CN106558568B - Packaging structure - Google Patents
Packaging structure Download PDFInfo
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- CN106558568B CN106558568B CN201510640033.7A CN201510640033A CN106558568B CN 106558568 B CN106558568 B CN 106558568B CN 201510640033 A CN201510640033 A CN 201510640033A CN 106558568 B CN106558568 B CN 106558568B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
A package structure includes a package body, an active device, a first lead frame and a second lead frame. The active element is packaged in the packaging body. The active device includes a first electrode and a second electrode. The first electrode is arranged on the first lead frame and is electrically connected with the first lead frame. The first lead frame has a first exposed surface. The first exposed surface and the first electrode are respectively positioned on the opposite sides of the first lead frame. The first exposed surface is exposed outside the packaging body. The second electrode is arranged on the second lead frame and is electrically connected with the second lead frame. The second lead frame has a second exposed surface. The second exposed surface and the second electrode are respectively positioned on the opposite sides of the second lead frame. The second exposed surface is exposed outside the packaging body. The shortest distance from the first electrode to the second electrode is smaller than the shortest distance from the first exposed surface to the second exposed surface.
Description
Technical Field
The invention relates to a packaging structure.
Background
With the rapid and vigorous development of information technology, the miniaturization trend of electronic devices is not always the trend. Therefore, the integration of electronic components on the circuit board is increasing, so that the heat dissipation problem of the electronic components is more important.
Further, the power transistor is a common basic element in electronic devices such as power supply devices, control devices, measuring instruments, electrical devices, computer peripherals, etc., and the main function of the power transistor is signal processing or power driving, and generally processing a signal with larger power, so that the heat generated is larger, and the requirement of heat dissipation is particularly important.
Generally, the heat dissipation of the power transistor is usually realized by the shape design of the lead frame. In addition to the heat dissipation problem, the signal power passing through the high power transistor is large, so the lead frames connected to different electrodes are relatively easy to be short-circuited. Therefore, the lead frame must also be designed to meet the requirement of short circuit prevention. Therefore, it is one of the important issues in the related art to satisfy the requirements of heat dissipation and short circuit prevention of the power transistor.
Disclosure of Invention
In an embodiment of the present invention, a package structure is provided, in which the requirements of heat dissipation and short circuit prevention of an active device can be satisfied.
According to an embodiment of the present invention, a package structure includes a package body, an active device, a first lead frame and a second lead frame. The active element is packaged in the packaging body. The active device includes a first electrode and a second electrode. The first electrode is arranged on the first lead frame and is electrically connected with the first lead frame. The first lead frame has a first exposed surface. The first exposed surface and the first electrode are respectively positioned on the opposite sides of the first lead frame. The first exposed surface is exposed outside the packaging body. The second electrode is arranged on the second lead frame and is electrically connected with the second lead frame. The second lead frame has a second exposed surface. The second exposed surface and the second electrode are respectively positioned on the opposite sides of the second lead frame. The second exposed surface is exposed outside the packaging body. The shortest distance from the first electrode to the second electrode is smaller than the shortest distance from the first exposed surface to the second exposed surface.
In the above embodiment, the first lead frame and the second lead frame have the first exposed surface and the second exposed surface exposed outside the package body, respectively, so that heat of the active device can be conducted to the outside of the package body. In addition, since the shortest distance from the first exposed surface to the second exposed surface is longer than the shortest distance from the first electrode to the second electrode, the first exposed surface may not be excessively close to the second exposed surface. Therefore, even if the first electrode and/or the second electrode of the active element transmit high-power signals, and the first exposed surface and the second exposed surface exposed in the air can generate electric arcs, the first exposed surface and the second exposed surface are kept at a long enough distance, so that the first exposed surface and the second exposed surface can be prevented from generating electric arcs, and the electric arcs can be further prevented from causing a short circuit condition of the first electrode and the second electrode. Therefore, in the above embodiments, the heat dissipation and short circuit prevention requirements of the active device can be satisfied.
The foregoing is merely illustrative of the problems to be solved, solutions to problems, and effects thereof, and the specific details of the present invention are set forth in the following description and the related drawings.
Drawings
In order that the embodiments of the invention may be more fully understood, reference is now made to the following descriptions taken in conjunction with the accompanying drawings:
FIG. 1 is a schematic perspective view illustrating a package structure according to an embodiment of the invention;
FIG. 2 is a schematic cross-sectional view taken along line 2-2' of FIG. 1;
FIG. 3 is a schematic cross-sectional view of a package structure according to another embodiment of the invention;
FIG. 4 is a schematic cross-sectional view of a package structure according to another embodiment of the invention;
FIG. 5 is a schematic perspective view illustrating a package structure according to another embodiment of the invention;
FIG. 6 is a cross-sectional view taken along line 6-6' of FIG. 5; and
fig. 7 is a schematic cross-sectional view illustrating a package structure according to another embodiment of the invention.
Wherein the reference numerals are as follows:
100: package body
200: active component
201: first surface
202: second surface
210: a first electrode
211: first inner edge
221: second inner edge
220: second electrode
230: third electrode
300. 300 a: first lead frame
301. 301 a: the first exposed surface
3011: first exposed edge
310 a: a first embedded part
311 a: inner end surface
320 a: the first exposed part
400. 400 a: second lead frame
401. 401 a: the second exposed surface
4011: second exposed edge
410. 410 a: second embedded part
411: inner end surface
420. 420 a: the second exposed part
500: third lead frame
501: the third exposed surface
600. 600 a: heat sink
601: first heat conducting surface
602. 602 a: second heat-conducting surface
710. 720: adhesive layer
A: direction of arrangement
D1, D2: shortest distance
L1: first embedded length
L2: second length of embedding
L3: first overlap length
L4: second overlap length
O1: first overlapping area
O2: second overlapping area
P1, P2: orthographic projection
Detailed Description
In the following description, for purposes of explanation, numerous implementation details are set forth in order to provide a thorough understanding of the various embodiments of the present invention. However, it will be apparent to one skilled in the art that these implementation details are not required in some embodiments of the invention and are not to be construed as limiting the invention. In addition, some conventional structures and elements are shown in simplified schematic form in the drawings.
Fig. 1 is a schematic perspective view illustrating a package structure according to an embodiment of the invention. FIG. 2 is a schematic cross-sectional view taken along line 2-2' of FIG. 1. As shown in fig. 1 and 2, in the present embodiment, the package structure includes a package body 100, an active device 200, a first lead frame 300, and a second lead frame 400. The active device 200 is encapsulated in the package 100 and can be protected by the package 100. The active device 200 includes a first electrode 210 and a second electrode 220. The first electrode 210 is disposed on the first lead frame 300 and electrically connected to the first lead frame 300. The second electrode 220 is disposed on the second lead frame 400 and electrically connected to the second lead frame 400. The first lead frame 300 has a first exposed surface 301. The first exposed surface 301 and the first electrode 210 are respectively located on opposite sides of the first lead frame 300. In other words, the first exposed surface 301 faces away from the first electrode 210. The second lead frame 400 has a second exposed surface 401. The second exposed surface 401 and the second electrode 220 are respectively located on opposite sides of the second lead frame 400. In other words, the second exposed surface 401 faces away from the second electrode 220. The first exposed surface 301 and the second exposed surface 401 are exposed outside the package body 100. Thus, when the active device 200 operates, the heat generated by the first electrode 210 can be conducted to the first exposed surface 301 through the first lead frame 300, and dissipated to the external environment (such as air) through the first exposed surface 301; similarly, heat generated by the second electrode 220 can be conducted to the second exposed surface 401 through the second lead frame 400, and dissipated to the external environment (e.g., air) through the second exposed surface 401.
As shown in fig. 2, the first electrode 210 to the second electrode 220 define a shortest distance D1, and the first exposed surface 301 to the second exposed surface 401 define a shortest distance D2, wherein the shortest distance D1 is smaller than the shortest distance D2. In this way, when the first electrode 210 and/or the second electrode 220 transmit the high power signal, even though the first exposed surface 301 and the second exposed surface 401 may be exposed outside the package 100 to generate an arc, since the shortest distance D2 between the first exposed surface 301 and the second exposed surface 401 is long enough, the generation of the arc can be effectively prevented, thereby further preventing the first electrode 210 and the second electrode 220 from being short-circuited. Therefore, in the present embodiment, the heat dissipation and the short circuit prevention effect can be achieved at the same time.
In some embodiments, the active device 200 includes a first surface 201 and a second surface 202 opposite to each other. In other words, the first surface 201 and the second surface 202 are located on opposite sides of the active element 200. The first electrode 210 and the second electrode 220 are located on the first surface 201. In other words, the first electrode 210 and the second electrode 220 are located on the same surface of the active device 200. The first electrode 210 has a first inner edge 211 closest to the second electrode 220. The second electrode 220 has a second inner edge 221 closest to the first electrode 210. The first electrodes 210 and the second electrodes 220 are arranged on the first surface 201 along the arrangement direction a. The shortest distance D1 may be a distance measured along the arrangement direction a from the first inner edge 211 to the second inner edge 221. The first exposed face 301 has a first exposed edge 3011 closest to the second exposed face 401. The second exposed face 401 has a second exposed edge 4011 closest to the first exposed face 301. The shortest distance D2 may be the distance measured along the arrangement direction a from the first exposed edge 3011 to the second exposed edge 4011.
In some embodiments, as shown in fig. 2, an orthographic projection P1 of the first electrode 210 onto the first lead frame 300 overlaps the first exposed surface 301. In other words, as shown in fig. 2, a portion of the first exposed surface 301 is located directly below the first electrode 210. As a result, the thermal conduction path from the first electrode 210 to the first exposed surface 301 can be shortened, so that the heat of the first electrode 210 can be transferred to the first exposed surface 301, thereby improving the heat dissipation effect of the first lead frame 300 on the first electrode 210. For example, in some embodiments, as shown in fig. 2, the orthographic projection P1 of the first electrode 210 toward the first lead frame 300 may completely overlap the first exposed surface 301. In other words, the orthographic projection P1 of the first electrode 210 toward the first lead frame 300 may be entirely within the first exposed surface 301. In this way, the entire first electrode 210 is located right above the first exposed surface 301, so that heat generated at any position of the first electrode 210 can be transferred downward to the first exposed surface 301, thereby improving the heat dissipation effect of the first lead frame 300 on the first electrode 210.
In some embodiments, as shown in fig. 2, the orthographic projection P2 of the second electrode 220 onto the second lead frame 400 does not overlap the second exposed surface 401. Such a design may preferably maintain the relationship that the shortest distance D2 is greater than the shortest distance D1 when the first electrode 210 overlaps the first exposed surface 301 toward the front projection P1 of the first lead frame 300, so as to help prevent the first electrode 210 and the second electrode 220 from being shorted due to arcing between the first lead frame 300 and the second lead frame 400.
In some embodiments, since the orthographic projection P2 of the second electrode 220 toward the second lead frame 400 does not overlap the second exposed surface 401, and the orthographic projection P1 of the first electrode 210 toward the first lead frame 300 overlaps the first exposed surface 301, the heat dissipation effect of the second lead frame 400 on the second electrode 220 may be lower than the heat dissipation effect of the first lead frame 300 on the first electrode 210, and therefore, in some embodiments, a relatively high temperature electrode in the active device 200 may be used as the first electrode 210, and a relatively low temperature electrode in the active device 200 may be used as the second electrode 220. For example, the active device 200 may be a Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET), and when the MOSFET is operated, the temperature of the drain is higher than that of the source, so that the first electrode 210 may be the drain and the second electrode 220 may be the source, and thus the drain with relatively high temperature may be disposed on the first leadframe 300 with higher heat dissipation Effect, and the source with relatively low temperature may be disposed on the second leadframe 400 with lower heat dissipation Effect. It should be understood that the above-mentioned MOSFET is only used for illustration and not for limiting the active device 200 of the present invention, and in other embodiments, the active device 200 may be other devices, such as: junction Field Effect Transistors (JFETs), fin field effect transistors (finfets), or Insulated Gate Bipolar Transistors (IGBTs), etc., but the invention is not limited thereto.
In some embodiments, as shown in fig. 1, the package structure may further include a third lead frame 500, and the active device 200 may further include a third electrode 230. The third electrode 230 is located on the first surface 201 of the active device 200. In other words, the first electrode 210, the second electrode 220, and the third electrode 230 may be located on the same surface of the active device 200. The third electrode 230 is disposed on the third lead frame 500 and electrically connected to the third lead frame 500. In this way, the third electrode 230 may dissipate heat and transmit signals through the third lead frame 500. For example, the active device 200 may be a transistor, and the first electrode 210 may be a drain of the transistor; the second electrode 220 may be a source of a transistor; the third electrode 230 may be a gate of a transistor.
In some embodiments, the first lead frame 300, the second lead frame 400 and the third lead frame 500 may be made of a conductive material to electrically connect to corresponding electrodes, for example, the conductive material may be a metal, but the invention is not limited thereto. The first, second and third lead frames 300, 400 and 500 are separated from each other to prevent electrical connection therebetween. For example, a portion of the package body 100 may be filled in a gap between the first lead frame 300, the second lead frame 400 and the third lead frame 500 to separate them. In some embodiments, the package 100 may be made of an insulating material, such as: the polymer resin material, but the invention is not limited thereto, and the insulating resin material can prevent the first lead frame 300, the second lead frame 400 and the third lead frame 500 from being electrically connected.
In some embodiments, a conductive adhesive (not shown) may be interposed between the first electrode 210 and the first lead frame 300, so that the first electrode 210 may be fixed and electrically connected to the first lead frame 300 by the conductive adhesive. Similarly, in some embodiments, a conductive adhesive may be interposed between the second electrode 220 and the second lead frame 400, such that the second electrode 220 may be fixed and electrically connected to the second lead frame 400 by the conductive adhesive. Similarly, in some embodiments, a conductive adhesive may be interposed between the third electrode 230 and the third lead frame 500, such that the third electrode 230 may be fixed and electrically connected to the third lead frame 500 by the conductive adhesive. It should be understood that the conductive paste is only used for illustrating the connection between the electrode and the lead frame, and is not intended to limit the present invention, and in other embodiments, different connection methods may be used to connect the electrode and the lead frame, for example: solder may be used to connect the electrodes to the leadframe, but the invention is not limited thereto.
Fig. 3 is a schematic cross-sectional view illustrating a package structure according to another embodiment of the invention. As shown in fig. 3, the main differences between this embodiment and the embodiment shown in fig. 2 are: the first lead frame 300a is different from the first lead frame 300. Specifically, the first lead frame 300a includes a first buried portion 310a and a first exposed portion 320 a. The first embedded portion 310a and the first exposed portion 320a are arranged along the arrangement direction a of the first electrode 210 and the second electrode 220, and the first embedded portion 310a is closer to the second electrode 220 than the first exposed portion 320 a. The first embedded portion 310a is embedded in the package 100 without being exposed outside the package 100. The first exposed surface 301a is located on the first exposed portion 320a and exposed outside the package body 100.
The first electrode 210 is disposed on the first embedded portion 310a and the first exposed portion 320 a. In other words, the orthographic projection P1 of the first electrode 210 toward the first lead frame 300a overlaps the first buried portion 310a and the first exposed portion 320 a. In other words, the orthographic projection P1 of the first electrode 210 toward the first lead frame 300a is not entirely within the first exposed surface 301 a. Since the orthographic projection P1 of the first electrode 210 to the first lead frame 300a overlaps the first embedded portion 310a, and the first embedded portion 310a is embedded in the package 100, the orthographic projection P1 of the first electrode 210 to the first lead frame 300a overlaps a portion of the package 100, that is, a portion of the package 100 is located right below the first electrode 210, and further, the first embedded portion 310a is located between the portion of the package 100 and the first electrode 210. Such a design may help the package body 100 to fix the first lead frame 300a more firmly.
In some embodiments, as shown in fig. 3, the second lead frame 400 includes a second buried portion 410 and a second exposed portion 420. The second embedded portion 410 and the second exposed portion 420 are arranged along the arrangement direction a of the first electrode 210 and the second electrode 220, and the second embedded portion 410 is closer to the first electrode 210 than the second exposed portion 420. The second embedded portion 410 is embedded in the package 100 without being exposed outside the package 100. The second exposed surface 401 is located on the second exposed portion 420 and exposed outside the package body 100. The second electrode 220 is disposed on the second buried portion 410. In other words, the second electrode 220 overlaps the second embedded portion 410 toward the front projection P2 of the second lead frame 400, and does not overlap the second exposed portion 420. As such, the second electrode 220 is completely disposed on the second embedded portion 410. Since the second embedded portion 410 is embedded in the package body 100, an orthographic projection P2 of the second electrode 220 toward the second lead frame 400 overlaps a portion of the package body 100, that is, a portion of the package body 100 is located right below the second electrode 220, and further, the second embedded portion 410 is located between the portion of the package body 100 and the second electrode 220. Such a design may help the package body 100 to fix the second lead frame 400 more firmly.
In some embodiments, as shown in fig. 3, the first buried portion 310a has a first buried length L1 parallel to the arrangement direction a of the first and second electrodes 210 and 220, and the second buried portion 410 also has a second buried length L2 parallel to the arrangement direction a. The first buried length L1 is less than the second buried length L2. In other words, in a dimension parallel to the arrangement direction a, the first embedded portion 310a is shorter than the second embedded portion 410, which may help the shortest distance from the first exposed surface 301a to the first inner edge 211 along the arrangement direction a to be smaller than the shortest distance from the second exposed surface 401 to the second inner edge 221 along the arrangement direction a, such that the heat dissipation effect of the first leadframe 300a is higher than that of the second leadframe 400, such that the drain electrode that is relatively easy to generate heat is disposed on the first leadframe 300a, and the source electrode that is relatively difficult to generate heat is disposed on the second leadframe 400.
For example, the first embedded part 310a has an inner end surface 311a closest to the second embedded part 410, and the second embedded part 410 has an inner end surface 411 closest to the first embedded part 310 a. In some embodiments, the inner end surface 311a of the first embedded portion 310a and the first inner edge 211 of the first electrode 210 may be substantially aligned, so that the shortest distance from the first exposed surface 301a to the first inner edge 211 along the arrangement direction a is the first embedded length L1 of the first embedded portion 310 a. Similarly, in some embodiments, the inner end surface 411 of the second embedded portion 410 and the second inner edge 221 of the second electrode 220 may be substantially aligned, so that the shortest distance from the second exposed surface 401 to the second inner edge 221 along the arrangement direction a is the second embedded length L2 of the second embedded portion 410. Since the first embedding length L1 is smaller than the second embedding length L2, the shortest distance from the first exposed surface 301a to the first inner edge 211 along the arrangement direction a is smaller than the shortest distance from the second exposed surface 401 to the second inner edge 221 along the arrangement direction a, so that the heat dissipation effect of the first lead frame 300a is better than that of the second lead frame 400.
In some embodiments, as shown in fig. 3, an orthogonal projection P1 of the first electrode 210 toward the first lead frame 300a and the first exposed surface 301a define a first overlapping region O1. The first overlap region O1 has a first overlap length L3 parallel to the arrangement direction a of the first electrodes 210 and the second electrodes 220. Preferably, the ratio of the first overlap length L3 to the first embedding length L1 is greater than 3, so as to facilitate heat dissipation of the first lead frame 300a to the first electrode 210.
Other features shown in fig. 3 are similar to those of fig. 1 and 2, and thus the corresponding description above may be referred to without repetition.
Fig. 4 is a schematic cross-sectional view illustrating a package structure according to another embodiment of the invention. As shown in fig. 4, the main differences between this embodiment and the embodiment shown in fig. 3 are: the orthographic projection P2 of the second electrode 220 onto the second lead frame 400a overlaps the second exposed surface 401 a. In other words, a portion of the second exposed surface 401a is located under the second electrode 220. As a result, the thermal conduction path from the second electrode 220 to the second exposed surface 401a can be shortened, so that the heat of the second electrode 220 can be transferred to the second exposed surface 401a, thereby improving the heat dissipation effect of the second lead frame 400a on the second electrode 220. Specifically, the second electrode 220 is disposed on the second embedded portion 410a and the second exposed portion 420 a. In other words, the orthographic projection P2 of the second electrode 220 onto the second lead frame 400a not only overlaps the second embedded portion 410, but also overlaps the second exposed surface 401a of the second exposed portion 420a to help heat dissipation.
In some embodiments, as shown in fig. 4, the orthogonal projection P2 of the second electrode 220 toward the second lead frame 400a and the second exposed surface 401a define a second overlapping area O2. The second overlap area O2 has a second overlap length L4 parallel to the arrangement direction a of the first and second electrodes 210 and 220. The first overlap length L3 of the first overlap region O1 is greater than the second overlap length L4 of the second overlap region O2. In other words, the overlapping area of the first exposed surface 301a and the first electrode 210 is larger than the overlapping area of the second exposed surface 401a and the second electrode 220, so that the heat dissipation effect of the first lead frame 300a on the first electrode 210 is better than the heat dissipation effect of the second lead frame 400a on the second electrode 220.
Other features shown in fig. 4 are similar to those of fig. 1 to 3, and the corresponding description may be referred to without repetition.
Fig. 5 is a schematic perspective view illustrating a package structure according to another embodiment of the invention. FIG. 6 is a cross-sectional view taken along line 6-6' of FIG. 5. As shown in fig. 5 and 6, the main difference between the present embodiment and the foregoing embodiment is that: in this embodiment, the package structure further includes a heat sink 600. The heat sink 600 connects the second surface 202 of the active device 200 and the third leadframe 500. In this way, the heat of the active device 200 may be conducted not only to the first lead frame 300 and the second lead frame 400 through the first electrode 210 and the second electrode 220 on the first surface 201, but also to the third lead frame 500 through the heat sink 600 on the second surface 202.
Further, as shown in fig. 6, the heat dissipation member 600 includes a first heat conduction surface 601 and a second heat conduction surface 602 opposite to each other. The first thermal conductive surface 601 faces the active device 200 and the third lead frame 500, and is disposed on the active device 200 and the third lead frame 500. For example, the package structure may also include adhesive layers 710 and 720. The adhesive layer 710 is adhered between the first thermal conductive surface 601 and the second surface 202 of the active device 200. The adhesive layer 720 is adhered between the first thermal conductive surface 601 and the third lead frame 500. In this way, the heat on the second surface 202 of the active device 200 may be conducted to the third leadframe 500 through the heat spreader 600. In some embodiments, the third leadframe 500 has a third exposed surface 501. The third exposed surface 501 is exposed outside the package body 100. In this way, the heat conducted from the active device 200 to the third leadframe 500 can be dissipated to the external environment (e.g., air) through the third exposed surface 501.
Other features shown in fig. 5 and 6 are similar to those of fig. 1 to 4, and thus the corresponding description may be referred to without repetition.
Fig. 7 is a schematic cross-sectional view illustrating a package structure according to another embodiment of the invention. As shown in fig. 7, the main difference between this embodiment and the embodiment shown in fig. 6 is that: the second heat conducting surface 602a of the heat sink 600a is exposed outside the package 100. In this way, the heat conducted from the active device 200 to the heat sink 600a can be conducted not only to the third lead frame 500, but also dissipated to the external environment (e.g., air) through the second heat conducting surface 602. Other features shown in fig. 7 are similar to those of fig. 1 to 6, and the corresponding description may be referred to without repetition.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (8)
1. A package structure, comprising:
a package body;
the active element is packaged in the packaging body and comprises a first electrode, a second electrode, a third electrode, a first surface and a second surface which are opposite, and the first electrode, the second electrode and the third electrode are positioned on the first surface;
the first lead frame is provided with a first exposed surface, the first exposed surface and the first electrode are respectively positioned at the opposite sides of the first lead frame, and the first exposed surface is exposed outside the packaging body; and
the second lead frame is provided with a second exposed surface, the second exposed surface and the second electrode are respectively positioned on the opposite sides of the second lead frame, and the second exposed surface is exposed outside the packaging body;
wherein the shortest distance from the first electrode to the second electrode is smaller than the shortest distance from the first exposed surface to the second exposed surface;
the first lead frame comprises a first embedded part and a first exposed part, the first electrode and the second electrode are arranged along an arrangement direction, the first embedded part and the first exposed part are arranged along the arrangement direction, the first embedded part is closer to the second electrode than the first exposed part, the first electrode overlaps the first embedded part and the first exposed part towards the orthographic projection of the first lead frame, the first embedded part is embedded in the packaging body, and the first exposed surface is positioned at the first exposed part;
the package structure further includes:
a heat sink and a third lead frame;
the third electrode is arranged on the third lead frame, and the heat dissipation part is connected with the second surface of the active element and the third lead frame;
the heat sink includes a first heat conducting surface facing the active device and the third lead frame, and is disposed on the second surface of the active device and the third lead frame.
2. The package structure according to claim 1, wherein an orthogonal projection of the first electrode toward the first leadframe overlaps the first exposed surface.
3. The package structure according to claim 1, wherein an orthogonal projection of the second electrode toward the second leadframe does not overlap the second exposed surface.
4. The package structure of claim 1, wherein an orthogonal projection of the first electrode toward the first leadframe and the first exposed surface define a first overlapping area, an orthogonal projection of the second electrode toward the second leadframe and the second exposed surface define a second overlapping area, the first electrode and the second electrode are arranged along an arrangement direction, the first overlapping area has a first overlapping length parallel to the arrangement direction, the second overlapping area has a second overlapping length parallel to the arrangement direction, and the first overlapping length is greater than the second overlapping length.
5. The package structure of claim 1, wherein the first electrode has a first inner edge closest to the second electrode, the second electrode has a second inner edge closest to the first electrode, the first and second electrodes are arranged along an arrangement direction, and a shortest distance from the first exposed surface to the first inner edge along the arrangement direction is smaller than a shortest distance from the second exposed surface to the second inner edge along the arrangement direction.
6. The package structure according to claim 1, wherein the second leadframe includes a second embedded portion and a second exposed portion, the second embedded portion and the second exposed portion are arranged along the arrangement direction, the second embedded portion is closer to the first electrode than the second exposed portion, the second electrode overlaps the second embedded portion toward an orthographic projection of the second leadframe, the second embedded portion is embedded in the package body, the second exposed surface is located at the second exposed portion, wherein the first embedded portion has a first embedded length parallel to the arrangement direction, the second embedded portion has a second embedded length parallel to the arrangement direction, and the first embedded length is smaller than the second embedded length.
7. The package structure of claim 1, wherein the first electrode is a drain and the second electrode is a source.
8. The package structure according to claim 1, wherein the heat spreader has a first thermal conductive surface and a second thermal conductive surface opposite to each other, and the second thermal conductive surface is exposed outside the package body.
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| CN201510640033.7A CN106558568B (en) | 2015-09-30 | 2015-09-30 | Packaging structure |
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| CN201510640033.7A CN106558568B (en) | 2015-09-30 | 2015-09-30 | Packaging structure |
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| CN110140217B (en) * | 2017-10-27 | 2023-03-14 | 瑞仪光电(苏州)有限公司 | LED light source module and manufacturing method thereof |
| US11686896B2 (en) | 2017-10-27 | 2023-06-27 | Radiant Opto-Electronics(Suzhou) Co., Ltd. | LED light source module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1868057A (en) * | 2003-10-17 | 2006-11-22 | 皇家飞利浦电子股份有限公司 | Method for providing double-sided cooling of leadframe-based wire-bonded electronic packages and device produced thereby |
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| KR100583494B1 (en) * | 2000-03-25 | 2006-05-24 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package |
| US7880282B2 (en) * | 2003-12-18 | 2011-02-01 | Rf Module & Optical Design Ltd. | Semiconductor package with integrated heatsink and electromagnetic shield |
| US7880313B2 (en) * | 2004-11-17 | 2011-02-01 | Chippac, Inc. | Semiconductor flip chip package having substantially non-collapsible spacer |
| CN202839586U (en) * | 2012-09-14 | 2013-03-27 | 杰群电子科技（东莞）有限公司 | Outer-pin-free flat semiconductor package structure adopting elastic device |
| US9230880B2 (en) * | 2014-01-28 | 2016-01-05 | Infineon Technolgies Ag | Electronic device and method for fabricating an electronic device |
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| CN1868057A (en) * | 2003-10-17 | 2006-11-22 | 皇家飞利浦电子股份有限公司 | Method for providing double-sided cooling of leadframe-based wire-bonded electronic packages and device produced thereby |
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Effective date of registration: 20221116 Address after: No. 252, Shanying Road, Guishan District, Taoyuan City, Taiwan, China, China (6/F) Patentee after: Anchorage Semiconductor Co.,Ltd. Address before: Taoyuan City, Taiwan, China Patentee before: DELTA ELECTRONICS, Inc. |
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