CN220543324U - Water-cooling heat dissipation plate for notebook computer - Google Patents
Water-cooling heat dissipation plate for notebook computer Download PDFInfo
- Publication number
- CN220543324U CN220543324U CN202322267047.1U CN202322267047U CN220543324U CN 220543324 U CN220543324 U CN 220543324U CN 202322267047 U CN202322267047 U CN 202322267047U CN 220543324 U CN220543324 U CN 220543324U
- Authority
- CN
- China
- Prior art keywords
- water cooling
- water
- cooling
- chip
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 174
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 113
- 238000004512 die casting Methods 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 12
- 238000007664 blowing Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 11
- 239000000110 cooling liquid Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000005494 condensation Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a water-cooling heat dissipation plate of a notebook computer, which relates to the technical field of computer assembly and has the technical key points that: including water-cooling portion and forced air cooling portion, the water-cooling portion includes: the lower surface of the water cooling plate is contacted with the chip, the water cooling pipeline in the water cooling plate surrounds the periphery of the chip, the position of the upper surface of the water cooling plate corresponding to the chip is an air cooling area, an air cooling device is arranged in the air cooling area, the air cooling part comprises a heat pipe arranged on the upper surface of the water cooling plate, the air cooling device is connected with the heat pipe, and the technical effects that the air cooling device and the water cooling device can jointly act and the whole water cooling capacity is enhanced are achieved through the arrangement of the structure.
Description
Technical Field
The utility model relates to the technical field of computer assembly, in particular to a water-cooling heat dissipation plate for a notebook computer.
Background
In the prior art, the power consumption of electronic components such as a CPU (Central processing Unit), a GPU (graphics processing Unit) and the like in the field of notes is higher and higher, the heat generation is also higher and higher, and the heat dissipation requirement is also higher and higher, so that the conventional high-performance notebook or game book is generally pulled by increasing the number of heat pipes, improving the diameter of the heat pipes, increasing the thickness of fins and increasing the number of fins, but the heat dissipation effect is not good, and a water cooling structure is generated in the environment.
The conventional notebook computer water-cooling heat dissipation is that the heat pipe is welded or connected together by using heat conducting glue through the water-cooling pipe, the heat is emitted through the sheet, the copper block, the heat pipe and the water-cooling pipe, when the cooling liquid in the water-cooling pipe passes through, the cooling liquid can take away part of the heat carried by the heat pipe, the distance between the water-cooling pipe and the chip is far, the contact area between the water-cooling pipe and the heat pipe is small, and the heat energy which can be led out through heat conduction is low, so that the water-cooling scheme in the prior art has the problem of low water-cooling efficiency.
Disclosure of Invention
In order to solve the technical problems, the utility model provides a water-cooling heat dissipation plate for a notebook computer.
The technical scheme of the utility model is as follows: the air cooling device comprises a water cooling part and an air cooling part, wherein the water cooling part comprises: the water cooling device comprises a water cooling plate with a built-in water cooling pipeline, wherein the lower surface of the water cooling plate is in contact with a chip, the water cooling pipeline is arranged around the chip in the water cooling plate, the position, corresponding to the chip, of the upper surface of the water cooling plate is an air cooling area, an air cooling device is arranged in the air cooling area, the air cooling part comprises a heat pipe arranged in the direction, far away from the chip, of the water cooling plate, the heat pipe is connected with the surface of the water cooling plate, air cooling is carried out by connecting the heat pipe with the air cooling device, the position of water cooling is changed, the simultaneous use of air cooling and water cooling is ensured, and the water cooling effect is increased.
The utility model further provides that the water cooling plate comprises a water cooling upper cover and a water cooling lower cover, the water cooling upper cover is contacted with the heat pipe, and the water cooling lower cover is contacted with the chip, so that the water cooling plate can smoothly discharge heat on the surface of the chip.
The utility model further provides that a water-cooling groove is formed downwards on the water-cooling lower cover through stamping, the water-cooling upper cover is fixedly arranged on the water-cooling lower cover and forms a water-cooling pipeline with the water-cooling groove, and the water-cooling pipeline is easier to shape through stamping.
The utility model is further characterized in that the water cooling part is provided with a bolt hole, and the die casting structural part is provided with a bolt component inserted into the bolt hole; the water-cooling upper cover and the water-cooling lower cover are integrally formed, and the fixing capability between the water-cooling upper cover and the water-cooling lower cover is guaranteed through bolts.
The utility model is further provided with a die-casting structural member arranged between the water cooling part and the chip, wherein the water cooling part and the die-casting structural member are matched in shape and are embedded into a clamping groove on the surface of the die-casting structural member
The utility model is further characterized in that the die-casting structural member is provided with a bolt hole, and the die-casting structural member is provided with a bolt component inserted into the bolt hole, so that the integral structure of the water cooling part is stabilized.
The utility model is further arranged that the water cooling pipeline is connected with a water cooling circulation system, the water cooling circulation system comprises a water inlet circulation pipe and a water outlet circulation pipe, the water outlet circulation pipe is used for leading out liquid from the water cooling part to be connected with a cooling module, and the water inlet circulation pipe is used for leading in the liquid cooled by the cooling module into the water cooling part.
The air cooling device is further arranged in a manner that the air cooling device comprises radiating fins and an air cooling fan, the heat pipe is connected with the radiating fins, a plurality of radiating fins are stacked in the vertical direction, and the air blowing direction of the air cooling fan is parallel to the radiating fins.
The beneficial technical effects of the utility model are as follows: the chip part is provided with the water cooling part, a water cooling channel which bypasses the chip is formed in the copper sheet through the process, the water cooling liquid is guaranteed to be close to the chip further, the heat pipe is used for radiating heat, the heat pipe is arranged on the water cooling part as an air cooling device, and the water cooling effect of the notebook computer is enhanced through the combined action of the air cooling device and the water cooling device.
Drawings
FIG. 1 is an exploded view of the present utility model;
FIG. 2 is a partial top view of the present utility model;
FIG. 3 is a partial cross-sectional view of the present utility model;
wherein, 1, an air cooling part; 2. a water cooling part; 21. a water-cooled upper cover; 22. a water-cooled lower cover; 23. a liquid inlet; 24. a liquid outlet; 25. a first surrounding part; 26. a second surrounding part; 3. die casting structural members; 31. bolt holes; 32. a bolt member; 4. a clamping structure; 5. and a chip.
Detailed Description
In order that the manner in which the above recited features of the present utility model are attained and can be understood in detail, a more particular description of the utility model, briefly summarized below, may be had by reference to the appended drawings and examples, which are illustrated in their embodiments, but are not intended to limit the scope of the utility model.
The novel water cooling structure of the notebook computer is provided, the structure of the traditional water cooling pipe covering heat pipe is abandoned, and water cooling liquid is infused into the copper sheet on the chip 5, so that better water cooling effect and water cooling efficiency are realized.
The notebook computer is specifically structurally characterized in that as shown in fig. 1-3, the whole structure is divided into a water cooling part 2 and an air cooling part 1 from bottom to top, a computer chip 5 is arranged in the water cooling part, the operation of the notebook computer is carried out through the chip 5, and the area of the chip 5 is divided into two parts to respectively control different blocks of the computer.
As shown in fig. 1-3, the water cooling part 2 is a copper structure, and is a flat copper sheet, a water cooling flow passage is formed in the copper sheet through a CNM stamping process, the water cooling flow passage is communicated with a water cooling circulation device, moisture is transmitted through a condensation pipe and heated to form gas, and is condensed into moisture in the condensation pipe to flow back into the water cooling passage to form water circulation, the water cooling passage is arranged around the chip 5 and is provided with a liquid inlet 23 and a liquid outlet 24, a pipeline along the direction of the liquid inlet 23 extends towards a direction away from the liquid outlet 24, the chip 5 is wound around, an air cooling device is arranged at a corresponding position, the water inlet passage continues to extend to form a first surrounding part 25 surrounding the rectangular chip 5, the first surrounding part 25 corresponds to the position of the chip 5 and enables the water inlet passage to extend reversely, the air cooling part 1 is formed as a heat pipe arranged on the surface of the water cooling part 2, the second surrounding part 26 surrounds the square chip 5 and forms a liquid outlet 24 at the end of the passage, and the surfaces of the first surrounding part 25 and the second surrounding part 26 are both provided with heat pipes.
As shown in fig. 1-3, a plurality of embedded grooves are formed in the surface of the chip 5, a plurality of clamping structures 4 are arranged below the water-cooling part 2, the clamping structures 4 extend into the embedded grooves, the length of each clamping structure 4 is slightly larger than the depth of each embedded groove, so that the water-cooling part 2 and the chip 5 are not completely contacted, the heat dissipation effect of the chip 5 is improved, a die-casting structural part 3 is arranged between the chip 5 and the water-cooling part 2, the shape of the die-casting structural part 3 is matched with the shape of the water-cooling part 2, bolt holes 31 are formed in the water-cooling part 2, bolt parts 32 corresponding to the bolt holes 31 are formed in the die-casting structural part 3, and the water-cooling part 2 is fixedly connected to the die-casting structural part 3 through bolts.
As shown in fig. 1-3, the water-cooled lower cover 22 forms a water-cooled runner by punching and is welded with the water-cooled upper cover 21 to form a water-cooled part, the bolt component 32 can integrate the water-cooled upper cover 21 and the lower cover, the water-cooled lower cover 22 is close to the chip 5, the water-cooled upper cover 21 is far away from the chip 5, a heat pipe part is connected above the water-cooled upper cover 21, the heat pipe part covers the top end of the water-cooled upper cover 21 and surrounds the water-cooled upper cover 21, and the length of the heat pipe part extends along the length direction of the pressing structural member.
When the device is used, the chip 5 generates heat when the computer is used for a long time, at the moment, water cooling liquid is introduced into the liquid inlet 23 in the water cooling part 2 through the connected water cooling device, the water cooling liquid can cool down around the chip 5 in the water cooling channel, at the moment, water in the water cooling part 2 forms water vapor at high temperature and enters the condensation pipe, cooling water is formed and then flows back, so that a continuous water cooling effect is realized, the heat energy on the surface of the chip 5 is quickly taken away and conducted to the heat pipe on the outer side and dissipated, the heat pipe is a part of the air cooling part and is connected with the heat dissipation fins, the air cooling fan is connected to one side of the heat dissipation fins, the heat energy transferred to the heat dissipation fins by the heat pipe is emitted through the fan blade in a high-speed rotation mode, the water cooling liquid continuously flowing in the water cooling part 2 can conduct low temperature into the chip 5, at the moment, the air cooling device of the heat pipe is started and transfers the heat energy, the effect of water cooling and the air cooling effect is guaranteed, the cooling efficiency of the chip 5 is improved, and the cooling effect of the chip 5 is guaranteed.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, and it should be noted that it is possible for those skilled in the art to make several improvements and modifications without departing from the technical principle of the present utility model, and these improvements and modifications should also be regarded as the protection scope of the present utility model.
Claims (7)
1. The utility model provides a notebook computer water-cooling heating panel which characterized in that: comprises a water cooling part (2) and an air cooling part (1),
the water cooling part (2) comprises: the water cooling plate with built-in water cooling pipelines is in contact with the chip (5), the water cooling pipelines in the water cooling plate are arranged around the chip (5), the position of the upper surface of the water cooling plate corresponding to the chip (5) is an air cooling area, the air cooling area is provided with an air cooling device,
the air cooling part (1) comprises a heat pipe arranged on the upper surface of the water cooling plate, and the heat pipe is connected with the air cooling device and performs air cooling and heat dissipation.
2. The notebook computer water cooling heat sink as claimed in claim 1, wherein: the water cooling plate comprises a water cooling upper cover (21) and a water cooling lower cover (22), wherein the water cooling upper cover (21) is in contact with the heat pipe, and the water cooling lower cover (22) is in contact with the chip (5).
3. The notebook computer water cooling heat sink as claimed in claim 2, wherein: and a water cooling groove is formed downwards on the water cooling lower cover (22) through stamping, and the water cooling upper cover (21) is fixedly arranged on the water cooling lower cover and forms a water cooling pipeline with the water cooling groove.
4. The notebook computer water cooling heat sink as claimed in claim 1, wherein: the die-casting structure is characterized in that a die-casting structure (3) is arranged between the water cooling part (2) and the chip (5), and the water cooling part (2) and the die-casting structure (3) are matched in shape and are embedded into clamping grooves on the surface of the die-casting structure (3).
5. The notebook computer water cooling heat dissipating plate as set forth in claim 4, wherein the die casting structure (3) is provided with a bolt hole (31) and a bolt member (32) inserted into the bolt hole (31).
6. The notebook computer water cooling heat radiation plate of claim 1, wherein the water cooling pipeline is connected with a water cooling circulation system, the water cooling circulation system comprises a water inlet circulation pipe and a water outlet circulation pipe, the water outlet circulation pipe guides liquid out of the water cooling part (2) and is connected with a cooling module, and the water inlet circulation pipe guides the liquid cooled by the cooling module into the water cooling part.
7. The notebook computer water cooling heat sink as claimed in claim 1, wherein: the air cooling device comprises radiating fins and an air cooling fan, the heat pipe is connected with the radiating fins, a plurality of radiating fins are stacked in the vertical direction, and the air blowing direction of the air cooling fan is parallel to the radiating fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322267047.1U CN220543324U (en) | 2023-08-23 | 2023-08-23 | Water-cooling heat dissipation plate for notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322267047.1U CN220543324U (en) | 2023-08-23 | 2023-08-23 | Water-cooling heat dissipation plate for notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220543324U true CN220543324U (en) | 2024-02-27 |
Family
ID=89976019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322267047.1U Active CN220543324U (en) | 2023-08-23 | 2023-08-23 | Water-cooling heat dissipation plate for notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220543324U (en) |
-
2023
- 2023-08-23 CN CN202322267047.1U patent/CN220543324U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |