CN220585199U - Wafer baking device - Google Patents
Wafer baking device Download PDFInfo
- Publication number
- CN220585199U CN220585199U CN202323474891.8U CN202323474891U CN220585199U CN 220585199 U CN220585199 U CN 220585199U CN 202323474891 U CN202323474891 U CN 202323474891U CN 220585199 U CN220585199 U CN 220585199U
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- wafer
- infrared heater
- process chamber
- support plate
- plate
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- 238000000034 method Methods 0.000 claims abstract description 29
- 230000008569 process Effects 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 abstract description 25
- 230000005855 radiation Effects 0.000 abstract description 7
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 28
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The application relates to the technical field of semiconductor material processing, in particular to a wafer baking device. Comprising the following steps: a process chamber; the infrared heater is arranged in the process chamber, and the temperature controller and the temperature sensor are connected with the infrared heater; the temperature controller controls the infrared heater according to feedback of the temperature sensor; the process chamber is a vacuum chamber. The wafer is baked by the infrared heater in a heat radiation mode, the heat radiation has good directivity and penetrability, the surface and the inside of the wafer can be uniformly heated at the same time, and the wafer deformation caused by uneven heat can be avoided. Compared with the heating pipe and heating wire baking mode in the prior art, the heating pipe and heating wire baking mode can quickly raise the temperature without heating an intermediate tool, and the heat conversion efficiency is improved. The temperature sensor, the temperature controller and the infrared heater form closed-loop control, so that the accurate regulation and control of the baking temperature can be realized.
Description
Technical Field
The application relates to the technical field of semiconductor material processing, in particular to a wafer baking device.
Background
With the rapid development of the semiconductor industry, a wafer surface needs to be cleaned by a heating and baking method before a plurality of key processes, so that the cleanliness of the wafer is improved to meet the process requirements.
The existing heating and baking equipment mainly adopts materials such as heating pipes or metal electric heating wires, designs the heating sources and the wafer supporting tool into a whole, and adopts a heat transfer mode for baking and heating. In the existing heating mode, the heating source needs to heat the supporting tool before transferring the supporting tool to the wafer, so that the heat conversion utilization efficiency is low, the power consumption is high, the temperature is uneven, and the temperature control is difficult.
Disclosure of Invention
The utility model aims to provide a wafer baking device which improves baking efficiency and precisely controls baking temperature.
To achieve the purpose, the utility model adopts the following technical scheme:
a wafer baking apparatus comprising: a process chamber;
an infrared heater disposed within the process chamber;
a temperature controller and a temperature sensor connected with the infrared heater;
the temperature controller controls the infrared heater according to feedback of the temperature sensor;
the process chamber is a vacuum chamber.
Further, a support structure is arranged in the process chamber and is used for bearing the infrared heater and the wafer.
Further, the supporting structure comprises a bottom plate, a first support plate and a top plate which are sequentially arranged from bottom to top;
the bottom plate, the first support plate and the top plate are connected through the second support leg.
Further, the first support plate is adjustable in distance relative to the bottom plate and/or the top plate.
Further, the first support plate is used for placing an infrared heater.
Further, the device also comprises a second support plate;
the second support plate is arranged between the first support plate and the top plate, or between the first support plate and the bottom plate.
Further, the second support plate is connected with the bottom plate or the top plate through a first support leg.
Further, the second support plate is used for placing a wafer.
Further, the number of the infrared heaters is plural.
Further, the infrared heaters are respectively provided with an independent temperature controller and an independent temperature sensor.
The utility model has the beneficial effects that:
the wafer baking device provided by the application is used for baking the wafer through the infrared heater in a heat radiation mode, the heat radiation has good directivity and penetrability, the surface and the inside of the wafer can be uniformly heated at the same time, and the wafer deformation caused by nonuniform heat can be avoided. Compared with the heating pipe and heating wire baking mode in the prior art, the heating pipe and heating wire baking mode can quickly raise the temperature without heating an intermediate tool, and the heat conversion efficiency is improved. The temperature sensor, the temperature controller and the infrared heater form closed-loop control, so that the temperature of the wafer can be monitored in real time, the heating temperature is regulated, the wafer is directly heated by the infrared heater in a heat radiation mode, the heater is closed, and the heating can be directly stopped, so that the accurate temperature control is realized. The distance between the first support plate for bearing the infrared heater and the top plate and/or the bottom plate is adjustable so as to adapt to different baking processes.
Drawings
FIG. 1 is a schematic view of a wafer baking apparatus according to the present utility model;
FIG. 2 is a schematic view of a support structure within a process chamber of the present utility model;
in the figure: 1. supporting the box body; 2. a process chamber; 3. a process chamber door; 4. a control system; 5. a bottom plate; 6. a first support plate; 7. a top plate; 8. a first leg; 9. an infrared heater; 10. a wafer; 11. a second leg; 12. and a second support plate.
Detailed Description
The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.
In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
Referring to fig. 1-2, the present embodiment provides a wafer baking apparatus, which includes a supporting box 1, and a vacuum breaking system can be placed in the supporting box 1. The supporting box body 1 is provided with a process chamber 2, the process chamber 2 is provided with a process chamber door 3, and when the process chamber door 3 is closed, a vacuum state can be formed in the process chamber 2. The process chamber door 3 is provided with an observation window for observing the conditions in the process chamber.
As an embodiment, the process chamber 2 is provided with a control system 4, and the control system 4 comprises a temperature control system for regulating and controlling the baking temperature, and an atmosphere control system for preparing an atmosphere environment.
In the wafer baking apparatus provided in this embodiment, a support structure for carrying an infrared heater and a wafer is disposed in the process chamber 2.
As an embodiment, the support structure comprises a bottom plate 5, a first support plate 6 and a top plate 7 arranged in sequence from bottom to top. The bottom plate 5, the first support plate 6 and the top plate 7 can be a whole plate or a plurality of plates.
As an embodiment, the bottom plate 5, the first support plate 6, and the top plate 7 are connected by the second leg 11. The second supporting leg 11 is preferably 4 cylindrical legs, and the bottom plate 5, the first supporting plate 6 and the top plate 7 are respectively provided with mounting holes matched with the cylindrical legs.
As an embodiment, the first support plate 6 is arranged with an adjustable distance relative to the bottom plate 5 and/or the top plate 7.
As an embodiment, the support structure further comprises a second support plate 12, wherein the second support plate 12 is arranged between the first support plate 6 and the top plate 7, or the second support plate 12 is arranged between the first support plate 6 and the bottom plate 5. The second support plate 12 is connected to the bottom plate 5 or the top plate 7 by the first support leg 8.
The first support plate 6 is used for placing the infrared heater 9, and the second support plate 12 is used for placing the wafer 10. That is, the wafer 10 may be disposed above the infrared heater 9 or may be disposed below the infrared heater 9.
As an embodiment, a plurality of infrared heaters, for example, 4, 8 or more, may be provided in the process chamber, and may be arranged according to the size of the process chamber and the number of baked wafers. The plurality of infrared heaters 9 are respectively provided with an independent temperature controller and a temperature sensor. The control system 4 respectively controls the independent infrared heater to start or stop heating according to the measured value of the temperature sensor so as to realize the accurate control of the baking temperature of the wafer.
The wafer 10 is baked by the infrared heater 9 in a heat radiation manner, the heat radiation has good directivity and penetrability, the surface and the inside of the wafer can be uniformly heated at the same time, and the wafer deformation caused by nonuniform heat can be avoided. Compared with the heating pipe and heating wire baking mode in the prior art, the heating pipe and heating wire baking mode can quickly raise the temperature without heating an intermediate tool, and the heat conversion efficiency is improved.
It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.
Claims (10)
1. Wafer baking equipment, its characterized in that includes: a process chamber;
an infrared heater disposed within the process chamber;
a temperature controller and a temperature sensor connected with the infrared heater;
the temperature controller controls the infrared heater according to feedback of the temperature sensor;
the process chamber is a vacuum chamber.
2. The wafer baking apparatus according to claim 1, wherein: and a supporting structure is arranged in the process chamber and is used for bearing the infrared heater and the wafer.
3. The wafer baking apparatus according to claim 2, wherein: the supporting structure comprises a bottom plate, a first support plate and a top plate which are sequentially arranged from bottom to top;
the bottom plate, the first support plate and the top plate are connected through the second support leg.
4. A wafer baking apparatus according to claim 3, wherein: the first support plate is adjustable in distance relative to the bottom plate and/or the top plate.
5. The wafer baking apparatus according to claim 4, wherein: the first support plate is used for placing an infrared heater.
6. The wafer baking apparatus according to claim 5, wherein: the second support plate is also included;
the second support plate is arranged between the first support plate and the top plate, or between the first support plate and the bottom plate.
7. The wafer baking apparatus according to claim 6, wherein: the second support plate is connected with the bottom plate or the top plate through the first support leg.
8. The wafer baking apparatus according to claim 7, wherein: the second support plate is used for placing a wafer.
9. The wafer baking apparatus according to claim 8, wherein: the number of the infrared heaters is a plurality.
10. The wafer baking apparatus according to claim 9, wherein: the infrared heaters are respectively provided with an independent temperature controller and an independent temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323474891.8U CN220585199U (en) | 2023-12-20 | 2023-12-20 | Wafer baking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323474891.8U CN220585199U (en) | 2023-12-20 | 2023-12-20 | Wafer baking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220585199U true CN220585199U (en) | 2024-03-12 |
Family
ID=90121043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323474891.8U Active CN220585199U (en) | 2023-12-20 | 2023-12-20 | Wafer baking device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220585199U (en) |
-
2023
- 2023-12-20 CN CN202323474891.8U patent/CN220585199U/en active Active
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