CN220576159U - Die cutting device for processing aluminum wafer - Google Patents
Die cutting device for processing aluminum wafer Download PDFInfo
- Publication number
- CN220576159U CN220576159U CN202322085038.0U CN202322085038U CN220576159U CN 220576159 U CN220576159 U CN 220576159U CN 202322085038 U CN202322085038 U CN 202322085038U CN 220576159 U CN220576159 U CN 220576159U
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- Prior art keywords
- die cutting
- sleeve
- frame
- limiting
- aluminum
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- 238000005520 cutting process Methods 0.000 title claims abstract description 59
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 56
- 238000003825 pressing Methods 0.000 claims abstract description 20
- 238000007599 discharging Methods 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims description 3
- 230000006978 adaptation Effects 0.000 claims 1
- 239000004411 aluminium Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 27
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000003860 storage Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model relates to the technical field of die cutting of aluminum wafers, in particular to a die cutting device for processing an aluminum wafer, wherein a first air cylinder is arranged at the upper end of a frame, a pressing plate is fixed at the telescopic end of the first air cylinder, die cutting components are arranged on the lower surface of the pressing plate at equal intervals, discharge tanks matched with the die cutting components are arranged on the upper surface of the frame below the pressing plate at equal intervals, a discharge component is arranged in each discharge tank, and a limiting component is arranged between the pressing plate and each discharge tank on the upper surface of the frame. According to the utility model, the aluminum plate is arranged at the stock gap, the die cutting assembly is driven to lift by the pressing plate, so that the sleeve passes through the limiting hole, the sleeve ring is further propped against the limiting plate, and the limiting plate is enabled to descend and prop against the aluminum plate, so that the fixing of the aluminum plate in the die cutting process is realized, the stability of the aluminum plate in the die cutting process is improved, the setting of the discharging assembly is beneficial to the output of an aluminum wafer from the inside of the discharge chute after die cutting, and the practicability of equipment is improved.
Description
Technical Field
The utility model relates to the technical field of die cutting of aluminum wafers, in particular to a die cutting device for processing an aluminum wafer.
Background
The aluminum wafer is widely applied to electronic, daily chemical, medical, cultural and educational and automobile accessories, and can be rapidly molded by a die cutting machine during the production and processing of the aluminum wafer, and the types of the die cutting machines are more, wherein the steel cutter die cutting is the most common mode of custom die cutting, and the method is to make a profiling steel cutter according to the specification requirements of customers, and cut out parts in a stamping mode. As disclosed in chinese patent publication No. CN217317525U, a die cutting device capable of deburring for processing an aluminum wafer is provided, the device can complete automatic feeding and discharging treatment by means of a driving motor, a driving belt, a rotating wheel and a feeding wheel, so that an aluminum sheet reaches the lower part of a die cutting machine to perform die cutting operation, and then the right feeding wheel is used for feeding the aluminum sheet, and the cut aluminum wafer enters the lower part of an operation platform.
However, the traditional die cutting equipment has poor fixing effect on the aluminum plate in the die cutting process of the aluminum wafer, and the die cutting precision is easy to be reduced, so that the die cutting quality is affected. Accordingly, a person skilled in the art provides a die cutting device for processing an aluminum wafer, so as to solve the problems set forth in the background art.
Disclosure of Invention
The utility model aims to provide a die cutting device for processing an aluminum wafer, which aims to solve the problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the die cutting device for processing the aluminum wafer comprises a frame, wherein a first air cylinder is arranged at the upper end of the frame, a pressing plate is fixed at the telescopic end of the first air cylinder, die cutting components are arranged on the lower surface of the pressing plate at equal intervals, discharge tanks matched with the die cutting components are arranged on the upper surface of the frame below the pressing plate at equal intervals, a discharge component is arranged in the discharge tank, and a limiting component is arranged between the pressing plate and the discharge tank on the upper surface of the frame;
the die cutting assembly comprises a sleeve fixed on the lower surface of the pressing plate, a die cutting knife is arranged at the lower end of the sleeve, a thimble assembly is arranged at the inner side of the sleeve, a fixed ring is fixed at the position, close to the middle section, of the outer side of the sleeve, a lantern ring is slidably arranged below the fixed ring, and a second spring is arranged between the lantern ring and the fixed ring;
the limiting assembly comprises guide rods fixed on the upper surface of the frame and close to four corners, limiting plates are slidably mounted between the four guide rods, sliding holes which are slidably connected with the guide rods are formed in the four corners of the limiting plates, a storage gap is formed between each limiting plate and the discharge chute, first springs are mounted on the outer sides of the guide rods and located below the sliding holes, and limiting holes which are matched with the sleeves one by one are formed in the limiting plates at equal intervals.
As a further aspect of the present utility model: the discharging assembly comprises second cylinders symmetrically fixed inside the frame, a connecting plate is arranged at the telescopic end of each second cylinder, push rods are arranged on one side of each connecting plate at equal intervals, and one ends of the push rods extend to the inside of the discharging groove and are provided with push plates.
As a further aspect of the present utility model: the thimble assembly comprises a sleeve fixed inside the sleeve, a thimble is slidably arranged inside the sleeve, and one end of the thimble extends to the inside of the sleeve and is provided with a third spring.
As a further aspect of the present utility model: the internal diameter of spacing hole is less than the internal diameter of discharge tank, and the internal diameter of spacing hole is less than the external diameter of lantern ring.
As a further aspect of the present utility model: the lower end of the guide rod is fixed with the frame through welding, and the upper end of the guide rod is provided with a limiting disc.
As a further aspect of the present utility model: the frame is of an inverted U-shaped structure, and rollers are arranged on the lower surface of the frame near the four corners.
Compared with the prior art, the utility model has the beneficial effects that: according to the utility model, the aluminum plate is arranged at the stock gap, the die cutting assembly is driven to lift by the pressing plate, so that the sleeve passes through the limiting hole, the sleeve ring is further propped against the limiting plate, and the limiting plate is enabled to descend and prop against the aluminum plate, so that the fixing of the aluminum plate in the die cutting process is realized, the stability of the aluminum plate in the die cutting process is improved, the setting of the discharging assembly is beneficial to the output of an aluminum wafer from the inside of the discharge chute after die cutting, and the practicability of equipment is improved.
Drawings
FIG. 1 is a schematic structural view of a die cutting device for processing an aluminum wafer;
FIG. 2 is a schematic view of the internal structure of a die-cutting device for processing aluminum wafers;
FIG. 3 is a schematic view of the mounting structure of a die cutter in a die cutting device for processing an aluminum wafer;
fig. 4 is a schematic structural view of a discharge assembly in a die-cutting device for processing an aluminum wafer.
In the figure: 1. a frame; 2. a guide rod; 3. a limiting plate; 4. a limiting hole; 5. a discharge chute; 6. a material storage gap; 7. a first cylinder; 8. a pressing plate; 9. a slide hole; 10. a first spring; 11. a push rod; 12. a push plate; 13. a sleeve; 14. a collar; 15. a second spring; 16. a die cutter; 17. a sleeve; 18. a thimble; 19. a third spring; 20. a connecting plate; 21. a second cylinder; 22. and a fixing ring.
Detailed Description
Referring to fig. 1 to 4, in the embodiment of the utility model, a die cutting device for processing an aluminum wafer comprises a frame 1, wherein a first cylinder 7 is installed at the upper end of the frame 1, a pressing plate 8 is fixed at the telescopic end of the first cylinder 7, die cutting components are installed on the lower surface of the pressing plate 8 at equal intervals, a discharge groove 5 matched with the die cutting components is arranged on the upper surface of the frame 1 below the pressing plate 8 at equal intervals, a discharge component is arranged in the discharge groove 5, and a limit component is arranged between the pressing plate 8 and the discharge groove 5 on the upper surface of the frame 1;
the die cutting assembly comprises a sleeve 13 fixed on the lower surface of the pressing plate 8, a die cutting knife 16 is arranged at the lower end of the sleeve 13, a thimble assembly is arranged on the inner side of the sleeve 13, a fixed ring 22 is fixed on the outer side of the sleeve 13 close to the middle section, a lantern ring 14 is slidably arranged below the fixed ring 22 on the outer side of the sleeve 13, a second spring 15 is arranged between the lantern ring 14 and the fixed ring 22, the first cylinder 7 is started to enable the pressing plate 8 to descend, so that the sleeve 13 passes through the limiting hole 4, the lantern ring 14 further enables the lantern ring 14 to abut against the limiting plate 3, the second spring 15 is further contracted, the lantern ring 14 further pushes the limiting plate 3 to descend, the first spring 10 is contracted, the limiting plate 3 further abuts against an aluminum plate, and the aluminum plate is fixed during die cutting, so that the stability of the aluminum plate during die cutting is improved;
the limiting component comprises guide rods 2 fixed on the upper surface of a frame 1 and close to four corners, limiting plates 3 are slidably mounted between the four guide rods 2, sliding holes 9 which are slidably connected with the guide rods 2 are formed in the four corners of the limiting plates 3, a storage gap 6 is formed in a gap between each limiting plate 3 and each discharge chute 5, an aluminum plate is placed in the storage gap 6, the limiting plates 3 are enabled to descend through sliding connection between the sliding holes 9 and the guide rods 2, the limiting plates 3 are enabled to abut against the aluminum plate, aluminum plate fixing is achieved, first springs 10 are mounted on the outer sides of the guide rods 2, located below the sliding holes 9, and are favorable for resetting after the limiting plates 3 descend, limiting holes 4 which are matched with sleeves 13 one by one are formed in the limiting plates 3 at equal intervals, and limiting of a die cutter 16 is achieved through the arrangement of the limiting holes 4.
In fig. 4, the unloading assembly comprises a second cylinder 21 symmetrically fixed inside the frame 1, a connecting plate 20 is installed at the telescopic end of the second cylinder 21, push rods 11 are installed at equal intervals on one side of the connecting plate 20, one end of each push rod 11 extends to the inside of the unloading groove 5 and is provided with a push plate 12, the second cylinder 21 is started, the connecting plate 20 is driven to move through the second cylinder 21, the push rods 11 are further enabled to move, the push plates 12 are enabled to push aluminum wafers inside the unloading groove 5, and the aluminum wafers are enabled to be output from the inside of the unloading groove 5, so that the practicability of the equipment is improved.
In fig. 3, the thimble assembly comprises a sleeve 17 fixed inside the sleeve 13, a thimble 18 is slidably mounted inside the sleeve 17, one end of the thimble 18 extends into the sleeve 17 and is provided with a third spring 19, and the thimble 18 is pushed to move by the third spring 19, so that the thimble 18 is prevented from being embedded inside the sleeve 13 after die cutting of an aluminum wafer.
In fig. 2, the inner diameter of the limiting hole 4 is smaller than the inner diameter of the discharge chute 5, so that the fault tolerance of the device is improved, the situation that an aluminum wafer cannot fall into the discharge chute 5 is avoided, and the inner diameter of the limiting hole 4 is smaller than the outer diameter of the sleeve ring 14, so that the sleeve ring 14 is favorable for propping against the limiting plate 3, and the limiting plate 3 is pushed to move downwards.
In fig. 1, the lower end of the guide rod 2 is fixed to the frame 1 by welding, and a limit disc is mounted at the upper end of the guide rod 2, which mainly plays a role in limiting.
In fig. 1, the frame 1 has an inverted U-shaped structure, and rollers are mounted on the lower surface of the frame 1 near the four corners, so that the movement of the equipment is facilitated.
The working principle of the utility model is as follows: when the aluminum plate is used, the aluminum plate is placed in the storage gap 6, the first air cylinder 7 is started to enable the pressing plate 8 to move downwards, the sleeve 13 penetrates through the limiting hole 4, the sleeve ring 14 is further made to abut against the limiting plate 3, the second spring 15 is further made to shrink, the sleeve ring 14 is further made to push the limiting plate 3 to move downwards, the first spring 10 is made to shrink, the limiting plate 3 is further made to abut against the aluminum plate, fixation of the aluminum plate during die cutting is achieved, stability during die cutting is improved, the aluminum plate is die-cut to be formed through the setting of the die cutting knife 16, the die-cut aluminum wafer falls into the discharge groove 5 under the setting of the ejector pin assembly, the second air cylinder 21 is started, the connecting plate 20 is driven to move through the second air cylinder 21, the push rod 11 is further made to move, the push plate 12 is made to push the aluminum wafer inside the discharge groove 5, the aluminum wafer is made to be output from the inside the discharge groove 5, and the practicability of the equipment is improved.
Claims (6)
1. The utility model provides a cross cutting device is used in aluminium disk processing, includes frame (1), its characterized in that, first cylinder (7) is installed to the upper end of frame (1), the flexible end of first cylinder (7) is fixed with clamp plate (8), the equidistant cross cutting subassembly of installing of lower surface of clamp plate (8), discharge chute (5) with cross cutting subassembly adaptation are offered to the upper surface of frame (1) below that is located clamp plate (8), be equipped with the subassembly of unloading in discharge chute (5), the upper surface of frame (1) is located between clamp plate (8) and discharge chute (5) and is equipped with spacing subassembly;
the die cutting assembly comprises a sleeve (13) fixed on the lower surface of the pressing plate (8), a die cutting knife (16) is arranged at the lower end of the sleeve (13), a thimble assembly is arranged at the inner side of the sleeve (13), a fixed ring (22) is fixed at the position, close to the middle section, of the outer side of the sleeve (13), a lantern ring (14) is slidably arranged below the fixed ring (22) on the outer side of the sleeve (13), and a second spring (15) is arranged between the lantern ring (14) and the fixed ring (22);
the limiting assembly comprises guide rods (2) fixed on the upper surface of the frame (1) and close to four corners, limiting plates (3) are slidably mounted between the guide rods (2), sliding holes (9) which are slidably connected with the guide rods (2) are formed in the four corners of the limiting plates (3), stock gaps (6) are formed in gaps between the limiting plates (3) and the unloading groove (5), first springs (10) are mounted on the outer sides of the guide rods (2) and located below the sliding holes (9), and limiting holes (4) which are matched with the sleeves (13) one by one are formed in the limiting plates (3) at equal intervals.
2. The die cutting device for processing the aluminum wafer according to claim 1, wherein the discharging assembly comprises second cylinders (21) symmetrically fixed in the frame (1), connecting plates (20) are arranged at telescopic ends of the second cylinders (21), push rods (11) are arranged on one sides of the connecting plates (20) at equal intervals, and one ends of the push rods (11) extend into the discharging groove (5) and are provided with push plates (12).
3. A die cutting device for processing an aluminum wafer according to claim 1, wherein the thimble assembly comprises a sleeve (17) fixed inside the sleeve (13), a thimble (18) is slidably mounted inside the sleeve (17), and one end of the thimble (18) extends into the sleeve (17) and is provided with a third spring (19).
4. The die cutting device for processing the aluminum wafer according to claim 1, wherein the inner diameter of the limiting hole (4) is smaller than the inner diameter of the discharge chute (5), and the inner diameter of the limiting hole (4) is smaller than the outer diameter of the sleeve ring (14).
5. The die cutting device for processing the aluminum wafer according to claim 1, wherein the lower end of the guide rod (2) is fixed with the frame (1) through welding, and a limiting disc is arranged at the upper end of the guide rod (2).
6. The die cutting device for processing the aluminum wafer according to claim 1, wherein the frame (1) is of an inverted U-shaped structure, and rollers are arranged on the lower surface of the frame (1) near four corners.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322085038.0U CN220576159U (en) | 2023-08-04 | 2023-08-04 | Die cutting device for processing aluminum wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322085038.0U CN220576159U (en) | 2023-08-04 | 2023-08-04 | Die cutting device for processing aluminum wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220576159U true CN220576159U (en) | 2024-03-12 |
Family
ID=90121997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322085038.0U Active CN220576159U (en) | 2023-08-04 | 2023-08-04 | Die cutting device for processing aluminum wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220576159U (en) |
-
2023
- 2023-08-04 CN CN202322085038.0U patent/CN220576159U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |