CN220503162U - Silicon wafer coating alignment device - Google Patents
Silicon wafer coating alignment device Download PDFInfo
- Publication number
- CN220503162U CN220503162U CN202321454572.8U CN202321454572U CN220503162U CN 220503162 U CN220503162 U CN 220503162U CN 202321454572 U CN202321454572 U CN 202321454572U CN 220503162 U CN220503162 U CN 220503162U
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- plate
- groove
- jig
- alignment device
- silicon wafer
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 69
- 239000010703 silicon Substances 0.000 title claims abstract description 69
- 238000000576 coating method Methods 0.000 title claims abstract description 36
- 239000011248 coating agent Substances 0.000 title claims abstract description 33
- 230000000149 penetrating effect Effects 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 47
- 238000000034 method Methods 0.000 description 8
- 230000007306 turnover Effects 0.000 description 3
- 241000252254 Catostomidae Species 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model belongs to a silicon wafer coating alignment device in the technical field of silicon wafer production. Including tool (1), layer board (5), set up tool through groove (11) on tool (1), the tool runs through the slot (11) in the limit and sets up step portion (10), tool (1) lower part sets up slot (12), sets up layer board through groove (21) on layer board (5), layer board (5) upper portion sets up cutting (13), layer board (5) side sets up picture peg groove (17), slot (12) of cutting (13) swing joint tool (1) of layer board (5). The silicon wafer coating alignment device is simple in structure, convenient and reliable in the silicon wafer coating process, and capable of accurately matching and aligning the silicon wafer and the mask plate, guaranteeing alignment precision, reducing labor intensity of operators and improving coating efficiency of the silicon wafer.
Description
Technical Field
The utility model belongs to the technical field of silicon wafer production, and particularly relates to a silicon wafer coating alignment device.
Background
In the actual film plating processing process of the silicon wafer, the processing mode is mainly vapor plating. In order to improve the accuracy of the coating and limit the range of the coating, the matching of a silicon wafer and a mask plate is generally required to be set, however, in the actual processing process, the existing limiting device is required to be adjusted by relying on the matching of a high-accuracy measuring tool, and the accurate positioning of the mounting is difficult to ensure, so that the processing efficiency is lower; in addition, the silicon wafer is thinner, clamping limit cannot be performed, and the silicon wafer is easy to deviate in the evaporation process.
In the prior art, the technology named as a jacking platform and a carrier plate sheet taking system and the technology with the publication number of 218101219U is available, the jacking platform of the technology is used for jacking silicon wafers loaded in each silicon wafer groove of the carrier plate, the jacking platform comprises a supporting plate, a plurality of groups of elastic jacking members are arranged on the supporting plate, the jacking surfaces of all the elastic jacking members are located on the same plane, and when the supporting plate is arranged below the carrier plate, each group of elastic jacking members can extend into one silicon wafer groove and jack the silicon wafers therein. The carrying plate taking system comprises a taking device and the jacking platform, wherein the taking device is arranged above the jacking platform and comprises a plurality of groups of suckers which are suspended, and each group of suckers is used for sucking silicon wafers in a silicon wafer groove on the carrying plate below the sucking device.
However, this technology does not relate to the technical problems and technical solutions of the present application.
Disclosure of Invention
The technical problems to be solved by the utility model are as follows: the silicon wafer coating alignment device is simple in structure, convenient and reliable in the silicon wafer coating process, accurate in matching alignment of the silicon wafer and the mask plate, capable of guaranteeing alignment precision, reducing labor intensity of operators and improving coating efficiency.
The technical scheme adopted by the utility model is as follows:
the utility model relates to a silicon wafer coating alignment device which comprises a jig and a supporting plate, wherein a jig penetrating groove is formed in the jig, a step part is arranged at the inner side of the jig penetrating groove, a slot is formed in the lower part of the jig, a supporting plate penetrating groove is formed in the supporting plate, an inserting strip is arranged at the upper part of the supporting plate, an inserting plate groove is formed in the side face of the supporting plate, and the inserting strip of the supporting plate is movably connected with the slot of the jig.
The supporting plate penetrates through the inner edge of the groove and is provided with a lifting groove, the bottom of the lifting groove is provided with a spring, the spring is connected with a lifting rod, the lifting rod is connected with a top plate with a column, and the inserting plate groove is communicated with the lifting groove.
The side of the jig is provided with a setting-off side plate, the setting-off side plate is clamped at the corner of the jig through a clamping part, a positioning column penetrates through a positioning hole on the jig to position the jig and the setting-off side plate, and a connecting rod is arranged on the setting-off side plate and connected with a film plating machine.
And a mask plate is inserted into the plugboard groove of the supporting plate.
When the mask plate is inserted into the plugboard groove, the mask plate is arranged to be capable of extending into the lifting groove, and the top plate with the column is propped against the lower surface of the mask plate.
The silicon wafer is placed on the step part of the jig, and when the silicon wafer is placed on the step part of the jig, the mask plate is arranged to be in a structure capable of being positioned below the silicon wafer.
The upper part of the supporting plate is provided with cutting bars at each side, the two cutting bars are arranged in parallel, each side of the lower part of the jig is provided with a slot, and the two slots are arranged in parallel.
The side face of the step part of the jig is provided with a concave side groove; the supporting plate is positioned below the inserting plate groove and is provided with a concave pushing groove.
The mask plate is provided with a push handle near the edge.
The side of the mask plate is provided with a positioning lug hole, and when the mask plate is inserted into the plugboard groove, the top plate with the column is of a structure capable of being inserted into the positioning lug hole.
By adopting the technical scheme of the utility model, the working principle and the beneficial effects are as follows:
when the silicon wafer coating alignment device is structurally arranged, the jig and the supporting plate are movably connected through the slots and the cutting, so that the supporting plate and the jig are conveniently and quickly installed. The slot is a T-shaped slot, the cutting is a T-shaped block, and the slot and the cutting are reliably clamped and connected, and only can slide without separation. The jig is used for placing the silicon wafers, the supporting plate is used for installing the mask plate, the jig and the supporting plate can be connected, and the silicon wafers cannot fall off during connection. Through the tool that has the step portion, step portion position is used for placing the silicon chip, and the step portion realizes the level limiting to the silicon chip, utilizes the bottom plate that has the picture peg groove, and the mask plate can be followed the horizontal grafting business turn over in picture peg groove, and the mask plate removes to be located the silicon chip below position to avoid mask plate skew in mask plate removal in-process, make mask plate and silicon chip correspond accurately.
Drawings
The following is a brief description of what is expressed in the drawings of this specification and the references in the drawings:
FIG. 1 is a schematic diagram of a silicon wafer coating alignment device according to the present utility model;
FIG. 2 is a schematic structural diagram of a jig for a wafer coating alignment device according to the present utility model;
FIG. 3 is a schematic structural view of a supporting plate of the silicon wafer coating alignment device;
FIG. 4 is a schematic structural view of a supporting plate of the silicon wafer coating alignment device;
FIG. 5 is a schematic view of a part A of the alignment device for coating silicon wafer shown in FIG. 4;
the reference numerals in the figures are respectively: 1. jig (jig plate); 2. a connecting rod; 3. a side plate is set off; 4. positioning columns; 5. a supporting plate; 6. a mask plate; 7. a push handle; 8. a side groove; 9. positioning holes; 10. a step portion; 11. the jig penetrates through the groove; 12. a slot; 13. cutting; 14. a lifting groove; 15. a top plate with a column; 16. pushing grooves; 17. a plugboard groove; 18. positioning the earhole; 19. a lifting rod; 20. a spring; 21. the supporting plate penetrates through the groove; 22. and a clamping part.
Detailed Description
The following describes the shape, structure, mutual position and connection relation between parts, action of parts and working principle of the specific embodiment of the present utility model by describing examples in further detail:
as shown in fig. 1-5, the utility model relates to a silicon wafer coating alignment device, which comprises a jig 1 and a supporting plate 5, wherein a jig penetrating groove 11 is formed in the jig 1, a step part 10 is arranged at the inner side of the jig penetrating groove 11, a slot 12 is formed in the lower part of the jig 1, a supporting plate penetrating groove 21 is formed in the supporting plate 5, a cutting 13 is formed in the upper part of the supporting plate 5, a plugboard groove 17 is formed in the side surface of the supporting plate 5, and the cutting 13 of the supporting plate 5 is movably connected with the slot 12 of the jig 1. The structure provides an improved technical scheme aiming at the defects in the prior art. When the structure is set up, tool 1 and layer board 5 pass through slot 12 and cutting 13 swing joint, realize the convenient installation of layer board 5 and tool 1. The slot 12 is a T-shaped slot, the cutting 13 is a T-shaped block, and the slot and the cutting are reliably clamped and connected. The jig 1 is used for placing silicon wafers, the supporting plate is used for installing the mask plate 6, the jig 1 and the supporting plate 5 can be connected, and the silicon wafers cannot fall off during connection. Through setting up tool 1 that has step portion 10, step portion 10 position is used for placing the silicon chip, and step portion 10 realizes the level spacing to the silicon chip, utilizes the bottom plate 5 that has picture peg groove 17, and mask plate 6 can transversely peg graft business turn over along picture peg groove 17, and mask plate 6 moves to the position that is located the silicon chip below to avoid mask plate 6 skew in mask plate 6 removal in-process, make mask plate 6 and silicon chip correspond accurately. The silicon wafer coating alignment device is simple in structure, convenient and reliable in the silicon wafer coating process, and capable of accurately matching and aligning the silicon wafer and the mask plate, guaranteeing alignment precision, reducing labor intensity of operators and improving coating efficiency of the silicon wafer.
The lifting groove 14 is arranged at the inner edge of the supporting plate penetrating groove 21, the spring 20 is arranged at the bottom of the lifting groove 14, the spring 20 is connected with the lifting rod 19, the lifting rod 19 is connected with the top plate 15 with the column, and the inserting plate groove 17 is communicated with the lifting groove 14. According to the structure, the lower supporting plate 5 with the plugboard groove 17 and the lifting groove 14 is utilized, the positioning lug 18 on the mask plate 6 is transversely inserted and installed in the supporting plate penetrating groove of the supporting plate along the plugboard groove 17, the lifting rod 19 in the lifting groove 14 is utilized to push the mask plate 6 to lift, the upper end of the mask plate 6 is attached to the lower end face of a silicon wafer, and in the process of transversely inserting and longitudinally lifting the mask plate 6, the mask plate 6 is prevented from being deviated, and meanwhile, the mask plate 6 is enabled to accurately correspond to the silicon wafer.
The side of the jig 1 is provided with a setting-off side plate 3, the setting-off side plate 3 is clamped at the corner of the jig 1 through a clamping part 22, a positioning column 4 passes through a positioning hole 9 on the jig 1 to position the jig 1 and the setting-off side plate 3, the setting-off side plate 3 is provided with a connecting rod 2, and the connecting rod 2 is connected with a film plating machine. Above-mentioned structure, through running through setting up locating hole 9 on tool 1, set off curb plate 3 installs reference column 4 in tool 1 corner locating hole 9 through joint portion 22 cartridge, utilizes the reference column to make tool 1 and set off curb plate 3 realize connecting and location, and set off curb plate 3 utilizes connecting rod 2 to fix on the coating machine, realizes the connection of device and coating machine to make tool 1 lower extreme positive evaporation source.
The mask plate 6 is inserted into the inserting plate groove 17 of the supporting plate 5. When the mask plate 6 is inserted into the inserting plate groove 17, the mask plate 6 can extend into the lifting groove 14, and the top plate 15 with the column is propped against the lower surface of the mask plate 6. The silicon wafer is placed on the step part 10 of the jig 1, and when the silicon wafer is placed on the step part 10 of the jig 1, the mask plate 6 is arranged to be capable of being positioned below the silicon wafer. According to the structure, after the jig 1 and the supporting plate 5 are connected, the positions of the jig 1 and the supporting plate are regulated, the jig cannot move, the jig is used for fixedly placing the silicon wafer, the supporting plate is used for inserting the mask plate, and therefore the silicon wafer and the mask plate are accurately positioned after being respectively in place.
Each side of the upper part of the supporting plate 5 is provided with cutting 13, two cutting 13 are arranged in parallel, each side of the lower part of the jig 1 is provided with a slot 12, and the two slots 12 are arranged in parallel. Above-mentioned structure, tool and layer board pass through slot and cutting structure reliable connection, and both are convenient to connect and dismantle.
The side surface of the step part 10 of the jig 1 is provided with a concave side groove 8; the supporting plate 5 is provided with a concave pushing groove 16 below the inserting plate groove 17. The mask plate 6 is provided with a push handle 7 near the edge. In the structure, the side groove 8 is formed in the side edge of the step part 10 of the jig 1, so that an operator can conveniently take and place silicon wafers from the recessed structural part. A push handle 7 is provided at the lower end of the mask plate 6, so that when the mask plate 6 is inserted into the insert plate groove 17, the mask plate 6 is pushed by the push handle 7, the push handle 7 is finally clamped in the push groove 16, and the mask plate 6 is accurately pushed into the pallet penetrating groove 21 in the middle of the pallet 5 and is positioned below the jig penetrating plate 11.
The side of the mask plate 6 is provided with a positioning lug hole 18, and when the mask plate 6 is inserted into the inserting plate groove 17, the top plate 15 with the column is in a structure capable of being inserted into the positioning lug hole 18. According to the structure, the support on two sides of the mask plate 6 is realized by arranging the positioning lug holes 18, and the lifting rod 19 is used for driving the top plate 15 with the column to be in plug-in fit with the positioning lug holes 18, so that the top plate 15 with the column drives the mask plate 6 to lift up when the position of the mask plate 6 is limited, the spring 20 is enabled to keep upward extrusion force under the action of reset elastic force, and the mask plate 6 is enabled to be tightly attached to a silicon wafer.
According to the silicon wafer coating alignment device, when the structure is arranged, the jig 1 and the supporting plate 5 are movably connected through the slot 12 and the cutting 13, so that the supporting plate 5 and the jig 1 are conveniently and quickly installed. The slot 12 is a T-shaped slot, the cutting 13 is a T-shaped block, and the slot and the cutting are reliably clamped and connected. The jig 1 is used for placing silicon wafers, the supporting plate is used for installing the mask plate 6, the jig 1 and the supporting plate 5 can be connected, and the silicon wafers cannot fall off during connection. Through setting up tool 1 that has step portion 10, step portion 10 position is used for placing the silicon chip, and step portion 10 realizes the level spacing to the silicon chip, utilizes the bottom plate 5 that has picture peg groove 17, and mask plate 6 can transversely peg graft business turn over along picture peg groove 17, and mask plate 6 moves to the position that is located the silicon chip below to avoid mask plate 6 skew in mask plate 6 removal in-process, make mask plate 6 and silicon chip correspond accurately. Simple structure and repeated use.
While the utility model has been described above with reference to the accompanying drawings, it will be apparent that the specific implementation of the utility model is not limited by the foregoing, but rather is within the scope of the utility model as long as various modifications are made by the method concept and technical scheme of the utility model, or the concept and technical scheme of the utility model are directly applied to other occasions without modification.
Claims (10)
1. A silicon wafer coating alignment device is characterized in that: including tool (1), layer board (5), set up tool through groove (11) on tool (1), the tool runs through the slot (11) in the limit and sets up step portion (10), tool (1) lower part sets up slot (12), sets up layer board through groove (21) on layer board (5), layer board (5) upper portion sets up cutting (13), layer board (5) side sets up picture peg groove (17), slot (12) of cutting (13) swing joint tool (1) of layer board (5).
2. The wafer coating alignment device according to claim 1, wherein: lifting grooves (14) are formed in the inner sides of the supporting plate penetrating grooves (21), springs (20) are arranged at the bottoms of the lifting grooves (14), the springs (20) are connected with lifting rods (19), the lifting rods (19) are connected with a top plate (15) with a column, and the inserting plate grooves (17) are communicated with the lifting grooves (14).
3. The wafer coating alignment device according to claim 1 or 2, wherein: the jig is characterized in that a setting-off side plate (3) is arranged on the side face of the jig (1), the setting-off side plate (3) is clamped at the corner of the jig (1) through a clamping part (22), a positioning column (4) penetrates through a positioning hole (9) in the jig (1) to position the jig (1) and the setting-off side plate (3), a connecting rod (2) is arranged on the setting-off side plate (3), and the connecting rod (2) is connected with a film plating machine.
4. The wafer coating alignment device according to claim 2, wherein: a mask plate (6) is inserted into the plugboard groove (17) of the supporting plate (5).
5. The wafer coating alignment device according to claim 4, wherein: when the mask plate (6) is inserted into the inserting plate groove (17), the mask plate (6) is arranged to extend into the lifting groove (14), and the top plate (15) with the column is propped against the lower surface of the mask plate (6).
6. The wafer coating alignment device according to claim 1 or 2, wherein: the silicon wafer is placed on the step part (10) of the jig (1), and when the silicon wafer is placed on the step part (10) of the jig (1), the mask plate (6) is of a structure capable of being positioned below the silicon wafer.
7. The wafer coating alignment device according to claim 1 or 2, wherein: the upper part of the supporting plate (5) is provided with cutting bars (13) at each side, the two cutting bars (13) are arranged in parallel, the lower part of the jig (1) is provided with slots (12) at each side, and the two slots (12) are arranged in parallel.
8. The wafer coating alignment device according to claim 2, wherein: the side surface of the step part (10) of the jig (1) is provided with a concave side groove (8); the supporting plate (5) is positioned below the inserting plate groove (17) and is provided with a concave pushing groove (16).
9. The wafer coating alignment device according to claim 4, wherein: the mask plate (6) is provided with a pushing handle (7) near the edge.
10. The wafer coating alignment device according to claim 4, wherein: the side of the mask plate (6) is provided with a positioning lug hole (18), and when the mask plate (6) is inserted into the inserting plate groove (17), the top plate (15) with the column is of a structure capable of being inserted into the positioning lug hole (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321454572.8U CN220503162U (en) | 2023-06-08 | 2023-06-08 | Silicon wafer coating alignment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321454572.8U CN220503162U (en) | 2023-06-08 | 2023-06-08 | Silicon wafer coating alignment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220503162U true CN220503162U (en) | 2024-02-20 |
Family
ID=89881881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321454572.8U Active CN220503162U (en) | 2023-06-08 | 2023-06-08 | Silicon wafer coating alignment device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220503162U (en) |
-
2023
- 2023-06-08 CN CN202321454572.8U patent/CN220503162U/en active Active
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