CN220509722U - Flexible composite conductive film - Google Patents
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- CN220509722U CN220509722U CN202321892157.0U CN202321892157U CN220509722U CN 220509722 U CN220509722 U CN 220509722U CN 202321892157 U CN202321892157 U CN 202321892157U CN 220509722 U CN220509722 U CN 220509722U
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- 230000009975 flexible effect Effects 0.000 title claims abstract description 108
- 239000002131 composite material Substances 0.000 title claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 229910052751 metal Inorganic materials 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 48
- 239000011248 coating agent Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 15
- 238000003851 corona treatment Methods 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 118
- -1 polyterephthalate Polymers 0.000 claims description 21
- 239000011241 protective layer Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000004743 Polypropylene Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 239000002033 PVDF binder Substances 0.000 claims description 5
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 5
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 229920002472 Starch Polymers 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 3
- 239000004760 aramid Substances 0.000 claims description 3
- 229920003235 aromatic polyamide Polymers 0.000 claims description 3
- 229920002678 cellulose Polymers 0.000 claims description 3
- 239000001913 cellulose Substances 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920006324 polyoxymethylene Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 102000004169 proteins and genes Human genes 0.000 claims description 3
- 108090000623 proteins and genes Proteins 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 239000008107 starch Substances 0.000 claims description 3
- 235000019698 starch Nutrition 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 claims 1
- 239000011149 active material Substances 0.000 abstract description 11
- 239000010408 film Substances 0.000 description 42
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 229920003023 plastic Polymers 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000002134 carbon nanofiber Substances 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229910021389 graphene Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 239000006230 acetylene black Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 2
- 230000000844 anti-bacterial effect Effects 0.000 description 2
- 239000003899 bactericide agent Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910000423 chromium oxide Inorganic materials 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 229910000428 cobalt oxide Inorganic materials 0.000 description 2
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 2
- 239000006258 conductive agent Substances 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000003273 ketjen black Substances 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- WRDNCFQZLUCIRH-UHFFFAOYSA-N 4-(7-azabicyclo[2.2.1]hepta-1,3,5-triene-7-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1C2=CC=C1C=C2 WRDNCFQZLUCIRH-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- JPMIIZHYYWMHDT-UHFFFAOYSA-N octhilinone Chemical compound CCCCCCCCN1SC=CC1=O JPMIIZHYYWMHDT-UHFFFAOYSA-N 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 210000000438 stratum basale Anatomy 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The utility model relates to a flexible composite conductive film, which comprises a flexible substrate layer and a conductive metal layer, wherein the upper surface or the lower surface of the flexible substrate layer is subjected to corona treatment so that the tension of the upper surface is unequal to the tension of the lower surface; the conductive metal layer is arranged on the upper surface and/or the lower surface of the flexible substrate layer, and a conductive coating is arranged on the outer surface of the conductive metal layer. According to the utility model, the upper surface or the lower surface of the flexible substrate layer is subjected to corona treatment, so that the upper surface and the lower surface of the flexible substrate layer are different in tension, the upper surface and the lower surface of the flexible substrate layer are not bonded together after the flexible substrate layer is wound into a roll, and the problem of unreeled flexible substrate layer is not caused during unreeling, so that the flexible substrate layer is not torn; by introducing the conductive coating, the interface resistance between the subsequently coated active material and the flexible composite conductive film is reduced, and meanwhile, the bonding performance of the active material and the flexible composite conductive film can be improved.
Description
Technical Field
The utility model relates to the field of composite films, in particular to a flexible composite conductive film.
Background
The flexible composite conductive film is a flexible and bendable material, the structural center layer is a flexible substrate layer, the flexible composite conductive film is used as a main body of the flexible composite conductive film, the flexible composite conductive film is generally made of plastic, also called a plastic substrate layer, and a functional layer (such as a conductive metal layer) is arranged on the plastic substrate layer, so that the flexible composite conductive film is finally formed.
The plastic substrate layer plays a role in supporting and protecting, and the conductive film can be bent, stretched and curled due to excellent flexibility and plasticity of the plastic, and the flexible property enables the flexible composite conductive film to be applied to curved surfaces and bendable devices, including electronic devices, touch screens, flexible displays, sensors and the like. The conductive metal layer is one of the key components of the flexible composite conductive film, and is typically deposited as a thin film on a plastic substrate layer, for example, using a process such as evaporation, spraying, or printing. Such a conductive metal layer can provide good electrical conductivity, enabling the flexible composite conductive film to conduct current and perform a conductive function.
In the existing flexible composite conductive film manufacturing process, the flexible substrate layer needs to be unreeled to rotate on each roller, and the phenomenon that the flexible substrate layer is easy to be adhered after being wound is found in production, so that when the flexible substrate layer is wound or unreeled, the film materials can be torn. In addition, in the subsequent application process of the flexible composite conductive film, the active material needs to be coated on the flexible composite conductive film, and the existing flexible composite conductive film and the active material have larger interface resistance, and meanwhile, the bonding performance of the active material and the flexible composite conductive film is poor and the active material is easy to fall off.
Disclosure of Invention
The utility model provides a flexible composite conductive film, which aims to solve the problems that the flexible substrate layer of the conventional flexible composite conductive film is easy to be stuck, and the prepared flexible composite conductive film has larger interface resistance and poor adhesive property between the active material and the flexible composite conductive film when the active material is coated.
The technical scheme of the utility model is as follows:
a flexible composite conductive film comprising a flexible substrate layer and a conductive metal layer, wherein the upper surface or the lower surface of the flexible substrate layer is subjected to corona treatment so that the tension of the upper surface is unequal to the tension of the lower surface; the conductive metal layer is arranged on the upper surface and/or the lower surface of the flexible substrate layer, and a conductive coating is arranged on the outer surface of the conductive metal layer.
According to the utility model of the above scheme, the conductive metal layer comprises a first area and a second area, and the thickness of the conductive metal layer of the first area is larger than that of the conductive metal layer of the second area.
Further, the material of the first area of the conductive metal layer is silver.
According to the present utility model of the above aspect, the thickness of the flexible substrate layer ranges from 1 to 8 micrometers.
Through adopting above-mentioned technical scheme, flexible stratum basale 1 micron to 8 microns's thickness design can compromise the intensity of flexible composite conductive film and reduce the weight of flexible composite conductive film.
By adopting the technical scheme, the thickness of the conductive metal layer is 1-5 micrometers.
By adopting the technical scheme, the thickness of the conductive coating is 50 nanometers to 5 micrometers.
According to the utility model of the above scheme, the flexible substrate layer is made of one of polyamide, polyethylene terephthalate, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, aramid, polydiformylphenylenediamine, acrylonitrile-butadiene-styrene copolymer, polybutylene terephthalate, poly-p-phenylene terephthalamide, polypropylene, polyoxymethylene, epoxy resin, phenolic resin, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber, polycarbonate, cellulose, starch, protein, polyvinyl alcohol and polyethylene glycol.
According to the utility model of the scheme, the conductive metal layer is a copper layer, an aluminum layer, a copper alloy layer, an aluminum alloy layer, a nickel alloy layer, a titanium layer or a silver layer.
According to the utility model of the scheme, the flexible composite conductive film further comprises a protective layer, wherein the protective layer is arranged on the surface of the flexible substrate layer and is positioned between the flexible substrate layer and the conductive metal layer.
Further, the thickness of the protective layer is 10 nanometers to 1 micrometer.
Further, the material of the protective layer is one of nickel, chromium, nickel-based alloy, copper oxide, aluminum oxide, nickel oxide, chromium oxide, cobalt oxide, graphite, carbon black, acetylene black, ketjen black, carbon nano quantum dots, carbon nanotubes, carbon nanofibers and graphene.
The utility model according to the scheme has the beneficial effects that:
according to the utility model, the upper surface or the lower surface of the flexible substrate layer is subjected to corona treatment, so that the upper surface and the lower surface of the flexible substrate layer are different in tension, the upper surface and the lower surface of the flexible substrate layer are not bonded together after the flexible substrate layer is wound into a roll, and the problem of unreeled flexible substrate layer is not caused during unreeling, so that the flexible substrate layer is not torn;
by introducing the conductive coating, the interface resistance between the subsequently coated active material and the flexible composite conductive film is reduced, and meanwhile, the bonding performance of the active material and the flexible composite conductive film can be improved.
Drawings
FIG. 1 is a schematic diagram of a first embodiment of the present utility model;
FIG. 2 is a schematic diagram of a conductive metal layer in a top view according to a second embodiment of the present utility model;
fig. 3 is a schematic structural diagram of a third embodiment of the present utility model.
In the drawing of the figure,
1. a flexible substrate layer; 2. a conductive metal layer; 21. a first region; 22. a second region; 3. a conductive coating; 4. and (3) a protective layer.
Detailed Description
For a better understanding of the objects, technical solutions and technical effects of the present utility model, the present utility model will be further explained below with reference to the drawings and examples. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, it is stated that the embodiments described below are only for explaining the present utility model and are not intended to limit the present utility model.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present, and when an element is referred to as being "connected" to the other element, it may be directly connected to the other element or intervening elements may also be present.
Example 1
As shown in fig. 1, a flexible composite conductive film comprises a flexible substrate layer 1 and a conductive metal layer 2, wherein the upper surface or the lower surface of the flexible substrate layer 1 is subjected to corona treatment, so that the tension of the upper surface is unequal to that of the lower surface, the conductive metal layer 2 is arranged on the upper surface and/or the lower surface of the flexible substrate layer 1, the effect of converging current is achieved, and a conductive coating 3 is arranged on the outer surface of the conductive metal layer 2.
According to the utility model, by carrying out corona treatment on the upper surface or the lower surface of the flexible substrate layer 1, one surface of the flexible substrate layer 1 has tension different from the other surface, after the flexible substrate layer 1 is wound into a roll, the upper surface and the lower surface of the flexible substrate layer 1 are not bonded together, and the problem of unwinding can not occur, so that the flexible substrate layer 1 can not be torn; the introduction of the conductive coating 3 increases the conductivity of the flexible composite conductive film, and improves the rate capability of the battery and the bonding capability of active substances (i.e. active materials) to the pole piece.
The thickness of the conductive coating 3 is 50 nanometers to 5 micrometers, and the conductive coating structure with the thickness value can increase the adhesive force of the conductive coating 3 without increasing excessive weight, namely without damaging the energy density of the battery.
In this embodiment, the thickness of the flexible base layer 1 ranges from 1 to 8 micrometers, and the selection of the thickness range can reduce the weight of the flexible composite conductive film to the maximum extent while ensuring the strength of the flexible composite conductive film, and reduce the cost.
The flexible substrate layer 1 is preferably made of one of polyamide, polybutylene terephthalate, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, aramid, polydiformylphenylenediamine, acrylonitrile-butadiene-styrene copolymer, polybutylene terephthalate, polydiformylenediamine, polypropylene, polyoxymethylene, epoxy resin, phenolic resin, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber, polycarbonate, cellulose, starch, protein, polyvinyl alcohol, and polyethylene glycol.
In this embodiment, the thickness of the conductive metal layer 2 is 1 to 5 micrometers, and the value of the thickness range is selected to ensure the physical and mechanical properties, such as tensile strength, of the flexible composite conductive film.
The conductive metal layer 2 is a copper layer, an aluminum layer, a copper alloy layer or an aluminum alloy layer. Copper is one of the common conductive metal layers, copper has excellent conductivity and low resistance, and can provide stable current transmission. Meanwhile, the copper layer also has good plasticity and can adapt to deformation such as bending, stretching and the like, so that the copper layer is widely applied to the fields of flexible electronic products, touch screens, flexible displays and the like. Aluminum is also one of the common conductive metal layers, which, although having relatively poorer conductivity than copper, has lower cost and lighter weight, which makes aluminum a certain advantage in some thin and portable devices.
In addition to the copper layer and the aluminum layer, a copper alloy layer and an aluminum alloy layer are also used as the choice of the conductive metal layer, and the balance of the conductive properties and the mechanical properties is optimized by adjusting the alloy composition and the ratio. For example, copper alloys such as copper nickel alloys and copper tin alloys have higher corrosion and wear resistance, and are suitable for applications in special environments; for another example, aluminum alloys such as aluminum magnesium alloy and aluminum silicon alloy have higher strength and light weight characteristics.
In addition to this, the conductive metal layer 2 may be a nickel layer, a nickel alloy layer, a titanium layer, or a silver layer. Specifically, the flexible composite conductive film can be selected according to the quality requirement of the flexible composite conductive film.
Example two
As shown in fig. 2, a flexible composite conductive film includes a flexible substrate layer 1, a conductive metal layer 2 and a conductive coating layer 3, and the other structures are the same as those of the first embodiment, in which: the conductive metal layer 2 comprises a first region 21 and a second region 22, and the thickness of the conductive metal layer 2 of the first region 21 is larger than that of the conductive metal layer 2 of the second region 22.
When the flexible composite conductive film is used in a battery, the first region 21 of the conductive metal layer 2 is contacted with the tab, and the thickness of the conductive metal layer of the first region 21 is larger than that of the conductive metal layer of the second region 22, so that the square resistance of the first region is smaller than that of the second region, the contact resistance between the tab and the flexible composite conductive film is reduced, and heat generation can be further reduced.
In this embodiment, the material of the first region 21 of the conductive metal layer 2 is silver, and the conductivity of silver is better than that of copper, so that the contact resistance can be further reduced.
Example III
As shown in fig. 2, a flexible composite conductive film includes a flexible substrate layer 1, a conductive metal layer 2, a conductive coating layer 3, and a protective layer 4, wherein the protective layer 4 is disposed on the surface of the flexible substrate layer 1, and the protective layer 4 is located between the flexible substrate layer 1 and the conductive metal layer 2. The protective layer 4 has the main function of preventing the conductive metal layer 2 from being chemically corroded in a battery or in the air, and is subjected to physical damage in the subsequent process or transportation, so that the service life of the flexible composite conductive film is prolonged while the quality of the flexible composite conductive film is ensured. The thickness of the protective layer 4 is 10 nanometers to 1 micrometer, avoiding adding excessive mass to the flexible composite conductive film.
The material of the protective layer 4 is one of nickel, chromium, nickel-based alloy, copper oxide, aluminum oxide, nickel oxide, chromium oxide, cobalt oxide, graphite, carbon black, acetylene black, ketjen black, carbon nano quantum dots, carbon nano tubes, carbon nano fibers and graphene.
In the utility model, the materials of the conductive coating are the prior art, the component proportion and the manufacturing method are known, and the materials of the common conductive coating and the proportion thereof comprise:
10-20 parts of a conductive agent, wherein the conductive agent is selected from one or more of conductive carbon black, carbon Nano Tubes (CNTs), graphene and carbon nano fibers;
1 to 2 parts of polyvinyl alcohol (PVA), such as polyvinyl alcohol (PVA);
1-2 parts of binder, wherein the binder is one or more selected from polyvinylidene fluoride (PVDF), aqueous polyester resin, aqueous acrylic resin, aqueous polyurethane resin, aqueous acrylonitrile copolymer and aqueous epoxy resin;
the additive is 0.1-2 parts, and the additive comprises any one or more of a thickening agent, a bactericide or pigment, wherein the thickening agent can comprise magnesium aluminum silicate and/or white carbon black, the bactericide comprises a kathon stock solution, and the pigment comprises pigment carbon black.
It should be noted that, the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is conventionally put when the product of the application is used, or the orientation or positional relationship that is conventionally understood by those skilled in the art, or the orientation or positional relationship that is conventionally put when the product of the application is used, which is merely for convenience of describing the application and simplifying the description, and is not indicative or implying that the device or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the application.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. A flexible composite conductive film comprising a flexible substrate layer and a conductive metal layer, wherein the upper surface or the lower surface of the flexible substrate layer is subjected to corona treatment so that the tension of the upper surface is unequal to the tension of the lower surface;
the conductive metal layer is arranged on the upper surface and/or the lower surface of the flexible substrate layer, and a conductive coating is arranged on the outer surface of the conductive metal layer.
2. The flexible composite conductive film of claim 1, wherein the conductive metal layer comprises a first region and a second region, the conductive metal layer of the first region having a thickness greater than a thickness of the conductive metal layer of the second region.
3. The flexible composite conductive film of claim 2, wherein the material of the first region of the conductive metal layer is silver.
4. The flexible composite conductive film of claim 1, wherein the conductive metal layer has a thickness of 1 to 5 microns.
5. The flexible composite conductive film of claim 1, wherein the conductive coating has a thickness of 50 nanometers to 5 micrometers.
6. The flexible composite conductive film of claim 1, wherein the flexible base layer has a thickness of 1 to 8 microns.
7. The flexible composite conductive film according to claim 1, wherein the flexible substrate layer is one of polyamide, polyterephthalate, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, aramid, polydiformylphenylenediamine, acrylonitrile-butadiene-styrene copolymer, polybutylene terephthalate, poly-paraphenylene terephthalamide, polypropylene, polyoxymethylene, epoxy, phenolic, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber, polycarbonate, cellulose, starch, protein, polyvinyl alcohol, and polyethylene glycol.
8. The flexible composite conductive film of claim 1, wherein the conductive metal layer is a copper layer, an aluminum layer, a copper alloy layer, an aluminum alloy layer, a nickel alloy layer, a titanium layer, or a silver layer.
9. The flexible composite conductive film of claim 1, further comprising a protective layer disposed on a surface of the flexible base layer and between the flexible base layer and the conductive metal layer.
10. The flexible composite conductive film of claim 9, wherein the protective layer has a thickness of 10 nanometers to 1 micrometer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202321892157.0U CN220509722U (en) | 2023-07-18 | 2023-07-18 | Flexible composite conductive film |
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