CN220570728U - Circuit board carrier and circuit board production equipment - Google Patents

Abstract

The application provides a circuit board carrier and circuit board production facility, circuit board carrier is used for bearing the circuit board, the circuit board includes first circuit board and second circuit board, the circuit board carrier includes the carrier body, the carrier body has first carrier groove and second carrier groove, first carrier groove is used for cooperating with first circuit board, the second carrier groove is used for cooperating with the second circuit board, first carrier groove has first size with first circuit board complex, the second carrier groove has the second size that is used for cooperating with the second circuit board, first size has first size tolerance a, the second size has second size tolerance b, 0.1mm is less than or equal to a is less than or equal to 0.1mm, 0.1mm is less than or equal to b is less than or equal to 0.1mm. The circuit board carrier provided by the application is favorable for smooth proceeding of the subsequent production process of the first circuit board and the second circuit board, and is favorable for improving the equipment utilization rate of the circuit board carrier and the production efficiency of the circuit board, and reducing the occupied space of the circuit board carrier.

Description

Circuit board carrier and circuit board production equipment

Technical Field

The application relates to the technical field of circuit board production, in particular to a circuit board carrier and circuit board production equipment.

Background

Batteries are widely used in electronic devices such as cellular phones, notebook computers, battery cars, electric vehicles, electric airplanes, electric ships, electric toy vehicles, electric toy ships, electric toy airplanes, electric tools, and the like.

A circuit board is typically provided in the battery to control the proper operation of the battery. However, in the related art, circuit boards with different specifications all need corresponding equipment for production, which affects the utilization rate of the circuit board production equipment.

Disclosure of Invention

The embodiment of the application provides a circuit board carrier and circuit board production equipment, which can improve the utilization rate of the circuit board production equipment.

In a first aspect, the application provides a circuit board carrier, the circuit board carrier is used for bearing a circuit board, the circuit board includes first circuit board and second circuit board, the circuit board carrier includes the carrier body, the carrier body has first carrier groove and second carrier groove, first carrier groove is used for cooperating with first circuit board, the second carrier groove is used for cooperating with the second circuit board, first carrier groove has first size with first circuit board complex, the second carrier groove has second size that is used for cooperating with the second circuit board, first size has first size tolerance a, the second size has second size tolerance b, 0.1mm is less than or equal to a is less than or equal to 0.1mm, 0.1mm is less than or equal to b is less than or equal to 0.1mm.

The circuit board carrier provided by the embodiment of the application has the first tolerance a through setting the first size of the first carrying groove and the first circuit board of the carrier body, the second size of the second carrying groove and the second circuit board is provided with the second tolerance b, the a is less than or equal to 0.1mm and less than or equal to 0.1mm, the b is less than or equal to 0.1mm and less than or equal to 0.1mm, the position precision of the first circuit board and the second circuit board after being respectively matched with the first carrying groove and the second carrying groove is favorably improved, the subsequent production process of the first circuit board and the second circuit board is favorably and smoothly carried out, the same circuit board carrier can simultaneously carry at least two circuit boards, the equipment utilization rate of the circuit board carrier and the production efficiency of the circuit board are favorably improved, and the occupied space of the circuit board carrier is favorably reduced.

In some embodiments, a is less than or equal to 0.02mm and less than or equal to 0.02mm, and the arrangement is beneficial to further improving the position precision of the first circuit board after the first bearing groove is matched, and further improving the process yield in the production process of the first circuit board.

In some embodiments, b is less than or equal to 0.02mm and less than or equal to 0.02mm, so that the arrangement is beneficial to further improving the position precision of the second circuit board after the second circuit board is matched with the second bearing groove, and further improving the process yield in the production process of the second circuit board.

In some embodiments, the direction of the first dimension intersects with the recess direction of the first carrying groove, so that the first circuit board has higher position accuracy along the direction intersecting with the recess direction of the first carrying groove after being matched with the first carrying groove, which is further beneficial to smooth proceeding of subsequent processes of the first circuit board and improving the process yield of the first circuit board.

In some embodiments, the direction of the second dimension intersects with the recess direction of the second carrying groove, so that the second circuit board has higher position accuracy along the direction intersecting with the recess direction of the second carrying groove after being matched with the second carrying groove, which is further beneficial to smooth proceeding of subsequent processes of the second circuit board and improving the process yield of the second circuit board.

In some embodiments, the first circuit board and the second circuit board have a thickness difference of h1, and the first carrier groove and the second carrier groove have a depth difference of h2, 0.ltoreq.h1-h2.ltoreq.0.02 mm. Therefore, after the first circuit board and the second circuit board are matched with the first bearing groove and the second bearing groove respectively, the distance between the first circuit board and the second circuit board and the surface on one side away from the carrier body meets the corresponding precision requirement, and the subsequent smooth proceeding of the procedures of printing, solder paste detection, surface mounting, reflow soldering, detection and the like of the first circuit board and the second circuit board is facilitated.

In some embodiments, the carrier body includes a plurality of first bearing grooves and a plurality of second bearing grooves, the plurality of first bearing grooves are arranged along a first direction, the plurality of second bearing grooves are arranged along a first direction, the first bearing grooves and the second bearing grooves are arranged along a second direction, and the first direction and the second direction intersect. The method is beneficial to realizing the following processes of printing, solder paste detection, surface mounting, reflow soldering, detection and the like of the first circuit board and the second circuit board on the circuit board carrier, and the processes of the first circuit board and the second circuit board can be simultaneously carried out, so that the phenomenon of mutual interference is not easy to occur, and the method is beneficial to further improving the production efficiency.

In some embodiments, the carrier body has a first surface and a second surface disposed opposite to each other along a third direction, and the first direction, the second direction, and the third direction intersect each other two by two; the first bearing groove and the second bearing groove are recessed by the first surface, the two sides of the second surface along the second direction are respectively provided with a first step and a second step, and absolute values |e1-e2| of differences of the sizes of the first step and the second step along the third direction meet the following conditions: and 0-0.02 mm. The first surface of the circuit board carrier is guaranteed to have higher levelness, and then the first circuit board and the second circuit board deviate from the surface of one side of the carrier body respectively and are located the same horizontal plane as far as possible, so that the subsequent process is smoothly carried out, and the production yield of the circuit board is improved.

In some embodiments, the circuit board carrier further comprises a locking assembly connecting the carrier body and the circuit board to limit displacement of the circuit board relative to the carrier body. The risk that the circuit board is separated from the carrier body or is offset relative to the carrier body is reduced, the position accuracy of the circuit board is improved, the follow-up process is facilitated to be carried out smoothly, and the production yield of the circuit board is improved.

In some embodiments, the circuit board has a positioning hole, and the locking assembly includes an elastic member and a stopper, the elastic member connecting the carrier body and the stopper, the stopper being configured to cooperate with the positioning hole to limit displacement of the circuit board relative to the carrier body. The accuracy of the locking assembly in positioning the circuit board is improved, and the structure of the locking assembly is simplified.

In some embodiments, the carrier body has a receiving groove, the locking assembly is received in the receiving groove, and the stopper is inserted into the positioning hole from an end of the positioning hole near the carrier body. The arrangement is beneficial to keeping the flatness of the surface of the circuit board, facilitating the smooth execution of the subsequent printing and other processes, reducing the process difficulty of the circuit board production process and improving the production yield of the circuit board.

In a second aspect, an embodiment of the present application provides a circuit board production apparatus for producing a circuit board, where the circuit board production apparatus includes the circuit board carrier provided in any one of the embodiments above.

The circuit board production equipment provided by the embodiment of the application has the same technical effects due to the adoption of the circuit board carrier provided by any one of the embodiments, and the description is omitted here.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and that other drawings may be obtained according to the drawings without inventive effort for a person skilled in the art.

Fig. 1 is a top view of a circuit board carrier according to an embodiment of the present disclosure;

fig. 2 is a schematic cross-sectional structure of a circuit board carrier and a circuit board after the circuit board carrier is matched with the circuit board according to the embodiment of the application;

fig. 3 is a top view of another circuit board carrier according to an embodiment of the present disclosure;

fig. 4 is a front view of a circuit board carrier provided in an embodiment of the present application;

fig. 5 is a top view of yet another circuit board carrier provided in an embodiment of the present application;

FIG. 6 is an enlarged view of a portion of N in FIG. 5;

fig. 7 is a top view of a part of the structure of the circuit board production apparatus provided in the embodiment of the present application.

In the drawings, the drawings are not necessarily to scale.

Marking:

1. a circuit board carrier;

11. a carrier body; 11a, a first surface; 11b, a second surface; 11c, a first step; 11d, a second step; 11e, a containing groove; 111. a first carrying groove; 111a, a first dimension; 112. a second carrying groove; 112a, a second dimension;

12. a locking assembly; 121. an elastic member; 122. a stopper;

2. a circuit board; 21. a first circuit board; 22. a second circuit board; 2a, positioning holes;

x, a first direction; y, second direction; z, third direction;

10. circuit board production equipment; 3. a track.

Detailed Description

Embodiments of the present application are described in further detail below with reference to the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the present application and are not intended to limit the scope of the application, i.e., the application is not limited to the embodiments described.

In the description of the present application, it is to be noted that, unless otherwise indicated, the meaning of "plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like indicate an orientation or positional relationship merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The "vertical" is not strictly vertical but is within the allowable error range. "parallel" is not strictly parallel but is within the tolerance of the error.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the present application can be understood as appropriate by one of ordinary skill in the art.

The term "plurality" as used herein refers to more than two (including two).

In the related art, specific circuit boards with different sizes or specifications are required to be arranged in different battery specifications, and in the production process of the circuit boards, the processes of printing, solder paste detection, surface mounting, reflow soldering, detection and the like are required to be carried out, and each process needs special equipment to operate at a specific position, so that the circuit board carrier is required to be always correspondingly arranged at the specific position in the feeding process, so that the circuit boards are accurately positioned, and the process yield of the circuit boards is improved. Therefore, the circuit boards with different specifications cannot be produced on the same circuit board production equipment due to the difference of the subsequent process parameters, and different circuit board production equipment is required to produce, so that the equipment utilization rate of the circuit board production equipment is low, and more space is occupied.

In view of this, the embodiment of the present application provides a technical solution, in which a first carrying groove and a second carrying groove are disposed on a carrier body of a circuit board carrier and are respectively matched with a first circuit board and a second circuit board, a tolerance a of a first size of the first carrying groove matched with the first circuit board, and a tolerance b of a second size of the second carrying groove matched with the second circuit board respectively satisfy: -a is less than or equal to 0.1mm and less than or equal to 0.1mm, b is less than or equal to 0.1mm and less than or equal to 0.1mm. The first bearing groove and the second bearing groove are respectively arranged, the first circuit board is matched with the first bearing groove, the second circuit board is matched with the second bearing groove, and the first circuit board and the second circuit board have fixed positions and relative position relations, so that the first circuit board and the second circuit board can be borne on the same circuit board carrier, subsequent processes can be carried out on the first circuit board and the second circuit board respectively, adverse effects can not be generated, at least two circuit boards with different specifications can be produced by using the same circuit board carrier, the utilization rate of circuit board production equipment is improved, and the space utilization rate is improved.

The technical scheme described in the embodiment of the application is suitable for the circuit board carrier and the circuit board production equipment using the circuit board carrier.

As shown in fig. 1 and 2, a circuit board carrier 1 provided according to an embodiment of the present application is used for carrying a circuit board 2, and the circuit board 2 includes a first circuit board 21 and a second circuit board 22. The circuit board carrier 1 comprises a carrier body 11, the carrier body 11 is provided with a first bearing groove 111 and a second bearing groove 112, the first bearing groove 111 is used for being matched with a first circuit board 21, the second bearing groove 112 is used for being matched with a second circuit board 22, the first bearing groove 111 is provided with a first size 111a matched with the first circuit board 21, the second bearing groove 112 is provided with a second size 112a matched with the second circuit board 22, the first size 111a is provided with a first size 111a tolerance a, the second size 112a is provided with a second size 112a tolerance b, the a is less than or equal to-0.1 mm, the b is less than or equal to-0.1 mm, and the b is less than or equal to-0.1 mm.

The circuit board 2 has a first circuit board 21 and a second circuit board 22, and the first circuit board 21 and the second circuit board 22 may be of different specifications, the circuit board carrier 1 may carry at least the first circuit board 21 and the second circuit board 22, i.e. the circuit board carrier 1 may be capable of carrying at least two circuit boards 2. It will be appreciated that the circuit board carrier 1 may also have other carrying slots for carrying other kinds of circuit boards 2, so as to realize that one circuit board carrier 1 is capable of carrying three, four or more kinds of circuit boards 2.

The first bearing groove 111 has a shape to be matched with the first circuit board 21, and then the first bearing groove 111 may be provided according to a specific shape of the first circuit board 21, and the first bearing groove 111 has a first size 111a to be matched with the first circuit board 21, and then the first size 111a may be a size of the first circuit board 21 in any direction, for example, the first size 111a may be a size along a length direction of the first circuit board 21, or the first size 111a may be a size along a width direction of the first circuit board 21. Similarly, the second dimension 112a may be a dimension along the length direction of the second circuit board 22, or the second dimension 112a may be a dimension along the width direction of the second circuit board 22.

The first dimension 111a tolerance a of the first dimension 111a satisfies: and a is more than or equal to 0.1mm and less than or equal to 0.1mm, the actual value of the first dimension 111a can float within the range of +/-0.1 mm compared with the design value, so that after the first bearing groove 111 is matched with the first circuit board 21, the first circuit board 21 can have better position accuracy, and the position accuracy of the first circuit board 21 is improved during the subsequent processes of printing, solder paste detection, surface mounting, reflow soldering, detection and the like on the first circuit board 21, so that the smooth proceeding of the subsequent processes is ensured.

Similarly, the second dimension 112a tolerance b satisfies: and b is more than or equal to 0.1mm and less than or equal to 0.1mm, the actual value of the second dimension 112a can float within the range of +/-0.1 mm compared with the design value, so that after the second bearing groove 112 is matched with the second circuit board 22, the second circuit board 22 has better position accuracy, and the position accuracy of the second circuit board 22 is improved during the subsequent processes of printing, solder paste detection, surface mounting, reflow soldering, detection and the like on the second circuit board 22, so that the smooth proceeding of the subsequent processes is ensured.

It will be appreciated that the relative positions of the first and second carrying grooves 111 and 112 may be set according to the subsequent process requirements to ensure the positional accuracy of the first and second circuit boards 21 and 22 during the subsequent process.

Optionally, in the production process, the carrier body 11 may be set to simultaneously carry the first circuit board 21 and the second circuit board 22 according to needs, so as to realize simultaneous production of the first circuit board 21 and the second circuit board 22, or the carrier body 11 may be set to simultaneously carry one of the first circuit board 21 and the second circuit board 22, so as to realize separate production of the first circuit board 21 and the second circuit board 22, and may be selected according to actual needs.

According to the circuit board carrier 1 provided by the embodiment of the application, the first size 111a of the carrier body 11 matched with the first circuit board 21 is provided with the first tolerance a, the second size 112a of the second carrier groove 112 matched with the second circuit board 22 is provided with the second tolerance b, the setting is that 0.1mm is less than or equal to a and less than or equal to 0.1mm, b is less than or equal to 0.1mm, the position accuracy of the first circuit board 21 and the second circuit board 22 respectively matched with the first carrier groove 111 and the second carrier groove 112 is improved, the subsequent production process of the first circuit board 21 and the second circuit board 22 is facilitated to be smoothly carried out, the same circuit board carrier 1 can simultaneously carry at least two circuit boards 2, the equipment utilization rate of the circuit board carrier 1 and the production efficiency of the circuit board 2 are facilitated to be improved, and the occupied space of the circuit board carrier 1 is facilitated to be reduced.

In some embodiments, 0.02 mm.ltoreq.a.ltoreq.0.02 mm.

Thus, after the preparation of the first carrying groove 111 is completed, the difference between the actual value and the design value of the first dimension 111a floats within the range of ±0.02mm, which is favorable for further improving the position accuracy of the first circuit board 21 after the completion of the cooperation with the first carrying groove 111 and further improving the process yield in the production process of the first circuit board 21.

In some embodiments, 0.02 mm.ltoreq.b.ltoreq.0.02 mm.

Thus, after the second carrying groove 112 is prepared, the difference between the actual value and the design value of the second dimension 112a floats within the range of ±0.02mm, which is beneficial to further improving the position precision of the second circuit board 22 after the second carrying groove 112 is matched, and further improving the process yield in the production process of the second circuit board 22.

In some embodiments, the direction of the first dimension 111a intersects the direction of the depression of the first bearing groove 111.

The direction of the first dimension 111a intersects with the concave direction of the first carrying groove 111, and then the direction of the first dimension 111a may be parallel to the arrangement direction of the first carrying groove 111 and the second carrying groove 112, or the direction of the first dimension 111a intersects with the arrangement direction of the first carrying groove 111 and the second carrying groove 112, so that after the first circuit board 21 is matched with the first carrying groove 111, the direction intersecting with the concave direction of the first carrying groove 111 has higher position accuracy, which is further beneficial to smooth proceeding of the subsequent process of the first circuit board 21 and improving the process yield of the first circuit board 21.

In some embodiments, the direction of the second dimension 112a intersects the direction of the depression of the second carrying groove 112.

The direction of the second dimension 112a intersects with the concave direction of the second carrying groove 112, and then the direction of the second dimension 112a may be parallel to the arrangement direction of the first carrying groove 111 and the second carrying groove 112, or the direction of the second dimension 112a intersects with the arrangement direction of the first carrying groove 111 and the second carrying groove 112, so that after the second circuit board 22 is matched with the second carrying groove 112, the second circuit board 22 has higher position accuracy along the direction intersecting with the concave direction of the second carrying groove 112, which is further beneficial to smooth proceeding of the subsequent process of the second circuit board 22 and improving the process yield of the second circuit board 22.

As shown in FIG. 2, in some embodiments, the first circuit board 21 and the second circuit board 22 have a thickness difference of h1, and the first carrier groove 111 and the second carrier groove 112 have a depth difference of h2, 0.ltoreq.h1-h2.ltoreq.0.02 mm.

The thickness difference h1 between the first circuit board 21 and the second circuit board 22 may be a difference between the thickness of the first circuit board 21 and the thickness of the second circuit board 22, and h1 may be a positive number or a negative number. Similarly, the difference h2 between the depths of the first and second carrying grooves 111 and 112 may be the difference between the depths of the first and second carrying grooves 111 and 112, and h2 may be a positive number or a negative number.

So configured, in the case where the thickness of the first circuit board 21 is greater than the thickness of the second circuit board 22, the depth of the first bearing groove 111 is also greater than the depth of the second bearing groove 112, and in the case where the thickness of the first circuit board 21 is less than the thickness of the second circuit board 22, the depth of the first bearing groove 111 is less than the depth of the second bearing groove 112. After the first circuit board 21 is matched with the first bearing groove 111 and the second circuit board 22 is matched with the second bearing groove 112, the height difference of the surfaces of the first circuit board 21 and the second circuit board 22, which are respectively away from one side of the carrier body 11, is less than or equal to 0.04mm.

That is, setting 0.ltoreq.h1-h2.ltoreq.0.02 mm is advantageous in realizing that the distance between the surfaces of the first circuit board 21 and the second circuit board 22 facing away from the carrier body 11 after the first circuit board 21 is mated with the first carrying groove 111 and the second circuit board 22 is mated with the second carrying groove 112 is within the range of 0.04mm, i.e., the first circuit board 21 and the second circuit board 22 are located on the same surface as much as possible.

Alternatively, |h1-h2| may be 0, 0.01mm, 0.02mm, or the like. For example, when i h1-h2 is 0, after the first circuit board 21 is mated with the first carrying groove 111 and the second circuit board 22 is mated with the second carrying groove 112, the surfaces of the first circuit board 21 and the second circuit board 22 facing away from the side of the carrier body 11 are located on the same plane.

Therefore, the setting of 0.ltoreq.h1-h2.ltoreq.0.02 mm makes the distance between the first circuit board 21 and the second circuit board 22, which deviate from the surface of the carrier body 11, meet the corresponding precision requirement after the first circuit board 21 and the second circuit board 22 are respectively matched with the first carrying groove 111 and the second carrying groove 112, which is beneficial to the subsequent smooth process of printing, solder paste detection, surface mounting, reflow soldering, detection and the like of the first circuit board 21 and the second circuit board 22.

As shown in fig. 3, in some embodiments, the carrier body 11 includes a plurality of first carrying grooves 111 and a plurality of second carrying grooves 112, the plurality of first carrying grooves 111 are arranged along a first direction X, the plurality of second carrying grooves are arranged along a first direction X, the first carrying grooves 111 and the second carrying grooves 112 are arranged along a second direction Y, and the first direction X and the second direction Y intersect.

The first carrying groove 111 and the second carrying groove 112 are all arranged along the first direction X, so that the circuit board carrier 1 can simultaneously carry a plurality of first circuit boards 21 and a plurality of second circuit boards 22, and run along the first direction X according to a reasonable beat, so that the subsequent printing, solder paste detection, surface mounting, reflow soldering, detection and other processes of the first circuit boards 21 and the second circuit boards 22 are performed on the circuit board carrier 1.

The first circuit board 21 and the second circuit board 22 are arranged along the second direction Y, and the second direction Y intersects the first direction X, equipment for soldering or detecting the first circuit board 21 and the second circuit board 22, respectively, may be arranged along the second direction Y in the subsequent process, so that the production processes of the first circuit board 21 and the second circuit board 22 may be performed simultaneously, and mutual interference may not occur.

Therefore, the first carrying groove 111 and the second carrying groove 112 are respectively arranged along the first direction X, and the first carrying groove 111 and the second carrying groove 112 are respectively arranged along the second direction Y, and the first direction X and the second direction Y intersect, which is favorable for realizing the following procedures of printing, solder paste detection, surface mounting, reflow soldering, detection and the like of the first circuit board 21 and the second circuit board 22 on the circuit board carrier 1, and the processes of the first circuit board 21 and the second circuit board 22 can be simultaneously carried out, and the phenomenon of mutual interference is not easy to occur, thereby being favorable for further improving the production efficiency.

As shown in fig. 3, 4 and 7, in some embodiments, the carrier body 11 has a first surface 11a and a second surface 11b disposed opposite to each other along a third direction Z, and the first direction X, the second direction Y and the third direction Z intersect each other. The first and second carrying grooves 111 and 112 are recessed from the first surface 11a, and both sides of the second surface 11b in the second direction Y are provided with first and second steps 11c and 11d, respectively, and absolute values |e1-e2| of differences in dimensions of the first and second steps 11c and 11d in the third direction Z satisfy: and 0-0.02 mm.

In the process of carrying the circuit board 2 by the circuit board carrier 1, after the circuit board 2 completes a production process, the circuit board carrier 1 continues to run along the first direction X, and the running of the circuit board carrier 1 can run along the corresponding track 3. The first step 11c and the second step 11d are respectively disposed on two sides of the second surface 11b of the carrier body 11 along the second direction Y, so that the movement of the circuit board carrier 1 along the first direction X can be realized through the cooperation of the first step 11c and the second step 11d with the corresponding track 3.

The absolute value |e1-e2| of the difference in the dimensions of the first step 11c and the second step 11d in the third direction Z satisfies: if the absolute value of e1-e2 is less than or equal to 0.02mm, the first surface 11a of the circuit body has higher levelness after the circuit board carrier 1 is matched with the corresponding track 3.

Alternatively, |e1-e2| may be 0, 0.01mm, or 0.02mm, etc.

After analysis and long-term practice of the system, the inventor finds that setting 0 is less than or equal to |e1-e2 is less than or equal to 0.02mm, which is beneficial to ensuring that the first surface 11a of the circuit board carrier 1 has higher levelness, and the surfaces of one side, away from the carrier body 11, of the first circuit board 21 and the second circuit board 22 are located on the same horizontal plane as far as possible, which is beneficial to smooth proceeding of subsequent processes and further beneficial to improving the production yield of the circuit board 2.

As shown in fig. 5, in some embodiments, the circuit board carrier 1 further includes a locking assembly 12, the locking assembly 12 connecting the carrier body 11 and the circuit board 2 to limit displacement of the circuit board 2 relative to the carrier body 11.

The locking component 12 can be any structure capable of connecting the circuit board 2 and the carrier body 11, such as a buckle, a clamp and a pin, and the locking component 12 is connected with the circuit board 2 and the carrier body 11, so that the risk that the circuit board 2 is separated from the carrier body 11 or is offset relative to the carrier body 11 is reduced, the position accuracy of the circuit board 2 is improved, the follow-up process is facilitated to be smoothly carried out, and the production yield of the circuit board 2 is improved.

As shown in fig. 5 and 6, in some embodiments, the circuit board 2 has a positioning hole 2a, the locking assembly 12 includes an elastic member 121 and a stopper 122, the elastic member 121 connects the carrier body 11 and the stopper 122, and the stopper 122 is used to cooperate with the positioning hole 2a to limit the displacement of the circuit board 2 relative to the carrier body 11.

The locking assembly 12 includes an elastic member 121 and a stop member 122, and the elastic member 121 connects the carrier body 11 and the stop member 122, so that the stop member 122 can be inserted into the positioning hole 2a of the circuit board 2 by pulling the stop member 122 to achieve the stop effect of the stop member 122 on the circuit board 2, and the stop member 122 automatically returns under the restoring force of the elastic member 121 after the stop member 122 is disengaged from the positioning hole 2 a.

Therefore, the stopper assembly including the elastic member 121 and the stopper 122 is provided, and the stopper 122 is provided to be engaged with the positioning hole 2a of the circuit board 2, which is advantageous in improving the accuracy of positioning the circuit board 2 by the locking assembly 12 and in simplifying the structure of the locking assembly 12.

With continued reference to fig. 5 and 6, in some embodiments, the carrier body 11 has a receiving groove 11e, the locking assembly 12 is received in the receiving groove 11e, and the stopper 122 is inserted into the positioning hole 2a from an end of the positioning hole 2a near the carrier body 11.

The locking component 12 is arranged in the accommodating groove 11e, and the stop piece 122 is inserted into the positioning hole 2a from one end of the positioning hole 2a, which is close to the carrier body 11, so that the locking component 12 does not occupy the space of the upper part of one side of the circuit board 2, which is away from the carrier body 11, which is favorable for maintaining the flatness of the surface of the circuit board 2, facilitating the smooth progress of the subsequent processes such as printing, reducing the process difficulty of the production process of the circuit board 2 and improving the production yield of the circuit board 2.

As shown in fig. 7, the circuit board production apparatus 10 provided according to the embodiment of the present application includes the circuit board carrier 1 provided in any of the above embodiments.

The circuit board production device 10 may comprise a guide rail 3 along which the circuit board carrier 1 may run.

The circuit board production device 10 provided in the embodiment of the present application has the same technical effects due to the circuit board carrier 1 provided in the embodiment of the present application, and will not be described herein again.

As shown in fig. 1-6, in some embodiments, embodiments of the present application provide a circuit board carrier 1 including a carrier body 11 and a locking assembly 12. The carrier body 11 has a plurality of first carrying grooves 111 and a plurality of second carrying grooves 112, the first carrying grooves 111 are used for being matched with the first circuit board 21, the second carrying grooves 112 are used for being matched with the second circuit board 22, the first carrying grooves 111 have a first size 111a matched with the first circuit board 21, the second carrying grooves 112 have a second size 112a matched with the second circuit board 22, the first size 111a has a first size 111a tolerance a, the second size 112a has a second size 112a tolerance b, a is less than or equal to 0.02mm and less than or equal to 0.02mm, b is less than or equal to 0.02mm, the direction of the first size 111a is intersected with the concave direction of the first carrying grooves 111, and the direction of the second size 112a is intersected with the concave direction of the second carrying grooves 112. The difference in thickness between the first circuit board 21 and the second circuit board 22 is h1, and the difference in depth between the first carrying groove 111 and the second carrying groove 112 is h2, and 0.ltoreq. |h1-h2|.ltoreq.0.02 mm. The first bearing grooves 111 are arranged along the first direction X, the second bearing grooves are arranged along the first direction X, and the first bearing grooves 111 and the second bearing grooves 112 are arranged along the second direction Y. The carrier body 11 has a first surface 11a and a second surface 11b disposed opposite to each other along a third direction Z, and the first direction X, the second direction Y, and the third direction Z intersect each other two by two; the first and second carrying grooves 111 and 112 are recessed from the first surface 11a, and both sides of the second surface 11b in the second direction Y are provided with first and second steps 11c and 11d, respectively, and absolute values |e1-e2| of differences in dimensions of the first and second steps 11c and 11d in the third direction Z satisfy: and 0-0.02 mm. The circuit board 2 has a positioning hole 2a, the locking component 12 comprises an elastic piece 121 and a stop piece 122, the elastic piece 121 is connected with the carrier body 11 and the stop piece 122, the carrier body 11 is provided with a containing groove 11e, the locking component 12 is contained in the containing groove 11e, and one end, close to the carrier body 11, of the positioning hole 2a is inserted into the positioning hole 2a, so that the displacement of the circuit board 2 relative to the carrier body 11 is limited.

According to the circuit board carrier 1 provided by the embodiment of the application, the first size 111a of the first carrying groove 111 of the carrier body 11 and the first circuit board 21 are provided with the first tolerance a, the second size 112a of the second carrying groove 112 and the second circuit board 22 are provided with the second tolerance b, the a is less than or equal to 0.02mm and less than or equal to 0.02mm, the b is less than or equal to 0.02mm and less than or equal to 0.02mm, the position precision of the first circuit board 21 and the second circuit board 22 after being respectively matched with the first carrying groove 111 and the second carrying groove 112 is improved, the subsequent production process of the first circuit board 21 and the second circuit board 22 is smoothly carried out, the same circuit board carrier 1 can simultaneously carry at least two circuit boards 2, the equipment utilization rate of the circuit board carrier 1 is improved, the production efficiency of the circuit board 2 is improved, and the occupied space of the circuit board carrier 1 is reduced.

While the present application has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the present application, and in particular, the technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.

Claims (10)

1. A circuit board carrier for carrying a circuit board, the circuit board comprising a first circuit board and a second circuit board, the circuit board carrier comprising:

the carrier body, the carrier body has first carrier groove and second carrier groove, first carrier groove be used for with first circuit board cooperation, the second carrier groove be used for with the cooperation of second circuit board, first carrier groove have with first circuit board complex first size, the second carrier groove have be used for with second circuit board complex second size, first size has first size tolerance a, the second size has second size tolerance b, 0.1mm is less than or equal to 0.1mm, 0.1mm is less than or equal to b is less than or equal to 0.1mm.

2. The circuit board carrier of claim 1, wherein-0.02 mm +.a +.0.02 mm; and/or-0.02 mm < b < 0.02mm.

3. The circuit board carrier of claim 1, wherein a direction of the first dimension intersects a direction of depression of the first carrier slot and/or a direction of the second dimension intersects a direction of depression of the second carrier slot.

4. The circuit board carrier of claim 1, wherein a thickness difference between the first circuit board and the second circuit board is h1, and a depth difference between the first carrying groove and the second carrying groove is h2, and 0.ltoreq.h1-h2.ltoreq.0.02 mm.

5. The circuit board carrier of claim 1, wherein the carrier body comprises a plurality of the first carrier grooves and a plurality of the second carrier grooves, the plurality of first carrier grooves being arranged in a first direction, the plurality of second carrier grooves being arranged in the first direction, the first carrier grooves and the second carrier grooves being arranged in a second direction, the first direction and the second direction intersecting.

6. The circuit board carrier of claim 5, wherein the carrier body has a first surface and a second surface disposed opposite each other along a third direction, the first direction, the second direction, and the third direction intersecting one another; the first bearing groove and the second bearing groove are recessed from the first surface, a first step and a second step are respectively arranged on two sides of the second surface along the second direction, and absolute values |e1-e2| of differences of sizes of the first step and the second step along the third direction meet the following conditions: and 0-0.02 mm.

7. The circuit board carrier of claim 1, further comprising a locking assembly connecting the carrier body and the circuit board to limit displacement of the circuit board relative to the carrier body.

8. The circuit board carrier of claim 7, wherein the circuit board has a locating hole, and the locking assembly includes an elastic member connecting the carrier body and the stopper for cooperating with the locating hole to limit displacement of the circuit board relative to the carrier body.

9. The circuit board carrier of claim 8, wherein the carrier body has a receiving slot, the locking assembly is received in the receiving slot, and the stop is inserted into the positioning hole from an end of the positioning hole near the carrier body.

10. Circuit board production apparatus for producing circuit boards, characterized in that it comprises a circuit board carrier according to any one of claims 1 to 9.