CN220584343U - Non-probe contact type chip test structure - Google Patents
Non-probe contact type chip test structure Download PDFInfo
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- CN220584343U CN220584343U CN202321908507.8U CN202321908507U CN220584343U CN 220584343 U CN220584343 U CN 220584343U CN 202321908507 U CN202321908507 U CN 202321908507U CN 220584343 U CN220584343 U CN 220584343U
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- base
- chip
- test structure
- probe contact
- chip test
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- 238000012360 testing method Methods 0.000 title claims abstract description 29
- 239000000523 sample Substances 0.000 title claims abstract description 20
- 230000000149 penetrating effect Effects 0.000 claims abstract description 6
- 238000005299 abrasion Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The application relates to a non-probe contact chip test structure, which comprises: the base is provided with a placing groove in a penetrating way; the flexible insulating board, it has a plurality of conductive posts to link up the array on the flexible insulating board, the conductive post is fixed in the base bottom surface so that conductive post corresponds the chip carrier with the standing groove, open at the chip carrier middle part has the contact groove, the chip carrier is fixed and is used for placing the chip above the standing groove. The application can effectively reduce the abrasion of the conductive column and the contact point of the chip, and is simple and convenient to assemble and disassemble.
Description
Technical Field
The application relates to the technical field of chip testing, in particular to a non-probe contact type chip testing structure.
Background
The chip test is the last procedure in the chip processing production process, and is also the procedure of the comparison core, the conventional chip test seat is provided with a conductive structure which is responsible for communicating the corresponding contact point on the chip with the test point on the PCB board, thereby realizing the detection of the chip performance,
at present, the probe type test structure is complex to install, and in the use process, because the probe frequently abuts against a chip test point or a PCB test point, the problems of abrasion and the like are easy to occur, the process of replacing the probe is also complex, and the whole use is inconvenient.
Disclosure of Invention
In order to solve the technical problem, the application provides a non-probe contact type chip test structure which has the advantages of being capable of effectively reducing abrasion, simple in disassembly and assembly and convenient to operate.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
a non-probe contact chip test structure, comprising:
the base is provided with a placing groove in a penetrating way;
the flexible insulating plate is provided with a plurality of conductive columns in a penetrating array, and the conductive columns are fixed on the bottom surface of the base so that the conductive columns correspond to the placing grooves;
the chip seat, open at the chip seat middle part has the contact groove, the chip seat is fixed and is used for placing the chip above the standing groove.
According to the technical scheme, when the chip is tested, the PCB is mounted on the bottom surface of the base, the test point of the PCB is correspondingly abutted to the bottom surface of the conductive column of the insulating plate, then the chip is placed in the contact groove to enable the chip to be in contact with the top surface of the conductive column, and therefore chip signal transmission is achieved.
As one optional embodiment of the application, a frame is arranged on the periphery of the insulating plate, and a magnetic attraction piece is arranged on the frame and used for being adsorbed and fixed on the base.
By means of the technical scheme, operation processes such as maintenance and replacement of the insulating plate and the conductive column are greatly saved, and convenience in the operation process is improved.
As one optional embodiment of the application, the bottom surface of the base is provided with a guide post, and the frame is provided with a guide hole corresponding to the guide post.
As one optional embodiment of the application, a step is arranged on the base, a plurality of magnetic attraction posts are arranged on the step, a magnetic attraction hole is formed in the bottom surface of the chip seat, and the magnetic attraction posts are in plug-in fit in the magnetic attraction hole.
As one optional embodiment of the chip holder, the step is provided with a positioning column, and the bottom surface of the chip holder is correspondingly provided with a positioning hole which is in plug-in fit with the positioning column.
As one optional embodiment of the application, the device further comprises a base, wherein a protruding portion is arranged on the base, the base is fixed on the protruding portion through a bolt, and a gap is reserved between the base and the surface of the protruding portion.
According to the technical scheme, the base and the protruding portion can be conveniently detached, so that the PCB and the insulating plate can be conveniently taken, placed and installed, the operation convenience is improved, and a gap is reserved between the base and the protruding portion, so that heat dissipation is facilitated.
As an alternative embodiment of the present application, the bottom surface of the base is provided with a plurality of legs.
As one of the optional embodiments of the present application, a bearing platform is provided on the surface of the base for temporarily placing the chip.
In summary, the present application includes at least one of the following beneficial technical effects:
1. through setting up flexible insulation board and the conductive column on the insulation board can effectively reduce the wearing and tearing to chip or PCB board, improves life and utilize magnetism to inhale the structure very simple and convenient when changing, improves the simple operation nature.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is an overall block diagram of a non-probe contact chip test structure;
FIG. 2 is a schematic view mainly used for showing the surface structure of the susceptor;
fig. 3 is an exploded structural view mainly for illustrating a mounting structure of a chip carrier and an insulating board.
Reference numerals: 1. a base; 2. a placement groove; 3. an insulating plate; 4. a conductive post; 5. a chip holder; 6. a contact groove; 7. a frame; 8. a magnetic attraction piece; 9. a positioning column; 10. a step; 11. a magnetic suction column; 12. a guide hole; 13. a base; 14. a boss; 15. a support leg; 16. a load-bearing platform; 161. an avoidance groove; 17. a pressing mechanism.
Detailed Description
The present application is described in further detail below in conjunction with figures 1-3.
Referring to fig. 1, in order to disclose a non-probe contact chip testing structure according to the embodiments of the present application, the non-probe contact chip testing structure includes a flat base 13, rectangular supporting legs 15 are disposed at four corners of a bottom surface of the base 13, and are used for being placed on a carrier during testing, a carrying platform 16 is further disposed on a surface of the base 13, a certain distance is formed between a plane of the carrying platform 16 and a surface of the base 13, the carrying platform 16 is used for temporarily placing a tool or a chip product to be tested, and an avoidance groove 161 is formed on the carrying platform 16 and is used for placing a main component of a test chip.
Referring to fig. 2 and 3, the test structure further includes a rectangular boss 14 disposed on the base 13, the surface of the boss 14 is bolted to the base 1, a gap is provided between the base 1 and the surface of the boss 14, and the base 1 is perforated with a plurality of placement grooves 2, so that for facilitating simultaneous testing of a plurality of chips, the placement grooves 2 are configured in this example, and in other alternative embodiments, a pressing mechanism 17 is further configured corresponding to each placement groove 2. The periphery of the placing groove 2 is provided with a step 10, the chip seat 5 is placed on the step 10, the middle part of the chip seat 5 is provided with a contact groove 6, the contact groove 6 is communicated with the placing groove 2, the bottom surface of the base 1 is connected with a flexible insulating plate 3, a plurality of conductive columns 4 are arranged on the flexible insulating plate 3 in a penetrating mode, the conductive columns 4 are fixed on the bottom surface of the base 1 so that the conductive columns 4 correspond to the placing groove 2, the insulating plate 3 is fixed on the bottom surface of the base 1, a PCB (printed circuit board) is fixed on one side surface of the insulating plate 3, which faces away from the chip seat 5, after the chip seat 5 is arranged on the step 10, a chip is placed in the contact groove 6, the corresponding contact point of the chip can be contacted with the conductive columns 4, so that a detection process that signals finally flow from the chip to the PCB through the conductive columns 4 is realized, a gap is reserved between the surface of the base 1 and the protruding part 14, so that heat is convenient to be dissipated, and meanwhile, the detachment between the protruding part 14 and the base 1 is also convenient.
Referring to fig. 2 and 3, a frame 7 is arranged on the periphery of the insulating plate 3, a magnetic attraction piece 8 is arranged on the frame 7 and used for being adsorbed and fixed on the base 1, a guide column is arranged on the bottom surface of the base 1, and a guide hole 12 is arranged on the frame 7 corresponding to the guide column, so that the insulating plate 3 can be conveniently assembled and disassembled; the ladder 10 is provided with a plurality of magnetic attraction posts 11, the bottom surface of the chip seat 5 is provided with a magnetic attraction hole, the magnetic attraction posts 11 are in plug-in fit in the magnetic attraction hole, the ladder 10 is provided with alignment posts 9, and the bottom surface of the chip seat 5 is correspondingly provided with alignment holes in plug-in fit with the alignment posts 9, so that the chip seat 5 can be conveniently and rapidly disassembled and assembled.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (8)
1. A non-probe contact chip test structure, comprising:
the base (1) is provided with a placing groove (2) in a penetrating way;
the flexible insulating plate (3) is provided with a plurality of conductive columns (4) in a penetrating array on the insulating plate (3), and the conductive columns (4) are fixed on the bottom surface of the base (1) so that the conductive columns (4) correspond to the placing grooves (2);
the chip holder (5), open at chip holder (5) middle part has contact groove (6), chip holder (5) are fixed and are used for placing the chip above standing groove (2).
2. The non-probe contact chip test structure according to claim 1, wherein: the periphery of the insulating plate (3) is provided with a frame (7), and the frame (7) is provided with a magnetic attraction piece (8) for being adsorbed and fixed on the base (1).
3. The non-probe contact chip test structure according to claim 2, wherein: the bottom surface of the base (1) is provided with a guide column, and the frame (7) is provided with a guide hole (12) corresponding to the guide column.
4. The non-probe contact chip test structure according to claim 1, wherein: the base (1) is provided with a step (10), the step (10) is provided with a plurality of magnetic attraction posts (11), the bottom surface of the chip seat (5) is provided with a magnetic attraction hole, and the magnetic attraction posts (11) are in plug-in fit in the magnetic attraction hole.
5. The non-probe contact chip test structure according to claim 4, wherein: the step (10) is provided with a positioning column (9), and the bottom surface of the chip seat (5) is correspondingly provided with a positioning hole which is in plug-in fit with the positioning column (9).
6. The non-probe contact chip test structure according to claim 1, wherein: the novel portable electronic device is characterized by further comprising a base (13), wherein a protruding portion (14) is arranged on the base (13), the base (1) is fixed on the protruding portion (14) through bolts, and a gap is reserved between the base (1) and the surface of the protruding portion (14).
7. The non-probe contact chip test structure according to claim 6, wherein: the bottom surface of the base (13) is provided with a plurality of supporting legs (15).
8. The non-probe contact chip test structure according to claim 7, wherein: the surface of the base (13) is provided with a bearing platform (16) for temporarily placing chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321908507.8U CN220584343U (en) | 2023-07-19 | 2023-07-19 | Non-probe contact type chip test structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321908507.8U CN220584343U (en) | 2023-07-19 | 2023-07-19 | Non-probe contact type chip test structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220584343U true CN220584343U (en) | 2024-03-12 |
Family
ID=90118057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321908507.8U Active CN220584343U (en) | 2023-07-19 | 2023-07-19 | Non-probe contact type chip test structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220584343U (en) |
-
2023
- 2023-07-19 CN CN202321908507.8U patent/CN220584343U/en active Active
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