CN220511567U - Circuit board heat abstractor - Google Patents
Circuit board heat abstractor Download PDFInfo
- Publication number
- CN220511567U CN220511567U CN202322178217.9U CN202322178217U CN220511567U CN 220511567 U CN220511567 U CN 220511567U CN 202322178217 U CN202322178217 U CN 202322178217U CN 220511567 U CN220511567 U CN 220511567U
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- China
- Prior art keywords
- heat dissipation
- circuit board
- shaped plate
- embedded
- singlechip
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 65
- 238000001514 detection method Methods 0.000 claims abstract description 12
- 238000001931 thermography Methods 0.000 claims abstract description 11
- 238000004080 punching Methods 0.000 claims abstract description 10
- 230000005540 biological transmission Effects 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims 1
- 238000005265 energy consumption Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 4
- 238000005057 refrigeration Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of circuit boards, in particular to a circuit board heat dissipation device, which comprises a circuit main board and frame frames embedded on two sides of the circuit main board, wherein two ends of the two frame frames are jointly provided with end clamping plates; the C-shaped plate is slidably arranged at the bottom ends of the two side frames, and is provided with a heat dissipation piece, wherein the heat dissipation piece comprises a punching shell, a fan, a heat dissipation wing plate and a miniature telescopic rod; the temperature detection assembly is embedded in the middle of the C-shaped plate and comprises a singlechip, an infrared thermal imaging detector and a temperature sensor, wherein the singlechip is embedded in the bottom end of the middle of the C-shaped plate 4 and is electrically connected with the fan and the miniature telescopic rod through cables, and the infrared thermal imaging detector and the temperature sensor are symmetrically embedded on the C-shaped plate; the driving piece is used for driving the driving piece that the C template removed to install on two end splint. The circuit board heat dissipation device provided by the utility model has the advantages of low energy consumption, accurate heat dissipation and local temperature rise avoidance.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a circuit board heat dissipation device.
Background
The circuit board is also called a circuit board, and is mainly used for connecting various electronic components in electronic equipment and plays a role of a structural support. When the electronic equipment works, the electronic devices have power consumption to different degrees, the heating intensity changes along with the power consumption, so that the circuit board has the phenomena of local temperature rise, large-area temperature rise or short-time temperature rise and long-time temperature rise, and if the heat is not timely emitted, part of components carried on the circuit board can be invalid due to overheating. The heat dissipation mode in the prior art is to optimize the structural layout of components and parts and dissipate heat through a fan, so that the heat dissipation effect is poor and the accurate and efficient heat dissipation can not be realized for a local high-temperature area.
Disclosure of Invention
In order to solve the technical problems, the utility model provides the circuit board heat dissipation device which has low energy consumption and is capable of precisely dissipating heat and avoiding local temperature rise.
The circuit board heat dissipation device provided by the utility model comprises: the circuit board comprises a circuit main board and frame frames embedded on two sides of the circuit main board, wherein end clamping plates are commonly installed at two ends of the two frame frames;
the C-shaped plate is slidably arranged at the bottom ends of the two side frames, a heat dissipation piece is arranged on the C-shaped plate, the heat dissipation piece comprises a punching shell, a fan, heat dissipation wing plates and miniature telescopic rods, the punching shell is detachably arranged at the bottom end of the C-shaped plate through screws, the fan is embedded in the punching shell, straight grooves are symmetrically formed in the side walls of the C-shaped plate, the heat dissipation wing plates are slidably arranged in the two straight grooves, the miniature telescopic rods are fixedly arranged on the side walls of the C-shaped plate, and connecting rods are fixedly arranged at the telescopic ends of the miniature telescopic rods and fixedly connected with pins, inserted into the straight grooves, of the connecting rods and the heat dissipation wing plates through screws;
the temperature detection assembly is embedded in the middle of the C-shaped plate and comprises a singlechip, an infrared thermal imaging detector and a temperature sensor, wherein the singlechip is embedded in the bottom end of the middle of the C-shaped plate 4 and is electrically connected with the fan and the miniature telescopic rod through cables, and the infrared thermal imaging detector and the temperature sensor are symmetrically embedded in the C-shaped plate and are electrically connected with the singlechip through cables;
the driving piece is used for driving the C-shaped plate to move, and the driving piece is arranged on the two end clamping plates.
Preferably, a plurality of refrigerating sheets are arranged at the top ends of the radiating wing plates, and the refrigerating sheets are fixedly connected with the singlechip through cables.
Preferably, a plurality of springs are welded at the bottom ends of the refrigerating sheets, and one ends of the springs, deviating from the refrigerating sheets, are fixedly connected with the top ends of the heat dissipation wing plates.
Preferably, the one end symmetry that the heat dissipation pterygoid lamina deviates from the straight flute is installed the guide bar, two the one end that the guide bar deviates from the heat dissipation pterygoid lamina is inserted and is located in the through-hole that the C template was seted up.
Preferably, the heat dissipation piece is provided with two groups, and the two groups of heat dissipation pieces are symmetrically distributed based on the middle part of the C-shaped plate.
Preferably, the driving piece comprises a screw rod, a transmission block and a servo motor, the screw rod is rotatably arranged on the two end clamping plates, the transmission block is arranged on the screw rod in a threaded manner, the transmission block is fixedly connected with the C-shaped plate, and the servo motor for driving the screw rod to rotate is arranged on one of the end clamping plates and is electrically connected with the single chip microcomputer through a cable.
Compared with the related art, the circuit board heat dissipation device provided by the utility model has the following beneficial effects:
the utility model provides a circuit board heat dissipation device, wherein a C-shaped plate is slidably arranged on frame frames at two sides of a circuit board, heat dissipation pieces and temperature detection assembly are symmetrically arranged on the C-shaped plate, the temperature detection assembly can detect heat energy distribution of the circuit board in real time by utilizing the cooperation of a singlechip, an infrared thermal imaging detector and a temperature sensor, then a driving piece is controlled to drive the C-shaped plate to move to a high-temperature area according to the temperature distribution, and the heat dissipation pieces are started to conduct accurate heat dissipation and temperature reduction;
the heat dissipation piece is through utilizing the cooperation of punching a hole casing, fan, heat dissipation pterygoid lamina, miniature telescopic link, connecting rod, refrigeration piece, spring and guide bar, when removing to circuit motherboard high temperature region, drive heat dissipation pterygoid lamina is pressed close to circuit motherboard as far as possible, improves the radiating effect.
Drawings
Fig. 1 is a schematic structural diagram of a preferred embodiment of a circuit board heat dissipating device according to the present utility model;
fig. 2 is a schematic structural diagram of a circuit board heat dissipation device without a circuit board;
FIG. 3 is a schematic view of the circuit board heat dissipating device shown in FIG. 2 from another perspective;
fig. 4 is a schematic view of a structure in which a cooling fin is mounted on the heat dissipation wing plate shown in fig. 3.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Specific implementations of the utility model are described in detail below in connection with specific embodiments.
Referring to fig. 1 to 4, a circuit board heat dissipation device provided in an embodiment of the utility model includes: the circuit board comprises a circuit main board 1, a frame 2, an end clamping plate 3, a C-shaped plate 4, a heat radiating piece 5, a temperature detecting component 6 and a driving piece 7.
The circuit board 1 and the frame frames 2 embedded at two sides of the circuit board 1 are provided with end clamping plates 3 at two ends of the two frame frames 2;
the C-shaped plate 4 is slidably arranged at the bottom ends of the two frame frames 2, the C-shaped plate 4 is provided with a heat dissipation piece 5, the heat dissipation piece 5 comprises a punching shell 51, a fan 52, a heat dissipation wing plate 53 and a miniature telescopic rod 54, the punching shell 51 is detachably arranged at the bottom end of the C-shaped plate 4 through screws, the fan 52 is embedded in the punching shell 51, the side wall of the C-shaped plate 4 is symmetrically provided with a straight groove 501, the heat dissipation wing plate 53 is slidably arranged in the two straight grooves 501, the side wall of the C-shaped plate 4 is fixedly provided with the miniature telescopic rod 54, the telescopic end of the miniature telescopic rod 54 is fixedly provided with a connecting rod 541, and pins of the connecting rod 541 inserted into the straight groove 501 are fixedly connected with the heat dissipation wing plate 53 through screws;
the temperature detection assembly 6 is embedded in the middle of the C-shaped plate 4, the temperature detection assembly 6 comprises a singlechip 61, an infrared thermal imaging detector 62 and a temperature sensor 63, the singlechip 61 is embedded in the bottom end of the middle of the C-shaped plate 4, the singlechip 61 is electrically connected with the fan 52 and the miniature telescopic rod 54 through cables, and the infrared thermal imaging detector 62 and the temperature sensor 63 are symmetrically embedded on the C-shaped plate 4 and are electrically connected with the singlechip 61 through cables;
the driving piece 7 is used for driving the driving piece 7 for driving the C-shaped plate 4 to move and is arranged on the two end clamping plates 3; the driving piece 7 comprises a screw rod 71, a transmission block 72 and a servo motor 73, wherein the screw rod 71 is rotatably arranged on the two end clamping plates 3, the transmission block 72 is arranged on the screw rod 71 in a threaded manner, the transmission block 72 is fixedly connected with the C-shaped plate 4, and the servo motor 73 for driving the screw rod 71 to rotate is arranged on one of the end clamping plates 3 and is electrically connected with the single chip microcomputer 61 through a cable.
It should be noted that: when the circuit board 1 is in use, the temperature sensor 63 and the infrared thermal imaging detector 62 of the temperature detection assembly 6 are started to monitor the temperature of the whole circuit board 1, then detection data are transmitted to the single chip microcomputer 61, the single chip microcomputer 61 controls the servo motor 73 of the driving piece 7 to start according to feedback information, the servo motor 73 drives the screw rod 71 to rotate, when the screw rod 71 rotates, the transmission block 72 drives the C-shaped plate 4 to slide on the two frame frames 2 until the C-shaped plate slides to a high temperature area, then the micro telescopic rod 54 is controlled to extend, the heat dissipation wing plate 53 is close to the high temperature area of the circuit board 1, then the fan 52 is controlled to start, heat is forcedly blown out, and accurate heat dissipation is performed.
In the embodiment of the present utility model, referring to fig. 2 and 3, a plurality of cooling fins 55 are disposed at the top end of the heat dissipation wing plate 53, and the plurality of cooling fins 55 are fixedly connected with the singlechip 61 through cables;
it should be noted that: when the heat dissipation wing plate 53 is close to the high-temperature area of the circuit main board 1, the plurality of refrigerating sheets 55 move to be close to the circuit main board 1 under the action of the springs 551, and the refrigerating sheets 55 conduct heat conduction and dissipation, so that the heat dissipation effect is improved;
whereas in the present embodiment: a plurality of springs 551 are welded at the bottom of a plurality of refrigeration piece 55, and the one end that a plurality of springs 551 deviate from refrigeration piece 55 is fixed connection with the top of heat dissipation pterygoid lamina 53.
In the embodiment of the present utility model, referring to fig. 2 and 3, the end of the heat dissipation wing plate 53 facing away from the straight groove 501 is symmetrically provided with the guide rods 56, and the ends of the two guide rods 56 facing away from the heat dissipation wing plate 53 are inserted into the through holes formed in the C-shaped plate 4.
It should be noted that: thus, when the micro telescopic rod 54 pushes the heat dissipation wing plate 53 to move, the heat dissipation wing plate 53 moves more smoothly under the guidance of the guide rod 56.
In the embodiment of the present utility model, referring to fig. 1 and 2, two sets of heat dissipation elements 5 are provided, and the two sets of heat dissipation elements 5 are symmetrically distributed based on the middle portion of the C-shaped board 4.
It should be noted that: through the symmetry setting two sets of, firstly improve the radiating efficiency of forced air cooling, secondly the symmetric distribution is more steady when driving piece 7 drive C template 4 removes.
The working principle of the circuit board heat dissipation device provided by the utility model is as follows:
when the circuit board 1 is in use, the temperature sensor 63 and the infrared thermal imaging detector 62 of the temperature detection assembly 6 are started to monitor the temperature of the whole circuit board 1, then detection data are transmitted to the singlechip 61, the singlechip 61 controls the servo motor 73 of the driving piece 7 to start according to feedback information, the servo motor 73 drives the screw rod 71 to rotate, when the screw rod 71 rotates, the transmission block 72 drives the C-shaped plate 4 to slide on the two frame frames 2 until the C-shaped plate slides to a high temperature area, then the micro telescopic rod 54 is controlled to extend out, the heat dissipation wing plate 53 is close to the high temperature area of the circuit board 1, when the heat dissipation wing plate 53 is close to the high temperature area of the circuit board 1, the plurality of cooling plates 55 are preferentially moved to be close to the circuit board 1 under the action of the spring 551, so that the heat dissipation effect is improved, then the fan 52 is controlled to start, the heat is blown out forcedly, and the heat is dissipated accurately.
The circuits and control involved in the present utility model are all of the prior art, and are not described in detail herein.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (6)
1. A circuit board heat sink comprising:
the circuit board comprises a circuit main board (1), frame frames (2) embedded on two sides of the circuit main board (1), and end clamping plates (3) are commonly arranged at two ends of the two frame frames (2);
characterized by further comprising:
c template (4), slidable mounting is in two the bottom of frame (2), just install radiator (5) on C template (4), radiator (5) are including punching a hole casing (51), fan (52), heat dissipation pterygoid lamina (53) and miniature telescopic link (54), punching a hole casing (51) through screw demountable installation in the bottom of C template (4), and punch a hole casing (51) embedment is equipped with fan (52), straight flute (501) have been seted up to the lateral wall symmetry of C template (4), two install heat dissipation pterygoid lamina (53) in the straight flute (501) sliding mounting, fixed mounting has miniature telescopic link (54) on the lateral wall of C template (4), the telescopic link fixed mounting of miniature telescopic link (54) has connecting rod (541), the pin of connecting rod (541) and heat dissipation pterygoid lamina (53) inserted straight flute (501) passes through screw fixed connection.
The temperature detection assembly (6) is embedded in the middle of the C-shaped plate (4), the temperature detection assembly (6) comprises a singlechip (61), an infrared thermal imaging detector (62) and a temperature sensor (63), the singlechip (61) is embedded in the bottom end of the middle of the C-shaped plate (4), the singlechip (61) is electrically connected with the fan (52) and the miniature telescopic rod (54) through cables, and the infrared thermal imaging detector (62) and the temperature sensor (63) are symmetrically embedded on the C-shaped plate (4) and are electrically connected with the singlechip (61) through the cables;
the driving piece (7) is used for driving the C-shaped plate (4) to move, and the driving piece (7) is arranged on the two end clamping plates (3).
2. The circuit board heat dissipation device according to claim 1, wherein a plurality of cooling fins (55) are arranged at the top end of the heat dissipation wing plate (53), and the plurality of cooling fins (55) are fixedly connected with the single chip microcomputer (61) through cables.
3. The circuit board heat dissipation device according to claim 2, wherein a plurality of springs (551) are welded at the bottom ends of the plurality of cooling fins (55), and one ends of the plurality of springs (551) deviating from the cooling fins (55) are fixedly connected with the top ends of the heat dissipation wing plates (53).
4. The circuit board heat dissipation device according to claim 1, wherein one end of the heat dissipation wing plate (53) deviating from the straight groove (501) is symmetrically provided with guide rods (56), and one ends of the two guide rods (56) deviating from the heat dissipation wing plate (53) are inserted into through holes formed in the C-shaped plate (4).
5. The circuit board heat dissipating device according to claim 1, wherein two groups of heat dissipating members (5) are provided, and the two groups of heat dissipating members (5) are symmetrically distributed based on the middle part of the C-shaped board (4).
6. The circuit board heat dissipation device according to claim 1, wherein the driving member (7) comprises a screw rod (71), a transmission block (72) and a servo motor (73), the screw rod (71) is rotatably mounted on the two end clamping plates (3), the transmission block (72) is mounted on the screw rod (71) in a threaded manner, the transmission block (72) is fixedly connected with the C-shaped plate (4), and the servo motor (73) for driving the screw rod (71) to rotate is mounted on one of the end clamping plates (3) and is electrically connected with the single chip microcomputer (61) through a cable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322178217.9U CN220511567U (en) | 2023-08-14 | 2023-08-14 | Circuit board heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322178217.9U CN220511567U (en) | 2023-08-14 | 2023-08-14 | Circuit board heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220511567U true CN220511567U (en) | 2024-02-20 |
Family
ID=89875136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322178217.9U Active CN220511567U (en) | 2023-08-14 | 2023-08-14 | Circuit board heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220511567U (en) |
-
2023
- 2023-08-14 CN CN202322178217.9U patent/CN220511567U/en active Active
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| GR01 | Patent grant | ||
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