CN220491851U

CN220491851U - Power semiconductor packaging chip mounter

Info

Publication number: CN220491851U
Application number: CN202322125140.9U
Authority: CN
Inventors: 魏明宇; 魏松泽
Original assignee: Jiangsu Xinghui Semiconductor Co ltd
Current assignee: Jiangsu Xinghui Semiconductor Co ltd
Priority date: 2023-08-09
Filing date: 2023-08-09
Publication date: 2024-02-13
Anticipated expiration: 2033-08-09

Abstract

The utility model discloses a power semiconductor packaging chip mounter, which relates to the technical field of chip mounters, and particularly relates to a power semiconductor packaging chip mounter. This power semiconductor encapsulation chip mounter through starting first servo can drive the driving disk and rotate, utilizes the driving disk can drive the actuating post and rotate, makes the actuating post drive the actuating sleeve and is eccentric motion then, utilizes the actuating sleeve can drive power pole reciprocating motion, makes the power pole drive the material loading piece drive then, can make the material loading piece last to derive the paster piece in the material loading case inner chamber, can effectually avoid the paster piece to take place the skew simultaneously.

Description

Power semiconductor packaging chip mounter

Technical Field

The utility model relates to the technical field of chip mounters, in particular to a power semiconductor packaging chip mounter.

Background

The semiconductor packaging workshop is a dust-free workshop, the cleanliness of the required space is extremely high, the dust-free workshop is extremely high in environmental maintenance, the size of the occupied area of equipment determines the maintenance area of the dust-free workshop, so that the number of the maintenance cost of the dust-free workshop is determined, two kinds of semiconductor packaging equipment feeding devices are arranged, one kind of semiconductor packaging equipment feeding device is a sucking disc feeding device, the other kind of semiconductor packaging equipment feeding device is a material box feeding device, the sucking disc feeding device and the material box feeding device can be used independently or in combination, and patent number (CN 201910862696.1) discloses a compound feeding device of a semiconductor packaging chip mounter, wherein the requirement of customers cannot be met by providing a single feeding device which is low in working efficiency; the combined feeding generally adopts sucker feeding and magazine feeding to place in tandem, when the sucker feeding and magazine feeding place in tandem side by side, the dust-free workshop area that feed mechanism occupy is great "and through arranging sucker feeding frame and magazine feeding frame from top to bottom in the vertical direction, make full use of dust-free workshop's vertical space, equipment's area has been reduced, thereby dust-free workshop environmental maintenance cost has been reduced, can freely change between horizontal state and vertical state through actuating mechanism drive sucker feeding frame, the efficiency of material loading has been improved, and then work efficiency can be improved, but the paster spare falls ash easily before the paster is in the conveying, when the surface of paster spare exists the dust, can lead to the paster unstable, influence product quality, in addition, traditional conveyer belt material loading in the material loading process, easily leads to the paster spare to producing the skew because of inertia when the conveyer belt stops, moreover, the operation process is comparatively troublesome, power semiconductor packaging machine is proposed here and solves above-mentioned problem.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides a power semiconductor packaging chip mounter, which solves the problems in the background art.

In order to achieve the above purpose, the utility model is realized by the following technical scheme: the utility model provides a power semiconductor encapsulation chip mounter, includes chip mounter, first mounting bracket is in the left side of chip mounter, the middle part of chip mounter is provided with the delivery port, the back fixed mounting of first mounting bracket has first servo motor, fixed mounting has the driving disc on the output shaft of first servo motor, the positive edge fixed mounting of driving disc has the actuating post, the surface of actuating post is provided with the drive sleeve, the right side fixed mounting of drive sleeve has the power pole, the other fixed mounting of power pole has the fixed plate, the last fixed surface of fixed plate installs the fixed frame, the inboard movable mounting of fixed frame has the material loading piece, the outside of material loading piece is provided with the material loading case, the right side fixed mounting of material loading case has the delivery rail, the inside of chip mounter is provided with the second mounting bracket.

Optionally, the back fixed mounting of second mounting bracket has the second servo motor, fixed mounting has the lead screw on the output shaft of second servo motor, the surface threaded connection of lead screw has the swivel nut, the bottom fixed mounting of swivel nut has the push pedal.

Optionally, the surface fixed sleeve of second servo motor output shaft has cup jointed first runner, the surface transmission of first runner is connected with the drive belt, the downside transmission of drive belt is connected with the second runner, the middle part fixed mounting of second runner has first bevel gear, the downside meshing of first bevel gear has the second bevel gear, the middle part fixed mounting of second bevel gear has the cotton of wiping.

Optionally, the left and right sides of swivel nut is all fixed mounting has the locating part, the inside of second mounting bracket is seted up the movable groove with locating part looks adaptation.

Optionally, the surface of first runner and second runner has all been seted up the spacing groove, the drive belt transmission is connected in the spacing groove.

Optionally, the drive slot has been seted up at the middle part of drive sleeve, the shape at both ends about the drive slot is the arc, the positive fixed mounting of drive post has the stopper.

Optionally, the positive fixed mounting of power pole has the gag lever post, the surface movable mounting of gag lever post has the gag lever post, the shape of gag lever post is T shape lug, the inside of gag lever post is seted up and is had the T shape spout with gag lever post looks adaptation.

Optionally, the shape of material loading piece is L shape, the sunken one side of material loading piece is towards left side, the movable groove with material loading piece looks adaptation is seted up to the bottom of material loading case.

The utility model provides a power semiconductor packaging chip mounter, which has the following beneficial effects:

1. this power semiconductor encapsulation chip mounter through starting first servo can drive the driving disk and rotate, utilizes the driving disk can drive the actuating post and rotate, makes the actuating post drive the actuating sleeve and is eccentric motion then, utilizes the actuating sleeve can drive power pole reciprocating motion, makes the power pole drive the material loading piece drive then, can make the material loading piece last to derive the paster piece in the material loading case inner chamber, can effectually avoid the paster piece to take place the skew simultaneously.

2. This power semiconductor encapsulation chip mounter can drive the lead screw through starting first runner and rotate, utilize the lead screw can drive the swivel nut and drive, then make the swivel nut drive the push pedal remove, lead into the delivery port with the paster piece, second servo motor can drive first runner simultaneously, utilize first runner can drive the drive belt, then make the drive belt drive second runner rotate, utilize the second runner can drive first bevel gear and rotate, then make first bevel gear drive second bevel gear rotate, and then make and clean cotton rotation, can clear up the paster piece, can ensure the cleanness on paster piece surface, improve the paster effect.

Drawings

FIG. 1 is a schematic side view of the present utility model;

FIG. 2 is a schematic view of a three-dimensional structure of a feeding box of the utility model;

FIG. 3 is a schematic view of a driving sleeve of the present utility model;

FIG. 4 is a schematic view of the structure of the feeding block of the present utility model;

fig. 5 is a schematic view of a perspective view of a wipe of the present utility model.

In the figure: 1. a chip mounter; 2. a first mounting frame; 3. a first servo motor; 4. a drive plate; 5. a drive column; 6. a drive sleeve; 7. a limiting block; 8. a power lever; 9. a fixing plate; 10. a fixed frame; 11. feeding a material block; 12. feeding a material box; 13. a limit rod; 14. a limit rail; 15. a conveying rail; 16. a second mounting frame; 17. a second servo motor; 18. a screw rod; 19. a screw sleeve; 20. a limiting piece; 21. a push plate; 22. a first wheel; 23. a transmission belt; 24. a second wheel; 25. a first bevel gear; 26. a second bevel gear; 27. wiping cotton; 28. a delivery port.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1 to 4, the present utility model provides the following technical solutions: the power semiconductor packaging chip mounter comprises a chip mounter 1, a first mounting frame 2, wherein the first mounting frame 2 is positioned at the left side of the chip mounter 1, a conveying port 28 is arranged in the middle of the chip mounter 1, a first servo motor 3 is fixedly arranged at the back of the first mounting frame 2, a driving disc 4 is fixedly arranged on an output shaft of the first servo motor 3, a driving column 5 is fixedly arranged at the edge of the front of the driving disc 4, a driving sleeve 6 is arranged on the outer surface of the driving column 5, a driving groove is arranged in the middle of the driving sleeve 6, the upper end and the lower end of the driving groove are arc-shaped, the driving of the driving column 5 is smoother, the phenomenon of blocking in the driving process of the driving column 5 is prevented, a limiting block 7 is fixedly arranged at the front of the driving column 5, the diameter of the limiting block 7 is three to four centimeters larger than the width of the driving groove in the middle of the driving sleeve 6, the driving sleeve 6 can be limited, a power rod 8 is fixedly arranged at the right side of the driving sleeve 6, the front of the power rod 8 is fixedly provided with a limit rod 13, the outer surface of the limit rod 13 is movably provided with a limit rail 14, the shape of the limit rod 13 is a T-shaped protruding block, the inside of the limit rail 14 is provided with a T-shaped chute matched with the limit rod 13, the power rod 8 can be limited by the limit rod 13, so that the power rod 8 is more stable when being fed in a reciprocating manner, shaking is avoided, the other end of the power rod 8 is fixedly provided with a fixing plate 9, the upper surface of the fixing plate 9 is fixedly provided with a fixing frame 10, the inner side of the fixing frame 10 is movably provided with a feeding block 11, the feeding block 11 is L-shaped, one sunken side of the feeding block 11 faces to the left side, contacts with a patch piece when the feeding block 11 is reset, the feeding block 11 rotates at the moment, and then reset is realized, the bottom of the feeding block 12 is provided with a movable groove matched with the feeding block 11, can make the material loading piece 11 go on the material loading smoothly, place material loading case 12 and cause the interference to material loading piece 11, the outside of material loading piece 11 is provided with material loading case 12, and material loading case 12 is in the left side of chip mounter 1 inner chamber, and interval fifty to eighty centimetres between the top of material loading case 12 and the top of chip mounter 1 inner chamber can facilitate the user to carry out the material loading, and material loading case 12's right side fixed mounting has conveying rail 15, and chip mounter 1's inside is provided with second mounting bracket 16.

Referring to fig. 2 and 5, a second servo motor 17 is fixedly mounted on the back of a second mounting frame 16, a screw rod 18 is fixedly mounted on an output shaft of the second servo motor 17, a threaded sleeve 19 is connected to the outer surface of the screw rod 18 in a threaded manner, limiting pieces 20 are fixedly mounted on the left side and the right side of the threaded sleeve 19, movable grooves matched with the limiting pieces 20 are formed in the second mounting frame 16, the threaded sleeve 19 can be limited by the limiting pieces 20, the threaded sleeve 19 is more stable in driving, shake is avoided when the threaded sleeve 19 moves, a push plate 21 is fixedly mounted at the bottom of the threaded sleeve 19, through grooves matched with the push plate 21 are formed in one side of a conveying rail 15, and the push plate 21 is convenient for pushing patch pieces to feed.

Referring to fig. 1 and 5, the outer surface of the output shaft of the second servo motor 17 is fixedly sleeved with a first rotating wheel 22, the outer surfaces of the first rotating wheel 22 and a second rotating wheel 24 are provided with limiting grooves, a driving belt 23 is connected in the limiting grooves in a driving manner, the driving belt 23 can be limited by the limiting grooves, the driving belt 23 is prevented from separating from the outer surfaces of the first rotating wheel 22 and the second rotating wheel 24, the driving belt 23 is connected with the outer surface of the first rotating wheel 22 in a driving manner, the lower side of the driving belt 23 is connected with the second rotating wheel 24 in a driving manner, a first bevel gear 25 is fixedly arranged in the middle of the second rotating wheel 24, a second bevel gear 26 is meshed with the lower side of the first bevel gear 25, wiping cotton 27 is fixedly arranged in the middle of the second bevel gear 26, and the diameter of the wiping cotton 27 is matched with the inner width of the conveying rail 15, so that the upper surface of a patch piece can be cleaned comprehensively.

In summary, when the power semiconductor packaging chip mounter is used, firstly, a user needs to place a chip part in the feeding box 12, then starts the first servo motor 3 to drive the driving disc 4 to rotate, drives the driving column 5 to rotate by using the driving disc 4, drives the driving sleeve 6 to do eccentric motion, drives the power rod 8 to reciprocate by using the driving sleeve 6, drives the feeding box 11 to drive the feeding box 11, continuously leads out the chip part in the inner cavity of the feeding box 12, then needs to start the first rotating wheel 22 to drive the lead screw 18 to drive the screw sleeve 19 by using the lead screw 18, drives the screw sleeve 19 to drive the push plate 21 to move, guides the chip part into the conveying port 28, simultaneously drives the second servo motor 17 to drive the first rotating wheel 22 to rotate, drives the driving belt 23 by using the first rotating wheel 22 to drive the second rotating wheel 24 to rotate, drives the first bevel gear 25 to drive the second bevel gear 26 by using the second rotating wheel 24, and further drives the wiping cotton 27 to rotate to clean the chip part surface, thus ensuring that the chip part can be cleaned.

In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element to be referred to must have a specific direction, be constructed and operated in the specific direction, and thus should not be construed as limiting the present utility model; the terms "first," "second," "third," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "coupled," and the like are to be construed broadly, and may be fixedly coupled, detachably coupled, or integrally coupled, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a power semiconductor encapsulation chip mounter, includes chip mounter (1), first mounting bracket (2) are in the left side of chip mounter (1), its characterized in that: the utility model discloses a chip mounter, including chip mounter, fixed frame (10), fixed frame (9), fixed frame (10)'s inboard movable mounting has material loading piece (11), material loading piece (11)'s outside is provided with material loading case (12), material loading case (12) right side fixed mounting has conveying rail (15), chip mounter (1)'s inside is provided with second mounting bracket (16), the middle part of chip mounter (1) is provided with delivery port (28), the back fixed mounting of first mounting bracket (2) has first servo motor (3), positive edge fixed mounting of driving plate (4) has driving post (5), the surface of driving post (5) is provided with driving sleeve (6), the right side fixed mounting of driving sleeve (6) has power pole (8), the other end fixed mounting of power pole (8) has fixed plate (9), the inboard movable mounting of fixed frame (10) has material loading piece (11), the outside of material loading piece (11) is provided with material loading case (12).

2. The power semiconductor package chip mounter according to claim 1, wherein: the back fixed mounting of second mounting bracket (16) has second servo motor (17), fixed mounting has lead screw (18) on the output shaft of second servo motor (17), the surface threaded connection of lead screw (18) has swivel nut (19), the bottom fixed mounting of swivel nut (19) has push pedal (21).

3. The power semiconductor package chip mounter according to claim 2, wherein: the cotton wiping device is characterized in that a first rotating wheel (22) is fixedly sleeved on the outer surface of an output shaft of the second servo motor (17), a transmission belt (23) is connected to the outer surface of the first rotating wheel (22) in a transmission mode, a second rotating wheel (24) is connected to the lower side of the transmission belt (23), a first bevel gear (25) is fixedly arranged in the middle of the second rotating wheel (24), a second bevel gear (26) is meshed with the lower side of the first bevel gear (25), and wiping cotton (27) is fixedly arranged in the middle of the second bevel gear (26).

4. The power semiconductor package chip mounter according to claim 2, wherein: limiting pieces (20) are fixedly mounted on the left side and the right side of the threaded sleeve (19), and movable grooves matched with the limiting pieces (20) are formed in the second mounting frame (16).

5. A power semiconductor package pick-and-place machine according to claim 3, characterized in that: limiting grooves are formed in the outer surfaces of the first rotating wheel (22) and the second rotating wheel (24), and the transmission belt (23) is in transmission connection with the limiting grooves.

6. The power semiconductor package chip mounter according to claim 1, wherein: the driving groove is formed in the middle of the driving sleeve (6), the upper end and the lower end of the driving groove are arc-shaped, and a limiting block (7) is fixedly arranged on the front face of the driving column (5).

7. The power semiconductor package chip mounter according to claim 1, wherein: the front fixed mounting of power pole (8) has gag lever post (13), the surface movable mounting of gag lever post (13) has gag lever post (14), the shape of gag lever post (13) is T shape lug, the inside of gag lever post (14) has seted up the T shape spout with gag lever post (13) looks adaptation.

8. The power semiconductor package chip mounter according to claim 1, wherein: the feeding block (11) is L-shaped, one sunken side of the feeding block (11) faces to the left, and a movable groove matched with the feeding block (11) is formed in the bottom of the feeding box (12).