CN220548072U

CN220548072U - Semiconductor plastic packaging mould groove grinding device

Info

Publication number: CN220548072U
Application number: CN202321810777.5U
Authority: CN
Inventors: 李红伟
Original assignee: Suining Loulan Precision Machinery Co ltd
Current assignee: Suining Loulan Precision Machinery Co ltd
Priority date: 2023-07-11
Filing date: 2023-07-11
Publication date: 2024-03-01
Anticipated expiration: 2033-07-11

Abstract

The utility model discloses a polishing device for a groove of a semiconductor plastic package die, and relates to the technical field of polishing. Including the fixed bolster main part, the fixed driving motor that is provided with on the surface of fixed bolster main part, the fixed bolster main part still rotates on the surface and is provided with initiative runner, the fixed guide bar and the last guide bar of being provided with of upside of fixed bolster main part, the inside slip of lower guide bar is provided with places the platform, the inside slip of going up the guide bar is provided with the movable rod, one side rotation of movable rod is provided with rotatory movable plate, rotatory movable plate's fixed limiting plate that is provided with on the surface, through rotating rotatory movable plate position on the movable rod, because the length of the outside area of polishing of parcel at a plurality of rotation wheels is certain, when the angle change of arc guide slot drives the interior angle change of polishing area downside, changes the tensioning force of polishing area, conveniently polishes the position of different angular position.

Description

Semiconductor plastic packaging mould groove grinding device

Technical Field

The utility model relates to the technical field of polishing, in particular to a polishing device for a groove of a semiconductor plastic package die.

Background

The mould is used for producing various moulds and tools of the needed products by injection molding, blow molding, extrusion, die casting or forging, smelting, stamping and other methods in industry. In short, a mold is a tool used to make a molded article, which is made up of various parts, with different molds being made up of different parts. The processing of the appearance of the article is realized mainly by changing the physical state of the formed material. The term "industrial mother" is used.

In production, the polishing equipment needs to be polished to ensure the use requirement, and when the traditional polishing equipment faces different dies, the polishing effect is poor due to different setting positions, so that the polishing equipment is inconvenient to polish

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides a polishing device for a groove of a semiconductor plastic package die, which solves the problems proposed by the background technology.

In order to achieve the above purpose, the utility model is realized by the following technical scheme: the utility model provides a semiconductor plastic envelope mould recess grinding device, includes the fixed bolster main part, the fixed driving motor that is provided with on the surface of fixed bolster main part, still rotate on the surface of fixed bolster main part and be provided with initiative runner, the fixed guide bar and the last guide bar of being provided with of upside of fixed bolster main part, the inside slip of lower guide bar is provided with places the platform, the inside slip of going up the guide bar is provided with the movable rod, one side rotation of movable rod is provided with the rotary motion board, the arc guide slot has been seted up on the surface of rotary motion board, the both sides rotation of rotary motion board is provided with the rotor, the fixed limiting plate that is provided with on the surface of rotary motion board, be equipped with buckling restriction portion on the limiting plate, when needs are polished, through the position of rotary motion board on the movable rod, because the length of the outside polishing of parcel at a plurality of rotor is certain, the inside angle change in arc guide slot drives the interior angle change of polishing belt, changes the tensioning force of polishing belt, and the rotation direction of rotary motion board passes through the restriction motor of arc guide slot, and the upper driving pulley carries out the initiative runner, carries out the rotation of the fixed runner of rotation of support and the realization simultaneously, realizes the rotation of the fixed runner of the inside the support and the rotation of the movable support.

Preferably, the fixed bolster main part is last to rotate and is provided with the rotation restriction pole, also rotate on the rotation restriction pole and be provided with the rotor, the upside of going up the guide bar rotates and is provided with the hydraulic pressure restriction pole, the piston rod end of hydraulic pressure restriction pole links to each other with rotating between the rotation restriction pole, and when the angle of rotatory movable plate changes, the rotor on the rotation restriction pole carries out certain position change under the effect of hydraulic pressure restriction pole, guarantees holistic work effect.

Preferably, the driving wheel is in transmission connection with the driving end of the upper driving motor through a transmission belt, and the shaft end of the driving wheel is fixedly connected with the shaft end of the rotating wheel on the fixed support body.

Preferably, the rotating wheel on the fixed bracket main body, the rotating wheel on the rotation limiting rod and the two rotating wheels on the rotation moving plate are jointly provided with a polishing belt.

Preferably, the outer parts of the upper guide rod and the lower guide rod are provided with adjusting knobs in a threaded manner, and the adjusting knobs penetrate through the lower guide rod and the upper guide rod and are abutted with the surfaces of the moving rod and the placing table.

Preferably, the bending limiting part and the polishing belt are arranged in parallel, and the bottom of the fixing support main body is fixedly provided with a lower main body support.

Advantageous effects

The utility model provides a polishing device for a groove of a semiconductor plastic package die. Compared with the prior art, the method has the following beneficial effects:

1. when needs are polished, the groove polishing device for the semiconductor plastic package die is used for rotating the position of the movable plate on the movable rod, and the polishing inner angles of the lower sides of the polishing strips are changed by changing the angles of the arc-shaped guide grooves due to the fact that the lengths of the polishing strips wrapped outside the rotating wheels are fixed, so that the tensioning force of the polishing strips is changed, and the polishing of the parts at different angle positions is facilitated.

2. The utility model provides a semiconductor plastic envelope mould recess grinding device, through last guide bar and lower guide bar in movable rod and place the platform and can carry out the displacement on the length direction to realize the regulation of tensioning force, adjust simply.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the rear side structure of the present utility model;

fig. 3 is a front view of the structure of the present utility model.

In the figure: 1. a lower body bracket; 2. an upper driving motor; 3. a driving rotating wheel; 4. a lower guide rod; 5. an upper guide rod; 6. an arc-shaped guide groove; 7. rotating the moving plate; 8. a limiting plate; 9. a bending restriction portion; 10. a placement table; 11. a rotating wheel; 12. a rotation restricting lever; 13. a hydraulic restraining bar; 14. an adjustment knob; 15. a moving rod; 16. and a fixing bracket main body.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a semiconductor plastic envelope mould recess grinding device, includes fixed bolster main part 16, fixed drive motor 2 of being provided with on the surface of fixed bolster main part 16, fixed bolster main part 16 still rotates on the surface and is provided with initiative runner 3, fixed guide bar 4 and last guide bar 5 are provided with to the upside of fixed bolster main part 16, the inside slip of lower guide bar 4 is provided with places platform 10, the inside slip of going up guide bar 5 is provided with movable rod 15, one side rotation of movable rod 15 is provided with rotatory movable plate 7, arc guide slot 6 has been seted up on the surface of rotatory movable plate 7, rotatory movable plate 7's both sides rotation is provided with rotor 11, rotatory movable plate 7 is fixed on the surface to be provided with limiting plate 8, limiting plate 8 is last to be equipped with buckling limiter 9, when needs are polished, through rotating the position of rotatory movable plate 7 on movable rod 15, because the outside length of the area of polishing of parcel at a plurality of rotor 11 is certain, and the angle change of arc guide slot 6 drives the inside angle change of polishing area and drives the runner 3 of the inside angle change of the runner, and the rotation of the inside angle change of the inside runner 3 through the rotation of the fixed runner 3, and the inside runner 3 is realized through the rotation of the fixed runner 3 of the rotation of the rotatable guide plate 3, and the inside runner 3, and the rotation of the inside runner 3 is realized, and the rotation of the movable support 3 is realized and the rotation 3 is adjusted through the rotation of the movable runner 3.

The fixed bolster main part 16 is last to rotate and to be provided with rotation restriction pole 12, also rotate on the rotation restriction pole 12 and be provided with rotation wheel 11, the upside rotation of going up guide bar 5 is provided with hydraulic pressure restriction pole 13, the piston rod end of hydraulic pressure restriction pole 13 links to each other with rotation restriction pole 12 rotation, and when the angle of rotatory movable plate 7 changes, rotation wheel 11 on the rotation restriction pole 12 carries out certain position change under the effect of hydraulic pressure restriction pole 13, guarantees holistic work effect.

The driving wheel 3 is in transmission connection with the driving end of the upper driving motor 2 through a transmission belt, and the shaft end of the driving wheel 3 is fixedly connected with the shaft end of the rotating wheel 11 on the fixed support main body 16.

The rotating wheel 11 on the fixed bracket main body 16, the rotating wheel 11 on the rotation limiting rod 12 and the two rotating wheels 11 on the rotation moving plate 7 are jointly provided with a polishing belt.

The outer parts of the upper guide rod 5 and the lower guide rod 4 are provided with adjusting knobs 14 in a threaded manner, and the adjusting knobs 14 penetrate through the surfaces of the lower guide rod 4 and the upper guide rod 5 and the moving rod 15 and the placing table 10 to be abutted.

The bending limiting part 9 is arranged in parallel with the polishing belt, and the bottom of the fixing bracket main body 16 is fixedly provided with the lower main body bracket 1.

When the rotary grinding belt is used, the rotary moving plate 7 is rotated to be at the position on the moving rod 15, the length of the grinding belt wrapped outside the rotary wheels 11 is fixed, the angle change of the arc-shaped guide groove 6 drives the inner angle of the grinding belt to be changed, the tensioning force of the grinding belt is changed, the rotation direction of the rotary moving plate 7 is controlled by the limitation of the arc-shaped guide groove 6, the upper driving motor 2 drives the driving rotating wheel 3 to rotate, the rotating wheel 11 on the fixed support main body 16 is driven by the rotation of the driving rotating wheel 3, so that the rotation of the grinding belt is realized, and meanwhile, the moving rod 15 and the placing table 10 in the upper guide rod 5 and the lower guide rod 4 can be displaced in the length direction, so that the tensioning force is adjusted.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor plastic envelope mould recess grinding device, includes fixed bolster main part (16), its characterized in that: the fixed bolster body (16) is fixed on the surface and is provided with driving motor (2), still rotate on the surface of fixed bolster body (16) and be provided with initiative runner (3), fixed guide bar (4) and the last guide bar (5) of being provided with of upside of fixed bolster body (16), the inside slip of lower guide bar (4) is provided with places platform (10), the inside slip of going up guide bar (5) is provided with movable rod (15), one side rotation of movable rod (15) is provided with rotatory movable plate (7), arc guide slot (6) have been seted up on the surface of rotatory movable plate (7), both sides rotation of rotatory movable plate (7) are provided with rotor (11), fixed limiting plate (8) that are provided with on the surface of rotatory movable plate (7), be equipped with buckling restriction portion (9) on limiting plate (8).

2. The semiconductor plastic package mold groove polishing device according to claim 1, wherein: the fixed support is characterized in that a rotation limiting rod (12) is rotatably arranged on the fixed support body (16), a rotation wheel (11) is rotatably arranged on the rotation limiting rod (12), a hydraulic limiting rod (13) is rotatably arranged on the upper side of the upper guide rod (5), and a piston rod end of the hydraulic limiting rod (13) is rotatably connected with the rotation limiting rod (12).

3. The semiconductor plastic package mold groove polishing device according to claim 1, wherein: the driving wheel (3) is connected with the driving end of the upper driving motor (2) through transmission of a transmission belt, and the shaft end of the driving wheel (3) is fixedly connected with the shaft end of the rotating wheel (11) on the fixed support main body (16).

4. The semiconductor plastic package mold groove polishing device according to claim 1, wherein: the rotating wheel (11) on the fixed bracket main body (16), the rotating wheel (11) on the rotating limiting rod (12) and the two rotating wheels (11) on the rotating moving plate (7) are jointly provided with a polishing belt.

5. The semiconductor plastic package mold groove polishing device according to claim 1, wherein: the outer parts of the upper guide rod (5) and the lower guide rod (4) are provided with adjusting knobs (14) through threads, and the adjusting knobs (14) penetrate through the surfaces of the lower guide rod (4) and the upper guide rod (5) and the surfaces of the moving rod (15) and the placing table (10) to be abutted.

6. The semiconductor plastic package mold groove polishing device according to claim 4, wherein: the bending limiting part (9) is arranged in parallel with the polishing belt, and the bottom of the fixing support main body (16) is fixedly provided with a lower main body support (1).