CN220545326U - Electronic equipment - Google Patents
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- CN220545326U CN220545326U CN202320647353.5U CN202320647353U CN220545326U CN 220545326 U CN220545326 U CN 220545326U CN 202320647353 U CN202320647353 U CN 202320647353U CN 220545326 U CN220545326 U CN 220545326U
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- metal piece
- heat
- electronic device
- metal
- gap
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- 239000002184 metal Substances 0.000 claims abstract description 184
- 239000004020 conductor Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000002791 soaking Methods 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 4
- 239000012782 phase change material Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 239000012811 non-conductive material Substances 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 13
- 230000008054 signal transmission Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides electronic equipment, and relates to the technical field of electronic equipment. Wherein, electronic equipment includes: a first metal piece; the second metal piece is provided with a gap with the first metal piece; and the heat conducting component is at least partially arranged in the gap and comprises a heat conducting material. The application provides an electronic equipment connects in the clearance between first metalwork and second metalwork through heat conduction part, and heat conduction part includes heat conduction material to can form the heat conduction bridge between first metalwork and second metalwork, in order to conduct the heat between first metalwork and the second metalwork, thereby improve the heat dispersion of equipment.
Description
Technical Field
The present disclosure relates to the field of electronic devices, and in particular, to an electronic device.
Background
Electronic devices such as cell phones have become one of the indispensable products for deep use by users. With the increase of demands of users, when running large games, editing software and other software with higher performance requirements by using electronic devices such as mobile phones, the heat dissipation performance of the electronic devices is also important.
Currently, for electronic devices such as mobile phones, the device frame generally includes a middle frame metal piece and an antenna metal piece, where the middle frame metal piece provides a ground for the motherboard and provides a main heat dissipation conductive path for the motherboard. The antenna metal piece is used for transmitting signals, and the antenna metal piece is required to ensure signal transmission performance, so that the antenna metal piece cannot be directly connected with the middle frame metal piece, a gap is formed between the antenna metal piece and the middle frame metal piece, the antenna metal piece is connected with a plastic piece at the gap, and the heat conductivity of the plastic is relatively low, so that heat on the middle frame metal piece cannot be transmitted to the antenna metal piece, and the heat cannot be transmitted to the outside of the equipment through the antenna metal piece.
Accordingly, there is a need for an electronic device to address at least the above-mentioned problems.
Disclosure of Invention
The main object of the present application is to provide an electronic device, which can conduct heat on a middle frame metal piece by using an antenna metal piece, so as to solve the problem that heat on the middle frame metal piece cannot be transferred to the antenna metal piece.
In order to solve the technical problems, the embodiment of the application provides the following technical scheme:
the application provides an electronic device, comprising:
a first metal piece;
a second metal piece, a gap is arranged between the second metal piece and the first metal piece;
and the heat conducting component is at least partially arranged in the gap and comprises a heat conducting material.
The purpose and the technical problem of the application can be further achieved by adopting the following technical measures.
Optionally, the first metal piece is a first part of a metal frame of the electronic device; the second metal piece is a second part of a metal frame of the electronic device.
Optionally, at least one of the first metal piece and the second metal piece is an antenna of the electronic device.
Optionally, the thermally conductive member is made of a non-conductive material.
Optionally, the heat conducting material is any one of the following: a liquid; phase change materials.
Optionally, the thermally conductive material is a high thermal conductivity material.
Optionally, the first metal piece and the second metal piece are respectively contacted with the heat conducting material.
Optionally, the heat conductive member includes: a first portion embedded in the gap; the second part is connected with the first metal piece and the second metal piece in a sealing way, and surrounds the first metal piece, the second metal piece and the first part to form the cavity; the thermally conductive material is located within the cavity.
Optionally, the second portion is larger than the first portion, and a projection surface of the second portion includes the first portion and portions of the first and second metal pieces.
Optionally, the heat conducting component includes a third portion and a fourth portion, where the third portion and the fourth portion are respectively embedded in the gap and enclose to form the cavity; the electronic device further includes a soaking portion, and the third portion or the fourth portion is in contact with the soaking portion.
The foregoing description is only an overview of the technical solutions of the present application, and in order to make the technical means of the present application more clearly understood, it can be implemented according to the content of the specification, and the following detailed description of the preferred embodiments of the present application will be given with reference to the accompanying drawings.
Drawings
The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like reference numerals refer to similar or corresponding parts and in which:
fig. 1 schematically illustrates a cross-sectional view of a connection between a first metal member and a second metal member in an electronic device according to an embodiment of the present application;
fig. 2 schematically illustrates a schematic position state of a first metal part and a second metal part in an electronic device according to an embodiment of the present application;
fig. 3 schematically illustrates a cross-sectional view of a connection between a first metal member and a second metal member in an electronic device according to a second embodiment of the present application;
reference numerals illustrate:
1. a first metal piece; 2. a second metal piece; 3. a heat conductive member; 4. a first portion; 5. a second portion; 6. a cavity; 7. a third section; 8. a fourth section; 9. a soaking section; 10. a gap.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is noted that unless otherwise indicated, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs.
Example 1
To solve the problems in the prior art, as shown in fig. 1 to 2, an embodiment of the present application provides an electronic device, including: a first metal piece 1; a second metal piece 2, a gap 10 is arranged between the second metal piece 2 and the first metal piece 1; the heat conductive member 3 is at least partially disposed in the gap 10, and the heat conductive member 3 includes a heat conductive material.
The electronic equipment provided by the application can be mobile terminals such as mobile phones and notebook computers, and also can be equipment such as processing equipment and display equipment. Wherein, the first metal piece 1 and the second metal piece 2 are isolated from each other through the gap 10, and the heat conducting component 3 is arranged between the first metal piece 1 and the second metal piece 2, so that a heat conducting bridge can be formed between the first metal piece 1 and the second metal piece 2, and heat on the first metal piece 1 and the second metal piece 2 can be mutually transferred, thereby improving heat dissipation capability.
The electronic equipment provided by the application is connected in the gap 10 between the first metal piece 1 and the second metal piece 2 through the heat conduction component 3, and the heat conduction component 3 comprises a heat conduction material, so that a heat conduction bridge can be formed between the first metal piece 1 and the second metal piece 2, heat between the first metal piece 1 and the second metal piece 2 can be conducted, and the heat dissipation performance of the equipment is improved.
Specifically, the first metal piece 1 is a first portion 4 of a metal frame of the electronic device; the second metal member 2 is a second portion 5 of the metal housing of the electronic device, and the first metal member 1 and the second metal member 2 can be fitted to each other with the above-described gap 10 therebetween for use in the metal housing.
Specifically, the first metal piece 1 and the second metal piece 2 may be portions of a metal frame respectively, and when the first metal piece 1 and the second metal piece 2 are spaced apart from each other due to a process requirement, the heat conducting component 3 is embedded in the gap 10, so that the first metal piece 1 and the second metal piece 2 are fixed to each other, and meanwhile, heat transfer can be performed between the first metal piece 1 and the second metal piece 2 by using a heat conducting material, so that a heat dissipation effect of the electronic device is improved.
Specifically, the first metal piece 1 and the second metal piece 2 may be only parts of the metal frame body, and have no function of transmitting signals, and at this time, the heat conducting material of the heat conducting component 3 is arranged between the first metal piece 1 and the second metal piece 2, so that heat can be mutually transferred between the first metal piece 1 and the second metal piece 2.
Specifically, at least one of the first metal piece 1 and the second metal piece 2 is an antenna of the electronic device.
When one of the first metal piece 1 and the second metal piece 2 is an antenna, signal transmission is realized between the antenna and a main board of the electronic equipment through the connecting lug, and the heat transferred to the antenna by the main board through the connecting lug is smaller due to smaller contact area between the main board and the antenna; the first metal piece 1 or the second metal piece 2 which is not an antenna is in contact with the main board and used for transferring heat of the main board to the outside, and a heat conduction bridge is formed between the first metal piece 1 and the second metal piece 2 through the heat conduction material of the heat conduction component 3, so that the heat on the first metal piece 1 or the second metal piece 2 which is not the antenna is transferred to the antenna, and the heat dissipation effect of the electronic equipment is improved by utilizing the auxiliary heat dissipation of the antenna.
When the first metal piece 1 and the second metal piece 2 are both antennas, signal transmission between the two antennas and a main board of the electronic equipment is realized through connecting the ears. The heat conduction bridge is formed between the first metal piece 1 and the second metal piece 2 through the heat conduction material of the heat conduction component 3, so that heat on the first metal piece 1 or the second metal piece 2 is transferred to the antenna, and the antenna is utilized for assisting in heat dissipation, so that the heat dissipation effect of the electronic equipment is improved.
As shown in fig. 1, the heat conductive member 3 may be provided at any two metal pieces having a gap 10, such as between a center metal and a frame metal, between a center metal and an antenna, or between two adjacent antennas.
Specifically, the heat conductive material of the heat conductive member 3 is made of a non-conductive material, and when one of the first metal piece 1 and the second metal piece 2 is an antenna, the heat conductive member 3 can isolate the first metal piece 1 and the second metal piece 2, thereby ensuring the integrity and stability of signal transmission of the antenna.
When the first metal piece 1 and the second metal piece 2 are both antennas, the heat conduction component 3 can isolate the first metal piece 1 and the second metal piece 2, so that the integrity and stability of signal transmission of the two antennas are ensured.
Specifically, the heat conductive material of the heat conductive member 3 is made of a low dielectric constant material, and/or the dielectric constant of the heat conductive material is not more than 4, preferably 2 to 3. The heat conducting material is made of a low dielectric constant material, so that the first metal piece 1 and the second metal piece 2 can be isolated, and an electric circuit breaker is formed between the first metal piece 1 and the second metal piece 2, so that the mutual independence of electricity is ensured between the first metal piece 1 and the second metal piece 2.
Specifically, the heat conductive material may be any one of the following: liquid, phase change material.
The heat conducting material may be liquid, such as oil, to dissipate heat by absorbing external heat, or may be a phase change material to transfer heat by switching between different states of material properties.
Specifically, the first metal piece 1 and the second metal piece 2 are respectively in contact with the heat conductive material, so that the heat conductive material can transfer heat between the first metal piece 1 and the second metal piece 2.
Wherein the heat conductive member 3 includes: a first portion 4 embedded in the gap 10; the second part 5 is connected with the first metal piece 1 and the second metal piece 2 in a sealing way, and forms a cavity 6 with the first metal piece 1, the second metal piece 2 and the first part 4 in a surrounding way; a thermally conductive material is located within the cavity 6.
The first part 4 and the second part 5 of the heat conducting element 3 may be injection molded from plastic or plastic, the first part 4 being connected in the gap 10 such that the first metal part 1 and the second metal part 2 are integrated, and the second part 5 may be connected to the first metal part 1 and the second metal part 2 by injection molding.
Because the heat conducting material has high heat conductivity, the heat conducting material is arranged in the cavity 6 and can be connected with the first metal piece 1 and the second metal piece 2 respectively, so that the heat of the second metal piece 2 can be transferred to the first metal piece 1, and the rapid transfer of the heat can be realized.
Specifically, the second portion 5 is larger than the first portion 4, and the projection surface of the second portion 5 includes the first portion 4 and portions of the first metal piece 1 and the second metal piece 2.
Taking the first metal piece 1 as an antenna and the second metal piece 2 as a middle frame metal as an example, a part of the first metal piece 1 and the second metal piece 2 are positioned on the same plane, a gap 10 is formed between the first metal piece 1 and the second metal piece 2, and the first part 4 of the heat conducting component 3 is embedded in the gap 10 so as to connect the first metal piece 1 and the second metal piece 2.
The projection surface of the second part 5 comprising the first part 4 and the parts of the first metal part 1 and the second metal part 2 means that: the projection surface of the second portion 5 is located in a range covering part of the first metal member 1 and part of the second metal member 2, respectively. The second portion 5 is respectively contacted with the first surface of the first metal piece 1, which is not located on the same plane with the second metal piece 2, and the second surface of the second metal piece 2, which is located on the same plane with the first metal piece 1, so that the first portion 4 of the heat conduction component 3, the second metal piece 2 and the first metal piece 1 enclose a cavity 6, and the sealing performance is ensured.
Specifically, the heat conductive member 3 is integrally formed, and the heat conductive member 3 is provided with a one-way hole connected to the cavity 6 for injecting a heat conductive material into the cavity 6 by a tool.
According to the electronic equipment provided by the embodiment of the application, the heat conduction component 3 is embedded between the first metal piece 1 and the second metal piece 2, and heat conduction is carried out through the heat conduction material in the sealed cavity 6, so that the effect of not only conducting heat but also electrically isolating between the first metal piece 1 and the second metal piece 2 is formed, and the heat dissipation performance of the equipment is improved.
Example 2
Embodiment 2 of the present application provides an electronic apparatus differing from embodiment 1 in the structure of the heat conductive member 3.
Specifically, as shown in fig. 3, the heat conducting member 3 includes a third portion 7 and a fourth portion 8, and the third portion 7 and the fourth portion 8 are respectively embedded in the gap 10 and enclose to form a cavity 6;
the electronic device further comprises a soaking section 9, and the third section 7 or the fourth section 8 is in contact with the soaking section 9.
The heat conducting member 3 is embedded in the gap 10, and has the cavity 6 inside, the heat conducting material is disposed in the cavity 6, and the third portion 7 or the fourth portion 8 is in contact with the soaking portion 9, so that the heat of the cavity 6 can be transferred to the soaking portion 9, and the heat is dissipated by utilizing the heat dissipating capability of the soaking portion 9.
When the first metal piece 1 or the second metal piece 2 is an antenna and the antenna accessory is provided with a heat source, such as a horn, part of the outer wall of the cavity 6 is in contact with the antenna, and the heat conduction material in the cavity 6 can absorb the heat of the antenna due to the thinner wall thickness of the cavity 6, and meanwhile, the other part of the outer wall of the cavity 6 is in contact with the soaking part 9, so that the heat of the antenna is transferred by the soaking part 9 through a traditional heat dissipation path.
The soaking part 9 can be a radiating fin of the electronic equipment made of graphite so as to be capable of further radiating the antenna, so that the performance of antenna signal transmission is ensured, and overheating is avoided. The heat conducting member 3 is embedded in the gap 10, and a part of the soaking part 9 can be attached to a part of the surface of the heat conducting member 3, so that heat of the first metal piece 1 and/or the second metal piece 2 can be transferred to the soaking part 9 through the heat conducting member 3 and the heat conducting material, and heat dissipation of the first metal piece 1 and/or the second metal piece is achieved.
The embodiment of the application provides electronic equipment, inlays between first metalwork 1 and second metalwork 2 through heat conduction part 3 to carry out heat conduction through the heat conduction material in sealed cavity 6, utilize traditional heat dissipation route to dispel the heat, thereby improved the heat dispersion of equipment.
It will be appreciated that the relevant features of the apparatus described above may be referred to with respect to each other. In addition, the "first", "second", and the like in the above embodiments are for distinguishing the embodiments, and do not represent the merits and merits of the embodiments.
In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the present application may be practiced without these specific details. In some instances, well-known structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (9)
1. An electronic device, comprising:
a first metal piece;
a second metal piece, a gap is arranged between the second metal piece and the first metal piece;
a heat conducting member at least partially disposed in the gap, the heat conducting member comprising a heat conducting material;
the heat conductive material of the heat conductive member is made of a non-conductive material.
2. The electronic device of claim 1, wherein the electronic device comprises a memory device,
the first metal piece is a first part of a metal frame of the electronic equipment;
the second metal piece is a second part of a metal frame of the electronic device.
3. The electronic device of claim 2, wherein the electronic device comprises a memory device,
at least one of the first metal piece and the second metal piece is an antenna of the electronic device.
4. The electronic device of claim 1, wherein the thermally conductive material is any one of:
a liquid;
phase change materials.
5. The electronic device of claim 4, wherein the thermally conductive material is a high thermal conductivity material.
6. The electronic device of claim 1, wherein the first metal piece and the second metal piece are each in contact with the thermally conductive material.
7. The electronic device of claim 6, wherein the electronic device comprises a memory device,
the heat conductive member includes:
a first portion embedded in the gap;
the second part is connected with the first metal piece and the second metal piece in a sealing way, and forms a cavity with the first metal piece, the second metal piece and the first part in a surrounding way;
the thermally conductive material is located within the cavity.
8. The electronic device of claim 7, wherein the electronic device comprises a memory device,
the second portion is larger than the first portion, and a projection surface of the second portion includes the first portion and portions of the first and second metal pieces.
9. The electronic device of claim 1, wherein the electronic device comprises a memory device,
the heat conduction component comprises a third part and a fourth part, and the third part and the fourth part are respectively embedded in the gap and enclose to form a cavity;
the electronic device further includes a soaking portion, and the third portion or the fourth portion is in contact with the soaking portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320647353.5U CN220545326U (en) | 2023-03-27 | 2023-03-27 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320647353.5U CN220545326U (en) | 2023-03-27 | 2023-03-27 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220545326U true CN220545326U (en) | 2024-02-27 |
Family
ID=89976238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320647353.5U Active CN220545326U (en) | 2023-03-27 | 2023-03-27 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220545326U (en) |
-
2023
- 2023-03-27 CN CN202320647353.5U patent/CN220545326U/en active Active
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| GR01 | Patent grant | ||
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