CN212476925U - Device for electroplating copper artware - Google Patents

Abstract

The utility model discloses a device for electroplating copper handicraft belongs to electroplating technical field, the on-line screen storage device comprises a base, electroplating box is installed at the base top, electroplating box inside wall left side is seted up flutedly, the recess has two sets of symmetry forms of being to set up on electroplating box inside wall right side, the horizontal pole is installed to the recess lateral wall, the couple is installed on horizontal pole bottom right side, electroplating box inside wall is installed bar copper and is run through the horizontal pole, pipe connection is passed through with the inside wall right side of rose box in electroplating box inside wall left side, the valve is installed to the lateral wall of pipe. The utility model discloses a thereby mutually supporting of sepiolite, rose box, active carbon and pipe can be so that filter the environmental protection to the plating solution when discharging the plating solution, thereby mutually supporting of rethread horizontal pole couple can make things convenient for the handicraft to stabilize and electroplate, is fit for being extensively promoted and used.

Description

Device for electroplating copper artware

Technical Field

The utility model relates to an electroplate technical field, especially relate to a device for electro-coppering handicraft.

Background

Sodium cyanide is added to the plating solution in small amounts in the current copper plating process to provide bonding strength and surface smoothness of the plating layer, but the cyanide in the generated waste liquid is difficult to treat, causing environmental pollution and harming the health of operators.

Patent No. CN201510266295 discloses a circuit board copper electroplating device, which belongs to the field of circuit board production and manufacturing. The copper electroplating device comprises a copper electroplating cylinder, a copper dissolving barrel, a liquid outlet pipe and a return pipe; a copper block is arranged in the copper dissolving barrel; the liquid outlet pipe is communicated with the copper electroplating cylinder and the copper dissolution barrel, the backflow pipe is communicated with the copper electroplating cylinder and the copper dissolution barrel, and electroplating liquid in the copper electroplating cylinder enters the copper dissolution barrel through the liquid outlet pipe and then enters the copper electroplating cylinder through the backflow pipe. The copper electroplating device is suitable for insoluble anode electroplating, and can replace the existing copper plating solution copper oxide adding process by using relatively cheap pure copper balls, so that the manufacturing cost is reduced; the operation is simple, and the manual operation intensity is reduced; in addition, the copper ion content in the copper plating solution is more stable, and the quality of the electroplated copper layer is better.

At present, the technology has certain defects: 1. after heavy metals and some chlorides exist in the electroplating solution, the sewage land causes damage to human health; 2. when the handicraft is electroplated, the handicraft is not firm enough, so that the surface of the handicraft is not uniformly electroplated.

SUMMERY OF THE UTILITY MODEL

The utility model provides a device for copper electroplating handicraft can filter the plating solution when can making to discharge the plating solution through mutually supporting of sepiolite, rose box, active carbon and pipe and protect the environment, thereby mutually supporting of rethread horizontal pole couple can make things convenient for the handicraft to stabilize and electroplate, can effectively solve the problem in the background art.

The utility model provides a specific technical scheme as follows:

the utility model provides a pair of a device for electroplating copper handicraft, the on-line screen storage device comprises a base, electroplating box is installed at the base top, electroplating box inside wall left side is seted up flutedly, the recess has two sets of symmetry forms of being to set up on electroplating box inside wall right side, the horizontal pole is installed to the recess lateral wall, the couple is installed on horizontal pole bottom right side, electroplating box inside wall is installed bar copper and is run through the horizontal pole, pipe connection is passed through on electroplating box's inside wall left side and rose box's inside wall right side, the valve is installed to the lateral wall of pipe, sepiolite is installed at the inside wall top of rose box, activated carbon is installed to rose box inside wall bottom, control switch is installed on electroplating box outside wall right side, control switch's input and external power supply.

Optionally, the through-hole has been seted up on the left side of rose box lateral wall and the through-hole is two sets of sepiolite left sides and active carbon left side that all are located.

Optionally, a drain pipe is installed at the bottom of the filter box.

Optionally, the anode output end of the control switch is electrically connected with the top of the copper bar, and the cathode output end of the control switch is electrically connected with the bottom of the hook.

Optionally, a feeding opening is formed in the top of the electroplating box, and electroplating liquid is placed on the inner side wall of the electroplating box.

The utility model has the advantages as follows:

1. the utility model discloses it is practical, convenient operation and excellent in use effect, the inside wall of electroplating box passes through pipe connection with the inside wall of rose box, and the valve is installed to the lateral wall of pipe, opens the valve after electroplating, and in the rose box was counted into through the pipe to the plating solution, sepiolite and active carbon were installed respectively to the rose box inside wall, sepiolite and active carbon adsorptivity can adsorb some heavy metals and chloride very strongly to can filter the plating solution, thereby prevent that the pollution ring influences health.

2. The utility model discloses in, control switch is installed to the lateral wall of electroplating box, control switch's positive pole output is connected with the bar copper of installing at the electroplating box inside wall, two sets of symmetry recesses have been seted up to the electroplating box inside wall, the horizontal pole is installed to two sets of symmetry recesses, the couple is installed to the bottom of horizontal pole, hang the handicraft and detain in couple department, the couple is connected with control switch's negative pole output, thereby open behind the control switch, because the bar copper is in the plating solution and with positive pole articulate, thereby it becomes copper ion to make logical atom carry out chemical change, thereby the handicraft takes the negative charge because handicraft is connected with the negative pole, because opposite sex electric charge attracts each other, thereby copper ion depends on in handicraft surface department, thereby can advance to electroplate to the handicraft surface, handicraft stability when can guaranteeing to electroplate, thereby can electroplate.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of an apparatus for electroplating copper artware according to an embodiment of the present invention;

FIG. 2 is a schematic structural view of a filter box of the device for electroplating copper artware according to the embodiment of the present invention;

in the figure: 1. a base; 2. electroplating box; 3. a groove; 4. a cross bar; 5. hooking; 6. a control switch; 7. electroplating solution; 8. a copper bar; 9. a conduit; 10. a valve; 11. a drain pipe; 12. a filter box; 13. sepiolite; 14. activated carbon.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

An apparatus for electroplating copper artware according to an embodiment of the present invention will be described in detail with reference to fig. 1 to 2.

As shown in fig. 1-2, an apparatus for copper electroplating of artware comprises a base 1, an electroplating tank 2 mounted on the top of the base 1, the left side of the inner side wall of the electroplating box 2 is provided with a groove 3, two groups of the grooves 3 are symmetrically arranged on the right side of the inner side wall of the electroplating box 2, a cross bar 4 is arranged on the outer side wall of the groove 3, a hook 5 is arranged on the right side of the bottom of the cross bar 4, the copper bar 8 is arranged on the inner side wall of the electroplating box 2, the copper bar 8 penetrates through the cross rod 4, the left side of the inner side wall of the electroplating box 2 is connected with the right side of the inner side wall of the filter box 12 through a guide pipe 9, the outer side wall of the conduit 9 is provided with a valve 10, the top of the inner side wall of the filter box 12 is provided with sepiolite 13, active carbon 14 is installed to rose box 12 inside wall bottom, control switch 6 is installed on 2 lateral wall right sides of electroplating tank, control switch 6's input and external power supply output electric connection. Thereby, thereby through mutually supporting of sepiolite, rose box, active carbon and pipe can make and filter the environmental protection to the plating solution when discharging the plating solution, thereby the rethread horizontal pole couple mutually support and can make things convenient for the handicraft to carry out stable electroplating.

In this embodiment, as shown in fig. 1, through holes are formed in the left side of the outer side wall of the filter box 12, and two sets of the through holes are located on the left side of the sepiolite 13 and the left side of the activated carbon 14. Wherein, the sepiolite and the active carbon are convenient to be replaced in the later period.

In this embodiment, as shown in fig. 1, a drain pipe 11 is installed at the bottom of the filter box 12. Wherein, the filtered electroplating solution is convenient to discharge.

In this embodiment, as shown in fig. 1, an anode output end of the control switch 6 is electrically connected to the top of the copper bar 8, and a cathode output end of the control switch 6 is electrically connected to the bottom of the hook 5. Wherein, simple structure conveniently carries out the electroplating.

In this embodiment, as shown in fig. 1, a feeding opening is formed at the top of the electroplating tank 2, and electroplating solution 7 is placed on the inner side wall of the electroplating tank 2. Wherein, the copper bar is convenient to be ionized.

It should be noted that, the utility model relates to a device for copper electroplating handicraft, in operation, switch on the external power supply, control switch 6 is installed to the lateral wall of electroplating box 2, control switch 6's positive pole output is connected with the bar copper 8 of installing at electroplating box 2 inside wall, electroplating box 2 inside wall is seted up two sets of symmetrical recess 3, two sets of symmetrical recess 3 department install horizontal pole 4, couple 5 is installed to the bottom of horizontal pole 4, hang the handicraft and detain in couple 5 department, couple 5 is connected with control switch 6's negative pole output, thereby after opening control switch 6, because bar copper 8 is in electroplate liquid 7 and is connected with the positive pole joint, thereby make the atomic chemical change that leads to become the copper ion, thereby the handicraft takes the negative charge with the negative pole connection, because opposite sex's charge inter attraction, thereby the copper ion depends on handicraft surface department, thereby can advance to electroplate the handicraft surface, handicraft stability when can guaranteeing to electroplate, thereby can electroplate evenly, the inside wall of electroplating box 2 passes through pipe 9 with the inside wall of rose box 12 and is connected, valve 10 is installed to pipe 9's lateral wall, open valve 10 after electroplating, plating solution 7 counts into in the rose box 12 through the pipe, sepiolite 13 and active carbon 14 are installed respectively to rose box 12 inside wall, sepiolite 13 and active carbon 14 adsorptivity can adsorb some heavy metals and chloride very strongly, thereby can filter the plating solution, thereby prevent that the pollution ring from influencing human health.

The utility model relates to a device 1 for copper electroplating handicraft, a base; 2. electroplating box; 3. a groove; 4. a cross bar; 5. hooking; 6. a control switch; 7. electroplating solution; 8. a copper bar; 9. a conduit; 10. a valve; 11. a drain pipe; 12. a filter box; 13. sepiolite; 14. the activated carbon elements are all standard elements or elements known to the person skilled in the art, the structure and the principle of which are known to the person skilled in the art by means of technical manuals or by means of routine experimentation.

It is apparent that those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (5)

1. The utility model provides a device for copper electroplating handicraft, includes base (1), its characterized in that, electroplating box (2) are installed at base (1) top, electroplating box (2) inside wall left side is seted up flutedly (3), recess (3) have two sets ofly to be the symmetry form and set up on electroplating box (2) inside wall right side, horizontal pole (4) are installed to recess (3) lateral wall, couple (5) are installed on horizontal pole (4) bottom right side, electroplating box (2) inside wall is installed copper bar (8) and is run through horizontal pole (4), the inside wall left side of electroplating box (2) is passed through pipe (9) with the inside wall right side of rose box (12) and is connected, valve (10) are installed to the lateral wall of pipe (9), sepiolite (13) are installed at the inside wall top of rose box (12), activated carbon (14) are installed to rose box (12) inside wall bottom, control switch (6) is installed on electroplating box (2) lateral wall right side, control switch (6)'s input and external power supply output electric connection.

2. The device for the copper electroplating handicraft according to the claim 1, characterized in that the filter box (12) is provided with through holes on the left side of the outer side wall, and the through holes are two groups which are positioned on the left side of the sepiolite (13) and the left side of the activated carbon (14).

3. An apparatus for electrolytic copper plating handicraft according to claim 1, characterized in that a drain pipe (11) is installed at the bottom of the filter box (12).

4. The apparatus for copper electroplating handicraft according to claim 1, wherein the anode output end of the control switch (6) is electrically connected with the top of the copper bar (8), and the cathode output end of the control switch (6) is electrically connected with the bottom of the hook (5).

5. The device for copper electroplating artware according to claim 4, wherein a feeding opening is formed in the top of the electroplating box (2), and electroplating solution (7) is placed on the inner side wall of the electroplating box (2).

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