CN220509396U - Fin cavity server liquid cooling radiator based on porous metal - Google Patents
Fin cavity server liquid cooling radiator based on porous metal Download PDFInfo
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- CN220509396U CN220509396U CN202322184860.2U CN202322184860U CN220509396U CN 220509396 U CN220509396 U CN 220509396U CN 202322184860 U CN202322184860 U CN 202322184860U CN 220509396 U CN220509396 U CN 220509396U
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- cavity
- porous metal
- heat exchange
- heat
- exchange cavity
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 68
- 239000002184 metal Substances 0.000 title claims abstract description 68
- 239000007788 liquid Substances 0.000 title claims abstract description 27
- 238000001816 cooling Methods 0.000 title claims abstract description 25
- 239000000498 cooling water Substances 0.000 claims abstract description 12
- 238000009826 distribution Methods 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000835 fiber Substances 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 abstract description 12
- 239000012530 fluid Substances 0.000 abstract description 7
- 230000005855 radiation Effects 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 3
- 239000007787 solid Substances 0.000 abstract description 3
- 230000009471 action Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 13
- 150000002739 metals Chemical class 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a fin cavity server liquid cooling radiator based on porous metal, which comprises a groove plate, porous metal, a cover plate, a water pipe connector and a locking bolt; a flow distribution cavity, a heat exchange cavity and a flow collecting cavity are arranged in the groove plate; the porous metal is placed in the heat exchange cavity, and an array fin is arranged in the heat exchanger. The porous metal in the radiator is filled in the heat exchange cavity, so that the convection heat exchange area of solid and fluid in the heat exchange cavity is increased, the turbulence degree of cooling water is increased, and the efficient enhanced heat transfer is realized at low cost; the array fins are arranged in the heat exchange cavity, so that heat of a heat source at the bottom of the groove plate can be transferred to each region of fluid in the heat exchange cavity, the heat is uniformly distributed in the heat exchange cavity, the defect of low heat transfer efficiency caused by low effective heat conductivity coefficient of porous metal is overcome, and the performance of the radiator is further enhanced; under the action of the two components, the server liquid cooling radiator with excellent heat radiation performance and low application cost can be obtained.
Description
Technical Field
The utility model relates to the technical field of heat dissipation and cooling of data center servers, in particular to a fin cavity server liquid cooling radiator based on porous metal.
Background
With the rapid development of internet information technology and the arrival of the big data age of the internet of things, the scale of a data center is rapidly increased, and the operation performance of a server is continuously improved. Meanwhile, the integration level of the server is continuously improved, the power of a CPU chip is increased year by year, and the problem of thermal management becomes a key factor for restricting the large-scale application of the high-power density server. However, most of the existing data centers adopt an air cooling heat dissipation technology, so that the defects of high energy consumption, limited heat dissipation capacity and the like exist, the heat dissipation technology is only suitable for the heat management of CPU chips with low power consumption and small heat productivity, and the heat dissipation requirement of the CPU chips of the high-performance server is difficult to meet.
In this context, liquid cooling has been actively developed and applied in the field of data center cooling in recent years due to higher heat dissipation efficiency and lower energy consumption. In a plurality of liquid cooling modes, the cold plate type liquid cooling heat dissipation technology has the advantages of excellent heat dissipation performance, relatively controllable application cost, wide application range, easiness in implementation and the like, is an ideal choice for solving the heat dissipation problem of a data center, but the upper limit of the heat transfer capability of the micro-channel liquid cooling is limited by the scale of an internal flow channel, and has certain limitation in the heat management application of a chip with high heat flux in the future.
The porous metal has extremely high specific surface area and stronger fluid disturbance capability, the reinforced heat transfer can be realized by placing the porous metal in the liquid cooling plate cavity, and the solid metal framework of the porous metal is utilized to transfer heat from the bottom of the liquid cooling plate to the middle upper part of the fluid, so that higher heat dissipation capability can be obtained. Although common porous metals such as open-pore foam metal, metal fiber felt and the like take metals such as copper, aluminum and the like with high heat conductivity as base materials, the porous metals are extremely high in porosity, poor in heat transfer performance and low in heat transfer efficiency, and the heat dissipation effect of directly filling the porous metals in a rectangular liquid cooling plate cavity with a simple structure is poor, so that the porous metals are still difficult to directly replace a micro-channel liquid cooling plate and are applied to the field of heat dissipation and cooling of a data center server.
Disclosure of Invention
In order to solve the technical problems, the utility model aims to provide the liquid cooling radiator of the fin cavity server based on the porous metal, which has the advantages of simple manufacturing process, low price, good heat radiation performance, suitability for heat radiation of a high heat flux density server, low cost and large-scale commercial use.
The aim of the utility model is achieved by the following technical scheme:
a porous metal based fin cavity server liquid cooled heat sink comprising:
the device comprises a groove plate, porous metal, a cover plate, a water pipe connector and a locking bolt; a flow distribution cavity, a heat exchange cavity and a flow collecting cavity are arranged in the groove plate; the porous metal is placed in the heat exchange cavity, and an array fin is arranged in the heat exchanger.
One or more embodiments of the present utility model may have the following advantages over the prior art:
the cavity has the advantages of simple structure, simple manufacturing process, low price and low cost and is used for large-scale business.
The design of filling porous metal in a simple cavity structure replaces a micro-channel, increases the convective heat exchange area of solid and fluid in a heat exchange cavity, increases the turbulence degree of cooling water, and realizes high-efficiency enhanced heat transfer at low cost.
The array fins are arranged in the heat exchange cavity, so that heat of a heat source at the bottom of the groove plate can be transferred to each region of fluid in the heat exchange cavity, the heat is uniformly distributed in the heat exchange cavity, the defect of low effective heat conductivity coefficient of porous metal is overcome, and the heat transfer efficiency of the radiator is further enhanced; under the action of the two components, the server liquid cooling radiator with excellent heat radiation performance and low application cost can be obtained.
Drawings
FIG. 1 is a schematic diagram of an exploded structure of a porous metal based fin cavity server liquid cooled radiator;
fig. 2 is a schematic diagram of a fluted plate structure.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, embodiments of the present utility model will be described in further detail with reference to examples and drawings.
As shown in fig. 1, the liquid cooling radiator of the fin cavity server based on porous metal comprises a locking device 1, a water pipe connector 2, a cover plate 3, porous metal 4 and a groove plate 5; a flow distribution cavity 501, a heat exchange cavity 502 and a flow collecting cavity 504 are arranged in the groove plate 5; the porous metal is placed in a heat exchange cavity and array fins 503 (shown in fig. 2) are provided within the heat exchanger.
The flow distribution cavity, the heat exchange cavity and the flow collecting cavity in the groove plate are axisymmetric and centrosymmetric, and the flow distribution cavity and the flow collecting cavity are isosceles triangle in structure, so that cooling water uniformly flows in the heat exchange cavity. The depth of the diversion cavity and the depth of the collecting cavity in the groove plate are the same, and the depth of the heat exchange cavity is 0.25-2 mm deeper than the depth of the diversion cavity and the depth of the collecting cavity, so that the groove plate is used for positioning and fixing porous metal. The distance between the array fins is 6 mm-12 mm, the width of the array fins is 1 mm-3 mm, the length of the array fins is larger than or equal to the size of a heat source (a main heating chip of a server) in the flowing direction, and the array fins can be ensured to effectively transfer the heat of the heat source at the bottom of the groove plate to each region of fluid.
The shape of the porous metal is the same as that of the heat exchange cavity, and the size of the porous metal is the same as or slightly larger than that of the heat exchange cavity of the radiator. When the size and the shape of the porous metal are the same as those of the heat exchange cavity, the porous metal is respectively fastened with the bottom surface and the side surface of the heat exchange cavity and the side wall of the array fin; if the shape of the porous metal is the same as that of the heat exchange cavity, but the size of the porous metal is slightly larger than that of the heat exchange cavity, the porous metal is fastened through interference fit with the heat exchange cavity.
The porous metal is one or more of open-cell foam metal or metal fiber felt, and the material of the porous metal is copper, aluminum or alloy thereof.
After the porous metal is fixed, the plate cover is welded with the groove plate through friction welding, only the threaded hole connected with the water pipe joint is left to be communicated with the outside, and the rest parts are sealed. The cover plate, the porous metal and the groove plate are connected into a whole through the locking device and are fixed on the surface of the CPU chip of the server.
The heat dissipation process of the liquid cooling radiator of the fin cavity server based on the porous metal is as follows:
the cooling water flows into the diversion cavity 501 in the trough plate 5 through the water pipe joint 2, and the diversion cavity 501 distributes the cooling water evenly into the heat exchange cavity 502.
The bottom of the groove plate is tightly attached to the server CPU chip with the surface smeared with silicone grease, the working heat of the server CPU chip is transferred to the bottom of the groove plate 5, meanwhile, the array fins 503 and the porous metal 4 can further transfer the heat to the heat exchange cavity 502 and the porous metal 4 inside the heat exchange cavity, and when cooling water flows to the heat exchange cavity 502, the heat exchange is conducted with the bottom surface and the side surface of the heat exchange cavity 502, the side walls of the array fins 503 and the porous metal 4. In the process, the cooling water flows in the three-dimensional irregular channel formed by the porous metal 4 and is in a continuously separated and mixed state, and the temperature of the cooling water is almost consistent in the section perpendicular to the flow direction of the cooling water, so that the heat transfer efficiency of the radiator is greatly improved.
After the cooling water and the bottom surface and the side surface of the heat exchange cavity 502, the side walls of the array fins 503 and the porous metal 4 finish convection heat exchange, the cooling water is converged by the manifold 504 and flows out through the water pipe joint 2 at the other end, and finally the working heat of the CPU chip of the server is carried away from the server.
Although the embodiments of the present utility model are described above, the embodiments are only used for facilitating understanding of the present utility model, and are not intended to limit the present utility model. Any person skilled in the art can make any modification and variation in form and detail without departing from the spirit and scope of the present disclosure, but the scope of the present disclosure is still subject to the scope of the appended claims.
Claims (10)
1. The liquid cooling radiator of the fin cavity server based on the porous metal is characterized by comprising a groove plate, the porous metal, a cover plate, a water pipe connector and a locking bolt; a flow distribution cavity, a heat exchange cavity and a flow collecting cavity are arranged in the groove plate; the porous metal is placed in the heat exchange cavity, and the array fins are arranged in the heat exchange cavity.
2. The liquid cooling radiator of the fin cavity server based on porous metal according to claim 1, wherein the flow distribution cavity, the heat exchange cavity and the flow collecting cavity in the groove plate are axisymmetric and centrosymmetric, and the flow distribution cavity and the flow collecting cavity are isosceles triangle structures, so that cooling water uniformly flows in the heat exchange cavity.
3. The liquid cooling radiator of the fin cavity server based on the porous metal according to claim 1, wherein the depths of the diversion cavity and the collecting cavity in the groove plate are the same, and the depths of the heat exchange cavity are 0.25-2 mm deeper than the depths of the diversion cavity and the collecting cavity, so as to be used for positioning and fixing the porous metal.
4. The porous metal based fin cavity server liquid cooled radiator of claim 1, wherein the array fins have a pitch of 6mm to 12mm, a width of 1mm to 3mm, and a length of the array fins is greater than or equal to the dimension of the heat source in the flow direction.
5. The fin cavity server liquid cooled heat sink of claim 1, wherein the porous metal has the same shape as the heat exchange cavity and the porous metal has the same size as the heat exchange cavity of the heat sink.
6. The fin cavity server liquid cooled heat sink of claim 1, wherein the porous metal has the same shape as the heat exchange cavity and the size of the porous metal is larger than the heat exchange cavity of the heat sink.
7. The liquid-cooled heat sink of claim 5, wherein the porous metal is fastened to the bottom and side surfaces of the heat exchange cavity and the side walls of the array fins, respectively.
8. The porous metal based fin cavity server liquid cooled heat sink of claim 6, wherein the porous metal is secured in an interference fit with the heat exchange cavity.
9. The fin cavity server liquid-cooled heat sink of claim 1, wherein the porous metal is one of an open cell foam metal or a metal fiber mat.
10. The fin cavity server liquid cooling radiator based on porous metal according to claim 1, wherein the cover plate, the porous metal and the groove plate are connected into a whole through a locking device and fixed on the surface of a server CPU chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322184860.2U CN220509396U (en) | 2023-08-15 | 2023-08-15 | Fin cavity server liquid cooling radiator based on porous metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322184860.2U CN220509396U (en) | 2023-08-15 | 2023-08-15 | Fin cavity server liquid cooling radiator based on porous metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220509396U true CN220509396U (en) | 2024-02-20 |
Family
ID=89870126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322184860.2U Active CN220509396U (en) | 2023-08-15 | 2023-08-15 | Fin cavity server liquid cooling radiator based on porous metal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220509396U (en) |
-
2023
- 2023-08-15 CN CN202322184860.2U patent/CN220509396U/en active Active
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