CN220545215U - Automatic copper ball adding device for circuit board production - Google Patents
Automatic copper ball adding device for circuit board production Download PDFInfo
- Publication number
- CN220545215U CN220545215U CN202322197082.0U CN202322197082U CN220545215U CN 220545215 U CN220545215 U CN 220545215U CN 202322197082 U CN202322197082 U CN 202322197082U CN 220545215 U CN220545215 U CN 220545215U
- Authority
- CN
- China
- Prior art keywords
- track
- moving plate
- copper ball
- support frame
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 43
- 239000010949 copper Substances 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000009713 electroplating Methods 0.000 claims abstract description 12
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses an automatic copper ball adding device for circuit board production, which comprises a support frame, wherein a moving plate is arranged on the support frame in a sliding manner, the left end and the right end of the moving plate are in sliding connection with a sliding groove formed in the support frame, a material groove is formed in the moving plate, the top and the right side of the material groove are opened, the bottom of the material groove is in a slope shape inclined rightwards, a material opening is formed in the top of the rear side of the material groove, a track for the copper balls to automatically slide downwards is arranged on the right side of the support frame, one end of the track penetrates into the support frame to be communicated with the sliding groove, the other end of the track is positioned on the same vertical line with the material opening after being bent and can be in sliding connection with the moving plate, a rotatable rotating plate is arranged at the bottom of the track, the copper balls can slide into the track from the side face of the material groove through lifting the moving plate, the copper balls can fall into a material pipe through the rotating plate downwards, the copper balls enter into an electroplating pool along the material pipe, and the redundant copper balls can slide to the tail end of the track to be blocked by a spring rod.
Description
Technical Field
The utility model relates to the technical field of circuit board production, in particular to an automatic copper ball adding device for circuit board production.
Background
In the production of circuit boards, copper balls are usually a material for electroplating copper, the copper balls are used as consumables in the electroplating process, timely replenishment is needed in the production process, the copper balls are heavy, and manual addition of the copper balls consumes manpower, so the utility model provides an automatic copper ball adding device for circuit board production.
Disclosure of Invention
The utility model aims to provide an automatic copper ball adding device for circuit board production, so as to solve the problems in the background technology.
In order to achieve the above purpose, the utility model provides the following technical scheme, a device for automatically adding copper balls in circuit board production, which comprises a supporting frame and is characterized in that: the copper ball electroplating device is characterized in that a moving plate is arranged on the supporting frame in a sliding mode, the left end and the right end of the moving plate are connected with sliding grooves formed in the supporting frame in a sliding mode, a trough is arranged in the moving plate, the top and the bottom of the trough are inclined to the right, a material opening is formed in the top of the rear side of the trough, a track for allowing a copper ball to automatically slide downwards is arranged on the right side of the supporting frame, one end of the track penetrates into the supporting frame to be communicated with the sliding grooves, the other end of the track is located on the same vertical line with the material opening after being bent, the track can be connected with the moving plate in a sliding mode, a rotatable rotating plate is arranged at the bottom of the track, and a material pipe communicated with an electroplating pool is arranged below the rotating plate.
Preferably, the top of the supporting frame is rotatably provided with a rotating wheel, one end of the rotating wheel is rotatably connected with the supporting frame, the other end of the rotating wheel is connected with the output end of the motor, a traction rope is wound in the middle of the rotating wheel, and one end of the traction rope is connected with the moving plate.
Preferably, one end of the rotating plate is rotationally connected with the track, the bottom of the rotating plate is rotationally connected with the telescopic end of the telescopic machine, and the driving end of the telescopic machine is rotationally connected with the inner wall of the material pipe.
Preferably, a telescopic spring rod is arranged below the moving plate, and the telescopic end of the spring rod can prevent the copper ball from sliding out when being positioned at the port of the lower part of the track.
Compared with the prior art, the utility model has the beneficial effects that: through placing the copper ball in the silo, through promoting the movable plate, make the copper ball can slide into in the track from the side of silo, rotatory rotor plate downwards makes the copper ball fall into the material pipe and enter into the electroplating pond along the material pipe, and the unnecessary copper ball of closed rotor plate can make the track end be blocked by the spring beam of sliding.
Drawings
FIG. 1 is a front cross-sectional view of the present utility model;
FIG. 2 is a schematic view showing the change of the connection position of the spring rod, the moving block and the sliding rail according to the present utility model.
In the figure: 1 supporting frame, 11 sliding chute, 12 rotating wheel, 13 hauling rope, 14 motor, 2 track, 3 movable plate, 31 trough, 32 material mouth, 4 rotating plate, 5 telescopic machine, 6 material pipe, 7 spring rod.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-2, an automatic copper ball adding device for circuit board production comprises a supporting frame 1, and is characterized in that: the copper ball electroplating device is characterized in that a moving plate 3 is arranged on the supporting frame 1 in a sliding manner, the left end and the right end of the moving plate 3 are in sliding connection with a chute 11 formed in the supporting frame 1, a chute 31 is arranged in the moving plate 3, the top and the right side of the chute 31 are opened, the bottom of the chute is in a slope shape inclined rightward, a material opening 32 is formed in the top of the rear side of the chute 31, a track 2 for enabling a copper ball to automatically slide downwards is arranged on the right side of the supporting frame 1, one end of the track 2 penetrates the supporting frame 1 to be communicated with the chute 11, the other end of the track 2 is positioned on the same vertical line with the material opening 32 after being bent, the track is in sliding connection with the moving plate 3, a rotatable rotating plate 4 is arranged at the bottom of the track 2, and a material pipe communicated with an electroplating pool is arranged below the rotating plate 4.
The top of the support frame 1 is rotatably provided with a rotating wheel 12, one end of the rotating wheel 12 is rotatably connected with the support frame 1, the other end of the rotating wheel is connected with the output end of a motor 14, a traction rope 13 is wound in the middle of the rotating wheel 12, and one end of the traction rope 13 is connected with the moving plate 3. One end of the rotating plate 4 is rotationally connected with the track 2, the bottom of the rotating plate is rotationally connected with the telescopic end of the telescopic machine 5, and the driving end of the telescopic machine 5 is rotationally connected with the inner wall of the material pipe 6. A telescopic spring rod 7 is arranged below the moving plate 3, and the telescopic end of the spring rod 7 can prevent the copper ball from sliding out when being positioned at the lower port of the track 2.
When the device is used, the motor 14 is controlled to drive the rotating wheel 12 to rotate, thereby winding the traction rope 13, enabling the traction rope 13 to pull the movable plate 3 to move upwards along the sliding groove 11, when copper balls in the sliding groove 11 reach the communicating position of the track 2 and the supporting frame 1, the copper balls slide into the track 2 under the action of self gravity, an electroplating pool needing to be added with the copper balls can shrink by controlling the corresponding telescopic machine 5, the rotating plate 4 rotates downwards, the passing copper balls fall into the material pipe 6 and enter the electroplating pool along the material pipe, redundant copper balls slide into the tail end of the track 2 to be blocked and temporarily stored by the spring rod 7, at the moment, the movable plate moves downwards to downwards press the telescopic end of the spring rod 7, the copper balls are blocked by the outer wall of the movable plate 3, and when the material port 32 is aligned with the tail end port of the track 2, the copper balls slide into the sliding groove 11 from the material port 32, and the recovery of the copper balls is completed.
The orientation or positional relationship shown in the drawings is for convenience of description and simplicity of description only, and is not intended to indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus should not be construed as limiting the utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (4)
1. The utility model provides an automatic copper ball device that adds of circuit board production, includes support frame (1), its characterized in that: the copper ball electroplating device is characterized in that a moving plate (3) is arranged on the supporting frame (1) in a sliding manner, two ends of the moving plate (3) are connected with a sliding groove (11) formed in the supporting frame (1) in a sliding manner, a trough (31) is arranged in the moving plate (3), the top and the bottom of the trough (31) are inclined to the right, a material opening (32) is formed in the top of the rear side of the trough (31), a track (2) for enabling copper balls to automatically slide downwards is arranged on the right side of the supporting frame (1), one end of the track (2) penetrates into the supporting frame (1) to be communicated with the sliding groove (11), the other end of the track (2) is positioned on the same vertical line with the material opening (32) after being bent, the track (2) is connected with the moving plate (3) in a sliding manner, and a rotatable rotating plate (4) is arranged at the bottom of the track (2), and a material pipe communicated with an electroplating pool is arranged below the rotating plate.
2. The automatic copper ball adding device for circuit board production according to claim 1, wherein: the top of the support frame (1) rotates to be provided with a rotating wheel (12), one end of the rotating wheel (12) is rotationally connected with the support frame (1), the other end of the rotating wheel is connected with the output end of the motor (14), a traction rope (13) is wound in the middle of the rotating wheel (12), and one end of the traction rope (13) is connected with the movable plate (3).
3. The automatic copper ball adding device for circuit board production according to claim 1, wherein: one end of the rotating plate (4) is rotationally connected with the track (2), the bottom of the rotating plate is rotationally connected with the telescopic end of the telescopic machine (5), and the driving end of the telescopic machine (5) is rotationally connected with the inner wall of the material pipe (6).
4. The automatic copper ball adding device for circuit board production according to claim 1, wherein: the telescopic spring rod (7) is arranged below the moving plate (3), and the telescopic end of the spring rod (7) can prevent the copper ball from sliding out when being positioned at the lower port of the track (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322197082.0U CN220545215U (en) | 2023-08-16 | 2023-08-16 | Automatic copper ball adding device for circuit board production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322197082.0U CN220545215U (en) | 2023-08-16 | 2023-08-16 | Automatic copper ball adding device for circuit board production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220545215U true CN220545215U (en) | 2024-02-27 |
Family
ID=89972756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322197082.0U Active CN220545215U (en) | 2023-08-16 | 2023-08-16 | Automatic copper ball adding device for circuit board production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220545215U (en) |
-
2023
- 2023-08-16 CN CN202322197082.0U patent/CN220545215U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |