CN220525128U - CMOS sensor applied to hyperspectral detection equipment - Google Patents
CMOS sensor applied to hyperspectral detection equipment Download PDFInfo
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- CN220525128U CN220525128U CN202321837398.5U CN202321837398U CN220525128U CN 220525128 U CN220525128 U CN 220525128U CN 202321837398 U CN202321837398 U CN 202321837398U CN 220525128 U CN220525128 U CN 220525128U
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- fixedly connected
- wall
- cmos sensor
- heat
- water
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- 238000001514 detection method Methods 0.000 title claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 73
- 230000017525 heat dissipation Effects 0.000 claims abstract description 27
- 238000001816 cooling Methods 0.000 claims description 16
- 230000033228 biological regulation Effects 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000013016 damping Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 239000000110 cooling liquid Substances 0.000 description 20
- 238000005516 engineering process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000005086 pumping Methods 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000000701 chemical imaging Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003651 drinking water Substances 0.000 description 1
- 235000020188 drinking water Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008236 heating water Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
Abstract
The utility model discloses a CMOS sensor applied to hyperspectral detection equipment, in particular to the hyperspectral detection field, which comprises a shell, wherein the inner wall of the shell is fixedly connected with a heat dissipation mechanism, the heat dissipation mechanism comprises a water tank, the outer wall of the water tank is fixedly connected with a water adding nozzle, the upper end of the water tank is fixedly connected with a miniature water pump, the outer wall of the miniature water pump is fixedly connected with a water suction pipe, the outer wall of the miniature water pump is fixedly connected with a water outlet pipe, one end of the water outlet pipe is fixedly connected with a heat collection head, the outer wall of the heat collection head is fixedly connected with a mounting block, the upper end of the heat collection head is fixedly connected with a heat collection plate, the outer wall of the heat collection head is fixedly connected with a heat dissipation pipe, and the outer wall of the heat dissipation pipe is fixedly connected with a heat dissipation box; the utility model can carry out high-efficiency heat dissipation through the heat dissipation mechanism, can rapidly dissipate heat of the CMOS sensor assembly, ensures that the CMOS sensor assembly can maintain high-efficiency working efficiency, and can prolong the service life of the CMOS sensor assembly.
Description
Technical Field
The present utility model relates to the field of hyperspectral detection, and more particularly to a CMOS sensor for use in hyperspectral detection devices.
Background
The hyperspectral imaging technology is based on an image data technology of a very large number of narrow wave bands, combines the imaging technology with a spectrum technology, detects two-dimensional geometric space and one-dimensional spectrum information of a target, and acquires continuous and narrow wave band image data with hyperspectral resolution;
through searching, the prior patent (publication number: CN 207976219U) discloses a hyperspectral image detection device and detection equipment. The hyperspectral image detection device comprises a telecentric optical module, a slit element, a quasi-straight dispersion element and a photosensitive element. The telecentric optical module includes a scanning mirror, and the slit element is adjacent to the light emitting side of the telecentric optical module, so that a part of the two-dimensional light passing through the telecentric optical module passes through the slit element to form one-dimensional linear light. The collimating and dispersing element disperses the one-dimensional linear light into a dispersed light beam. The photosensitive element disperses the light beam to obtain spectral information corresponding to the one-dimensional linear light. Therefore, a series of one-dimensional light spectrum information can be formed into a hyperspectral image of a two-dimensional scene light field by continuously changing the reflecting angle of the scanning mirror. The inventors found that the following problems exist in the prior art in the process of implementing the present utility model:
the existing CMOS sensor of the hyperspectral detection device can generate heat when in use, a fan is usually used for radiating the CMOS sensor, and the higher heat is inconvenient to radiate in time under long-time use, so that the service life of the CMOS sensor is influenced, and therefore, a radiating mechanism is needed to radiate heat efficiently when the CMOS sensor applied to the hyperspectral detection device is used;
accordingly, a CMOS sensor applied to a hyperspectral sensing apparatus is proposed in view of the above-described problems.
Disclosure of Invention
In order to overcome the above-mentioned drawbacks of the prior art, the present utility model provides a CMOS sensor applied to a hyperspectral detection device, so as to solve the above-mentioned problems of the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an use at hyperspectral check out test set's CMOS sensor, includes the shell, the inner wall fixedly connected with cooling mechanism of shell, cooling mechanism is including the water tank, the outer wall fixedly connected with of water tank adds the water injection well choke, the upper end fixedly connected with miniature water pump of water tank, the outer wall fixedly connected with drinking-water pipe of miniature water pump, the outer wall fixedly connected with outlet pipe of miniature water pump.
One end fixedly connected with heat-collecting head of outlet pipe, the outer wall fixedly connected with installation piece of heat-collecting head, the upper end fixedly connected with heat-collecting plate of heat-collecting head, the outer wall fixedly connected with cooling tube of heat-collecting head, the outer wall fixedly connected with cooling box of cooling tube, the upper end fixedly connected with fan of cooling box.
Preferably, the inner wall sliding connection of shell has the mechanism of placing, the bottom fixedly connected with of shell adjusts the supporting legs, the inner wall fixedly connected with CMOS sensor subassembly of shell, the upper end threaded connection of shell has the protective cover, the outer wall fixedly connected with operating panel of shell, the outer wall fixedly connected with pilot lamp of shell.
Preferably, the water suction pipe and the heat collection head form a communication structure through the miniature water pump and the water outlet pipe.
Preferably, a communication structure is formed between the heat collecting head and the heat collecting plate, and the heat collecting plate is coated with heat dissipation silicone grease.
Preferably, the radiating pipe penetrates through the inside of the radiating box and is fixedly connected with the water tank, and the radiating pipe is wavy in the radiating box.
Preferably, the placing mechanism comprises a placing plate, wherein the outer wall of the placing plate is fixedly connected with a sliding block, and the outer wall of the placing plate is fixedly connected with a pull rod.
Preferably, the bottom of placing the board has seted up the fixed slot, the inner wall of fixed slot is connected with the supporting leg through the damping pivot.
Preferably, the bottom threaded connection of supporting leg has the regulation leg, the bottom fixed mounting of regulation leg has the slipmat.
The utility model has the technical effects and advantages that:
1. compared with the prior art, the CMOS sensor applied to the hyperspectral detection equipment can conduct efficient heat dissipation through the heat dissipation mechanism, heat dissipation silicone grease is smeared on the heat collection plate when the CMOS sensor is used, the heat collection plate is arranged on the CMOS sensor component, then cooling liquid is poured into the water tank through the water adding nozzle, then the miniature water pump can work to pump out cooling liquid in the water tank through the water pumping pipe, then the cooling liquid is conveyed into the heat collection head through the water outlet pipe, then the cooling liquid can absorb heat on the heat collection plate, then the heat on the heat collection plate is taken away from the heat dissipation pipe, when the cooling liquid absorbing the heat enters the heat dissipation box, the fan can work to dissipate the heat of the heat dissipation pipe, then the cooling liquid after cooling can return to the water tank for recycling, the CMOS sensor component can be rapidly cooled, the CMOS sensor component can keep efficient working efficiency, and the service life of the CMOS sensor component can be prolonged.
2. Compared with the prior art, this use is at convenient article of placing of hyperspectral detection equipment's CMOS sensor through placing the mechanism, can take out the board from the shell through the pull rod in placing when using, can rotate out the fixed slot from the bottom of placing the board after taking out, then adjust the regulation leg according to the height, make the regulation leg support ground, then place the article that needs to detect on the board, this mode can conveniently accomodate, can not occupation space when not using to make hyperspectral detection equipment conveniently carry about.
Drawings
Fig. 1 is a schematic perspective view of the whole structure of the present utility model.
Fig. 2 is a cross-sectional view of the present utility model.
Fig. 3 is a schematic structural diagram of a heat dissipation mechanism according to the present utility model.
Fig. 4 is a schematic view of a heat dissipating tube according to the present utility model.
Fig. 5 is a schematic structural view of the placement mechanism of the present utility model.
The reference numerals are: 1. a housing; 2. a heat dissipation mechanism; 3. adjusting the supporting feet; 4. a placement mechanism; 5. a protective cover; 6. a CMOS sensor assembly; 7. an operation panel; 8. an indicator light; 201. a water tank; 202. a water adding nozzle; 203. a water pumping pipe; 204. a micro water pump; 205. a water outlet pipe; 206. a heat collecting head; 207. a heat collecting plate; 208. a mounting block; 209. a heat radiating pipe; 2010. a heat radiation box; 2011. a fan; 401. placing a plate; 402. a slide block; 403. a pull rod; 404. a fixing groove; 405. support legs; 406. the legs are adjusted.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
The CMOS sensor for hyperspectral detection apparatus shown in fig. 2 to 4 comprises a housing 1, wherein a heat dissipation mechanism 2 is fixedly connected to the inner wall of the housing 1, the heat dissipation mechanism 2 comprises a water tank 201, a water adding nozzle 202 is fixedly connected to the outer wall of the water tank 201, a micro water pump 204 is fixedly connected to the upper end of the water tank 201, a water suction pipe 203 is fixedly connected to the outer wall of the micro water pump 204, and a water outlet pipe 205 is fixedly connected to the outer wall of the micro water pump 204.
One end fixedly connected with heat-collecting head 206 of outlet pipe 205, the outer wall fixedly connected with installation piece 208 of heat-collecting head 206, the upper end fixedly connected with heat-collecting plate 207 of heat-collecting head 206, the outer wall fixedly connected with cooling tube 209 of heat-collecting head 206, the outer wall fixedly connected with cooling tank 2010 of cooling tube 209, the upper end fixedly connected with fan 2011 of cooling tank 2010.
Wherein: when the CMOS sensor assembly is used, heat dissipation silicone grease is smeared on the heat collection plate 207, the heat collection plate 207 is arranged on the CMOS sensor assembly 6, then cooling liquid is poured into the water tank 201 through the water adding nozzle 202, then the micro water pump 204 can work to pump out the cooling liquid in the water tank 201 through the water pumping pipe 203, then the cooling liquid is conveyed into the heat collection head 206 through the water outlet pipe 205, then the cooling liquid can absorb heat on the heat collection plate 207, then the heat on the heat collection plate 207 is taken away from the heat dissipation pipe 209, when the cooling liquid absorbing the heat enters the heat dissipation box 2010, the fan 2011 can work to dissipate the heat of the heat dissipation pipe 209, and then the cooled cooling liquid can return to the water tank 201 for recycling.
Example two
On the basis of the first embodiment, the scheme in the first embodiment is further introduced in detail in combination with the following specific working manner, as shown in fig. 1 to 4, and described in detail below:
as a preferred embodiment, the inner wall of the housing 1 is slidably connected with the placement mechanism 4, the bottom end of the housing 1 is fixedly connected with the adjusting support leg 3, the inner wall of the housing 1 is fixedly connected with the CMOS sensor assembly 6, the upper end of the housing 1 is in threaded connection with the protective cover 5, the outer wall of the housing 1 is fixedly connected with the operation panel 7, and the outer wall of the housing 1 is fixedly connected with the indicator lamp 8; further, the height of the housing 1 can be adjusted by adjusting the supporting feet 3 when the portable electronic device is in use, so that the housing 1 is more stable when in use, then the placement mechanism 4 is pulled out to place articles on the placement mechanism 4, then the articles can be placed on the CMOS sensor assembly 6 for detection after the protective cover 5 is opened, the operation can be performed through the operation panel 7 when in detection, and then the indicator lamp 8 blinks for indication.
As a preferred embodiment, the water suction pipe 203 forms a communication structure with the heat collection head 206 through the micro water pump 204 and the water outlet pipe 205; further, the cooling liquid may flow from the inside of the water tank 201 into the heat collecting head 206.
As a preferred embodiment, a communication structure is formed between the heat collecting head 206 and the heat collecting plate 207, and the heat collecting plate 207 is coated with heat dissipation silicone grease; further, the heat generated in the CMOS sensor assembly 6 can be absorbed.
As a preferred embodiment, the radiating pipe 209 penetrates through the inside of the radiating case 2010 and is fixedly connected with the water tank 201, and the radiating pipe 209 is wavy in the radiating case 2010; further, the cooling liquid in the radiating pipe 209 can be cooled.
As a preferred embodiment, the placement mechanism 4 comprises a placement plate 401, wherein a sliding block 402 is fixedly connected to the outer wall of the placement plate 401, and a pull rod 403 is fixedly connected to the outer wall of the placement plate 401; further, the placement plate 401 can be pulled out by the pull rod 403.
As a preferred embodiment, a fixed slot 404 is formed at the bottom end of the placement plate 401, and a supporting leg 405 is connected to the inner wall of the fixed slot 404 through a damping rotating shaft; further, the support legs 405 may be rotated out of the bottom of the placement plate 401 for support.
As a preferred embodiment, the bottom ends of the supporting legs 405 are connected with adjusting legs 406 in a threaded manner, and the bottom ends of the adjusting legs 406 are fixedly provided with anti-slip pads; further, the height is convenient to adjust.
The working process of the utility model is as follows: firstly, placing the CMOS sensor of the hyperspectral detection device at a place needing to work, then electrifying the CMOS sensor of the hyperspectral detection device, then adjusting the height of the shell 1 through the adjusting supporting legs 3, enabling the shell 1 to be more stable in use, then extracting the placing plate 401 from the shell 1 through the pull rod 403, rotating the fixing groove 404 out of the bottom of the placing plate 401 after extracting, then adjusting the adjusting legs 406 according to the height, enabling the adjusting legs 406 to support the ground, then placing objects needing to be detected on the placing plate 401, then opening the protective cover 5, then placing the objects on the CMOS sensor assembly 6 for detection, operating through the operating panel 7, then indicating the flickering of the indicating lamp 8, then smearing the heat dissipation silicone grease on the heat collection plate 207 during use, installing the heat collection plate 207 on the CMOS sensor assembly 6, then pouring cooling liquid into the water tank 201 through the heating water nozzle 202, then operating the micro water pump 204 to draw out the cooling liquid in the water tank 201 through the water suction pipe 203, then taking the cooling liquid back to the heat collection plate 209 through the water suction pipe 205, then carrying the cooling liquid back to the heat collection plate 209 through the fan, and then carrying the heat is circulated on the cooling liquid when the heat collection plate is the heat collection plate 209, and the heat is absorbed by the cooling liquid is circulated on the cooling pipe 209.
Finally: the foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the utility model are intended to be included within the scope of the utility model.
Claims (8)
1. CMOS sensor for use in hyperspectral detection apparatus, comprising a housing (1), characterized in that: the novel water heater is characterized in that a heat dissipation mechanism (2) is fixedly connected to the inner wall of the shell (1), the heat dissipation mechanism (2) comprises a water tank (201), a water adding nozzle (202) is fixedly connected to the outer wall of the water tank (201), a miniature water pump (204) is fixedly connected to the upper end of the water tank (201), a water suction pipe (203) is fixedly connected to the outer wall of the miniature water pump (204), and a water outlet pipe (205) is fixedly connected to the outer wall of the miniature water pump (204);
one end fixedly connected with heat collecting head (206) of outlet pipe (205), the outer wall fixedly connected with installation piece (208) of heat collecting head (206), the upper end fixedly connected with heat collecting plate (207) of heat collecting head (206), the outer wall fixedly connected with cooling tube (209) of heat collecting head (206), the outer wall fixedly connected with cooling tank (2010) of cooling tube (209), the upper end fixedly connected with fan (2011) of cooling tank (2010).
2. A CMOS sensor for use in a hyperspectral sensing device as claimed in claim 1 wherein: the inner wall sliding connection of shell (1) has placement machine constructs (4), the bottom fixedly connected with of shell (1) adjusts supporting legs (3), the inner wall fixedly connected with CMOS sensor subassembly (6) of shell (1), the upper end screw thread connection of shell (1) has protective cover (5), the outer wall fixedly connected with operating panel (7) of shell (1), the outer wall fixedly connected with pilot lamp (8) of shell (1).
3. A CMOS sensor for use in a hyperspectral sensing device as claimed in claim 1 wherein: the water suction pipe (203) and the heat collection head (206) form a communication structure through the miniature water pump (204) and the water outlet pipe (205).
4. A CMOS sensor for use in a hyperspectral sensing device as claimed in claim 3 wherein: a communication structure is formed between the heat collecting head (206) and the heat collecting plate (207), and the heat collecting plate (207) is coated with heat dissipation silicone grease.
5. A CMOS sensor for use in a hyperspectral sensing device as claimed in claim 1 wherein: the radiating pipe (209) penetrates through the inside of the radiating box (2010) and is fixedly connected with the water tank (201), and the radiating pipe (209) is wavy in the radiating box (2010).
6. A CMOS sensor for use in a hyperspectral sensing device as claimed in claim 2 wherein: the placing mechanism (4) comprises a placing plate (401), wherein a sliding block (402) is fixedly connected to the outer wall of the placing plate (401), and a pull rod (403) is fixedly connected to the outer wall of the placing plate (401).
7. A CMOS sensor for use in a hyperspectral sensing device as claimed in claim 6 wherein: the bottom of placing board (401) has seted up fixed slot (404), the inner wall of fixed slot (404) is connected with supporting leg (405) through the damping pivot.
8. A CMOS sensor for use in a hyperspectral sensing device as claimed in claim 7 wherein: the bottom threaded connection of supporting leg (405) has regulation leg (406), the bottom fixed mounting of regulation leg (406) has the slipmat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321837398.5U CN220525128U (en) | 2023-07-13 | 2023-07-13 | CMOS sensor applied to hyperspectral detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321837398.5U CN220525128U (en) | 2023-07-13 | 2023-07-13 | CMOS sensor applied to hyperspectral detection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220525128U true CN220525128U (en) | 2024-02-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321837398.5U Active CN220525128U (en) | 2023-07-13 | 2023-07-13 | CMOS sensor applied to hyperspectral detection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220525128U (en) |
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2023
- 2023-07-13 CN CN202321837398.5U patent/CN220525128U/en active Active
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