CN220491841U - Cooling device for semiconductor processing - Google Patents
Cooling device for semiconductor processing Download PDFInfo
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- CN220491841U CN220491841U CN202223177081.1U CN202223177081U CN220491841U CN 220491841 U CN220491841 U CN 220491841U CN 202223177081 U CN202223177081 U CN 202223177081U CN 220491841 U CN220491841 U CN 220491841U
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- semiconductor processing
- cooling
- cooling device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 49
- 238000001816 cooling Methods 0.000 title claims abstract description 45
- 238000012545 processing Methods 0.000 title claims abstract description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- 230000006835 compression Effects 0.000 claims abstract description 15
- 238000007906 compression Methods 0.000 claims abstract description 15
- 239000000498 cooling water Substances 0.000 claims abstract description 12
- 238000004891 communication Methods 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 14
- 239000007921 spray Substances 0.000 claims description 10
- 210000005239 tubule Anatomy 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 7
- 239000002826 coolant Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 28
- 230000009471 action Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 8
- 238000000889 atomisation Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000005389 magnetism Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000005415 magnetization Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model relates to the technical field of semiconductor processing, and discloses a cooling device for semiconductor processing, which comprises a device base, wherein a cooling water tank, a lifting rail and an air compression pump are fixed on the device base, a movable roller is rotatably connected to the bottom of the device base, and a control panel and a pressure pump are fixed on the top of the cooling water tank. This cooling device for semiconductor processing, through the air compression pump, be convenient for cooperate the solenoid valve to make the air after the compression through gas nozzle quick blowout, remain the water stain blow off with semiconductor material surface, it is rotatory to drive first connecting rod through first motor, be convenient for cooperate the second connecting rod to promote the reciprocal slip of second intercommunication board on the sliding rod, make spun gas quick repeated action at the material surface, improve the result of use, thereby after having solved and having carried out cooling treatment through atomizer, remain the water stain on semiconductor material surface easily, cause the problem of influence to semiconductor material subsequent processing easily.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to a cooling device for semiconductor processing.
Background
The semiconductor is very complicated in the production and processing process, needs to be crushed, melted, cooled, molded and the like, and needs to use cooling equipment to accelerate cooling in the cooling process, so that the cooling equipment for semiconductor processing firstly moves to a conveying device and enables a plurality of groups of spray heads to be positioned above a conveying belt of the conveying device, then the conveying device drives the conveying belt to convey a semiconductor material, a time-controlled cooling fan inputs cold air into a conveying pipe, and the cold air is sprayed to the semiconductor material through the plurality of groups of spray heads, so that the cooling speed of the material is accelerated, and the existing cooling device for semiconductor processing has the following defects: the height and the position of the spray head are fixed, cannot be adjusted according to the position conditions of the conveying device and the semiconductor material, and have poor adaptability; the semiconductor material is cooled only by the air cooler, so that the cooling effect is poor.
The utility model provides a cooling device for semiconductor processing, which comprises a shell, a transmission mechanism and a cooling mechanism, wherein a groove plate is fixedly connected to the surface of the shell, a movable groove is formed in the surface of the groove plate, the transmission mechanism is arranged in the movable groove, the transmission mechanism comprises a threaded rod, a sliding groove, a sliding block and a transverse plate, the threaded rod is arranged on the inner side wall of the movable groove, the transverse plate is arranged on the surface of the threaded rod, the sliding groove is formed in the inner side wall of the movable groove, the sliding block is slidingly connected with the inner side wall of the sliding groove, one end of the sliding block is connected with the transverse plate, a servo motor is arranged on the upper surface of the groove plate, and the power output end of the servo motor is connected with one end of the threaded rod.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the utility model provides a cooling device for semiconductor processing, which solves the problems that water stains are easy to remain on the surface of a semiconductor material and the subsequent processing of the semiconductor material is easy to be influenced after the cooling treatment is carried out through an atomization nozzle.
(II) technical scheme
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a cooling device for semiconductor processing, includes the device base, be fixed with coolant tank, lifting rail and air compression pump on the device base, device base bottom rotates and is connected with the removal gyro wheel, coolant tank top is fixed with control panel and force pump, the water inlet pipe is installed in the coolant tank outside, install the outlet pipe between coolant tank and the force pump input, the outlet pipe surface is provided with magnetism tubule, lifting rail's inside rotation is connected with the transfer line, transfer line surface threaded connection has the linking seat, be fixed with first link plate on the linking seat, be fixed with a set of first motor and two sets of symmetrical slide bars on the first link plate, install the multiunit atomizer on the first link plate, two sets of sliding connection has the second link plate between the slide bar, install two sets of gas nozzle on the second link plate, the solenoid valve is installed at the second link plate top, the output of first motor is fixed with first connecting rod, rotate on the first connecting rod and be connected with the second connecting rod outside rotation and the second connecting rod.
Preferably, the bottom of the lifting rail is provided with a second motor, and the output end of the second motor is fixed with the bottom end of the transmission rod.
Preferably, the connecting seat slides in the lifting rail, both sides of the connecting seat are provided with limiting sliding blocks, and the inner side of the lifting rail is provided with sliding grooves matched with the limiting sliding blocks.
Preferably, the surfaces of the two groups of sliding rods are respectively fixed with symmetrical limiting rings, and the second communication plates are arranged between the symmetrical limiting rings.
Preferably, a first hose is communicated between the output end of the pressure pump and the first communication plate, and a second hose is communicated between the output end of the air compression pump and the electromagnetic valve.
Preferably, three rows of atomizing nozzles are uniformly distributed at the bottom of the first communication plate, and adjacent atomizing nozzles are distributed in a staggered manner.
(III) beneficial effects
Compared with the prior art, the utility model provides a cooling device for semiconductor processing, which has the following beneficial effects:
1. this cooling device for semiconductor processing, through the air compression pump, be convenient for cooperate the solenoid valve to make the air after the compression through gas nozzle quick blowout, remain the water stain blow off with semiconductor material surface, it is rotatory to drive first connecting rod through first motor, be convenient for cooperate the second connecting rod to promote the reciprocal slip of second intercommunication board on the sliding rod, make spun gas quick repeated action at the material surface, improve the result of use, thereby after having solved and having carried out cooling treatment through atomizer, remain the water stain on semiconductor material surface easily, cause the problem of influence to semiconductor material subsequent processing easily.
2. This cooling device for semiconductor processing, through the position of removing the gyro wheel of being convenient for remove cooling device, drive the transfer line operation through the second motor, the control docking station of being convenient for reciprocates in the lifting track, the quick adjustment atomizer and the distance between gas nozzle and the semiconductor material, guarantee cooling effect and the effect of getting rid of the water stain, through magnetism tubule, be convenient for make water by magnetization, form the viscosity that the magnetized water reduced water, improved the atomization degree of water, and cooperate the force pump to make magnetized water spout from the atomizer in and cool off.
3. This cooling device for semiconductor processing, through the connecting seat at the inside slip of lifting track, the both sides of connecting the seat all are provided with spacing slider, and the inboard spout of matching with spacing slider of having seted up of lifting track, be convenient for by the spout to spacing of spacing slider, can only control the connecting seat and reciprocate when making the transfer line move, have three rows of atomizer through first link plate bottom evenly distributed, be the staggered distribution between the adjacent atomizer, be convenient for improve atomizer's coverage area to improve cooling efficiency.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of a slide bar according to the present utility model;
FIG. 3 is a schematic view of the structure of the gas nozzle and atomizer of the present utility model.
In the figure: 1. a device base; 2. moving the roller; 3. a cooling water tank; 4. a control panel; 5. a water inlet pipe; 6. a water outlet pipe; 7. a magnetic tubule; 8. a pressure pump; 9. lifting rails; 10. a transmission rod; 11. a connecting seat; 12. a first communication plate; 14. a slide bar; 15. a second communication plate; 16. a first motor; 17. a first link; 18. a second link; 19. an electromagnetic valve; 20. an air compression pump; 21. a gas nozzle; 22. an atomizing spray head.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, the present utility model provides a technical solution: a cooling device for semiconductor processing comprises a device base 1, a cooling water tank 3, a lifting track 9 and an air compression pump 20 are fixed on the device base 1, air compressed by the air compression pump 20 enters a second communication plate 15 and is rapidly ejected out through an air nozzle 21 to remove water stains on the surface of semiconductor materials, a movable roller 2 is rotationally connected to the bottom of the device base 1, a control panel 4 and a pressure pump 8 are fixed on the top of the cooling water tank 3, a water inlet pipe 5 is installed on the outer side of the cooling water tank 3, a water outlet pipe 6 is installed between the cooling water tank 3 and the input end of the pressure pump 8, a magnetic tubule 7 is arranged on the surface of the water outlet pipe 6, water is magnetized through the magnetic tubule 7 to form magnetized water, the viscosity of the magnetized water is reduced, the atomization degree of the water is improved, a transmission rod 10 is rotationally connected to the inside of the lifting track 9, a connecting seat 11 is in threaded connection with the surface of the transmission rod 10, the first connecting plate 12 is fixed on the connecting seat 11, a group of first motors 16 and two groups of symmetrical sliding rods 14 are fixed on the first connecting plate 12, a plurality of groups of atomizing spray heads 22 are installed on the first connecting plate 12, a second connecting plate 15 is connected between the two groups of sliding rods 14 in a sliding way, two groups of gas nozzles 21 are installed on the second connecting plate 15, the connecting seat 11 is controlled to slide and lift in the lifting track 9 through the running transmission rod 10, the space between the gas nozzles 21 and the atomizing spray heads 22 and the semiconductor material is controlled, an electromagnetic valve 19 is installed at the top of the second connecting plate 15, a first connecting rod 17 is fixed at the output end of the first motor 16, a second connecting rod 18 is connected on the first connecting rod 17 in a rotating way, the second connecting rod 18 is connected with the outer side of the second connecting plate 15 in a rotating way, the first connecting rod 17 is driven to rotate through the first motor 16, and then the second connecting rod 18 is matched to push the second communicating plate 15 to slide on the sliding rod 14 in a reciprocating manner, so that the operation duration and the effect of removing water stains are improved.
Specifically, in order to facilitate driving of the transmission rod 10 to operate, a second motor is installed at the bottom end of the lifting track 9, and the output end of the second motor is fixed with the bottom end of the transmission rod 10, so that the transmission rod 10 operates independently, and lifting of the connecting seat 11 is controlled.
Specifically, in order to be convenient for to linking seat 11 spacing, linking seat 11 slides in lifting rail 9 inside, and linking seat 11's both sides all are provided with spacing slider, and lifting rail 9 inboard seted up the spout that matches with spacing slider, through the spacing of spout to spacing slider, can only control linking seat 11 oscilaltion when making transfer line 10 operation.
Specifically, in order to facilitate limiting the position of the second communication plate 15, symmetrical limiting rings are fixed on the surfaces of the two groups of sliding rods 14, and the second communication plate 15 is arranged between the symmetrical limiting rings to prevent the second communication plate 15 from being separated from the sliding rods 14.
Specifically, in order to avoid the intervention to the gas nozzle 21 and the atomizer 22, a first hose is communicated between the output end of the pressure pump 8 and the first communicating plate 12, a second hose is communicated between the output end of the air compression pump 20 and the electromagnetic valve 19, the height positions of the gas nozzle 21 and the atomizer 22 can be adjusted along with the lifting of the connecting seat 11, and then the cooling water is ensured to enter the atomizer 22 through the first hose, and the compressed air is enabled to enter the gas nozzle 21 through the second hose.
Specifically, in order to facilitate improving the cooling effect, three rows of atomizing nozzles 22 are uniformly distributed at the bottom of the first communicating plate 12, and the adjacent atomizing nozzles 22 are distributed in a staggered manner, so that the coverage area of the atomizing nozzles 22 is increased, and the cooling efficiency is improved.
Working principle: when the semiconductor material is processed and then needs cooling treatment, the cooling device is pushed to a designated position by the movable roller 2, the transmission rod 10 is driven to rotate by controlling the operation of the second motor, the connecting seat 11 is enabled to move up and down in the lifting track 9, the distance between the atomizing spray head 22 and the semiconductor material is quickly adjusted, the operation of the pressure pump 8 is controlled, negative pressure is formed by the operation of the pressure pump 8, water in the cooling water tank 3 enters the water outlet pipe 6, the water is magnetized by the magnetic tubule 7, magnetized water is formed, the viscosity of the magnetized water is reduced, the atomization degree of the water is improved, the magnetized water is introduced into the atomizing spray head 22 through the first hose to be sprayed out, thereby effectively cooling and cooling the semiconductor material, the cooled and cooled semiconductor material is moved to the lower part of the second communication plate 15, the first motor 16 is used for driving the first connection rod 17 to rotate, the second communication plate 15 is pushed to slide back and forth on the sliding rod 14 by matching with the second connection rod 18, meanwhile, air compressed by the air through the air compression pump 20 enters the second communication plate 15 through the control of the electromagnetic valve 19, and the gas nozzle 21 is quickly sprayed out, and the sprayed out gas is quickly and repeatedly sprayed out to remove the gas stains on the semiconductor material on the surface.
In summary, the cooling device for semiconductor processing is convenient for matching with the electromagnetic valve 19 to make compressed air rapidly spray out through the gas nozzle 21 through the air compression pump 20, residual water stains on the surface of the semiconductor material are blown off, the first connecting rod 17 is driven to rotate through the first motor 16, the second connecting rod 18 is matched to push the second communicating plate 15 to slide back and forth on the sliding rod 14, the sprayed gas rapidly and repeatedly acts on the surface of the material, the using effect is improved, the problem that the residual water stains are easy to be remained on the surface of the semiconductor material after cooling treatment through the atomizing nozzle, the influence on the subsequent processing of the semiconductor material is easy to be caused is solved, the position of the cooling device is convenient to move through the moving roller 2, the driving rod 10 is driven to operate through the second motor, the connecting seat 11 is convenient to be controlled to move up and down in the lifting track 9, the distance between atomizer 22 and gas nozzle 21 and the semiconductor material is adjusted fast, guarantee cooling effect and get rid of the effect of water stain, through magnetism tubule 7, be convenient for make water by magnetization, form the viscosity that magnetized water reduced water, the degree of atomizing of water has been improved, and cooperate force pump 8 make magnetized water spout in from atomizer 22 and cool off, slide in lifting rail 9 through connecting seat 11, the both sides of connecting seat 11 all are provided with spacing slider, and lifting rail 9 inboard has been seted up the spout that matches with spacing slider, be convenient for by the spout spacing of spacing slider, can only control the lifting movement about connecting seat 11 when making transfer line 10 operate, evenly distributed has three rows of atomizer 22 through first link plate 12 bottom, be staggered distribution between the adjacent atomizer 22, be convenient for improve atomizer 22's coverage area, and improve cooling efficiency.
The electrical components are all connected with an external main controller and 220V mains supply, and the main controller can be conventional known equipment for controlling a computer and the like.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a cooling device for semiconductor processing, includes device base (1), be fixed with coolant tank (3), lifting rail (9) and air compression pump (20) on device base (1), its characterized in that: the device is characterized in that a movable roller (2) is rotationally connected to the bottom of a base (1), a control panel (4) and a pressure pump (8) are fixed to the top of a cooling water tank (3), a water inlet pipe (5) is installed on the outer side of the cooling water tank (3), a water outlet pipe (6) is installed between the cooling water tank (3) and the input end of the pressure pump (8), a magnetic tubule (7) is arranged on the surface of the water outlet pipe (6), a transmission rod (10) is rotationally connected to the inside of a lifting track (9), a connecting seat (11) is in threaded connection with the surface of the transmission rod (10), a first connecting plate (12) is fixed to the connecting seat (11), a first set of motors (16) and two sets of symmetrical sliding rods (14) are fixed to the first connecting plate (12), a plurality of sets of atomizing spray heads (22) are installed on the first connecting plate (12), a second connecting plate (15) is connected between the sliding rods (14), two sets of gas nozzles (21) are installed on the second connecting plate (15), a first connecting rod (17) is connected to the first connecting rod (17), the second connecting rod (18) is rotationally connected with the outer side of the second communicating plate (15).
2. The cooling device for semiconductor processing according to claim 1, wherein: the bottom of lifting rail (9) is installed the second motor, and the output of second motor and the bottom mounting of transfer line (10).
3. The cooling device for semiconductor processing according to claim 1, wherein: the connecting seat (11) slides in the lifting rail (9), limiting sliding blocks are arranged on two sides of the connecting seat (11), and sliding grooves matched with the limiting sliding blocks are formed in the inner side of the lifting rail (9).
4. The cooling device for semiconductor processing according to claim 1, wherein: the surfaces of the two groups of sliding rods (14) are respectively fixed with symmetrical limiting rings, and the second communication plates (15) are arranged between the symmetrical limiting rings.
5. The cooling device for semiconductor processing according to claim 1, wherein: a first hose is communicated between the output end of the pressure pump (8) and the first communication plate (12), and a second hose is communicated between the output end of the air compression pump (20) and the electromagnetic valve (19).
6. The cooling device for semiconductor processing according to claim 1, wherein: three rows of atomizing nozzles (22) are uniformly distributed at the bottom of the first communication plate (12), and adjacent atomizing nozzles (22) are distributed in a staggered manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223177081.1U CN220491841U (en) | 2022-11-29 | 2022-11-29 | Cooling device for semiconductor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223177081.1U CN220491841U (en) | 2022-11-29 | 2022-11-29 | Cooling device for semiconductor processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220491841U true CN220491841U (en) | 2024-02-13 |
Family
ID=89841470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223177081.1U Active CN220491841U (en) | 2022-11-29 | 2022-11-29 | Cooling device for semiconductor processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220491841U (en) |
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2022
- 2022-11-29 CN CN202223177081.1U patent/CN220491841U/en active Active
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