CN220564780U - Multi-wafer constant-temperature annealing equipment for N-type wafer processing - Google Patents

Abstract

The utility model discloses a multi-wafer constant-temperature annealing device for processing N-type wafers, which relates to the technical field of monocrystalline silicon solar cells and aims to solve the problems that when cooling operation of a plurality of monocrystalline silicon wafers is carried out, high-efficiency and stable cooling devices are not available, temperature change during cooling cannot be effectively controlled, and annealing effect of the monocrystalline silicon wafers is affected. The effects of high efficiency, stability, cooling and convenient use are achieved.

Description

Multi-wafer constant-temperature annealing equipment for N-type wafer processing

Technical Field

The utility model relates to the technical field of monocrystalline silicon solar cells, in particular to polycrystalline constant temperature annealing equipment for processing N-type wafers.

Background

An important step in the solar cell manufacturing process is annealing of monocrystalline silicon wafers, which is a material heat treatment process, which refers to slowly heating the material to a certain temperature for a sufficient time and then cooling at a suitable speed in order to reduce hardness, improve machinability, eliminate residual stress, stabilize dimensions, reduce deformation and crack tendencies, refine grains, adjust texture, eliminate texture defects, anneal to activate more phosphorus atoms, reduce surface concentration, reduce surface "dead layers" and improve cell efficiency.

The prior art solutions described above have the following drawbacks: when the existing annealing furnace is used for cooling a plurality of single silicon wafers, efficient and stable cooling equipment is not available, so that the temperature change during cooling cannot be effectively controlled, and the annealing effect of the single silicon wafers is affected.

Disclosure of Invention

The utility model aims to provide a multi-wafer constant-temperature annealing device for processing an N-type wafer, which can efficiently control temperature change during cooling.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a polycrystalline constant temperature annealing equipment for N type wafer processing, includes the box, the inside fixedly connected with first metal mesh chain conveyer and the temperature sensor of box, the equal fixedly connected with of the upper and lower both sides of box inside is the same ventilate the cover, the one end fixedly connected with first dust screen in the ventilate the cover outside, the inside fixedly connected with first shell of ventilate the cover, the inside fixedly connected with first fan of first shell.

Through adopting above-mentioned technical scheme, through increase first metal mesh chain conveyer in the inside of box, put the monocrystalline silicon wafer that will anneal the cooling on the conveyer, increase ventilation hood and first fan respectively at the upper and lower both ends of conveyer simultaneously, because metal mesh chain conveyer adopts the conveyer belt of metal mesh chain, the wind can see through the conveyer, carries out the cooling treatment to the both sides of monocrystalline silicon wafer simultaneously, temperature sensor can detect temperature variation at any time, the temperature variation when convenient control cooling.

Further, the one end fixedly connected with feeder hopper in the box outside, the other end fixedly connected with ejection of compact fill in the box outside, the outside of feeder hopper is provided with second wire mesh chain conveyer, the outside of ejection of compact hopper is provided with third wire mesh chain conveyer, the equal fixedly connected with of upper and lower both ends in the box outside is the same cooling subassembly, the one side in the box outside is provided with control panel and glass observation window.

Through adopting above-mentioned technical scheme, through increasing the structure of business turn over material, carry out automatic conveying with single silicon wafer through second wire mesh chain conveyer and third wire mesh chain conveyer, improve the efficiency of annealing cooling.

Further, the ventilation hood, the first dust screen, the first shell and the first fan are respectively provided with two groups, each group of ventilation hood, the first dust screen, the first shell and the first fan are respectively provided with a plurality of ventilation holes, and the inside of the first shell is reserved with ventilation holes.

Through adopting above-mentioned technical scheme, blow out wind from the ventilation hood inside through first fan, begin to blow the cooling treatment to the single silicon wafer on the first wire mesh chain conveyer.

Further, the inside of cooling subassembly is including cooling tank, condensation plate, fin, air-supply line, second shell, second fan and second dust screen, the inside bottom fixedly connected with condensation plate of cooling tank, the outside fixedly connected with fin of condensation plate, the lower extreme fixedly connected with air-supply line of cooling tank, the inside fixedly connected with second shell of air-supply line, the inside fixedly connected with second fan of second shell, the one end fixedly connected with second dust screen in the second shell outside.

Through adopting above-mentioned technical scheme, through increase cooling subassembly in the bottom of box, cool down cooling box inside through the condensate plate, reduce inside air, the inside that the second fan introduced the cooling box with outside air simultaneously, after the cooling, can carry cold air to cool down, further improves the cooling effect.

Further, the cooling box is communicated with the ventilation hood, the air inlet pipe is communicated with the inside of the cooling box, and air holes are reserved in the second shell.

Through adopting above-mentioned technical scheme, can introduce the inside of cooler bin with external air through the second fan, improve the efficiency of air conversion.

In summary, the beneficial technical effects of the utility model are as follows:

1. the ventilation hood and the cooling assembly are adopted, the single silicon wafer on the first metal mesh chain conveyor is cooled by air through the first fan in the ventilation hood, the temperature sensor detects the temperature at any time, the temperature change during cooling is conveniently controlled, the rotating speed and the service condition of the fan are regulated, meanwhile, when the cooling is required to be quickened, the surrounding air is cooled through the condensing plate, the outside air is introduced into the cooling box through the second fan, and the cold air can be introduced into the cooling box to be cooled, so that the efficient and stable cooling effect is generated;

2. the single-silicon wafer annealing and cooling device has the advantages that the first metal mesh chain conveyor, the second metal mesh chain conveyor and the third metal mesh chain conveyor are adopted, a single-silicon wafer needing annealing and cooling is conveyed to the first metal mesh chain conveyor inside the box body through the second metal mesh chain conveyor, movable cooling can be carried out through cooperation of the first metal mesh chain conveyor, the single-silicon wafer after annealing is conveyed to the next station through the third metal mesh chain conveyor, automatic conveying operation is achieved, and the effect of convenient use is achieved.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic perspective view of the present utility model;

FIG. 3 is a schematic view of the internal cross-sectional structure of the vent hood of the present utility model;

FIG. 4 is a schematic diagram of the internal cross-sectional structure of the cooling module of the present utility model.

In the figure, 1, a box body; 2. a first wire mesh chain conveyor; 3. a temperature sensor; 4. a ventilation hood; 5. a first dust screen; 6. a first housing; 7. a first fan; 8. a feed hopper; 9. discharging a hopper; 10. a second wire mesh chain conveyor; 11. a third wire mesh chain conveyor; 12. a cooling component; 13. a control panel; 14. a glass viewing window; 121. a cooling box; 122. a condensing plate; 123. a heat radiation fin; 124. an air inlet pipe; 125. a second housing; 126. a second fan; 127. and a second dust screen.

Detailed Description

The present utility model will be described in further detail with reference to the accompanying drawings.

Referring to fig. 1-4, a polycrystalline wafer constant temperature annealing equipment for N type wafer processing, the power distribution box comprises a box body 1, the inside fixedly connected with first metal mesh chain conveyer 2 and the temperature sensor 3 of box 1, the equal fixedly connected with of the upper and lower both sides in box 1 is the same, the one end fixedly connected with first dust screen 5 in the outside of aeration cover 4, the inside fixedly connected with first shell 6 of aeration cover 4, the inside fixedly connected with first fan 7 of first shell 6, the one end fixedly connected with feeder hopper 8 in the outside of box 1, the other end fixedly connected with ejection of compact fill 9 in the outside of box 1, the outside of feeder hopper 8 is provided with second metal mesh chain conveyer 10, the outside of ejection of compact fill 9 is provided with third metal mesh chain conveyer 11, the equal fixedly connected with of upper and lower both ends in box 1 is the same cooling module 12, the one side in box 1 outside is provided with control panel 13 and glass observation window 14, increase first metal mesh chain conveyer 2 in the inside of box 1, put the monocrystalline wafer that needs to anneal on the conveyer, simultaneously put on the conveyer at the same time, can adopt the fan 7 to detect the temperature sensor 3 at any time in the time of the fan that the temperature sensor is connected with the first metal mesh chain conveyer 7, the temperature sensor 3 can be changed at the both ends because of the temperature sensor 3 is adopted to the fan, the temperature sensor is connected with the temperature sensor 3 at the temperature sensor is convenient, the temperature sensor is different at the both ends of the temperature sensor 3.

As shown in fig. 1-4, the ventilation hood 4, the first dust screen 5, the first outer shell 6 and the first fan 7 are respectively provided with two groups, each group of ventilation hood 4, the first dust screen 5, the first outer shell 6 and the first fan 7 are respectively provided with a plurality of ventilation holes, ventilation holes are reserved in the first outer shell 6, the cooling component 12 comprises a cooling box 121, a condensation plate 122, cooling fins 123, an air inlet pipe 124, a second outer shell 125, a second fan 126 and a second dust screen 127, the bottom end of the cooling box 121 is fixedly connected with the condensation plate 122, the outer side of the condensation plate 122 is fixedly connected with the cooling fins 123, the lower end of the cooling box 121 is fixedly connected with the air inlet pipe 124, the inner side of the air inlet pipe 124 is fixedly connected with the second outer shell 125, the second outer shell 125 is fixedly connected with the second dust screen 127, the cooling box 121 is mutually communicated with the ventilation box 4, the ventilation holes are reserved in the second outer shell, the cooling box 121 is additionally provided with the cooling component 12, the cooling box 121 is cooled down through the condensation plate, and the cooling air can be further cooled down through the cooling box 121, and the cooling effect can be further improved by introducing the cooling air into the cooling box 121 after the cooling box 1.

The implementation principle of the embodiment is as follows: the single silicon wafer needing annealing cooling treatment is placed at the upper end of the second metal mesh chain conveyor 10 and conveyed to the position of the feed hopper 8 to enter the upper end of the first metal mesh chain conveyor 2 positioned in the box body 1, then the single silicon wafer positioned on the first metal mesh chain conveyor 2 is annealed and cooled, the first fan 7 is started, the two sides of the single silicon wafer on the first metal mesh chain conveyor 2 are simultaneously subjected to air cooling treatment, meanwhile, the temperature sensor 3 is used for detecting the temperature at any time, the temperature change during cooling is conveniently controlled, meanwhile, when the rapid cooling treatment is needed, the temperature of the air inside the cooling box 121 is reduced through the condensation plate 122, then the outside air is introduced into the cooling box 121 through the second fan 126, cooling treatment is carried out, then cold air can be blown into the box body 1, the cooling efficiency is further improved, and the operation and the use are carried out according to requirements.

The embodiments of the present utility model are all preferred embodiments of the present utility model, and are not intended to limit the scope of the present utility model in this way, therefore: all equivalent changes in structure, shape and principle of the utility model should be covered in the scope of protection of the utility model.

Claims (5)

1. The utility model provides a polycrystalline constant temperature annealing equipment for N type wafer processing, includes box (1), its characterized in that: the novel fan is characterized in that the first metal mesh chain conveyor (2) and the temperature sensor (3) are fixedly connected to the inside of the box body (1), the same ventilation hood (4) is fixedly connected to the upper side and the lower side of the inside of the box body (1), the first dustproof mesh (5) is fixedly connected to one end of the outer side of the ventilation hood (4), the first shell (6) is fixedly connected to the inside of the ventilation hood (4), and the first fan (7) is fixedly connected to the inside of the first shell (6).

2. The multi-wafer constant temperature annealing apparatus for N-type wafer processing according to claim 1, wherein: one end fixedly connected with feeder hopper (8) in box (1) outside, the other end fixedly connected with ejection of compact fill (9) in box (1) outside, the outside of feeder hopper (8) is provided with second wire mesh chain conveyer (10), the outside of ejection of compact fill (9) is provided with third wire mesh chain conveyer (11), the equal fixedly connected with cooling module (12) in upper and lower both ends in box (1) outside, the one side in box (1) outside is provided with control panel (13) and glass observation window (14).

3. The multi-wafer constant temperature annealing apparatus for N-type wafer processing according to claim 1, wherein: the novel air conditioner is characterized in that two groups of ventilation hoods (4), first dustproof nets (5), first shells (6) and first fans (7) are respectively arranged, each group of ventilation hoods (4), first dustproof nets (5), first shells (6) and first fans (7) are respectively arranged, and ventilation holes are reserved in the first shells (6).

4. The multi-wafer constant temperature annealing apparatus for N-type wafer processing according to claim 2, wherein: the inside of cooling subassembly (12) is including cooling box (121), condensation plate (122), fin (123), air-supply line (124), second shell (125), second fan (126) and second dust screen (127), inside bottom fixedly connected with condensation plate (122) of cooling box (121), the outside fixedly connected with fin (123) of condensation plate (122), the lower extreme fixedly connected with air-supply line (124) of cooling box (121), the inside fixedly connected with second shell (125) of air-supply line (124), the inside fixedly connected with second fan (126) of second shell (125), the one end fixedly connected with second dust screen (127) in the outside of second shell (125).

5. The apparatus for constant temperature annealing of N-type wafer processing multicrystal of claim 4, wherein: the cooling box (121) is communicated with the ventilation hood (4), the air inlet pipe (124) is communicated with the inside of the cooling box (121), and ventilation holes are reserved in the second shell (125).