CN220543908U - Power module and power equipment - Google Patents

Abstract

The utility model discloses a power module and a power device, the power module comprises: a substrate; a shunt disposed on the substrate; pins extending from the side edge of the substrate, wherein the pins comprise power pins and signal pins of a current divider; the first ends of the adjacent power pins and the signal pins of the current divider are arranged in a staggered manner in the pin extending direction, and/or the second ends of the adjacent power pins and the signal pins of the current divider are arranged in a staggered manner in the pin extending direction. The utility model can solve the problems of high power density and high cost of the power semiconductor device with the built-in current divider.

Description

Power module and power equipment

Technical Field

The present utility model relates to the field of power devices, and in particular, to a power module and a power device.

Background

The main power circuit of the industrial motor driver generally adopts a typical rectifier bridge, a brake link and a two-level or three-level inversion topology. The rectifier bridge is used for converting alternating current input into direct current, and is generally a single-phase or three-phase uncontrollable rectifier or controllable silicon rectifier bridge; the braking link is used for releasing feedback energy of the motor, and a power transistor IGBT is generally adopted; the inversion part is generally formed by IGBT and anti-parallel diode, or silicon carbide power semiconductor device.

The existing power module, such as the traditional integrated PIM of Ying Fei Ling, pack series, etc. module schemes integrate rectifier bridge + brake link + inversion into PIM module, such as the integrated module of platform system and day system again, can also built-in drive and sampling function in the module, and the integrated level is higher. In order to improve the integration level of the module, a current packaging scheme also has a shunt built in the power module.

However, the built-in current divider in the power module needs to additionally increase the outer PINs, namely 6 PIN needles, if a single-row PIN extraction mode is adopted, the size of the power module is increased, and the module cost is increased.

Disclosure of Invention

The utility model mainly aims to provide a power module, which aims to solve the problems of large size and high cost of the existing power module with a built-in current divider.

In order to achieve the above object, the present utility model provides a power module, including:

a substrate;

a shunt disposed on the substrate;

pins extending from the side edge of the substrate, wherein the pins comprise power pins and signal pins of a current divider;

the first ends of the adjacent power pins and the signal pins of the current divider are arranged in a staggered manner in the pin extending direction, and/or the second ends of the adjacent power pins and the signal pins of the current divider are arranged in a staggered manner in the pin extending direction.

Optionally, the pins further include driving signal pins, and the adjacent driving signal pins and the first ends of the power pins are arranged in a dislocation manner in the pin extending direction, and/or the adjacent driving signal pins and the second ends of the power pins are arranged in a dislocation manner in the pin extending direction.

Optionally, the first ends of the adjacent driving signal pins and the signal pins of the shunt are arranged in a dislocation manner in the pin extending direction, and/or the second ends of the adjacent driving signal pins and the signal pins of the shunt are arranged in a dislocation manner in the pin extending direction.

Optionally, the first ends of the signal pins of two adjacent shunts are arranged in a dislocation manner in the pin extending direction, and/or the second ends of the signal pins of two adjacent shunts are arranged in a dislocation manner in the pin extending direction.

Optionally, the pins arranged in a staggered manner in the extending direction of the pins are all located on the first side of the substrate.

Optionally, the power pins include a plurality of first power pins, and the first power pins and the signal pins of the shunt are both located on the first side of the substrate.

Optionally, the power module further includes:

the substrate and the shunt are in plastic package in the plastic package;

the first ends of the pins are arranged in the plastic package.

Optionally, the plastic package is further provided with a flange extending towards the second end of the pin, and one flange is arranged corresponding to one pin;

the flange wraps at least a portion of one of the adjacent pins and a second end of the wrapped pin is exposed to the flange.

Optionally, the plastic package is further provided with grooves extending towards the first ends of the pins, and one groove is arranged corresponding to one pin;

the second end of at least one of the adjacent pins is exposed out of the groove.

Optionally, the power module further includes a plurality of power device chips, and the number of the shunts is a plurality of the power device chips;

the power device chip is electrically connected to form an inverter circuit;

one of the current splitters is arranged corresponding to one phase of the output end of the inverter circuit, and the current splitter is electrically connected with the inverter circuit.

Optionally, the power device chip is further electrically connected to form a rectifying circuit and/or a braking circuit;

the rectifying circuit and/or the braking circuit is/are electrically connected with the inverter circuit.

Optionally, the power device chip is an IGBT chip and/or a diode chip.

The utility model also provides power equipment, which comprises the power module, wherein the power module is arranged on the circuit board.

According to the utility model, the current divider is integrated in the power module, and the adjacent power pins and the first ends of the signal pins of the current divider are arranged in a staggered manner in the pin extending direction, and/or the adjacent power pins and the second ends of the signal pins of the current divider are arranged in a staggered manner in the pin extending direction, so that the power module meets the electric gap requirement of the power electrode of the module, and meanwhile, the distance between the two adjacent pins is reduced, thereby reducing the size of the power module, improving the power density of the power module and reducing the module cost. Meanwhile, the staggered arrangement can facilitate wiring inside the module, so that the space layout of the module is facilitated, and the space utilization rate of the power module is improved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a power module according to an embodiment of the utility model;

fig. 2 is a schematic structural diagram of a power module according to another embodiment of the present utility model;

fig. 3 is a schematic structural diagram of a power module according to another embodiment of the present utility model;

fig. 4 is a schematic structural diagram of a power module according to another embodiment of the present utility model;

fig. 5 is a schematic structural diagram of a power module according to another embodiment of the present utility model;

fig. 6 is a schematic circuit diagram of a rectifying circuit according to an embodiment of the utility model;

fig. 7 is a schematic circuit diagram of a braking circuit and an inverter circuit according to an embodiment of the utility model;

fig. 8 is a schematic circuit diagram of an inverter circuit and a current divider according to another embodiment of the present utility model;

fig. 9 is a schematic cross-sectional structure of a power module according to an embodiment of the utility model.

Reference numerals illustrate:

reference numerals	Name of the name	Reference numerals	Name of the name
				10	Signal pin of current divider	50	Flange
20	First power pin	60	Second power pin
				30	Substrate board	70	Groove
40	Plastic package part

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present utility model, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The present utility model proposes a power module, in an embodiment, the power module includes:

a substrate 30;

a shunt disposed on the substrate 30;

pins extending from the side of the substrate 30, the pins including power pins, signal pins 10 of the shunt;

the first ends of the signal pins 10 of the adjacent power pins and shunts are arranged offset in the pin extending direction and/or the second ends of the signal pins 10 of the adjacent power pins and shunts are arranged offset in the pin extending direction.

A shunt is a device that measures current. The two ends of the shunt are provided with signal leading-out ends for outputting detection signals to connected external devices.

When the power module is internally provided with the current divider, the signal pins of the current divider are required to be arranged on the power module to lead out the electric signals at two ends of the current divider, so that compared with the power module without the current divider, the number of the pins of the power module with the current divider can be increased, and the pins are arranged in a pin arrangement mode, so that the size of the power module can be increased.

The pins of the power device comprise power pins and signal pins of the current divider, the pins extend out from the side edge of the substrate, the power pins can be adjacent to the signal pins of the current divider, the power pins can also be adjacent to the power pins, and the power pins can also be adjacent to other types of pins; similarly, the signal pins of the current divider may be adjacent to the signal pins of the current divider, or may be adjacent to other types of pins.

In the pins of the power device, the first ends of the signal pins of the adjacent power pins and the current divider are arranged in a staggered manner in the pin extending direction, and/or the second ends of the signal pins of the adjacent power pins and the current divider are arranged in a staggered manner in the pin extending direction, namely, the signal pins of the adjacent power pins and the current divider meet the following conditions:

1. the adjacent power pins and the first ends of the signal pins of the current divider are arranged in a staggered manner in the extending direction of the pins; 2. the second ends of the adjacent power pins and the signal pins of the current divider are arranged in a staggered manner in the pin extending direction; 3. the first ends of the signal pins of the adjacent power pins and the current divider are arranged in a staggered manner in the pin extending direction, and the second ends of the signal pins of the adjacent power pins and the current divider are arranged in a staggered manner in the pin extending direction.

It can be understood that, in the same power module, all of the above 3 positional relationships may occur, which is not limited in the embodiment of the present application.

The power module provided by the embodiment is capable of arranging the adjacent power pins and the signal pins of the current divider in a staggered manner, so that the space between the adjacent power pins and the signal pins of the current divider is reduced while the electric gap requirement of the power electrode of the module is met, the size of the power module is reduced, and the power density of the power module is improved.

In an alternative embodiment based on the above embodiment, the power pins and the signal pins 10 of the current divider may be alternately arranged, that is, the plurality of pins are arranged in the order of the signal pins 10, the power pins, the signal pins 10, the power pins … …, the signal pins 10, and the power pins, where the first ends of the signal pins 10 and the first ends of the power pins of the current divider are arranged in a staggered manner in the pin extending direction, and/or the second ends of the signal pins 10 and the second ends of the power pins are arranged in a staggered manner in the pin extending direction.

The power pins and the signal pins 10 of the current divider may not be alternately arranged, i.e. the pins adjacent to the signal pins 10 may be either the signal pins 10 or the power pins.

In some examples, the power pins and the signal pins 10 of the shunt are illustrated in an alternating arrangement.

Alternatively, the first ends of the signal pins 10 and the first ends of the power pins of the adjacent shunts may be arranged offset in the pin extending direction, and the second ends of the signal pins 10 and the second ends of the power pins of the adjacent shunts may be arranged in parallel.

For example, as shown in fig. 1, the extending direction of the pins may be a horizontal direction from left to right, and the first ends of the signal pins 10 of the current divider and the first ends of the power pins are arranged in a left-right offset manner, that is, the first ends of the signal pins 10 of the current divider are arranged at the left side of the first ends of the power pins, and the second ends of the signal pins 10 of the current divider and the second ends of the power pins are arranged in parallel, that is, the second ends of the signal pins 10 of the current divider and the second ends of the power pins extend out of the substrate 30 by the same length.

Alternatively, the first ends of the signal pins 10 of adjacent shunts may be juxtaposed with the first ends of the power pins, while the second ends of the signal pins 10 of adjacent shunts are offset from the second ends of the power pins in the pin extension direction.

For example, as shown in fig. 2, the extending direction of the pins may be a horizontal direction from left to right, the second ends of the signal pins 10 and the second ends of the power pins of the current divider are arranged in a left-right offset manner, and the first ends of the signal pins 10 of the current divider are arranged at positions right above the first ends of the power pins, but the distances between the second ends of the signal pins 10 and the second ends of the power pins of the current divider extending out of the substrate 30 are different, that is, the signal pins 10 and the power pins of the current divider are long and short, so that the second ends of the signal pins 10 and the second ends of the power pins of the current divider are arranged in a left-right offset manner.

Alternatively, the first ends of the signal pins 10 and the first ends of the power pins of the adjacent shunts are arranged offset in the pin extending direction, and the second ends of the signal pins 10 and the second ends of the power pins of the adjacent shunts are arranged offset in the pin extending direction.

For example, as shown in fig. 3, the extending direction of the pins may be a horizontal direction from left to right, that is, the first ends of the signal pins 10 of the current divider are arranged in a left-right offset manner with respect to the first ends of the power pins, and the second ends of the signal pins 10 of the current divider are arranged in a left-right offset manner with respect to the second ends of the power pins. The first end of the signal pin 10 of the current divider is arranged at the position above the left of the first end of the power pin, and the length of the signal pin 10 of the current divider is the same as that of the power pin, so that the second end of the signal pin 10 of the current divider is also arranged at the position above the left of the second end of the power pin, namely, the second end of the signal pin 10 of the current divider and the second end of the power pin are arranged in a left-right dislocation mode.

It will be appreciated that the first and second ends of the pins are configured for electrical connection, and that the first and second ends of the pins may be wider than the middle portion of the pins, while a certain safety distance is required between the pins in order to meet the electrical clearance requirements.

When the two ends of the two pins are aligned, the distance between the middle parts of the two pins is necessarily larger than the distance between the two pin ends because the end parts of the pins are wider, i.e. the distance between the pin ends is larger than the safety distance when the safety distance is satisfied. Therefore, the end parts of the pins are staggered, so that the distance between the end parts of the pins can be reduced while the safety distance is met, the size of the module is reduced, and the cost of the module is reduced. Meanwhile, the dislocation arrangement can facilitate wiring inside the module, and is favorable for spatial layout of the module.

Correspondingly, the three pin staggering methods can be set according to an actual pin structure, if the first ends of the pins are set wider, the first ends can be set in a staggered mode, and if the second ends of the pins are set wider, the second ends can be set in a staggered mode. When both ends of the pins are staggered, the distance between the middle parts of the two pins can be reduced to the greatest extent, so that the size of the module is reduced, and the cost of the module is reduced.

In addition, the positions of the shunt and the power device chip also affect the positions of the pins, for example, assuming that the first side of the substrate 30 is the right side, the power device chip is disposed at the edge of the right side of the substrate 30, and the shunt is disposed at the left side of the power device chip, where the first end of the signal pin 10 may be disposed at a position above or below the left side of the first end of the power pin, so that the first end of the signal pin 10 and the first end of the power pin are disposed in a dislocation manner along the extending direction of the pins.

According to the utility model, the current divider is integrated in the power module, and the adjacent power pins and the first ends of the signal pins 10 of the current divider are arranged in a staggered manner in the pin extending direction, and/or the adjacent power pins and the second ends of the signal pins 10 of the current divider are arranged in a staggered manner in the pin extending direction, so that the power module meets the electric gap requirement of the power electrode of the module, and meanwhile, the distance between the two adjacent pins is reduced, thereby reducing the size of the power module, improving the power density of the power module and reducing the cost of the module. Meanwhile, the staggered arrangement can facilitate wiring inside the module, so that the space layout of the module is facilitated, and the space utilization rate of the power module is improved.

In an embodiment, the pins further comprise driving signal pins, and the first ends of the adjacent driving signal pins and power pins are arranged in a staggered manner in the pin extending direction, and/or the second ends of the adjacent driving signal pins and power pins are arranged in a staggered manner in the pin extending direction.

The driving signal pin is used for transmitting a driving signal.

The drive signal pin can set up in the same side of base plate with the power pin, and the drive signal pin also can set up in the different sides of base plate with the power pin, when drive signal pin and power pin are adjacent, and drive signal pin and power pin satisfy:

1. the first ends of the adjacent driving signal pins and power pins are arranged in a staggered manner in the pin extending direction; 2. the second ends of the adjacent driving signal pins and power pins are arranged in a staggered manner in the pin extending direction; 3. the first ends of the adjacent driving signal pins and the power pins are arranged in a staggered manner in the pin extending direction, and the second ends of the adjacent driving signal pins and the power pins are arranged in a staggered manner in the pin extending direction.

In another embodiment, the first ends of the signal pins of adjacent drive signal pins and shunts are offset in the pin extending direction and/or the second ends of the signal pins of adjacent drive signal pins and shunts are offset in the pin extending direction.

In yet another embodiment, the first ends of the signal pins 10 of two adjacent shunts are offset in the pin extending direction and/or the second ends of the signal pins 10 of two adjacent shunts are offset in the pin extending direction.

It can be understood that in the power module, the adjacent power pins and the signal pins of the current divider are arranged in a staggered manner; when including power pin, the signal pin of shunt, drive signal pin in the power module, after satisfying adjacent power pin and the signal pin dislocation set of shunt, in other pin adjacent circumstances, namely the signal pin of shunt is adjacent with the signal pin of shunt, power pin is adjacent with the power pin, drive signal pin is adjacent with the drive signal pin, drive signal pin is adjacent with the power pin, the signal pin of shunt is adjacent with the pin of drive signal, whether dislocation set is according to actual conditions to the both ends of 2 adjacent pins confirms, this application embodiment does not do not limit.

By the arrangement, the power module meets the requirements of the electric gap of the power electrode of the module, and meanwhile, the distance between two adjacent pins is reduced, so that the size of the power module is reduced, the power density of the power module is improved, and the module cost is reduced.

In the power module provided by the embodiment of the application, the signal pins of the current divider may include a plurality of signal pins of the current divider may be set on different sides of the substrate in a scattering manner, and the signal pins of the current divider may be set on a certain side of the substrate in a centralized manner. No matter which side of the substrate the signal pins of the power pins and the shunts are arranged, when the signal pins of the power pins and the shunts are adjacent to one side of the substrate, the adjacent signal pins of the power pins and the shunts are arranged in a staggered manner, that is, the first ends of the signal pins of the adjacent power pins and the shunts are arranged in a staggered manner in the extending direction of the pins, and/or the second ends of the signal pins of the adjacent power pins and the shunts are arranged in a staggered manner in the extending direction of the pins.

In one example, the signal pins of one shunt are adjacent to two pins, which are the signal pins and the power pins of the shunt respectively, that is, the arrangement sequence of 3 pins is as follows: the signal pin 1 of the shunt, the signal pin 2 of the shunt, the power pin, 3 pins set as: the first end and the second end of the signal pin 1 of the current divider and the signal pin 2 of the current divider are arranged in a dislocation mode in the pin extending direction, and the first end and the second end of the signal pin 2 of the current divider and the first end and the second end of the power pin are arranged in a dislocation mode in the pin extending direction.

In an alternative embodiment based on the above embodiment, the power pins comprise several first power pins 20, the first power pins 20 and the signal pins 10 of the shunt are each located on the first side of the substrate.

In an embodiment, the power pins include a plurality of first power pins 20, and the plurality of first power pins 20 and the signal pins 10 of the current divider are all disposed on the first side of the substrate, that is, the plurality of first power pins 20 and the signal pins 10 of the current divider are disposed on the same side of the substrate, at this time, on the first side of the substrate, the signal pins 10 of the adjacent current divider and the first power pins 20 are disposed in a staggered manner, which is favorable for the arrangement of the power device chip on the substrate, reduces the area of the substrate, reduces the manufacturing cost of the power module, and has simple manufacturing process and is favorable for the automatic production of the power module.

In an alternative embodiment based on the above embodiment, the pins arranged offset in the pin extending direction are all located on the first side of the substrate.

In an embodiment, in the power module, only pins arranged on a first side of the substrate are arranged in a staggered manner, and pins arranged on other sides of the substrate are not arranged in a staggered manner, namely, when signal pins and/or driving signal pins of the power pins and/or the current divider and adjacent pins are arranged in a staggered manner in the extending direction of the pins, the pins arranged in the staggered manner are positioned on the first side of the substrate.

The pin extending direction is arranged in a staggered mode, and the first ends of the two adjacent pins are arranged in a staggered mode in the pin extending direction and/or the second ends of the two adjacent pins are arranged in a staggered mode in the pin extending direction.

In an alternative embodiment based on the above embodiment, the power module further comprises:

the plastic package 40, the substrate 30 and the shunt are plastic-packaged in the plastic package 40;

the first ends of the pins are disposed within the plastic package 40.

Optionally, the power module may be encapsulated by using an epoxy compression molding process, and the substrate 30, the power device chip, the shunt, and the pins are encapsulated by using materials such as epoxy, so as to protect the power device chip and the shunt.

The first ends of the pins are disposed in the plastic package 40, and the second ends of the pins extend outward through the plastic package 40.

It should be noted that, the specific structure of the second end of the pin is set according to the actual situation, which is not limited in this embodiment of the present application, and the second end of the pin shown in the drawings in the embodiment of the present application is only exemplary.

Optionally, the plastic package 40 is further provided with a flange 50 extending towards the second end of the pin, and one flange 50 is arranged corresponding to one pin;

flange 50 wraps at least a portion of one of the adjacent pins, and a second end of the wrapped pin is exposed to flange 50.

In the following, an example of offset arrangement of the signal pins 10 and the power pins of the current divider is taken as an example, in an embodiment, the second ends of the signal pins 10 and the power pins of the current divider are offset in the pin extending direction, that is, the lengths of the signal pins 10 and the power pins of the current divider extending outside the plastic package 40 are different, that is, the distance that one pin extends out of the plastic package 40 is greater than the distance that the other pin extends out of the plastic package 40.

The signal pins 10 which extend out of the plastic package 40 and can be used as current splitters or power pins can be arranged according to practical application requirements.

Because the second ends of the signal pins 10 and the power pins of the current divider are arranged in a staggered manner along the extending direction of the pins, the distance between the signal pins 10 and the power pins of the current divider can be reduced, and after the distance between two adjacent pins is reduced, in order to meet the creepage distance requirement between the signal pins 10 and the power pins of the current divider, the plastic package 40 is also provided with a flange 50 protruding along the first direction, and the part of the pins extending far from the plastic package 40 is coated.

Referring to fig. 4, the pins extending out of the plastic package 40 for a long distance are power pins, and the flange 50 wraps up the parts of the power pins, so that an insulating part is added between the signal pins 10 and the power pins of the current divider, the creepage distance requirement between the signal pins 10 and the power pins of the current divider is met, and the safety design of the power module is further met.

In addition, in some embodiments, the second ends of the signal pins 10 and the power pins of the current divider are not arranged in a dislocation manner, that is, the lengths of the signal pins 10 and the power pins extending outside the plastic package 40 are the same, at this time, the signal pins 10 or the power pins of the current divider can be wrapped by the flange 50 according to practical application requirements, so that an insulating part is added between the signal pins 10 and the power pins of the current divider, the creepage distance requirement between the signal pins 10 and the power pins of the current divider is met, and the safety design of the power module is further met.

It can be appreciated that the pins include the signal pins 10, the driving signal pins and the power pins of the current divider, so that when any two pins are arranged in a staggered manner, one of the pins can be wrapped by the flange 50 so as to meet the creepage distance requirement between two adjacent pins, and the specific arrangement mode is the same as the above, and no further description is given here.

Similar to the flange 50 described above, a groove 70 may be provided on the plastic package to meet the creepage distance requirement between two adjacent pins.

In another embodiment, the plastic package is further provided with a groove 70 extending towards the first end of the pin, and one groove 70 is arranged corresponding to one pin;

the second end of at least one of the adjacent pins is exposed to the recess 70.

Taking the offset arrangement of the signal pins 10 and the power pins of the shunt as an example, the grooves 70 are arranged corresponding to the pins, the signal pins 10 and the first ends of the power pins of the shunt are in the plastic package, and at least part of the second ends of the signal pins 10 and/or at least part of the second ends of the power pins of the shunt are exposed out of the grooves. For example, a portion of the signal pins 10 of the shunt have their second ends exposed to the recess 70 and a portion of the power pins have their second ends exposed to the recess; alternatively, for example, only the second ends of the signal pins 10 of the shunt are exposed to the recess 70 or only the second ends of the power pins are exposed to the recess 70.

The second ends of the signal pins 10 and the second ends of the power pins of the current divider are arranged in a staggered manner along the first direction, that is, the lengths of the signal pins 10 and the power pins of the current divider extending outside the plastic package 40 are different, that is, the distance that one pin extends out of the plastic package 40 is greater than the distance that the other pin extends out of the plastic package 40.

The signal pins 10 which extend out of the plastic package 40 and can be used as current splitters or power pins can be arranged according to practical application requirements.

Because the second ends of the signal pins 10 and the second ends of the power pins of the current divider are arranged in a staggered manner along the extending direction of the pins, the distance between the signal pins 10 and the power pins of the current divider can be reduced, and after the distance between two adjacent pins is reduced, in order to meet the creepage distance requirement between the signal pins 10 and the power pins of the current divider, the plastic package 40 is also provided with the grooves 70, so that the part of the pins extending out of the plastic package 40 and having a relatively short distance is covered.

Referring to fig. 5, the pins extending out of the plastic package 40 and having a short distance are the signal pins 10 of the current divider, and the grooves wrap the signal pins 10 of the current divider, so that an insulated part is added between the signal pins 10 of the current divider and the power pins, the creepage distance requirement between the signal pins 10 of the current divider and the power pins is satisfied, and the safety design of the power module is further satisfied.

It can be appreciated that the pins include the signal pins 10, the driving signal pins and the power pins of the current divider, so that when any two pins are arranged in a staggered manner, one of the pins can be wrapped by the groove 70 so as to meet the creepage distance requirement between two adjacent pins, and the specific arrangement mode is the same as the above, and no further description is given here.

In one embodiment, the first power pins 20 on the first side of the substrate and the signal pins 10 of the shunt are alternately arranged along the second direction;

wherein the first direction and the second direction are perpendicular to each other.

The number of the signal pins 10 and the first power pins 20 of the current divider is generally set according to the type and the number of the power device chips, and the number of the current divider is generally connected to an output end of the inverter circuit, for example, so that one current divider corresponds to the two signal pins 10 of the current divider and one first power pin 20, the two signal pins 10 of the current divider are used for detecting the current flowing through the current divider, and one first power pin 20 is used for leading out the power output of the inverter circuit.

In an embodiment, the signal pins 10 and the first power pins 20 of the plurality of splitters are multiple, and the signal pins 10 and the first power pins 20 of the plurality of splitters can be alternately arranged along the second direction, wherein the first direction is perpendicular to the second direction, for example, the first direction is a horizontal direction from left to right, and the second direction is a vertical direction from top to bottom, so that the signal pins 10 and the first power pins 20 of the plurality of splitters are staggered from top to bottom, that is, adjacent pins of the signal pins 10 of one splitter are the first power pins 20.

Referring to fig. 4, the signal pins 10 and the first power pins 20 of the plurality of shunts are alternately arranged from top to bottom on the first side of the substrate 30, that is, the plurality of pins are arranged in the order of the signal pins 10, the first power pins 20, the signal pins 10 of the shunts, the signal pins 10 of the first power pins 20 … …, and the first power pins 20 of the shunts, that is, the pins are alternately arranged in a length of a distance extending outside the plastic package 40. In this way, the signal pins 10 and the first power pins 20 of the current divider are arranged in a staggered manner in the first direction, and the signal pins 10 and the first power pins 20 of the current divider are alternately arranged in the second direction, so that the space between the signal pins 10 and the first power pins 20 of the current divider is reduced while the electric gap requirement of the power electrode of the module is met, the size of the module is reduced, and the cost of the module is reduced.

Referring to fig. 4 and 5, in an embodiment, the power pins further include a second power pin 60, where the second power pin 60 extends from the second side of the substrate 30, that is, the second power pin 60 and the signal pins of the first power pin 20 and the shunt are located on different sides of the substrate, and the second power pin 60 is electrically connected with the power device chip.

Alternatively, the number of the second power pins 60 may be plural, and the plurality of second power pins 60 may be disposed on the second side of the substrate 30 in the form of a single pin header.

In an embodiment, the power module further includes a plurality of power device chips, and the number of the shunts is a plurality of the power device chips;

the power device chip is electrically connected to form an inverter circuit;

one shunt is arranged corresponding to one phase of the output end of the inverter circuit, and the shunt is electrically connected with the inverter circuit.

Optionally, the power device chip is further electrically connected to form a rectifying circuit and/or a braking circuit;

the rectifying circuit and/or the braking circuit is/are electrically connected with the inverter circuit.

Optionally, the power device chip is an IGBT chip and/or a diode chip.

It will be appreciated that the number of power device chips and shunts packaged in the power module may be set according to practical situations, for example, only one IGBT may be packaged with one shunt, in some cases, one IGBT may be formed by one IGBT chip and one diode chip, where two power device chips are packaged with one shunt, or one bridge arm circuit of the inverter circuit may be packaged with one shunt, where four power device chips are packaged with one shunt, or the entire inverter circuit may be packaged with one shunt, which is not described herein.

In an embodiment, the number of the power device chips and the number of the current splitters are multiple, and a rectifying circuit, a braking circuit and an inverting circuit can be formed among the power device chips. The rectifying circuit can be a single-phase or three-phase uncontrollable rectifying or controllable silicon rectifying bridge for converting alternating current input into direct current, the braking circuit can be a power transistor IGBT for releasing feedback energy of the motor, the inversion part can be formed by adopting the IGBT and an anti-parallel diode thereof, or a silicon carbide power semiconductor device, and the circuit is generally a two-level or three-level inversion circuit.

The power device chips and the current divider can be electrically connected through binding wires or circuit wiring on the substrate, and the binding wires can be aluminum wires, aluminum-clad copper or aluminum strips and the like for electrical connection.

In an example, the rectifying circuit, the braking circuit and the inverting circuit provided in the power module may refer to fig. 6 to 8, where fig. 6 is a schematic circuit diagram of the rectifying circuit, fig. 7 is a schematic circuit diagram of the braking circuit and the inverting circuit, and fig. 8 is a schematic circuit diagram of the inverting circuit and the current divider, where pins connected to nine connection ends of GU1, GV1, GW1, U1 (ue 1), U2, V1 (ve 1), V2, W1 (we 1) and W2 in the figures are signal pins 10, and pins connected to other connection ends are first power pins 20 or second power pins 60.

Fig. 9 provides a cross-sectional view of the internal structure of a power module, where a copper-clad area is disposed on a DBC substrate, a power device chip and a shunt are respectively disposed on the copper-clad area through solder, and a lead frame is designed as a metal integrated frame structure.

The technical dimension requirements of the power semiconductor package on mechanical strength, current carrying and the like can be met by changing different metal materials; the binding wires are generally aluminum wires, aluminum clad copper or aluminum strips and the like for electrical connection, and the requirements of different products on the reliability of electrical connection can be met through a packaging process; the insulating substrate comprises, but is not limited to, an aluminum substrate, a copper substrate, a single-sided or double-sided copper-clad substrate and the like, and the packaging materials and the process can be replaced to meet the requirements of different products on the technical dimensions of electromechanical, thermal, electrochemical and the like.

The power module with the novel packaging form provided by the utility model can be suitable for motor drive systems with voltage levels of 220V, 380V, 440V, 480V and 690V.

The utility model also provides a power device, which comprises the power module, wherein the power module is arranged on the circuit board, and the specific structure of the power module refers to the embodiment.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims (13)

1. A power module, comprising:

a substrate;

a shunt disposed on the substrate;

pins extending from the side edge of the substrate, wherein the pins comprise power pins and signal pins of a current divider;

the first ends of the adjacent power pins and the signal pins of the current divider are arranged in a staggered manner in the pin extending direction, and/or the second ends of the adjacent power pins and the signal pins of the current divider are arranged in a staggered manner in the pin extending direction.

2. The power module of claim 1, wherein the pins further comprise drive signal pins, first ends of adjacent drive signal pins and power pins being offset in a pin extension direction, and/or second ends of adjacent drive signal pins and power pins being offset in a pin extension direction.

3. The power module of claim 2, wherein the first ends of the adjacent drive signal pins and the signal pins of the shunt are offset in the pin extension direction and/or the second ends of the adjacent drive signal pins and the signal pins of the shunt are offset in the pin extension direction.

4. The power module of claim 1, wherein first ends of signal pins of two adjacent shunts are offset in a pin extending direction and/or second ends of signal pins of two adjacent shunts are offset in a pin extending direction.

5. The power module of claim 3 or 4, wherein the pins that are offset in the pin extending direction are located on the first side of the substrate.

6. The power module of any one of claims 1 to 4, wherein the power pins include a plurality of first power pins, the first power pins and the signal pins of the shunt being located on a first side of the substrate.

7. The power module of any one of claims 1 to 4, further comprising:

the substrate and the shunt are in plastic package in the plastic package;

the first ends of the pins are arranged in the plastic package.

8. The power module of claim 7, wherein the plastic package is further provided with a flange extending toward the second end of the pin, one of the flanges being disposed corresponding to one of the pins;

the flange wraps at least a portion of one of the adjacent pins and a second end of the wrapped pin is exposed to the flange.

9. The power module of claim 7, wherein the plastic package is further provided with grooves extending toward the first ends of the pins, one of the grooves being disposed corresponding to one of the pins;

the second end of at least one of the adjacent pins is exposed out of the groove.

10. The power module of any one of claims 1 to 4, further comprising a plurality of power device chips, the number of shunts being a plurality;

the power device chip is electrically connected to form an inverter circuit;

one of the current splitters is arranged corresponding to one phase of the output end of the inverter circuit, and the current splitter is electrically connected with the inverter circuit.

11. The power module of claim 10, wherein the power device chip is further electrically connected to form a rectifying circuit and/or a braking circuit;

the rectifying circuit and/or the braking circuit is/are electrically connected with the inverter circuit.

12. The power module of claim 10, wherein the power device chip is an IGBT chip and/or a diode chip.

13. A power device comprising a circuit board and a power module according to any one of claims 1-11, said power module being mounted on said circuit board.