CN220537952U - Automatic liquid feeding device for PCB electroplating - Google Patents

Automatic liquid feeding device for PCB electroplating Download PDF

Info

Publication number
CN220537952U
CN220537952U CN202322001564.4U CN202322001564U CN220537952U CN 220537952 U CN220537952 U CN 220537952U CN 202322001564 U CN202322001564 U CN 202322001564U CN 220537952 U CN220537952 U CN 220537952U
Authority
CN
China
Prior art keywords
electroplating
connecting rod
water pump
fixing frame
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202322001564.4U
Other languages
Chinese (zh)
Inventor
杨永祥
戴利明
李国平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN XIANSHENG ELECTRONIC TECHNOLOGY CO LTD
Original Assignee
KUNSHAN XIANSHENG ELECTRONIC TECHNOLOGY CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN XIANSHENG ELECTRONIC TECHNOLOGY CO LTD filed Critical KUNSHAN XIANSHENG ELECTRONIC TECHNOLOGY CO LTD
Priority to CN202322001564.4U priority Critical patent/CN220537952U/en
Application granted granted Critical
Publication of CN220537952U publication Critical patent/CN220537952U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

The utility model belongs to the technical field of PCB surface electroplating, in particular to an automatic liquid feeding device for PCB electroplating, which comprises a fixing frame; the top of the fixing frame is provided with a water pump; the water pump is bolted to the top of the fixing frame; a connecting rod is arranged in the middle of the fixing frame; the connecting rod is rotationally connected to the middle part of the fixing frame; the end part of the connecting rod is provided with a fixed ring; the end part of the fixed ring is provided with a floating ball; the floating ball is fixedly connected to the end of the fixed ring, the power supply is conveyed to the water pump, so that the water pump is started, the water pump is driven, the electroplating liquid is added to the electroplating tank, when the water level of the electroplating liquid is increased, the connecting rod is separated from the metal rod, and the power supply of the water pump is cut off, so that the automatic addition of the electroplating liquid is realized, further, the addition of the electroplating liquid by workers is effectively facilitated, the workload of the workers is reduced, and the degree of equipment automation is increased.

Description

Automatic liquid feeding device for PCB electroplating
Technical Field
The utility model belongs to the technical field of PCB surface electroplating, and particularly relates to an automatic liquid feeding device for PCB electroplating.
Background
In the production of PCBs, it is necessary that the PCB be subjected to an electroplating process so that copper or some metal adheres to the surface of the PCB to increase the conductivity of the PCB.
In the prior art, a PCB is fixed on a rack of an electrolytic bath for electroplating, so that copper, tin and nickel are plated on the rack, and then the rack is immersed in a nitric acid solution, and the copper, tin and nickel on the surface of the rack are corroded by nitric acid and stripped.
When electroplating is performed, a large amount of electroplating solution is consumed, so that the electroplating solution needs to be added frequently, and has certain corrosiveness and certain potential safety hazard, so that the automatic liquid feeding device for PCB electroplating is provided for solving the problems.
Disclosure of Invention
In order to overcome the defects in the prior art and solve at least one technical problem in the background art, the utility model provides an automatic liquid feeding device for PCB electroplating.
The technical scheme adopted for solving the technical problems is as follows: the utility model relates to an automatic liquid feeding device for PCB electroplating, which comprises a fixing frame; the top of the fixing frame is provided with a water pump; the water pump is bolted to the top of the fixing frame; a connecting rod is arranged in the middle of the fixing frame; the connecting rod is rotationally connected to the middle part of the fixing frame; the end part of the connecting rod is provided with a fixed ring; the end part of the fixed ring is provided with a floating ball; the floating ball is fixedly connected to the end part of the fixed ring; the top of the fixing frame is fixedly connected with a pair of metal bars.
Preferably, the output end of the water pump is provided with a hose; the hose is fixedly connected to the output end of the water pump; the end part of the hose is provided with a filter screen; the filter screen is fixedly connected to the end part of the hose.
Preferably, the side wall of the fixed ring is provided with a groove; the inner side wall of the groove is provided with a first magnet; the first magnet is fixedly connected to the inner side wall of the groove; the inner side wall of the groove is provided with two pairs of sliding blocks; the clamping groove is formed in the end portion of the connecting rod.
Preferably, a pair of graphite plates are arranged on the inner side wall of the groove; the graphite plate is fixedly connected to the inner side wall of the groove; the graphite plate is connected with the sliding block in a sliding way; the graphite plates are symmetrically arranged.
Preferably, a pair of second magnets are arranged at the top of the connecting rod; the second magnet is fixedly connected to the top of the connecting rod; the second magnets are symmetrically arranged.
Preferably, two pairs of limiting blocks are arranged on the inner side wall of the groove; the limiting block is fixedly connected to the inner side wall of the groove; the limiting block is positioned between the pair of sliding blocks.
The utility model has the beneficial effects that:
the utility model provides an automatic liquid feeding device for PCB electroplating, which is capable of effectively facilitating the addition of electroplating liquid by workers, reducing the workload of the workers and increasing the degree of equipment automation by automatically adding the electroplating liquid.
The utility model provides an automatic liquid feeding device for PCB electroplating, which is characterized in that a hose is arranged, the hose has certain flexibility, when electroplating liquid is added, a worker puts the hose into an electroplating liquid storage barrel, so that the operation of the worker on equipment is facilitated, the convenience of the equipment is improved, meanwhile, the electroplating liquid is effectively filtered through a filter screen arranged, and impurities are reduced from entering an electroplating pool, so that the cleaning of the electroplating pool by the worker is facilitated.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:
FIG. 1 is a perspective view of the present utility model;
FIG. 2 is a cross-sectional view of a retaining ring of the present utility model;
FIG. 3 is an enlarged view of FIG. 2 at A;
fig. 4 is a perspective view of a first magnet according to the present utility model;
FIG. 5 is a perspective view of a hollow cavity of the present utility model;
legend description:
1. a fixing frame; 11. a water pump; 12. a connecting rod; 13. a fixing ring; 14. a floating ball; 15. a metal rod; 2. a hose; 21. filtering and screening; 3. a groove; 31. a first magnet; 32. a sliding block; 33. a clamping groove; 4. a graphite plate; 5. a second magnet; 6. a limiting block; 7. a cavity.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Specific examples are given below.
Referring to fig. 1-4, the utility model provides an automatic liquid feeding device for PCB electroplating, comprising a fixing frame 1; the top of the fixing frame 1 is provided with a water pump 11; the water pump 11 is bolted to the top of the fixing frame 1; the middle part of the fixing frame 1 is provided with a connecting rod 12; the connecting rod 12 is rotatably connected to the middle part of the fixing frame 1; the end part of the connecting rod 12 is provided with a fixed ring 13; the end part of the fixed ring 13 is provided with a floating ball 14; the floating ball 14 is fixedly connected to the end part of the fixed ring 13; the utility model discloses a plating bath, including mount 1, the metal bar 15 of a pair of metal, during operation, when using equipment, need with the equipment installation area electroplating bath in, when the plating solution in the electroplating bath is consumed, the water level of plating solution can descend, thereby make the position of floating ball 14 descend along with the decline of plating solution water level, after the plating solution descends to a certain extent, connecting rod 12 tip can contact with metal bar 15, and metal bar 15 tip has two sheetmetals, and the positive pole of power is connected to the sheetmetal, the negative pole of another connection power, and a pair of metal bar 15 correspond respectively the positive negative pole of power of water pump 11, when connecting rod 12 tip and metal bar 15 contact, the power will be carried in water pump 11, thereby start water pump 11, and then drive water pump 11, add the plating solution into the electroplating bath in, when the plating solution water level risen, connecting rod 12 just can separate with metal bar 15, and then cut off the power of water pump 11, thereby realize the automatic interpolation of plating solution, and then effectually make things convenient for the staff to add the plating solution, the automatic work load of staff has been reduced, the degree of equipment has been increased.
Further, as shown in fig. 1-4, the output end of the water pump 11 is provided with a hose 2; the hose 2 is fixedly connected to the output end of the water pump 11; the end part of the hose 2 is provided with a filter screen 21; the filter screen 21 rigid coupling is in hose 2 tip, and during operation, through the hose 2 that sets up, and hose 2 has certain pliability, when adding the plating solution, the staff puts into the plating solution storage barrel with hose 2 in, and then has made things convenient for the staff to the operation of equipment, has increased the convenience of equipment, has filtered the plating solution effectively through the filter screen 21 that sets up simultaneously, reduces impurity and enters into in the electroplating bath to the staff has made things convenient for the clearance to the electroplating bath.
Further, as shown in fig. 1-4, the side wall of the fixing ring 13 is provided with a groove 3; the inner side wall of the groove 3 is provided with a first magnet 31; the first magnet 31 is fixedly connected to the inner side wall of the groove 3; two pairs of sliding blocks 32 are arranged on the inner side wall of the groove 3; the draw-in groove 33 has been seted up to connecting rod 12 tip, during operation, when installing float ball 14, need insert the middle part of solid fixed ring 13 with connecting rod 12, when connecting rod 12 inserts solid fixed ring 13 middle part, connecting rod 12 can extrude slider 32 inside recess 3, and first magnet 31 is the same with the material of slider 32, and there is repulsion between them, insert connecting rod 12 behind the solid fixed ring 13 middle part, in the effect of repulsion, slider 32 will be pushed into draw-in groove 33, and then fix float ball 14, when dismantling, because the tip of slider 32 is circular, pulling float ball 14, can extrude the slider 32 inside recess 3, can dismantle float ball 14, through the setting of disconnect-type, the effectual staff of having simplified the installation of float ball 14 with dismantle the step, thereby the staff's of having made things convenient for the installation dismantlement of equipment, and then reduced staff's work load, the staff's of having made things convenient for the change of equipment simultaneously.
Further, as shown in fig. 1-4, a pair of graphite plates 4 are arranged on the inner side wall of the groove 3; the graphite plate 4 is fixedly connected to the inner side wall of the groove 3; the graphite plate 4 is in sliding connection with the sliding block 32; the graphite sheet 4 is symmetrical, and during operation, through the graphite sheet 4 that sets up, reduced the frictional force between sliding block 32 and the graphite sheet 4 effectively, and then reduce the friction of sliding block 32, increase the gliding smoothness nature of sliding block 32, reduce the wearing and tearing of sliding block 32 simultaneously, improve the life of equipment.
Further, as shown in fig. 1-4, a pair of second magnets 5 are arranged on the top of the connecting rod 12; the second magnet 5 is fixedly connected to the top of the connecting rod 12; the second magnet 5 is symmetrical, and during operation, through setting up the second magnet 5, when second magnet 5 and metal bar 15 contact, both can adsorb together to increase the stability that equipment is connected, increase the smoothness nature of equipment operation.
Further, as shown in fig. 1-4, two pairs of limiting blocks 6 are arranged on the inner side wall of the groove 3; the limiting block 6 is fixedly connected to the inner side wall of the groove 3; the limiting block 6 is located between the pair of sliding blocks 32, and during operation, the limiting block 6 effectively limits the positions of the sliding blocks 32, reduces the displacement of the sliding blocks 32, ensures that the sliding blocks 32 fix equipment at different positions, and further increases the fixing effect of the equipment.
Further, as shown in fig. 5, the side wall of the floating ball 14 is provided with a cavity 7, and when in operation, the buoyancy of the floating ball 14 is effectively increased through the provided cavity 7.
Working principle: when the equipment is used, the equipment is required to be installed in a plating tank, when the plating solution in the plating tank is consumed, the water level of the plating solution is lowered, so that the position of a floating ball 14 is lowered along with the lowering of the water level of the plating solution, after the plating solution is lowered to a certain degree, the end part of a connecting rod 12 is contacted with a metal rod 15, two metal sheets are arranged at the end part of the metal rod 15, one metal sheet is connected with the positive electrode of a power supply, the other metal sheet is connected with the negative electrode of the power supply, the pair of metal rods 15 respectively correspond to the positive electrode and the negative electrode of the power supply of a water pump 11, when the end part of the connecting rod 12 is contacted with the metal rod 15, the power supply is conveyed into the water pump 11, the water pump 11 is started, the water pump 11 is driven, the plating solution is added into the plating tank, when the water level of the plating solution is raised, the connecting rod 12 is separated from the metal rod 15, and the power supply of the water pump 11 is cut off, so that the automatic addition of the plating solution is realized, the electroplating liquid is effectively and conveniently added by workers, the workload of the workers is reduced, the degree of equipment automation is increased, the hose 2 is arranged, the hose 2 has certain flexibility, when the electroplating liquid is added, the workers put the hose 2 into an electroplating liquid storage barrel, the workers can conveniently operate the equipment, the convenience of the equipment is improved, meanwhile, the electroplating liquid is effectively filtered through the filter screen 21, impurities are reduced to enter the electroplating pool, the cleaning of the electroplating pool by the workers is convenient, when the floating ball 14 is installed, the connecting rod 12 is required to be inserted into the middle part of the fixed ring 13, when the connecting rod 12 is inserted into the middle part of the fixed ring 13, the sliding block 32 is extruded into the groove 3 by the connecting rod 12, the first magnet 31 and the sliding block 32 are the same in material, and there is repulsion between them, insert solid fixed ring 13 middle part back with connecting rod 12, under the effect of repulsion force, slider 32 will be pushed into draw-in groove 33, and then with floating ball 14 is fixed, because the tip of slider 32 is circular during the dismantlement, pulling floating ball 14, can extrude slider 32 to recess 3 inside, can dismantle floating ball 14, through the setting of disconnect-type, the effectual step of simplifying the staff to the installation and the dismantlement of floating ball 14, thereby the staff dismantles the installation of equipment has been made things convenient for, and then the work load of staff has been reduced, the change of staff to equipment has been made things convenient for simultaneously, through the graphite sheet 4 of setting up, the frictional force between slider 32 and the graphite sheet 4 has been reduced effectively, and then the friction of slider 32 has been reduced, increase slider 32 gliding smoothness, simultaneously reduce slider 32's wearing and tearing, improve equipment's life, through setting up second magnet 5, when second magnet 5 and metal bar 15 contact, both can adsorb together, thereby the stability of equipment connection has been increased, the stopper of equipment operation has been made things convenient for, the slider has been limited to the slider through setting up 6, the position has effectively, the position has been set up at the fixed position of slider 32, and has been made the device has been improved through the fixed position of the slider 32, and has been made the device has been improved to the device, and has been moved at the position of the device has been made to be moved to the device.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.

Claims (6)

1. An automatic liquid feeding device for PCB electroplating comprises a fixing frame (1); the method is characterized in that: the top of the fixing frame (1) is provided with a water pump (11); the water pump (11) is bolted to the top of the fixing frame (1); a connecting rod (12) is arranged in the middle of the fixing frame (1); the connecting rod (12) is rotationally connected to the middle part of the fixing frame (1); the end part of the connecting rod (12) is provided with a fixed ring (13); a floating ball (14) is arranged at the end part of the fixed ring (13); the floating ball (14) is fixedly connected to the end part of the fixed ring (13); a pair of metal bars (15) are fixedly connected to the top of the fixing frame (1).
2. The automatic liquid feeding device for electroplating of a PCB according to claim 1, wherein: the output end of the water pump (11) is provided with a hose (2); the hose (2) is fixedly connected to the output end of the water pump (11); a filter screen (21) is arranged at the end part of the hose (2); the filter screen (21) is fixedly connected to the end part of the hose (2).
3. The automatic liquid feeding device for electroplating of a PCB according to claim 2, wherein: the side wall of the fixed ring (13) is provided with a groove (3); the inner side wall of the groove (3) is provided with a first magnet (31); the first magnet (31) is fixedly connected to the inner side wall of the groove (3); two pairs of sliding blocks (32) are arranged on the inner side wall of the groove (3); a clamping groove (33) is formed in the end portion of the connecting rod (12).
4. A PCB plating automatic liquid feeding apparatus according to claim 3, wherein: the inner side wall of the groove (3) is provided with a pair of graphite plates (4); the graphite plate (4) is fixedly connected to the inner side wall of the groove (3); the graphite plate (4) is in sliding connection with the sliding block (32); the graphite plates (4) are symmetrically arranged.
5. The automatic liquid feeding device for PCB electroplating according to claim 4, wherein: a pair of second magnets (5) are arranged at the top of the connecting rod (12); the second magnet (5) is fixedly connected to the top of the connecting rod (12); the second magnets (5) are symmetrically arranged.
6. The automatic liquid feeding device for PCB electroplating according to claim 5, wherein:
two pairs of limiting blocks (6) are arranged on the inner side wall of the groove (3); the limiting block (6) is fixedly connected to the inner side wall of the groove (3); the limiting block (6) is positioned between the pair of sliding blocks (32).
CN202322001564.4U 2023-07-27 2023-07-27 Automatic liquid feeding device for PCB electroplating Active CN220537952U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322001564.4U CN220537952U (en) 2023-07-27 2023-07-27 Automatic liquid feeding device for PCB electroplating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322001564.4U CN220537952U (en) 2023-07-27 2023-07-27 Automatic liquid feeding device for PCB electroplating

Publications (1)

Publication Number Publication Date
CN220537952U true CN220537952U (en) 2024-02-27

Family

ID=89964672

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322001564.4U Active CN220537952U (en) 2023-07-27 2023-07-27 Automatic liquid feeding device for PCB electroplating

Country Status (1)

Country Link
CN (1) CN220537952U (en)

Similar Documents

Publication Publication Date Title
CN104762651A (en) Crystallizer internal surface electroplating production line and electroplating method thereof
CN220537952U (en) Automatic liquid feeding device for PCB electroplating
CN215404629U (en) Plating bath with electroplating dross automatic clear function
CN204550776U (en) The plating inner surface production line of crystallizer
CN211005661U (en) Automatic liquid circulating device for electrolytic copper production
CN211311648U (en) Plating bath device
CN212476925U (en) Device for electroplating copper artware
CN209974951U (en) Electro-plating liquid filtering device with impurity removing structure
CN216304006U (en) Nickel electrolysis anode bag capable of improving electrolysis efficiency
CN211771616U (en) Electroplating device for electroplating tin-nickel alloy copper clad steel wire
CN214319387U (en) Lifting type magnetic mechanism applied to magnetic filter and magnetic filter
CN214736191U (en) Electroplating bath structure for manufacturing integrated circuit
CN215440706U (en) Copper refining electrolytic tank
CN220057069U (en) Multifunctional water pan device
CN207775376U (en) A kind of electroplating bath
CN219526838U (en) Electroplating solution circulation type electroplating bath
CN217231006U (en) Electroplating solution recovery device
CN221071688U (en) Electrophoresis coating electrophoresis tank
CN212419628U (en) Powder metallurgy die capable of being tightly fixed
CN213596426U (en) Horizontal silver electrolytic refining equipment with high current density
CN220579360U (en) Hot galvanizing scum cleaning device
CN218372586U (en) Plating bath with electroplating dross automatic clear function
CN214496477U (en) Device for directly and chemically plating nickel on silver layer at end of SMD magnetic core
CN214655323U (en) Automatic change high efficiency electrotinning equipment
CN211005704U (en) Electroplating slag removing device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant