CN220569129U

CN220569129U - Computing storage board suitable for super fusion modularized server

Info

Publication number: CN220569129U
Application number: CN202322251255.2U
Authority: CN
Inventors: 陈爱波; 张新健; 高葛; 李玉雪
Original assignee: Xian Chaoyue Shentai Information Technology Co Ltd
Current assignee: Xian Chaoyue Shentai Information Technology Co Ltd
Priority date: 2023-08-21
Filing date: 2023-08-21
Publication date: 2024-03-08
Anticipated expiration: 2033-08-21

Abstract

The application relates to the technical field of servers and discloses a computing storage board suitable for a super-fusion modularized server, which comprises a computing board, a storage board and a PCIE signal connector, wherein the computing board is connected with a chassis backboard through an imact backboard connector; the storage plate is of an adapter plate structure and is arranged in parallel with the computing plate; the PCIE signal connector is configured to connect the computing board and the storage board. According to the utility model, the overall size of the computing storage board suitable for the computing storage board of the super-fusion modularized server is smaller, the functions of high-performance computing, high-performance storage and single board management are supported, the 1U-height dual-node deployment can be supported, and the computing storage density of the super-fusion modularized server is effectively improved.

Description

Computing storage board suitable for super fusion modularized server

Technical Field

The present application relates to the field of server technology, for example, to a computing storage board suitable for a super-fusion modular server.

Background

The existing super-fusion modularized server can be used as core service equipment of a small data center or a mobile information processing system, adopts a fusion architecture integrating calculation, storage and network, takes a calculation storage board as a core unit of the server, can flexibly select the number and configuration of the units according to the system requirements, and can improve the reliability and maintainability of the whole by modularization and few-cable design.

In order to improve the calculation storage density of the super fusion modular server, the design of a calculation storage board is critical, and the optimization of calculation capacity, storage capacity and space utilization is striven for.

Accordingly, one skilled in the art would provide a computing storage board suitable for use with a super-converged modular server to address the problems set forth in the background above.

Disclosure of Invention

The utility model provides a computing storage board suitable for a super-fusion modularized server, which can effectively save space and improve space utilization efficiency on the basis of guaranteeing computing capacity and storage capacity of the server.

In some embodiments, the computing storage board suitable for the super fusion modular server comprises a computing board, a storage board and a PCIE signal connector, wherein the computing board is connected with the chassis back board through an imact back board connector; the storage plate is of an adapter plate structure and is arranged in parallel with the computing plate; the PCIE signal connector is configured to connect the computing board and the storage board.

Further, the computing plate is of an L-shaped structure and comprises a first portion and a second portion, the area of the first portion is larger than that of the second portion, and the storage plate is located above or below the second portion.

Further, the computing board is provided with a processor, a DIMM memory, a network chip, a bridge and a BMC chip: the processor is arranged at the first part; DIMM memory is arranged at the first part and is positioned at two sides of the processor; the network chip is arranged on the second part and is positioned at one side far away from the DIMM memory; the bridge piece is arranged at the second part and is positioned at the front side of the network chip; the BMC chip is arranged on the second part and is positioned on the front side of the bridge piece.

Further, the processor and the DIMM memory are provided with two groups.

Further, the two sets of the processor and the DIMM memory are mirror image or symmetrically or parallel disposed on the first portion of the computing board.

Further, the Impact backboard connector comprises an Impact power connector and an Impact signal connector, wherein the Impact power connector is arranged at the second part of the computing board and is positioned at the rear side of the network chip; the Impact signal connector is disposed on the second portion of the computing board on a side of the network chip adjacent to the DIMM memory.

Further, the storage board comprises a RAID controller and a plurality of mSATA solid state disks, and the RAID controller is positioned on the upper surface of the storage board; the mSATA solid state disks are positioned on the lower surface of the storage plate.

Further, a composite debugging interface is reserved at the front end of the computing board.

Further, the PCIE signal connector includes a PCIE signal connector calculating unit and a PCIE signal connector storage unit, where the PCIE signal connector calculating unit is disposed near the computing board; and the PCIE signal connector storage unit is arranged close to the storage board.

The computing storage board suitable for the super-fusion modularized server provided by the embodiment of the disclosure can realize the following technical effects:

1. the computing storage board suitable for the super-fusion modularized server provided by the utility model can realize the functions of computing, storing and single board management by adopting the combination design of the computing board and the storage board, is connected with the chassis back board by adopting the imact back board connector, and can be used as a core module of the super-fusion modularized server.

2. The storage board adopts an adapter board form, and is inserted with the computing board through the PCIE signal connector, so that high-capacity and high-speed data storage can be realized. Compared with the existing calculation storage board suitable for the super-fusion modularized server, the whole dimension of the calculation storage board suitable for the super-fusion modularized server is small, high-performance calculation, high-performance storage and single board management functions are supported, 1U-height double-node deployment can be supported, and the calculation storage density of the super-fusion modularized server is effectively improved.

3. The utility model discloses a calculate storage plate structure ingenious, convenient to use person's use can practice thrift the space effectively, and the staff's of being convenient for installation, practicality is high.

Drawings

One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which like reference numerals refer to similar elements, and in which:

FIG. 1 is a schematic diagram of a computing storage board assembly of the present utility model;

FIG. 2 is a schematic diagram of a computing board core device layout of the present utility model;

FIG. 3 is a schematic diagram of a first direction of a memory board according to the present utility model;

fig. 4 is a second schematic view of the memory board of the present utility model.

Reference numerals:

1. a computing board; 2. a storage plate; 3. PCIE signal connectors; 4. a processor; 5. DIMM memory; 6. a network chip; 7. a bridge piece; 8. a BMC chip; 9. an Impact power connector; 10. an Impact signal connector; 11. PCIE signal connector calculation unit; 12. a composite debugging interface; 13. a RAID controller; 14.PCIE signal connector memory cell; 15. mSATA solid state disk.

Detailed Description

So that the manner in which the features and techniques of the disclosed embodiments can be understood in more detail, a more particular description of the embodiments of the disclosure, briefly summarized below, may be had by reference to the appended drawings, which are not intended to be limiting of the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawing.

The terms first, second and the like in the description and in the claims of the embodiments of the disclosure and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe embodiments of the present disclosure. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.

In the embodiments of the present disclosure, the azimuth or positional relationship indicated by the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", etc. is based on the azimuth or positional relationship shown in the drawings. These terms are used primarily to better describe embodiments of the present disclosure and embodiments thereof and are not intended to limit the indicated device, element, or component to a particular orientation or to be constructed and operated in a particular orientation. Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the embodiments of the present disclosure will be understood by those of ordinary skill in the art in view of the specific circumstances.

In addition, the terms "disposed," "connected," and "fixed" are to be construed broadly. For example, "connected" may be in a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the embodiments of the present disclosure may be understood by those of ordinary skill in the art according to specific circumstances.

The term "plurality" means two or more, unless otherwise indicated.

In the embodiment of the present disclosure, the character "/" indicates that the front and rear objects are an or relationship. For example, A/B represents: a or B.

The term "and/or" is an associative relationship that describes an object, meaning that there may be three relationships. For example, a and/or B, represent: a or B, or, A and B.

It should be noted that, without conflict, the embodiments of the present disclosure and features of the embodiments may be combined with each other.

As shown in connection with fig. 1-4, embodiments of the present disclosure provide a compute and memory board suitable for use in a super-fusion modular server, including a compute board 1, a memory board 2, and PCIE signal connectors 3.

The computing board 1 is connected to the chassis backplane via an imact backplane connector.

The storage board 2 is an adapter board structure and is arranged in parallel with the computing board 1.

And the PCIE signal connector 3 is configured to connect the computing board 1 and the storage board 2.

It can be understood that the present disclosure realizes the functions of computing, storing and single board management by combining the computing board 1 and the storage board 2, where the computing board 1 is used as a motherboard, the storage board 2 is used as a carrier board, and the board-to-board insertion and the cable connection are realized through two sets of PCIE signal connectors 3. The present disclosure uses an imact backplane connector to connect the computing board 1 with the chassis backplane, and the combination of the computing board 1 and the storage board 2 may be used as a core module of a super-fusion modular server.

By adopting the computing storage board suitable for the super-fusion modularized server, which is provided by the disclosure, the storage board 2 adopts the adapter board form, and the PCIE signal connector 3 is inserted with the computing board 1, so that high-capacity and high-speed data storage can be realized. Compared with the existing calculation storage board suitable for the super-fusion modularized server, the whole dimension of the calculation storage board is smaller, high-performance calculation, high-performance storage and single board management functions are supported, the calculation storage board structure is ingenious, the use of a user is convenient, the space can be effectively saved, the installation of workers is convenient, and the practicability is high.

As an example, the overall size of the computing storage board is not more than 342mm multiplied by 183mm multiplied by 44mm (the computing storage board does not contain protruding parts such as debugging interfaces) and can support 1U-height double-node deployment, so that the computing storage density of the super-fusion modularized server is effectively improved.

Optionally, the computing board 1 has an L-shaped structure and includes a first portion and a second portion, the area of the first portion is larger than that of the second portion, and the storage board 2 is located above or below the second portion.

Through the technical scheme, the connection of the computing board 1 and the storage board 2 and the layout of the computing board 1 can be facilitated through the L-shaped structure.

Optionally, the computing board 1 is provided with a processor 4, DIMM memory 5, network chip 6, bridge 7 and BMC chip processor 8. The processor 4 is arranged at the first part; DIMM memories 5 are arranged on the first part and are positioned on two sides of the processor 4; the network chip 6 is arranged on the second part and is positioned at one side far away from the DIMM memory 5; the bridge piece 7 is arranged at the second part and positioned at the front side of the network chip 6; the BMC chip 8 is disposed at the second portion and located at the front side of the bridge piece 7.

Optionally, both the processor 4 and the DIMM memory 5 are provided with two sets.

Through the technical scheme, the processing effect can be further improved through the two groups of the processor 4 and the DIMM memory 5.

Optionally, the two sets of the processor 4 and the DIMM memory 5 are arranged in mirror image or symmetrical or parallel on the first portion of the computing board 1.

By means of the above technical solution, the installation can be conveniently performed by mirror image arrangement or symmetrical arrangement or parallel arrangement on the first part of the computing plate 1.

As an example, the computing board 1 adopts an L-shaped design, the length and width dimensions of the PCB are only 342mm×183mm, 2 paths of processors are configured, 8 DIMM memories 5 are placed on one side of the motherboard, two sides of the 2 paths of processors are placed on the other side of the processor 4, and a network chip 6, a bridge chip 7, a BMC chip 8 and the like are placed on the other side of the processor. This allows for high performance computing and motherboard health detection. The computing board 1 is connected with the chassis backboard through an imact backboard connector; the computing board 1 is connected to the memory board 2 via a PCIE signal connector 3.

Optionally, the Impact backplane connector includes an Impact power connector 9 and an Impact signal connector 10, where the Impact power connector 10 is disposed on the second portion of the computing board 1 and is located on the rear side of the network chip 6; an Impact signal connector 10 is disposed on the second portion of the computing board 1 on a side of the network chip 6 adjacent to the DIMM memory 5.

Optionally, the storage board 2 is in a adapter board form, and is connected with the computing board 1 through the PCIE signal connector 3, the Top surface is configured with the RAID controller 13, and the bottom surface is configured with the 4 msta solid state disk 15, so as to implement high-capacity and high-speed data storage.

Optionally, a composite debug interface 12 is reserved at the front end of the computing board 1.

It can be understood that the computing board 1 reserves 1 composite debug interface 12, which contains signals of 1 path VGA, 2 paths USB, and the like. Through the technical scheme, the composite debugging interface 12 is reserved through the computing board 1, so that debugging can be conveniently performed.

Further, the PCIE signal connector 3 includes a PCIE signal connector calculating unit 11 and a PCIE signal connector storing unit 14. A PCIE signal connector calculating unit 11 disposed near the computing board 1; PCIE signal connector storage unit 14 is arranged close to said memory board 2.

The embodiment of the disclosure provides a computing storage board suitable for a super-fusion modularized server, which adopts a combination design of a computing board 1 and a storage board 2 to realize computing, storage and single board management functions, adopts an imact backboard connector to be connected with a chassis backboard, and can be used as a core module of the super-fusion modularized server. The computing board 1 adopts an L-shaped design, the length and width dimensions of the PCB are only 342mm multiplied by 183mm, a 2-way processor is configured, 8 DIMM memories 5 and an onboard BMC chip 8 are arranged, and high-performance computing and motherboard health detection are realized. The storage board 2 adopts an adapter board form, is inserted with the computing board 1 through the PCIE signal connector 3, and is provided with the RAID controller 13 and 4 mSATA solid state disks 15, so that high-capacity and high-speed data storage is realized.

Compared with the existing calculation storage board suitable for the super-fusion modularized server, the calculation storage board suitable for the super-fusion modularized server is ingenious in structure, and space can be effectively saved and space utilization efficiency can be improved on the basis of guaranteeing the calculation capacity and storage capacity of the server.

The above description and the drawings illustrate embodiments of the disclosure sufficiently to enable those skilled in the art to practice them. Other embodiments may include structural and other modifications. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A computing storage board adapted for a super-converged modular server, comprising:

the computing board (1) is connected with the chassis backboard through an imact backboard connector;

the storage plate (2) is of an adapter plate structure and is arranged in parallel with the computing plate (1);

and the PCIE signal connector (3) is used for connecting the computing board (1) and the storage board (2).

2. The computing storage board of claim 1, wherein the computing device is further configured to,

the computing board (1) is of an L-shaped structure and comprises a first part and a second part, the area of the first part is larger than that of the second part,

the storage plate (2) is located above or below the second portion.

3. The computing storage board according to claim 2, characterized in that the computing board (1) is provided with:

a processor (4) provided in the first section;

DIMM memory (5) arranged at the first part and positioned at two sides of the processor (4);

a network chip (6) arranged at the second part and positioned at one side far away from the DIMM memory (5);

the bridge piece (7) is arranged at the second part and positioned at the front side of the network chip (6);

and the BMC chip (8) is arranged at the second part and positioned at the front side of the bridge piece (7).

4. The computing storage board of claim 3, wherein,

the processor (4) and the DIMM memory (5) are provided with two groups.

5. The computing storage board of claim 4, wherein the computing device is further configured to,

the two sets of processors (4) and DIMM memories (5) are arranged in mirror image or symmetrical or parallel on the first part of the computing board (1).

6. The computing storage board of claim 3, wherein the Impact backplane connector comprises:

an Impact power connector (9) arranged at a second part of the computing board (1) and positioned at the rear side of the network chip (6);

an Impact signal connector (10) is arranged on the second part of the computing board (1) and is positioned on one side of the network chip (6) close to the DIMM memory (5).

7. The computing storage board according to claim 1, characterized in that the storage board (2) comprises:

a RAID controller (13) positioned on the upper surface of the storage board (2);

the mSATA solid state disks (15) are positioned on the lower surface of the storage plate (2).

8. The computing storage board according to claim 1, characterized in that a composite debug interface (12) is reserved at the front end of the computing board (1).

9. The computing storage board of claim 1, wherein the PCIE signal connector (3) comprises:

a PCIE signal connector calculation unit (11) arranged close to the calculation board (1);

and the PCIE signal connector storage unit (14) is arranged close to the storage board (2).