1, and further includes: a magnetic core unit and a plurality of components;

the magnetic core unit comprises an upper magnetic core and a lower magnetic core, the upper magnetic core and the lower magnetic core have the same structure, and as shown in fig. 3, the upper magnetic core and the lower magnetic core respectively comprise a bottom plate 41, a core column 42 arranged in the middle of the bottom plate 41 and auxiliary parts 43 arranged at two sides of the bottom plate 41; the stem 42 is cylindrical and is adapted to the shape of the first through hole a shown in fig. 1; the auxiliary portion 43 is in a beam shape; the core unit has 6 pins, respectively: VCC pin, HMOS pin, H+ pin, AGND pin, GND pin, V+; the 6 pins are connected with the multi-layer PCB circuit board.

The upper magnetic core and the lower magnetic core are symmetrically arranged on the multilayer circuit board, and core columns 42 of the upper magnetic core and the lower magnetic core are accommodated in the first through hole A for lamination; the auxiliary portion 43 is accommodated in the fourth through hole D1 and the second through groove D2 of the fourth region;

part of the components are arranged in the third through groove E arranged in the fifth area, and part of the components are arranged on the upper surface of the third area C of the top-layer PCB substrate 21 and the lower surface (not shown in the figure) of the third area of the bottom-layer PCB substrate 22, and are connected with a power circuit; the components include: diode 31, rectifier bridge 32, chip inductor 33, electrolytic capacitor 34, interface 35, etc.

The multilayer circuit board and the power supply integrated module provided by the embodiment of the utility model have the advantages that the windings of the transformer, the magnetic core units for installing the transformer and the power supply circuit are arranged on the same multilayer circuit board, the integration of the transformer and the power supply circuit is realized, the size of a finished product is small, the thickness is thin, the efficiency is high, the energy consumption is small, and the multilayer circuit board and the power supply integrated module are suitable for electronic equipment with small size or thin. Low production cost and high cost performance of the product.

The foregoing is a further detailed description of embodiments of the utility model in connection with the specific embodiments, and it is not intended that the utility model be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the utility model, and these should be considered to be within the scope of the utility model.

Claims

1. The multi-layer circuit board is characterized by comprising a top-layer PCB substrate, a bottom-layer PCB substrate and a middle-layer PCB substrate group, wherein the middle-layer PCB substrate group comprises at least one middle-layer PCB substrate, and the bottom-layer PCB substrate, the middle-layer PCB substrates and the top-layer PCB substrate are stacked into a whole from bottom to top in sequence;

2. The multilayer circuit board of claim 1, wherein all or part of the second region of the intermediate layer PCB substrate except for the windings and/or the third region is provided with a second via in which a first electrical connector is provided for inter-winding electrical connection.

3. The multi-layer circuit board of claim 1, wherein a third through hole or a first through slot is provided on the third area of all or part of the PCB substrate, and a second electrical connector is provided in the third through hole or the first through slot, and the second electrical connector is used for electrically connecting the power circuit with the winding and/or electrically connecting the power circuit internally.

4. The multi-layer circuit board of claim 1, wherein each PCB substrate further has two symmetrically disposed fourth regions, and the corresponding fourth regions overlap after each PCB substrate is stacked up and down; and/or each PCB substrate is also provided with at least one fifth area, and the corresponding fifth areas are overlapped after each PCB substrate is stacked up and down.

5. The multi-layered circuit board of claim 4, wherein the fourth region of each PCB substrate is provided with a fourth through hole or a second through slot, and the corresponding fourth through hole or the corresponding second through slot of each PCB substrate after being stacked up and down is overlapped, the fourth through hole and the second through slot being used for mounting the auxiliary portions of the upper core and the lower core.

6. The multi-layered circuit board of claim 4, wherein the fifth region of each PCB substrate is provided with a fifth through hole or a third through slot, and the corresponding fifth through hole or the corresponding third through slot of each PCB substrate after being stacked one above the other is overlapped, and the fifth through hole or the third through slot is used for mounting components in a power circuit.

7. The multi-layer circuit board of claim 4, wherein the first region is located in the middle of each PCB substrate, the second region is ring-shaped around the first region, the fourth region is symmetrically disposed at two sides of an outer ring of the second region and is adapted to the shape of the outer ring of the second region, the fifth region is disposed at an edge of each PCB substrate, and the third region is disposed between the fourth region and the fifth region.

8. The multi-layer circuit board of any one of claim 1 to 7, wherein the power supply circuit comprises a power supply input circuit, a main control circuit, a first switching element circuit, and a power supply output circuit, wherein,

9. The multi-layer circuit of claim 8, wherein the power circuit further comprises an output feedback circuit, wherein,

10. The multi-layer circuit board of claim 8, wherein the power circuit further comprises an auxiliary circuit, wherein an input of the auxiliary circuit is coupled to the auxiliary side winding and an output of the auxiliary circuit is coupled to a third input of the main circuit.