CN220537954U - Photovoltaic slot type electroplating groove body - Google Patents
Photovoltaic slot type electroplating groove body Download PDFInfo
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- CN220537954U CN220537954U CN202321990140.9U CN202321990140U CN220537954U CN 220537954 U CN220537954 U CN 220537954U CN 202321990140 U CN202321990140 U CN 202321990140U CN 220537954 U CN220537954 U CN 220537954U
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- electroplating
- tank
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- 238000009713 electroplating Methods 0.000 title claims abstract description 86
- 239000007788 liquid Substances 0.000 claims abstract description 86
- 210000004027 cell Anatomy 0.000 claims abstract description 45
- 238000001816 cooling Methods 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 210000005056 cell body Anatomy 0.000 claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 14
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a photovoltaic cell type electroplating cell body, which comprises a first outer cell, wherein the right side of the first outer cell is provided with a second outer cell, the inner wall of the first outer cell is fixedly connected with a first inner cell, electroplating liquid is injected into the first outer cell, the electroplating liquid circularly flows between the first outer cell and the second outer cell through a connecting pipe, an inner and outer cell circulating mechanism is started to cooperate with a first overflow port to drive the electroplating liquid to circularly flow between the first outer cell and the first inner cell, a second circulating pump is started to drive the electroplating liquid to circularly flow between the first outer cell and the second outer cell, a cooling assembly and a heating assembly are started to heat or cool the electroplating liquid, a radiating assembly is started to radiate heat at the radiating end of the cooling assembly, the circulating uniformity of the electroplating liquid in a plurality of electroplating cells is improved, and the problems that the electroplating liquid circularly flows inconveniently, the consumption of the electroplating liquid is increased and the electroplating cell is inconvenient to maintain due to the fact that the conventional electroplating cell is generally a single cell or an upper and lower cell structure are avoided.
Description
Technical Field
The utility model relates to the technical field of photovoltaic groove electroplating, in particular to a groove body for photovoltaic groove electroplating.
Background
The electroplating bath is the most basic equipment in electroplating equipment, and has the main functions of installing solution, and the use mode of the electroplating bath is that the electroplating bath is arranged in a straight line according to a manually operated process flow production line, and the electroplating seed is arranged according to the field space separately according to local conditions. In the case of a mechanical automated production line, it is essentially in the form of a process flow.
When the photovoltaic tank is produced, the photovoltaic tank is required to be put into the electroplating tank to carry out electroplating work, and the existing electroplating tank is usually of a single tank or an upper and lower tank structure, and the single tank or the upper and lower tank structure is inconvenient for the electroplating liquid to circularly flow in the tank and between the tanks, so that the consumption of the electroplating liquid is increased, and the maintenance work is inconvenient.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides a photovoltaic groove type electroplating groove body which is used for solving the problems in the background art.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a cell body for photovoltaic slot type electroplating, includes first external tank, first external tank right side is provided with the second external tank, first external tank inner wall fixedly connected with first inside groove, second external tank inner wall fixedly connected with second inside groove, first overflow mouth has been seted up in the penetration of first inside groove inner wall, second overflow mouth has been seted up in the penetration of second inside groove inner wall, first external tank inner wall fixedly connected with connecting pipe, and connecting pipe goes out liquid end and second external tank inner wall fixedly connected with, first external tank bottom is provided with inside and outside groove circulation mechanism, first external tank inside is provided with cooling module, first external tank inside is provided with cooling body, first external tank inside is provided with heating module.
Preferably, the inner and outer tank circulating mechanism is composed of a circulating pump, a liquid inlet pipe and a liquid outlet pipe, the circulating pump is fixedly connected with the bottom surface of the first outer tank, the liquid inlet end of the liquid inlet pipe is fixedly connected with the inner wall of the first outer tank, the liquid outlet end of the liquid inlet pipe is fixedly connected with the liquid inlet end of the circulating pump, the liquid outlet end of the liquid outlet pipe is fixedly connected with the inner wall of the first outer tank, the liquid inlet end of the liquid outlet pipe is fixedly connected with the liquid outlet end of the circulating pump, and the liquid outlet end of the liquid outlet pipe is positioned inside the first inner tank.
Preferably, the cooling assembly comprises a fixed frame, a semiconductor refrigerating sheet and a cold guide plate, wherein the fixed frame is fixedly connected with the inner wall of the first outer groove, the semiconductor refrigerating sheet is fixedly connected with the inner wall of the fixed frame, the cold guide plate is fixedly connected with the refrigerating end of the semiconductor refrigerating sheet, and the cold guide plate is fixedly connected with the bottom surface of the fixed frame.
Preferably, the heat dissipation mechanism comprises a fan housing and a heat dissipation fan, wherein the fan housing is fixedly connected with the top surface of the fixed frame, and the heat dissipation fan is fixedly connected with the inner wall of the fan housing.
Preferably, the heating assembly comprises fixed plate, solid fixed ring and heating rod, fixed plate and first external groove inner wall fixed connection, gu fixed ring and fixed plate top surface fixed connection, heating rod and gu fixed ring inner wall fixed connection.
Preferably, the right side of the first outer groove is fixedly connected with a second circulating pump, the liquid inlet end of the second circulating pump is fixedly connected with the inner wall of the first outer groove, and the liquid outlet end of the second circulating pump is fixedly connected with the inner wall of the second outer groove.
Preferably, the number of the first overflow ports is multiple, and the first overflow ports are all arranged on the inner wall of the first inner tank in a penetrating way.
Preferably, the fixing plate is rectangular, and the fixing plate is made of stainless steel materials.
Compared with the prior art, the utility model has the beneficial effects that: according to the photovoltaic groove type electroplating tank body, electroplating liquid is injected into a first outer groove, the electroplating liquid circularly flows between the first outer groove and a second outer groove through a connecting pipe, an inner groove circulation mechanism and an outer groove circulation mechanism are started to cooperate with a first overflow port to drive the electroplating liquid to circularly flow in the first outer groove and the first inner groove, a second circulation pump is started to drive the electroplating liquid to circularly flow between the first outer groove and the second outer groove, a cooling assembly and a heating assembly are started to heat or cool the electroplating liquid, and a heat dissipation assembly is started to conduct heat dissipation work on a heat dissipation end of the cooling assembly; improves the circulation uniformity of the electroplating solution in a plurality of electroplating baths, and avoids the problems of inconvenient circulation flow of the electroplating solution, increased consumption of the electroplating solution and inconvenient maintenance of the electroplating baths caused by the conventional single-bath or up-down-bath structure of the electroplating baths.
Drawings
FIG. 1 is an isometric view of a structure of the present utility model;
FIG. 2 is a bottom view of the structure of the present utility model;
FIG. 3 is a front cross-sectional view of the structure of the present utility model;
FIG. 4 is an enlarged view of the structure A of the present utility model;
fig. 5 is an enlarged view of the structure at structure B of the present utility model.
In the figure: 1. a first outer groove; 2. a second outer groove; 3. a first inner tank; 4. a second inner tank; 5. a first overflow port; 6. a second overflow port; 7. a connecting pipe; 8. a circulation pump; 9. a liquid inlet pipe; 10. a liquid outlet pipe; 11. a fixed frame; 12. a semiconductor refrigeration sheet; 13. a cold guide plate; 14. a fan housing; 15. a heat radiation fan; 16. a fixing plate; 17. a fixing ring; 18. a heating rod; 19. and a second circulation pump.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to FIGS. 1-5, a photovoltaic cell type plating tank body comprises a first outer cell 1, a second circulating pump 19 is fixedly connected to the right side of the first outer cell 1, the liquid inlet end of the second circulating pump 19 is fixedly connected with the inner wall of the first outer cell 1, the liquid outlet end of the second circulating pump 19 is fixedly connected with the inner wall of the second outer cell 2 and is used for driving plating solution to flow between the first outer cell 1 and the second outer cell 2, the flow uniformity of the plating solution is improved, the right side of the first outer cell 1 is provided with the second outer cell 2, the inner wall of the first outer cell 1 is fixedly connected with a first inner cell 3, the inner wall of the second outer cell 2 is fixedly connected with a second inner cell 4, first overflow ports 5 are formed in the inner wall of the first inner cell 3 in a penetrating manner, the number of the first overflow ports 5 is multiple, the first overflow ports 5 are all formed in the inner wall of the first inner cell 3 in a penetrating manner and are used for assisting the plating solution to flow circularly, the flow uniformity is improved, the inner wall of the second inner tank 4 is penetrated and provided with a second overflow port 6, the inner wall of the first outer tank 1 is fixedly connected with a connecting pipe 7, the liquid outlet end of the connecting pipe 7 is fixedly connected with the inner wall of the second outer tank 2, the bottom surface of the first outer tank 1 is provided with an inner and outer tank circulating mechanism, the inner and outer tank circulating mechanism consists of a circulating pump 8, a liquid inlet pipe 9 and a liquid outlet pipe 10, the circulating pump 8 is fixedly connected with the bottom surface of the first outer tank 1, the liquid inlet end of the liquid inlet pipe 9 is fixedly connected with the liquid inlet end of the circulating pump 8, the liquid outlet end of the liquid outlet pipe 10 is fixedly connected with the inner wall of the first outer tank 1, the liquid outlet end of the liquid outlet pipe 10 is positioned in the first inner tank 3 and used for driving electroplating liquid to move, the uniformity of the electroplating liquid in a plurality of tanks is improved, a cooling assembly is arranged in the first outer tank 1, the cooling component consists of a fixed frame 11, a semiconductor refrigerating sheet 12 and a cold guide plate 13, wherein the fixed frame 11 is fixedly connected with the inner wall of a first outer groove 1, the semiconductor refrigerating sheet 12 is fixedly connected with the inner wall of the fixed frame 11, the cold guide plate 13 is fixedly connected with the refrigerating end of the semiconductor refrigerating sheet 12, the cold guide plate 13 is fixedly connected with the bottom surface of the fixed frame 11 and is used for cooling and reducing the electroplating solution, a heat dissipation mechanism is arranged in the first outer groove 1 and consists of a fan housing 14 and a heat dissipation fan 15, the fan housing 14 is fixedly connected with the top surface of the fixed frame 11, the heat dissipation fan 15 is fixedly connected with the inner wall of the fan housing 14 and is used for carrying out heat dissipation on the heat dissipation end of the semiconductor refrigerating sheet 12 so as to avoid the problem of overheat damage of the semiconductor refrigerating sheet 12, a heating component is arranged in the first outer groove 1 and consists of a fixed plate 16, a fixed ring 17 and a heating rod 18, the fixed plate 16 is rectangular, the fixed plate 16 is made of stainless steel materials, the fixed plate 16 made of stainless steel materials is higher in strength, difficult to rust, deform and damage and durable, the fixed plate 16 is fixedly connected with the inner wall of the first outer groove 1, the fixed ring 17 is fixedly connected with the top surface of the fixed plate 16, the heating rod 18 is fixedly connected with the inner wall of the fixed ring 17 and is used for heating so as to conveniently raise the temperature of the electroplating liquid, the electroplating liquid is injected into the first outer groove 1, the electroplating liquid circularly flows between the first outer groove 1 and the second outer groove 2 through the connecting pipe 7, the inner and outer groove circulation mechanism is started to cooperate with the first overflow port 5 to drive the electroplating liquid to circularly flow in the first outer groove 1 and the first inner groove 3, the second circulation pump 19 is started to drive the electroplating liquid to circularly flow between the first outer groove 1 and the second outer groove 2, and the cooling assembly and the heating assembly are started to heat or cool the electroplating liquid, the cooling assembly is started to radiate heat of the cooling end of the cooling assembly, so that the circulation uniformity of the electroplating solution in a plurality of electroplating baths is improved, and the problems that the electroplating solution flows in a circulating mode inconveniently, the consumption of the electroplating solution is increased and the electroplating baths are inconvenient to maintain due to the fact that the conventional electroplating baths are usually in a single-bath or upper-lower-bath structure are avoided.
The electrical components are all connected with an external main controller and 220V mains supply, and the main controller can be conventional known equipment for controlling a computer and the like.
When in use: firstly, electroplating liquid is injected into a first outer tank 1, after entering the first outer tank 1, the electroplating liquid flows into a second outer tank 2 through a connecting pipe 7, so that the electroplating liquid can circularly flow between the first outer tank 1 and the second outer tank 2, a circulating pump 8 is started to pump the electroplating liquid in the first outer tank 1 into a first inner tank 3 through a liquid inlet pipe 9 and a liquid outlet pipe 10, when the liquid level of the electroplating liquid in the first inner tank 3 reaches a first overflow port 5, the electroplating liquid flows back into the first outer tank 1 through the first overflow port 5, the electroplating liquid can circularly flow between the first outer tank 1 and the first inner tank 3, a second circulating pump 19 is started to drive the electroplating liquid to circularly flow between the first outer tank 1 and the second outer tank 2 through the connecting pipe 7, after the electroplating liquid is injected, a heating rod 18 and a cold guide plate 13 are submerged in the electroplating liquid, a semiconductor refrigerating plate 12 is started to reduce the problem of the cold guide plate 13, the cold guide plate 13 is transferred into the electroplating liquid, cooling work is performed, a starting fan 15 is started to perform heat dissipation work on a semiconductor radiating end 12, the heat dissipation work is started, and the heating rod is heated up, and the electroplating liquid can be cooled.
In summary, according to the tank body for photovoltaic tank type electroplating, the electroplating solution is injected into the first outer tank 1, the electroplating solution circularly flows between the first outer tank 1 and the second outer tank 2 through the connecting pipe 7, the inner and outer tank circulation mechanisms are started to cooperate with the first overflow port 5 to drive the electroplating solution to circularly flow in the first outer tank 1 and the first inner tank 3, the second circulation pump 19 is started to drive the electroplating solution to circularly flow between the first outer tank 1 and the second outer tank 2, the cooling assembly and the heating assembly are started to heat or cool the electroplating solution, the heat dissipation assembly is started to conduct heat dissipation on the heat dissipation end of the cooling assembly, the circulation uniformity of the electroplating solution in a plurality of electroplating tanks is improved, the problems that the conventional electroplating tanks are generally of a single tank or an upper tank structure and a lower tank structure, the circulation of the electroplating solution is inconvenient, the consumption of the electroplating solution is increased, and the electroplating tank is inconvenient to maintain are solved.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a cell body for photovoltaic slot type electroplating, includes first external groove (1), its characterized in that, first external groove (1) right side is provided with second external groove (2), first external groove (1) inner wall fixedly connected with first inside groove (3), second external groove (2) inner wall fixedly connected with second inside groove (4), first overflow mouth (5) have been seted up in penetrating the first inside groove (3) inner wall, second overflow mouth (6) have been seted up in penetrating the second inside groove (4) inner wall, first external groove (1) inner wall fixedly connected with connecting pipe (7), and connecting pipe (7) play liquid end and second external groove (2) inner wall fixed connection, first external groove (1) bottom surface is provided with inside and outside groove circulation mechanism, first external groove (1) inside is provided with cooling module, first external groove (1) inside is provided with heat dissipation mechanism, first external groove (1) inside is provided with heating element.
2. The tank body for photovoltaic tank type electroplating according to claim 1, wherein the inner and outer tank circulating mechanism consists of a circulating pump (8), a liquid inlet pipe (9) and a liquid outlet pipe (10), the circulating pump (8) is fixedly connected with the bottom surface of the first outer tank (1), the liquid inlet end of the liquid inlet pipe (9) is fixedly connected with the inner wall of the first outer tank (1), the liquid outlet end of the liquid inlet pipe (9) is fixedly connected with the liquid inlet end of the circulating pump (8), the liquid outlet end of the liquid outlet pipe (10) is fixedly connected with the inner wall of the first outer tank (1), the liquid inlet end of the liquid outlet pipe (10) is fixedly connected with the liquid outlet end of the circulating pump (8), and the liquid outlet end of the liquid outlet pipe (10) is positioned in the first inner tank (3).
3. The photovoltaic cell type electroplating cell body according to claim 1, wherein the cooling assembly comprises a fixed frame (11), a semiconductor refrigerating sheet (12) and a cold guide plate (13), the fixed frame (11) is fixedly connected with the inner wall of the first outer cell (1), the semiconductor refrigerating sheet (12) is fixedly connected with the inner wall of the fixed frame (11), the cold guide plate (13) is fixedly connected with the refrigerating end of the semiconductor refrigerating sheet (12), and the cold guide plate (13) is fixedly connected with the bottom surface of the fixed frame (11).
4. A photovoltaic cell type electroplating cell body according to claim 3, wherein the heat dissipation mechanism comprises a fan housing (14) and a heat dissipation fan (15), the fan housing (14) is fixedly connected with the top surface of the fixed frame (11), and the heat dissipation fan (15) is fixedly connected with the inner wall of the fan housing (14).
5. The photovoltaic cell type electroplating cell body according to claim 1, wherein the heating assembly comprises a fixing plate (16), a fixing ring (17) and a heating rod (18), the fixing plate (16) is fixedly connected with the inner wall of the first outer cell (1), the fixing ring (17) is fixedly connected with the top surface of the fixing plate (16), and the heating rod (18) is fixedly connected with the inner wall of the fixing ring (17).
6. The photovoltaic cell type electroplating cell body according to claim 1, wherein the right side of the first outer cell (1) is fixedly connected with a second circulating pump (19), the liquid inlet end of the second circulating pump (19) is fixedly connected with the inner wall of the first outer cell (1), and the liquid outlet end of the second circulating pump (19) is fixedly connected with the inner wall of the second outer cell (2).
7. The photovoltaic cell type electroplating cell body according to claim 1, wherein the number of the first overflow ports (5) is plural, and the first overflow ports (5) are all penetrating through and open on the inner wall of the first inner tank (3).
8. The photovoltaic cell plating tank according to claim 5, wherein the fixing plate (16) has a rectangular shape, and the fixing plate (16) is made of a stainless steel material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202321990140.9U CN220537954U (en) | 2023-07-27 | 2023-07-27 | Photovoltaic slot type electroplating groove body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321990140.9U CN220537954U (en) | 2023-07-27 | 2023-07-27 | Photovoltaic slot type electroplating groove body |
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Publication Number | Publication Date |
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CN220537954U true CN220537954U (en) | 2024-02-27 |
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ID=89975844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202321990140.9U Active CN220537954U (en) | 2023-07-27 | 2023-07-27 | Photovoltaic slot type electroplating groove body |
Country Status (1)
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CN (1) | CN220537954U (en) |
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2023
- 2023-07-27 CN CN202321990140.9U patent/CN220537954U/en active Active
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