CN220545182U - Plasma cavity assembly and plasma equipment - Google Patents
Plasma cavity assembly and plasma equipment Download PDFInfo
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- CN220545182U CN220545182U CN202321973951.8U CN202321973951U CN220545182U CN 220545182 U CN220545182 U CN 220545182U CN 202321973951 U CN202321973951 U CN 202321973951U CN 220545182 U CN220545182 U CN 220545182U
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- cavity
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- cooling
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims description 55
- 239000010410 layer Substances 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000011229 interlayer Substances 0.000 claims description 7
- 239000010453 quartz Substances 0.000 claims description 7
- 239000000110 cooling liquid Substances 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
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- 238000004088 simulation Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
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- 239000002826 coolant Substances 0.000 description 2
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- 230000005540 biological transmission Effects 0.000 description 1
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- 238000004140 cleaning Methods 0.000 description 1
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- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
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- 239000000463 material Substances 0.000 description 1
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- 239000012495 reaction gas Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Abstract
The utility model provides a plasma cavity assembly and plasma equipment, and belongs to the technical field of plasmas. The cavity assembly comprises a cavity and a waveguide tube, wherein one end of the cavity is a microwave inlet, and the other end of the cavity is a plasma outlet. The side wall of the waveguide tube is provided with a microwave outlet which is communicated with the microwave inlet. The waveguide tube is also provided with a waveguide conversion structure which is used for converting microwaves in the waveguide tube, so that the microwaves enter the cavity through the microwave outlet. When the microwave oven is used, microwaves are transmitted through the waveguide, and under the action of the microwave conversion structure, the microwaves penetrate through the quartz glass and enter the inner cavity of the cavity. The microwaves enter the cavity from the end part of the cavity, so that an electric field is more concentrated, and the power of a plasma beam from a plasma nozzle at the lower end of the cavity can be improved; further, the processing quality of the wafer surface can be improved.
Description
Technical Field
The utility model relates to the technical field of plasmas, in particular to a plasma cavity assembly and plasma equipment.
Background
Plasma equipment is mainly used for surface modification treatment of various materials, such as surface cleaning, surface activation, surface etching, surface grafting, surface deposition, surface polymerization, and plasmA-Assisted chemical vapor deposition. The plasma processor mainly comprises a discharge cavity, a working chamber, a vacuumizing system, a high-frequency power supply and an automatic control system. In the vacuum discharge chamber, the gas is discharged by an rf electric field, thereby forming a plasma. There is a plasma apparatus in which a waveguide is connected to a side wall of a discharge chamber, and after microwaves enter the discharge chamber, a reaction gas is ionized into plasma, and the plasma in the discharge chamber can be ejected from a plasma outlet, thereby performing surface treatment (e.g., photoresist removal, impurity removal, etc.) on a wafer. In the mode of side connection, the electric field distribution in the cavity is relatively dispersed, so that the plasma power sprayed from the plasma outlet is smaller, and the quality of wafer surface treatment is reduced.
Disclosure of Invention
The utility model aims to provide a plasma cavity assembly, wherein a waveguide of the plasma cavity assembly is connected with the end part of a cavity, so that an electric field is more concentrated in the middle part of the cavity, and further the quality of wafer surface treatment can be improved.
Another object of the present utility model is to provide a plasma apparatus employing the above plasma chamber assembly.
The utility model is realized in the following way:
a plasma chamber assembly, comprising:
the cavity is of a cylindrical structure, one end of the cavity is a microwave inlet, and the other end of the cavity is a plasma outlet;
the microwave oven comprises a waveguide tube, wherein a microwave outlet is arranged on the wide side surface of the waveguide tube, the microwave outlet is communicated with the microwave inlet, and a quartz plate is arranged between the microwave outlet and the microwave inlet;
the waveguide tube is further provided with a waveguide conversion structure, and the waveguide conversion structure is used for converting microwaves in the waveguide tube, so that the microwaves enter the cavity through the microwave outlet.
Further, the waveguide tube is a rectangular tube and comprises a first side plate and a second side plate which are arranged at intervals relatively, the microwave outlet is arranged on the first side plate, and the waveguide conversion structure is arranged on the second side plate.
Further, the waveguide conversion structure comprises a cone, wherein the cone is positioned in the inner cavity of the waveguide tube and is connected with the inner wall of the waveguide tube; the axis of the cone coincides with the central line of the cavity.
Further, a mounting through hole is formed in the waveguide tube, and the conical body is fixed in the mounting through hole.
Further, a cooling blind hole is formed in the end face of the large end of the conical body; the microwave conversion structure further comprises a cooling pipe, and the cooling pipe is connected with the conical body through a flange;
the end part of the cooling pipe is positioned in the cooling blind hole and is in clearance arrangement with the bottom of the cooling blind hole, and a cooling interlayer is formed between the outer wall of the cooling pipe and the inner wall of the cooling blind hole; and the flange is provided with a cooling channel which is communicated with the cooling interlayer.
Further, the cavity is of a circular cylindrical structure, the cavity is of a sandwich structure, the cavity comprises an inner layer and an outer layer, a closed cooling space is formed between the inner layer and the outer layer, and a cooling liquid inlet and a cooling liquid outlet are formed in the outer layer.
Further, the cavity is of a circular cylindrical structure, a ceramic cylinder is arranged in the cavity, and the outer wall of the ceramic cylinder is matched with the inner wall of the cavity.
Further, an alumina film or a diamond film is arranged on the inner wall of the cavity.
Further, the cavity is of a circular cylindrical structure, the plasma outlet is a conical opening, and the diameter of the plasma outlet gradually decreases from inside to outside.
A plasma apparatus includes a microwave source and the plasma chamber assembly, the microwave source being coupled to the waveguide.
The beneficial effects of the utility model are as follows:
when the plasma cavity assembly and the plasma equipment are used, microwaves are transmitted through the waveguide, and the microwaves enter the inner cavity of the cavity through the quartz glass under the action of the microwave conversion structure. According to simulation experiments, compared with a structure that microwaves enter the cavity from the side part, the cavity assembly provided by the application enters the cavity from the end part of the cavity, so that an electric field of the cavity is more concentrated, and the power of a plasma beam from a plasma nozzle at the lower end of the cavity can be improved; further, the processing quality of the wafer surface can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a perspective view of a cavity assembly provided by an embodiment of the present utility model;
FIG. 2 is a side view of a cavity assembly provided by an embodiment of the present utility model;
FIG. 3 is a cross-sectional view of A-A of FIG. 2 provided by an embodiment of the present utility model;
FIG. 4 is a partial view of FIG. 3 provided by an embodiment of the present utility model;
FIG. 5 is a simulation of the electric field of a prior art microwave entering a cavity assembly from the side into the cavity;
fig. 6 is an electric field simulation diagram of a cavity assembly according to an embodiment of the present utility model.
Icon: 1-a cavity assembly; 11-a cavity; 111-an inner layer; 112-an outer layer; 113-a microwave inlet; 114-a plasma outlet; 12-waveguide; 121-a first side plate; 122-a second side plate; 123-microwave outlet; 13-a waveguide transition structure; 131-cone; 132-a mounting portion; 1321-cooling blind holes; 133-cooling pipes; 14-quartz plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.
In this application, the broadside surface of the waveguide refers to the wider side wall of the rectangular waveguide.
Examples:
referring to fig. 1-4, the present embodiment provides a plasma chamber assembly 1, which includes a chamber 11 and a waveguide 12, wherein one end of the waveguide 12 is used for connecting to a microwave source (not shown), and the other end is used for connecting to other devices (not shown), or both ends of the waveguide 12 are connected to the microwave source (not shown). The broad side surface of the waveguide 12 is connected to the end of the cavity 11, and microwaves are transmitted into the cavity 11 through the waveguide 12, and then an electric field is generated in the cavity 11 to discharge, thereby generating plasma.
The cavity 11 is a cylindrical structure, and one end of the cavity is a microwave inlet 113; correspondingly, a circular microwave outlet 123 is provided on the side wall of the waveguide 12. The microwave inlet 113 of the cavity 11 is communicated with the microwave outlet 123 of the waveguide 12, and a quartz plate 14 which can be penetrated by microwaves is arranged between the microwave inlet 113 at the end part of the cavity 11 and the side wall of the waveguide 12. The waveguide 12 is provided with a waveguide conversion structure 13, and the waveguide conversion structure 13 can change the transmission direction of microwaves while minimizing the loss of microwaves, so that the microwaves in the waveguide 12 can pass through the quartz plate 14 and enter the cavity 11.
In this embodiment, the waveguide 12 adopts a rectangular tube, which includes a first side plate 121 and a second side plate 122 disposed at opposite intervals, the microwave outlet 123 is disposed on the first side plate 121, and the end of the cavity 11 is fixedly connected with the first side plate 121 of the waveguide 12 through a flange. After the cavity 11 is connected with the waveguide 12, the quartz plate 14 is clamped and fixed, and the quartz plate 14 is connected with the waveguide 12 in a sealing manner.
The microwave conversion structure comprises a cone 131, wherein the cone 131 is positioned in the inner cavity of the waveguide 12, and the large end of the cone 131 is fixedly connected with the inner wall of the waveguide 12; the axis of the tapered body 131 coincides with the center line of the cavity 11. Specifically, the second side plate 122 is provided with a circular mounting through hole; the large end of the cone 131 is further provided with a cylindrical mounting portion 132, the mounting portion 132 is disposed in the mounting through hole, and the outer end of the mounting portion 132 is fixedly connected with the outer side surface of the second side plate through a flange. The above design facilitates assembly and disassembly of the taper 131, since the large end portion of the taper 131 is located outside the waveguide 12.
In order to facilitate cooling down of the cone 131, the microwave conversion structure is also provided with a cooling structure. Specifically, the flange end surface of the mounting portion 132 is provided with a cooling blind hole 1321, and the cooling blind hole 1321 extends along the center line of the cone 131 to a position near the small end of the cone 131. Cooling tube 133 is disposed in cooling blind hole 1321, and one end of cooling tube 133 extends to the bottom of cooling blind hole 1321 and is disposed in a gap with the bottom of cooling blind hole 1321; the other end is located outside of the cooling blind hole 1321. The cooling pipe 133 is fixedly connected to the flange of the mounting portion 132 by a flange. A gap is left between the outer wall of the cooling tube 133 and the inner wall of the cooling blind hole 1321, thereby forming a cooling interlayer. A cooling channel is arranged on the flange on the cooling pipe 133, one end of the cooling channel is used for being connected with an external conveying pipe, and the other end of the cooling channel is communicated with the cooling interlayer. While the outer end of the cooling tube 133 communicates with another delivery tube. In specific use, the cooling liquid enters the cooling interlayer through the cooling channel, and then flows out of the cone 131 through the cooling pipe 133, so that heat is taken away, and the cone 131 is cooled.
In this embodiment, the cooling channel is a through hole extending radially along the flange on the cooling tube 133; other configurations are possible in other embodiments, as long as communication between the external delivery tube and the cooling jacket is enabled.
Further, in order to facilitate cooling of the cavity 11, the cavity 11 adopts a sandwich structure, which includes an inner layer 111 and an outer layer 112, and a closed cooling space is formed between the inner layer 111 and the outer layer 112. The outer layer 112 is provided with a coolant inlet and a coolant outlet, which are connected to the two delivery pipes, respectively.
In addition, a ceramic cylinder is arranged in the cavity 11, and the outer part of the ceramic cylinder is matched with the inner part of the cavity 11; the ceramic cylinder can prevent electron plasma from directly acting on the cavity and has a protective effect on the cavity.
The end of the chamber 11 remote from the waveguide 12 is a plasma outlet 114, the plasma outlet 114 being a tapered mouth with a gradually decreasing diameter from the inside to the outside. The above design facilitates the ejection of the plasma in the chamber 11 from the plasma outlet 114 at a relatively high velocity.
The beneficial effects of the plasma cavity assembly 1 provided in this embodiment are as follows:
referring to fig. 5 and 6, with respect to the cavity assembly having the microwave inlet 113 disposed on the sidewall of the cavity 11, since the microwaves enter from the end of the cavity assembly 1 in this embodiment, the electric field of the cavity can be more concentrated in the middle of the cavity, so that the power of the plasma beam exiting from the plasma nozzle at the lower end of the cavity can be increased; further, the processing quality of the wafer surface can be improved. In addition, the whole structure of the cavity 11 is relatively complete, that is, the microwave inlet 113 is not formed in the cavity 11, so that the cavity 11 is more conveniently cooled by the sandwich type cooling structure.
In other embodiments, the inner wall of the cavity 11 may be coated with an alumina film or a diamond film, which also can protect the inner wall of the cavity, instead of the ceramic cylinder.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, and various modifications and variations may be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (10)
1. A plasma chamber assembly, comprising:
the cavity is of a cylindrical structure, one end of the cavity is a microwave inlet, and the other end of the cavity is a plasma outlet;
the microwave oven comprises a waveguide tube, wherein a microwave outlet is arranged on the wide side surface of the waveguide tube, the microwave outlet is communicated with the microwave inlet, and a quartz plate is arranged between the microwave outlet and the microwave inlet;
the waveguide tube is further provided with a waveguide conversion structure, and the waveguide conversion structure is used for converting microwaves in the waveguide tube, so that the microwaves enter the cavity through the microwave outlet.
2. The plasma chamber assembly of claim 1, wherein:
the waveguide tube is a rectangular tube and comprises a first side plate and a second side plate which are arranged at intervals relatively, the microwave outlet is arranged on the first side plate, and the waveguide conversion structure is arranged on the second side plate.
3. The plasma chamber assembly of claim 1, wherein:
the waveguide conversion structure comprises a cone body, wherein the cone body is positioned in the inner cavity of the waveguide tube and is connected with the inner wall of the waveguide tube; the axis of the cone coincides with the central line of the cavity.
4. A plasma chamber assembly according to claim 3, wherein:
the waveguide tube is provided with a mounting through hole, and the conical body is fixed in the mounting through hole.
5. The plasma chamber assembly of claim 4, wherein:
a cooling blind hole is formed in the end face of the large end of the conical body; the microwave conversion structure further comprises a cooling pipe, and the cooling pipe is connected with the conical body through a flange;
the end part of the cooling pipe is positioned in the cooling blind hole and is in clearance arrangement with the bottom of the cooling blind hole, and a cooling interlayer is formed between the outer wall of the cooling pipe and the inner wall of the cooling blind hole; and the flange is provided with a cooling channel which is communicated with the cooling interlayer.
6. The plasma chamber assembly of claim 1, wherein:
the cavity is of a circular cylindrical structure, the cavity is of a sandwich structure, the cavity comprises an inner layer and an outer layer, a closed cooling space is formed between the inner layer and the outer layer, and a cooling liquid inlet and a cooling liquid outlet are formed in the outer layer.
7. The plasma chamber assembly of claim 1, wherein:
the cavity is of a circular cylindrical structure, a ceramic cylinder is arranged in the cavity, and the outer wall of the ceramic cylinder is matched with the inner wall of the cavity.
8. The plasma chamber assembly of claim 1, wherein: an alumina film or a diamond film is arranged on the inner wall of the cavity.
9. The plasma chamber assembly of claim 1, wherein:
the cavity is of a circular cylindrical structure, the plasma outlet is a conical opening, and the diameter of the plasma outlet gradually decreases from inside to outside.
10. A plasma apparatus comprising a microwave source and a plasma chamber assembly according to any one of claims 1 to 9, the microwave source being connected to the waveguide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321973951.8U CN220545182U (en) | 2023-07-25 | 2023-07-25 | Plasma cavity assembly and plasma equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321973951.8U CN220545182U (en) | 2023-07-25 | 2023-07-25 | Plasma cavity assembly and plasma equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220545182U true CN220545182U (en) | 2024-02-27 |
Family
ID=89976025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321973951.8U Active CN220545182U (en) | 2023-07-25 | 2023-07-25 | Plasma cavity assembly and plasma equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220545182U (en) |
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2023
- 2023-07-25 CN CN202321973951.8U patent/CN220545182U/en active Active
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